WO2011035645A1 - Ampoule à led à multiples couches de structures rayonnantes - Google Patents

Ampoule à led à multiples couches de structures rayonnantes Download PDF

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Publication number
WO2011035645A1
WO2011035645A1 PCT/CN2010/075355 CN2010075355W WO2011035645A1 WO 2011035645 A1 WO2011035645 A1 WO 2011035645A1 CN 2010075355 W CN2010075355 W CN 2010075355W WO 2011035645 A1 WO2011035645 A1 WO 2011035645A1
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WO
WIPO (PCT)
Prior art keywords
cup
layer
led
lamp cup
lamp
Prior art date
Application number
PCT/CN2010/075355
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English (en)
Chinese (zh)
Inventor
沈李豪
Original Assignee
Shen Lihao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shen Lihao filed Critical Shen Lihao
Publication of WO2011035645A1 publication Critical patent/WO2011035645A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the utility model relates to the technical field of application of LED chips, in particular to an LED bulb with a multi-layer heat dissipation structure.
  • LED Light Emitting Diode
  • Standard electric lamps are undergoing a revolution.
  • CFLs compact vacuum fluorescent lamps
  • LED lights provide a more efficient and environmentally friendly solution.
  • the LED light source has the advantages of using low-voltage power supply, low energy consumption, strong applicability, high stability, short response time, no pollution to the environment, multi-color light emission, etc., although with the gradual improvement of the luminous efficiency of white LED, white light
  • the possibility of LED application in the field of lighting is also increasing, but to achieve the lumens required for illumination, no matter which method is used, it is necessary to handle extremely high heat in a very small LED package. Dissipating this heat, in addition to various packaging materials, there will be problems of product reliability due to the difference in expansion coefficient between each other.
  • the luminous efficiency of the chip will decrease significantly with the increase of temperature, and the service life will be significantly shortened. And increase the cost of lumens. Therefore, how to dissipate the heat in the assembly has become an important issue in current LED applications.
  • the existing heat dissipation methods applied to LEDs generally add heat sinks to the LEDs to dissipate heat in a manner that increases the heat dissipation area.
  • the area of the heat sink is larger, and sometimes the heat dissipation requirement cannot be met. Therefore, the heat generation problem of most LEDs is difficult to solve by relying solely on the heat sink, and there are also a series of large weight, large volume, and relatively low cost. The problem is illustrated as follows:
  • Case 1 As disclosed in the Chinese Utility Model Patent No. 200410047327. 0, the LED is first placed on the metal body, and then the LED and the metal body are placed on the heat sink body. There are multiple heat sink fins on the heat sink body. This type of passive heat dissipation can meet the heat dissipation requirements when the LED heat is relatively small, but when multiple LEDs are densely arranged or/and the LED power is relatively large, this heat dissipation method cannot effectively dissipate the LED. .
  • Case 2 The patent CN1807971A (application number 200610038143. 7) also discloses a high-power high-brightness illumination lamp.
  • the principle is to use the forced convection of the fan to effectively dissipate heat on the heat sink on the back surface to achieve heat dissipation.
  • the life of the fan is limited, and the shockproof performance and the stability of the work are all far from the LED. Therefore, the LED illuminator using the forced convection of the fan must have a bottleneck on the fan.
  • the long life of the LED itself and the stability of the work are difficult to play. It also causes the LED lights to become complicated in assembly and the total weight increases.
  • An LED lighting bulb structure such as the patent application number 200820117326. 2, is provided with a bulb controller inside the lamp cap, the bottom surface of the bulb controller is fixed by an upper joint cover, and an inner sleeve is fixed on the bottom surface of the upper joint cover.
  • a heat dissipating fin set of at least one heat pipe and a lower joint cover a bulb case with a built-in tray is screwed to the outer periphery of the lower joint cover, and a plurality of LED lamps corresponding to the plurality of heat pipes are protruded from the bottom surface of the tray Therefore, the plurality of LED lamp sets generate heat energy, and the hot and cold exchanges of the plurality of heat pipes and the fins are separated to allow cold and heat to be separated.
  • the structure can improve a certain heat dissipation effect, the structure is complicated. It is not easy to assemble and has a large overall weight, which is not easy to be widely used.
  • the purpose of the utility model is to overcome the above-mentioned deficiencies of the prior art, and to provide an LED light bulb with a multi-layer heat dissipation structure with good heat dissipation performance, low energy consumption, low light decay and simple process.
  • An LED bulb having a multi-layer heat dissipation structure is constructed, including an LED line carrier, a lamp cup assembly, a controller, an LED chip, and a lamp cover.
  • the LED line carrier which may be planar, that is, a planar LED line carrier, has an A-based carrier surface and the entire circumference of the edge is folded into a wide side (so-called wide side refers to the edge of the A-based surface) Fold a certain width to be the edge of the A-based carrier surface. Since the planar LED line carrier is very thin, after folding a certain width, the actual effect is made to thicken the edge of the A-based carrier surface to increase the overall thickness of the lamp cup. Corresponding The contact surface of the cup wall at the mouth of the cup.
  • the LED line carrier can also be shaped to have a full-circle hat-like hat shape, that is, a hat-shaped LED line carrier, the central portion of which is arched to form a first base carrier surface, the first base carrier surface
  • the full circle of the edge is folded into a wide side and then folded around to form a second base-like surface forming a brim, and so on to the Nth base surface, where N is a positive integer greater than or equal to 2,
  • N is a positive integer greater than or equal to 2
  • the entire circumference of the outer circumference of the base surface is folded into a wide side.
  • the lamp cup is generally of a multi-layer structure, having a first layer of light cups, a second layer of light cups, and so on to the Nth layer of light cups, wherein N is a positive integer greater than or equal to 2; the first layer of light cups Located in a central portion of the overall color of the lamp cup, forming a first space therein, the diameter of the second layer of the cup cup is larger than the diameter of the first layer of the cup cup and is set on the outer circumference of the first layer of the lamp cup, and the second layer of the cup Forming a second space with the first layer of the lamp cup, the number of layers of the lamp cup and the number of layers of the space, and so on; except for the wall of the lamp at the mouth of the outermost lamp cup is a blade shape, at the mouth of the other layers of the lamp cup The wall of the lamp is folded into a wide side.
  • the A-based carrier surface is fitted to the lamp cup and is positioned close to the cup mouth, and the wide side of the edge of the A-based carrier surface is folded.
  • the innermost outermost lamp cup of the lamp cup is fitted close to the wall of the cup at the mouth of the cup.
  • the number and position of the first base to the Nth base are corresponding to the first to Nth cups of the entire cup, the first base to the first
  • the N-based carrier faces are respectively fitted to the corresponding cups of the lamp cups and positioned near the respective cup mouths, and the wide sides of the outermost base-loading faces are fitted into the outermost lamp cups.
  • the wide sides of the base surface of the other layers are fitted to the outer near cup opening of the corresponding layer of the respective light cup.
  • a circuit board is disposed on the A base carrier surface and the first base carrier surface to the Nth base carrier surface.
  • the LED line carrier is made of a material having thermal conductivity.
  • the lamp cup is generally made of a heat dissipation material.
  • a heat dissipation vent is densely disposed on the wall of the second to fourth N cups of the lamp cup.
  • the LED line carrier can be shaped as a hat-shaped LED line carrier, and has a plurality of base loading surfaces, and each of the base loading surfaces can be provided with an electronic circuit to increase the surface area of the carrier to increase the heat dissipation area of the carrier; 2.
  • the base surface of the LED line carrier can correspond to the multi-layer structure lamp cup, and the thermal energy generated by the LED chip on each base surface is generated through the corresponding layer of the lamp cup.
  • the wall of the cup is dissipated into the air, further dissipating the heat energy, improving the thermal shock resistance of the LED lamp, solving the heat dissipation problem of the LED lamp, and effectively prolonging the service life of the LED illuminator.
  • the second layer of the lamp cup and the cup wall pushed to the Nth layer of the lamp cup are densely covered with a heat dissipation vent hole formed by drilling, punching, forging, etching, punching, etc., and the heat dissipation vent hole is When the LED works hot, it is easy to quickly dissipate the heat energy in each space, effectively improving the heat dissipation efficiency.
  • the first space in the first layer of the lamp cup is a confined space, which can have a good waterproof function.
  • FIG. 1 is an exploded perspective view of the present invention having a two-layer heat dissipation structure and a planar LED line carrier.
  • FIG. 2 is an exploded perspective view of the present invention having a two-layer heat dissipation structure and a hat-shaped LED line carrier.
  • Figure 3 is an overall schematic view of the present invention having a two-layer heat dissipation structure and a hat-shaped LED line carrier.
  • Figure 4 is an overall schematic view of a two-layer heat dissipation structure and a planar LED line carrier.
  • Figure 5 is an overall schematic view of the present invention having a three-layer heat dissipation structure and a hat-shaped LED line carrier.
  • Figure 6 is an overall schematic view of a three-layer heat dissipation structure and a planar LED line carrier.
  • Figure 7 is a heat dissipation mechanism diagram of the planar LED line carrier of the present invention.
  • Figure 8 is a partial enlarged view of Figure 7.
  • Figure 9 is a heat dissipation mechanism diagram of the hat-shaped LED line carrier of the present invention.
  • Figure 10 is a partial enlarged view of Figure 9.
  • flat LED line carrier 101, A base surface; 01, hat-shaped LED line carrier; 011, first base surface; 012, second base surface; 013, third base surface; Wide side; 02, overall light cup; 021, first layer of light cup; 022, second layer of light cup; 023, third layer of light cup; 0211, First space; 0221, second space; 0231, third space; 03, heat dissipation vent; 0212, flat cup wall; 0213, concave cup wall; 04, controller; 05, LED chip; 07, lamp holder; 08, heat energy escape path.
  • the utility model relates to an LED bulb with a multi-layer heat dissipation structure, which comprises an LED line carrier, a lamp cup overall 02, a controller 04, an LED chip 05, a lamp cover 06 and a lamp holder 07.
  • the LED line carrier can be a planar LED line carrier 10 having an A-based carrier surface 101 and the entire circumference of the edge is folded into a wide edge 014 having a base surface 011 and a rim ring 014 is disposed on The base surface is folded down to be fitted, and can be fitted to the corresponding near cup opening of the lamp cup body 02 to be positioned and closely adhered to the cup wall.
  • the so-called wide edge refers to the edge of the A base surface.
  • a certain width is used as the side of the A-based carrier surface. Since the planar LED line carrier is very thin, after folding a certain width, the actual effect is made to thicken the edge of the A-based carrier surface to increase the correspondingness to the overall thickness of the lamp cup.
  • the contact surface of the cup wall at the mouth of the cup; the LED line carrier can also be formed into a hat-shaped LED line carrier 01, the central portion of which is arched to form a first base surface 011, and the edge of the first base surface 011 is completed.
  • the entire circumference of the edge of the outermost base surface is folded into a wide edge 014, which can be fitted to the lamp
  • the corresponding lamp cup of the cup body 02 is positioned near the cup mouth and closely fits with the cup wall;
  • the lamp cup overall 02 is a cup-shaped body of heat dissipation material, having a first layer lamp cup 021, and a second layer lamp cup 022
  • the first layer of the lamp cup 021 is located at the center of the lamp cup overall 02, the first layer of the lamp cup 021 forms a first space 0211, and the second layer of the lamp cup 022 cup
  • the diameter of the mouth is larger than the diameter of the first layer of the cup 021 cup and is set outside the first layer of the lamp cup 021, and forms the second space 0221, the number of layers of the lamp cup and the number of layers of space and so on, and except the outer
  • the flat LED line carrier 10 and the hat-shaped LED line carrier 01 are made of copper, aluminum, iron, stainless steel, ceramic or other stretchable and bendable metal having thermal conductivity, and can be stretched or stamped. Forming a plane or a variety of curved shapes (ie, hat-shaped), such as a stepped shape, a concave-convex shape or the like, and a plurality of base surfaces of the hat-shaped LED line carrier 01 are directly provided with a plurality of electronic circuits corresponding to the base surface, and one or more of the base surfaces are fixed on each of the base surfaces. LED chip 05.
  • the lamp cup body 02 may be made of copper, aluminum, ceramic or other heat dissipating material, wherein the first space 0211 formed in the first layer of the lamp cup 021 is a closed space; and the lamp cup overall 02, The first space 0211 can accommodate the controller 04 and form a closed space.
  • the cup wall 0212 can be a flat surface wall 0212, or can be a concave-convex shape or a spiral shape formed by electrolysis or etching.
  • the cup wall 0213, the second layer of the lamp cup 022 and the like are pushed to the cup wall of the Nth layer of the cup to be provided with a heat dissipation vent 03 formed by drilling, punching, forging, etching, punching, and the like.
  • the base surface of the hat-shaped LED line carrier 01 can correspond to the multi-layer lamp wall of the lamp cup body 02, and the wide side 014 of the base layer of the outermost layer is fitted into the outermost lamp cup. Positioned near the mouth of the cup, the wide sides 014 of the base surface of the other layers are fitted to the outer near cup opening of the corresponding layer of the lamp cup.
  • the LED line carrier, the controller 04, the LED chip 05 and the lampshade 06 of the present invention are assembled in the lamp cup overall 02.
  • the LED chip 05 when the LED bulb of the planar LED line carrier 10 of the present invention operates, the LED chip 05 generates a large amount of thermal energy 08, which is generated by the innermost layer of the LED chip 05 of the A-based carrier surface 101.
  • the thermal energy 08 is made up of the first layer of the lamp cup 021 to form the wide side 014, the first layer of the lamp cup 021 cup wall is discharged to the second space 0221, and the other part of the thermal energy 08 will be folded by the second layer of the lamp cup 022
  • the wide side 014 is formed, and the wall of the second layer of the lamp cup 022 is dissipated into the air.
  • the thermal energy 08 in the first space 0211 can escape into the air through the bottom of the lamp cup, and the second space 0221
  • the internal thermal energy 08 can be dissipated into the air through the heat dissipation vent 03 on the wall of the second layer of the lamp cup 022, and a large amount of thermal energy 08 is dissipated in this way, thereby improving the heat dissipation efficiency of the LED lamp.
  • the LED chip 05 when the LED bulb of the present invention having the hat-shaped LED line carrier 01 operates, the LED chip 05 generates a large amount of thermal energy 08, and the thermal energy generated by the LED chip 05 on the base surface 011 is 08.
  • the wide side 014 formed by folding, the wall of the first layer of the lamp cup 021 is dissipated to the second space 0221, and the thermal energy 08 generated by the LED chip on the second base surface 012 is made up of
  • the wall of the second layer of the lamp cup 022 is dissipated into the air, and at the same time, the thermal energy 08 in the first space 0211 can escape into the air through the bottom of the lamp cup, and the heat energy in the second space 0221 08 can be dissipated into the air through the heat dissipation vent 03 on the wall of the 022 cup of the second layer of the lamp cup, and a large amount of thermal energy 08 is dissipated in this way, thereby achieving the effect of improving the heat dissipation efficiency of the LED lamp.
  • the utility model has the advantages of simple structure, remarkable heat dissipation effect, low cost, environmental protection and energy saving.

Abstract

Une ampoule à LED à multiples couches de structures rayonnantes comprend un porte-circuit à LED, un corps principal (02) d'une coupelle de lampe, un dispositif de commande (04), des puces à LED (05) et un abat-jour (06). Le porte-circuit à LED peut être un porte-circuit à LED plan (10), qui comporte une surface de charge de base (101) dont tout le cercle du bord est plié en un bord large (014). Le porte-circuit à LED peut être également un porte-circuit à LED du type chapeau (01), dont la partie centrale fait une bosse pour former la première surface de charge de base (011). Tout le cercle du bord de la première surface de charge de base (011) est plié en un large bord (014), puis replié vers la circonférence et s'étend pour former une seconde surface de charge de base du type bord (012) et continue pour former la nième surface de charge de base par analogie. Le corps principal (02) de la coupelle de lampe comporte une structure de multiples couches, et comprend la coupelle de lampe de première couche (021), la coupelle de lampe de deuxième couche (022), jusqu'à la coupelle de lampe de nième couche par analogie. Chaque surface de charge de base (101, 011, 012) est pourvue d'une carte de circuit imprimé. Le porte-circuit à LED se compose d'un matériau thermoconducteur. Le corps principal (02) de la coupelle de lampe se compose d'un matériau rayonnant. Des orifices de rayonnement (03) sont répartis de façon dense dans les parois latérales de la coupelle de lampe de seconde couche (022) jusqu'à la coupelle de lampe de nième couche. L'ampoule à LED pourvue de multiples couches de structures rayonnantes présente un bon effet de rayonnement et une longue durée de vie.
PCT/CN2010/075355 2009-09-27 2010-07-21 Ampoule à led à multiples couches de structures rayonnantes WO2011035645A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2009202053313U CN201526837U (zh) 2009-09-27 2009-09-27 具有多层散热结构的led灯泡
CN200920205331.3 2009-09-27

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WO2011035645A1 true WO2011035645A1 (fr) 2011-03-31

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WO (1) WO2011035645A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101994943A (zh) * 2010-11-24 2011-03-30 英飞特光电（杭州）有限公司 一种具有双层散热壳体的led灯
CN102095109A (zh) * 2011-02-22 2011-06-15 翁小翠 大功率led灯泡
CN102954362A (zh) * 2011-08-24 2013-03-06 孙赫禹 一种全方位照明的led灯泡
CN202302884U (zh) * 2011-10-24 2012-07-04 广东德豪润达电气股份有限公司 Led灯泡形灯
CN102384451B (zh) * 2011-11-16 2013-05-01 沈李豪 一种led灯泡的透气式散热装置及一种透气式散热的led灯泡
CN104534369B (zh) * 2014-12-01 2018-02-16 方恒 一种led灯具
CN104565909A (zh) * 2014-12-03 2015-04-29 方恒 一种led灯具

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CN2886307Y (zh) * 2005-07-29 2007-04-04 夏志清 一种叠层结构的led灯
US20080013319A1 (en) * 2006-07-13 2008-01-17 Everlight Electronics Co., Ltd. Light emitting diode package
CN201145249Y (zh) * 2007-11-23 2008-11-05 张惠祥 高亮度led的高散热封装基板
CN201221694Y (zh) * 2008-06-10 2009-04-15 徐泓 贴片封装大功率led管形灯具
CN201281242Y (zh) * 2008-08-29 2009-07-29 李家茂 多层式反射杯
CN201302062Y (zh) * 2008-10-16 2009-09-02 何松涛 一种兼具散热与照明的led灯
CN201496823U (zh) * 2009-08-17 2010-06-02 沈李豪 Led照明灯泡结构总成
CN201526914U (zh) * 2009-10-26 2010-07-14 沈李豪 一种led灯具外壳
CN201528466U (zh) * 2009-10-23 2010-07-14 沈李豪 可造型印制电路板
CN201526933U (zh) * 2009-10-22 2010-07-14 沈李豪 一种led照明灯具的多层散热结构

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Publication number Priority date Publication date Assignee Title
CN2886307Y (zh) * 2005-07-29 2007-04-04 夏志清 一种叠层结构的led灯
US20080013319A1 (en) * 2006-07-13 2008-01-17 Everlight Electronics Co., Ltd. Light emitting diode package
CN201145249Y (zh) * 2007-11-23 2008-11-05 张惠祥 高亮度led的高散热封装基板
CN201221694Y (zh) * 2008-06-10 2009-04-15 徐泓 贴片封装大功率led管形灯具
CN201281242Y (zh) * 2008-08-29 2009-07-29 李家茂 多层式反射杯
CN201302062Y (zh) * 2008-10-16 2009-09-02 何松涛 一种兼具散热与照明的led灯
CN201496823U (zh) * 2009-08-17 2010-06-02 沈李豪 Led照明灯泡结构总成
CN201526933U (zh) * 2009-10-22 2010-07-14 沈李豪 一种led照明灯具的多层散热结构
CN201528466U (zh) * 2009-10-23 2010-07-14 沈李豪 可造型印制电路板
CN201526914U (zh) * 2009-10-26 2010-07-14 沈李豪 一种led灯具外壳

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