WO2011047565A1 - Multilayered heat-dissipating structure for led illumination lamp - Google Patents

Multilayered heat-dissipating structure for led illumination lamp Download PDF

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Publication number
WO2011047565A1
WO2011047565A1 PCT/CN2010/075289 CN2010075289W WO2011047565A1 WO 2011047565 A1 WO2011047565 A1 WO 2011047565A1 CN 2010075289 W CN2010075289 W CN 2010075289W WO 2011047565 A1 WO2011047565 A1 WO 2011047565A1
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WIPO (PCT)
Prior art keywords
heat
layer
heat sink
dissipating
circuit board
Prior art date
Application number
PCT/CN2010/075289
Other languages
French (fr)
Chinese (zh)
Inventor
沈李豪
Original Assignee
Shen Lihao
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Publication date
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Publication of WO2011047565A1 publication Critical patent/WO2011047565A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the utility model relates to a heat dissipation structure of an LED lighting fixture, in particular to a multilayer heat dissipation structure of an LED lighting fixture.
  • LED luminaires With the increasing use of LED luminaires, the book's manufacturing process is becoming more and more demanding, especially in terms of heat dissipation.
  • Ordinary LED lighting fixtures (such as PAR lamps, MR16 spotlights, bulbs, etc.) are mounted in the lamp cup with one or more LEDs, and the lamp cup is used for heat dissipation.
  • This lamp cup uses a general heat-dissipating material or fins made of aluminum.
  • the LED illumination lamp of this structure has a large use range, but due to poor manufacturing process, unreasonable structure, poor heat dissipation material, etc., the heat dissipation effect is not good, the service life of the product is shortened, and the fin type is
  • the aluminum lamp cup makes the product particularly cumbersome.
  • the working temperature is very important for the LED. Above or below its normal operating temperature range, it will affect its use effect and service life. Therefore, the heat dissipation problem cannot be solved well, and the LED lighting fixture will be used. There are many restrictions. Utility
  • the purpose of the utility model is to provide a multi-layer heat dissipation structure of an LED lighting fixture, which is used to solve the deficiencies of the above technology.
  • a multi-layer heat dissipation structure of an LED lighting fixture comprising a circuit board, an LED chip, a lamp cover and a heat dissipation overall
  • the heat sink generally comprising a heat conductive sheet and having a multi-layer structure
  • the heat sink has a heat dissipation vent hole on the heat sink.
  • the heat dissipating body is connected to the circuit board through the heat conducting sheet, and the shape and structure thereof may be different according to the distribution of the LED chip and the structure of the circuit board, and may be sawtooth or corrugated, and the portion and circuit of the heat radiating body are extended.
  • the plate and the lamp cover form a closed space, and the LED chips are distributed on the circuit board and are in the closed space.
  • the heat dissipating body has an N-layer structure (N is an integer greater than or equal to 2), sequentially from the inside to the outside, the innermost layer is the first layer of the heat sink, and then the second layer of the heat sink, and so on, the heat dissipation of each layer There is a certain space between the bodies, the space between the first heat sink and the second heat sink is the first space, and the space between the second heat sink and the third heat sink is the second space, in turn analogy.
  • the heat sink is made of copper, aluminum, iron, stainless steel or a thermally conductive ceramic.
  • the utility model has the following advantages: (1) The heat dissipation body is provided with a heat dissipation vent hole, so that the heat dissipation is more rapid and effective; (2) the heat dissipation body is a multi-layer heat dissipation structure, which fully expands the heat dissipation area; (3) The shape of the heat sink is jagged or corrugated, and the limited space is utilized to increase the heat dissipation area. (4) The extended portion of the heat sink and the circuit board and the lamp cover form a closed space, that is, heat can be dissipated, and The internal LED chip serves as a protection.
  • FIG. 1 is a cross-sectional view of an MR16 spotlight having a four-layer heat dissipation structure.
  • 2 is a cross-sectional view of an MR16 spotlight having a five-layer heat dissipation structure.
  • 3 is a cross-sectional view of a PAR lamp having a three-layer heat dissipation structure.
  • 4 is a cross-sectional view of an LED bulb having a two-layer heat dissipation structure.
  • Figure 5 is a schematic diagram of heat dissipation.
  • Figure 6 is a partial enlarged view of the heat dissipation principle. In the picture: 01— -Circuit board, 02—— - Thermal sheet, 04— - LED core,
  • 023 a third layer of heat sink
  • 024 a fourth layer of heat sink
  • 025 a fifth layer of heat sink
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • FIG. 1 A cross-sectional view of an MR16 spotlight having a four-layer heat dissipation structure as shown in FIG.
  • the lamp has four layers of heat sinks, which are connected to the circuit board 01 through the heat conducting sheet 02, and a gap of a certain width is left between the circuit board 01 at the joint and the first layer heat sink 021 and between the heat sinks of each layer to Conducive to the dissipation of heat.
  • the first layer heat dissipating body 021 and the fourth layer heat dissipating body 024 enclose a bowl-shaped space, and the circuit board is located at the bottom of the bowl-shaped space, and the second layer heat dissipating body 022 and the third layer heat dissipating body 023 are distributed inside thereof.
  • the space between the first layer of the heat sink 021 and the second layer of the heat sink 022 is the first space 0211, and the space between the second layer of the heat sink 022 and the third layer of the heat sink 023
  • the space between the third layer heat sink 023 and the fourth layer heat sink 024 is the third space 0231.
  • a heat dissipation vent 08 is disposed on each of the heat sinks, and the heat dissipation vent 08 is formed by drilling, punching, forging, etching, punching, and the like.
  • the lamp cover 06 is engaged and positioned, and then a closed space 10 is formed with the circuit board 01, which can protect the LED inside.
  • first layer heat dissipating body 021 is connected to the convex portion of the middle portion of the circuit board 01 through the heat conducting sheet 02
  • second layer heat dissipating body 022 is connected to the turning portion beside the middle portion of the circuit board 01 through the heat conducting sheet 02
  • third One end of the layer heat sink 023 is connected to the end of the circuit board 01, and the other ends thereof are connected to the lamp cap.
  • a first space 0211 is formed between the first layer heat sinks 021
  • a second space 0221 is formed between the first layer heat sink 021 and the second layer heat sink 022
  • a third space 0231 is formed between the layer heat sinks 023.
  • the circuit board 01, the lamp cover 06 and the third layer heat sink 023 enclose a closed space 10 which effectively protects the LED chip 04 on its internal circuit board 10.
  • the shape of the heat sink is corrugated, and the increased heat dissipation area and the heat dissipation vent 08 thereon cause the heat generated by the LED chip 04 to be emitted more quickly.
  • FIG. 4 A cross-sectional view of the LED bulb shown in Figure 4.
  • the LED bulb has only two layers of heat dissipation structure.
  • One end of the first layer heat sink 021 is connected to the middle raised portion of the circuit board 01 through the heat conductive sheet 02, and the second layer heat sink 022 is also passed through the heat conductive sheet 02 and the circuit board 01.
  • the ends are connected and their other ends are connected to the lamp cap.
  • These heat sinks form a suitable and aesthetically pleasing external shape according to the shape of the circuit board 01 and the distribution of the LED chips 04, that is, heat dissipation and protection.
  • the generated thermal energy 09 is transmitted to the circuit board 01, and then transmitted to the heat sinks of the respective layers through the thermal conductive sheet 02.
  • the thermal energy 09 of the first layer of heat sink 021 is transferred inside itself, wherein part of the thermal energy 09 is transferred to the outside air, and the other part is transferred to the first space 0211; the thermal energy 09 of the second layer of the heat sink 022 is partially transmitted to
  • the first space 0211 is transferred to the second space 0221, and the thermal energy 09 of the first space 0211 is diffused to the outside through the heat dissipation vent 08 on the first layer heat sink 021, and may also pass through the second layer heat sink 022,
  • the third layer heat sink 023, the fourth layer heat sink 024, and the heat dissipation vent 08 on the fifth layer heat sink are diffused to the outside.
  • the thermal energy 09 on the third layer heat sink 023 is diffused to the second space 0221 and the third space Between 0231, the thermal energy 09 of the third space 0231 is partially diffused to the outside through the heat dissipation vent 08 on the second heat sink 022 and the first heat sink 021, and the other portion passes through the fourth heat sink 024 and the fifth.
  • the heat dissipation vent 08 on the layer heat sink 025 diffuses to the outside. The same applies to the heat dissipation method of the fourth layer heat sink 024 and the fifth layer heat sink 025.
  • the heat dissipation principle of other shapes of LED lighting fixtures is also the same.

Abstract

A multilayered heat-dissipating structure for LED illumination lamp comprises a circuit board (01), LED chips (04), a lamp cover (06), and a heat-dissipating assembly. The heat-dissipating assembly comprises heat-conductive sheets (02) and heat-dissipating bodies (021,022,023,024,025) with multilayered structures. A space (0211,0221,0231,0241) is provided between every two adjacent heat-dissipating bodies (021,022,023,024,025), and heat-dissipating air holes (08) are provided on the heat-dissipating bodies (021,022,023,024,025). The heat-dissipating bodies (021,022,023,024,025) are connected with the circuit board (01) via the heat-conductive sheets (02). The shapes and structures of the heat-dissipating bodies (021,022,023,024,025) can be various according to the distribution of the LED chips (04) and the structure of the circuit board (01), like zigzag or ripple. The portions extending from the heat-dissipating bodies (021,022,023,024,025), the circuit board (01), and the lamp cover (06) constitute a closed space, and the LED chips (04) are distributed on the circuit board (01) and located in the closed space. The multilayered heat-dissipating structure takes full advantage of the increased heat-dissipating area and the heat-dissipating air holes (08) providing on the heat-dissipating bodies (021,022,023,024,025), and has remarkable heat-dissipating effect.

Description

一种 LED照明灯具的多层散热结构  Multi-layer heat dissipation structure of LED lighting fixture
技术领域 Technical field
本实用新型涉及一种 LED照明灯具的散热结构， 尤指一种 LED照明灯具的 多层散热结构。  The utility model relates to a heat dissipation structure of an LED lighting fixture, in particular to a multilayer heat dissipation structure of an LED lighting fixture.
说  Say
背景技术 Background technique
随着 LED灯具运用的范围越来越广泛，书对其制造工艺的要求也越来越高， 尤其是在散热方面。 普通的 LED照明灯具 （如 PAR灯、 MR16射灯、 灯泡等） 以 一只或多只 LED 安装在灯杯中， 利用灯杯进行散热。 此灯杯采用的是一般的散 热材料或铝制成的鳍片。 这种结构的 LED照明灯具有较大的使用范围， 但由于 制造工艺不好、 结构不够合理、 散热材料不佳等原因， 使得散热效果不好， 縮 短了产品的使用寿命， 而且鳍片型的铝制灯杯使产品显得特别笨重。 工作温度 对 LED来说是很重要的， 高于或低于其正常工作温度范围， 都会影响其使用效 果和使用寿命， 因此， 散热问题得不到较好的解决， LED照明灯具的运用就会受 到很多限制。 实用新型内容  With the increasing use of LED luminaires, the book's manufacturing process is becoming more and more demanding, especially in terms of heat dissipation. Ordinary LED lighting fixtures (such as PAR lamps, MR16 spotlights, bulbs, etc.) are mounted in the lamp cup with one or more LEDs, and the lamp cup is used for heat dissipation. This lamp cup uses a general heat-dissipating material or fins made of aluminum. The LED illumination lamp of this structure has a large use range, but due to poor manufacturing process, unreasonable structure, poor heat dissipation material, etc., the heat dissipation effect is not good, the service life of the product is shortened, and the fin type is The aluminum lamp cup makes the product particularly cumbersome. The working temperature is very important for the LED. Above or below its normal operating temperature range, it will affect its use effect and service life. Therefore, the heat dissipation problem cannot be solved well, and the LED lighting fixture will be used. There are many restrictions. Utility model content
本实用新型的目的在于提供一种 LED照明灯具的多层散热结构， 用以解决 上述技术存在的不足。  The purpose of the utility model is to provide a multi-layer heat dissipation structure of an LED lighting fixture, which is used to solve the deficiencies of the above technology.
解决上述问题的技术方案为： 一种 LED照明灯具的多层散热结构， 包括电 路板、 LED芯片、灯罩和散热总体， 所述散热器总体包括导热片和具有多层结构 的散热体且该散热体上设有散热通气孔。 所述的散热体通过导热片与电路板连接， 其形状和结构可根据 LED芯片的 分布及电路板的结构而有所不同， 可为锯齿状或波纹状， 并且散热体延展出来 的部分与电路板、灯罩构成一闭合空间， LED芯片分布在电路板上并处于该闭合 空间内。 The technical solution for solving the above problems is: a multi-layer heat dissipation structure of an LED lighting fixture, comprising a circuit board, an LED chip, a lamp cover and a heat dissipation overall, the heat sink generally comprising a heat conductive sheet and having a multi-layer structure The heat sink has a heat dissipation vent hole on the heat sink. The heat dissipating body is connected to the circuit board through the heat conducting sheet, and the shape and structure thereof may be different according to the distribution of the LED chip and the structure of the circuit board, and may be sawtooth or corrugated, and the portion and circuit of the heat radiating body are extended. The plate and the lamp cover form a closed space, and the LED chips are distributed on the circuit board and are in the closed space.
所述的散热体具有 N层结构（N为大于或等于 2的整数）， 依次由内向外数， 最里面的为第一层散热体， 接着是第二层散热体， 依次类推， 各层散热体之间 留有一定的空间， 第一层散热体和第二层散热体之间的空间为第一空间， 第二 层散热体与第三层散热体之间的空间为第二空间， 依次类推。 所述散热体的材质为铜、 铝、 铁、 不锈钢或导热陶瓷。 本实用新型具有以下优点： （1 )、 散热体上设有散热通气孔， 使得热量的散 发更迅速更有效； （2 ) 散热体为多层散热结构， 充分地扩大了散热面积； （3)、 散热体的形状为锯齿状或波纹状， 充分利用有限的空间来增大散热面积； （4)、 散热体延展出来的部分与电路板、 灯罩构成一闭合空间， 即可以散热， 又可以 对内部的 LED芯片起保护的作用。 附图说明  The heat dissipating body has an N-layer structure (N is an integer greater than or equal to 2), sequentially from the inside to the outside, the innermost layer is the first layer of the heat sink, and then the second layer of the heat sink, and so on, the heat dissipation of each layer There is a certain space between the bodies, the space between the first heat sink and the second heat sink is the first space, and the space between the second heat sink and the third heat sink is the second space, in turn analogy. The heat sink is made of copper, aluminum, iron, stainless steel or a thermally conductive ceramic. The utility model has the following advantages: (1) The heat dissipation body is provided with a heat dissipation vent hole, so that the heat dissipation is more rapid and effective; (2) the heat dissipation body is a multi-layer heat dissipation structure, which fully expands the heat dissipation area; (3) The shape of the heat sink is jagged or corrugated, and the limited space is utilized to increase the heat dissipation area. (4) The extended portion of the heat sink and the circuit board and the lamp cover form a closed space, that is, heat can be dissipated, and The internal LED chip serves as a protection. DRAWINGS
图 1为具有四层散热结构的 MR16射灯剖视图。 图 2为具有五层散热结构的 MR16射灯剖视图。 图 3为具有三层散热结构的 PAR灯剖视图。 图 4为具有两层散热结构的 LED灯泡剖视图。 图 5为散热原理图。 图 6为散热原理的局部放大图。 图中： 01— -电路板， 02—— -导热片， 04— - LED心片， 1 is a cross-sectional view of an MR16 spotlight having a four-layer heat dissipation structure. 2 is a cross-sectional view of an MR16 spotlight having a five-layer heat dissipation structure. 3 is a cross-sectional view of a PAR lamp having a three-layer heat dissipation structure. 4 is a cross-sectional view of an LED bulb having a two-layer heat dissipation structure. Figure 5 is a schematic diagram of heat dissipation. Figure 6 is a partial enlarged view of the heat dissipation principle. In the picture: 01— -Circuit board, 02—— - Thermal sheet, 04— - LED core,
05—透镜， 06—— -灯罩， 08— - -散热通气孔， 05—Lens, 06——-shade, 08—————heat vent,
10— -闭合空间， 021—一第一层散热体， 022—一第二层散热体，10—closed space, 021—a first layer of heat sink, 022—a second layer of heat sink,
023—一第三层散热体， 024—一第四层散热体， 025—一第五层散热体，023—a third layer of heat sink, 024—a fourth layer of heat sink, 025—a fifth layer of heat sink,
0211- 第一空间， 0221- 第二空间， 0231- ——第三空间，0211- First space, 0221- Second space, 0231- - Third space,
0241- 第四空间， 09—— -热能。 0241- Fourth space, 09——- Thermal energy.
具体实施方式 detailed description
下面将结合附图对具体实施方式加以说明：  Specific embodiments will be described below with reference to the accompanying drawings:
实施例一：  Embodiment 1:
如图 1所示的具有四层散热结构的 MR16射灯剖视图。该灯具有四层散热体， 通过导热片 02与电路板 01连接到一起，连接处的电路板 01与第一层散热体 021 之间、 各层散热体之间都留有一定宽度的间隙， 以利于热量的流散。 第一层散 热体 021与第四层散热体 024围成一碗状空间， 电路板则位于该碗状空间的底 部， 第二层散热体 022与第三层散热体 023分布在其内部， 呈锯齿状， 有效地 扩大了散热面积， 其中， 第一层散热体 021与第二层散热体 022之间的空间为 第一空间 0211， 第二层散热体 022与第三层散热体 023之间的空间为第二空间 0221， 第三层散热体 023与第四层散热体 024之间的空间为第三空间 0231。 各 层散热体上都分布有散热通气孔 08，该散热通气孔 08是经过钻孔、冲孔、锻造、 蚀刻、 打穿等方式形成的。 在第一层散热体 021的中部有一卡口， 对灯罩 06进 行卡合定位， 再与电路板 01围成一闭合空间 10， 可对处于内部的 LED起保护作 用。  A cross-sectional view of an MR16 spotlight having a four-layer heat dissipation structure as shown in FIG. The lamp has four layers of heat sinks, which are connected to the circuit board 01 through the heat conducting sheet 02, and a gap of a certain width is left between the circuit board 01 at the joint and the first layer heat sink 021 and between the heat sinks of each layer to Conducive to the dissipation of heat. The first layer heat dissipating body 021 and the fourth layer heat dissipating body 024 enclose a bowl-shaped space, and the circuit board is located at the bottom of the bowl-shaped space, and the second layer heat dissipating body 022 and the third layer heat dissipating body 023 are distributed inside thereof. The space between the first layer of the heat sink 021 and the second layer of the heat sink 022 is the first space 0211, and the space between the second layer of the heat sink 022 and the third layer of the heat sink 023 The space between the third layer heat sink 023 and the fourth layer heat sink 024 is the third space 0231. A heat dissipation vent 08 is disposed on each of the heat sinks, and the heat dissipation vent 08 is formed by drilling, punching, forging, etching, punching, and the like. In the middle of the first layer of heat sink 021, there is a bayonet, and the lamp cover 06 is engaged and positioned, and then a closed space 10 is formed with the circuit board 01, which can protect the LED inside.
如图 2所示的具有五层散热结构的 MR16射灯剖视图。其结构和具有四层散 热结构的 MR16射灯一样， 只是增加了一层锯齿状的散热体。 如图 3所示的具有三层散热结构的 PAR灯剖视图。 第一层散热体 021的一 端通过导热片 02与电路板 01中部凸起的部分相连接， 第二层散热体 022的一 端通过导热片 02与电路板 01中部旁的转折处相连接， 第三层散热体 023的一 端与电路板 01的末端相连接， 它们的另一端都连接到灯头。 这样， 第一层散热 体 021之间就形成了第一空间 0211， 第一层散热体 021与第二层散热体 022之 间就形成了第二空间 0221， 第二层散热体 022与第三层散热体 023之间就形成 了第三空间 0231。 电路板 01、灯罩 06和第三层散热体 023围成了闭合空间 10， 该闭合空间 10有效地保护了处于其内部电路板 10上的 LED芯片 04。 散热体的 形状为波纹状， 增大的散热面积和其上的散热通气孔 08使 LED芯片 04产生的 热量散发得更迅速。 A cross-sectional view of an MR16 spotlight having a five-layer heat dissipation structure as shown in FIG. The structure is the same as that of the MR16 spotlight with four layers of heat dissipation, except that a layer of jagged heat sink is added. A cross-sectional view of a PAR lamp having a three-layer heat dissipation structure as shown in FIG. One end of the first layer heat dissipating body 021 is connected to the convex portion of the middle portion of the circuit board 01 through the heat conducting sheet 02, and one end of the second layer heat dissipating body 022 is connected to the turning portion beside the middle portion of the circuit board 01 through the heat conducting sheet 02, and the third One end of the layer heat sink 023 is connected to the end of the circuit board 01, and the other ends thereof are connected to the lamp cap. Thus, a first space 0211 is formed between the first layer heat sinks 021, and a second space 0221 is formed between the first layer heat sink 021 and the second layer heat sink 022, and the second layer heat sink 022 and the third layer A third space 0231 is formed between the layer heat sinks 023. The circuit board 01, the lamp cover 06 and the third layer heat sink 023 enclose a closed space 10 which effectively protects the LED chip 04 on its internal circuit board 10. The shape of the heat sink is corrugated, and the increased heat dissipation area and the heat dissipation vent 08 thereon cause the heat generated by the LED chip 04 to be emitted more quickly.
如图 4所示的 LED灯泡剖视图。 该 LED灯泡只有两层散热结构， 第一层散 热体 021的一端通过导热片 02与电路板 01的中间凸起的部分相连接， 第二层 散热体 022也是通过导热片 02与电路板 01的末端相连接， 它们的另一端都接 到灯头处。 这些散热体根据电路板 01的形状和 LED芯片 04的分布而形成合适、 美观的外部形状， 即能散热又起到保护的作用。  A cross-sectional view of the LED bulb shown in Figure 4. The LED bulb has only two layers of heat dissipation structure. One end of the first layer heat sink 021 is connected to the middle raised portion of the circuit board 01 through the heat conductive sheet 02, and the second layer heat sink 022 is also passed through the heat conductive sheet 02 and the circuit board 01. The ends are connected and their other ends are connected to the lamp cap. These heat sinks form a suitable and aesthetically pleasing external shape according to the shape of the circuit board 01 and the distribution of the LED chips 04, that is, heat dissipation and protection.
如图 6和图 7所示的散热原理图。 当 LED芯片 04开始工作， 其产生的热能 09会传递到电路板 01上，再通过导热片 02传给各层散热体。第一层散热体 021 的热能 09会在自身内部进行传递， 其中热能 09的一部分传递到外部空气中， 另一部分则传递到第一空间 0211 ;第二层散热体 022的热能 09—部分传递到第 一空间 0211， 另一部分则传递到第二空间 0221， 第一空间 0211的热能 09则通 过第一层散热体 021上的散热通气孔 08扩散到外面， 也可通过第二层散热体 022、 第三层散热体 023、 第四层散热体 024和第五层散热体上的散热通气孔 08 扩散到外界去。 第三层散热体 023上的热能 09扩散到第二空间 0221和第三空 间 0231， 第三空间 0231的热能 09—部分通过第二层散热体 022和第一层散热 体 021上的散热通气孔 08扩散到外界去， 另一部分则通过第四层散热体 024和 第五层散热体 025上的散热通气孔 08扩散到外界去。 第四层散热体 024和第五 层散热体 025的散热方式也是如此。 其他形状的 LED照明灯具的散热原理也与 此相同。 The heat dissipation schematic shown in Figures 6 and 7. When the LED chip 04 starts to work, the generated thermal energy 09 is transmitted to the circuit board 01, and then transmitted to the heat sinks of the respective layers through the thermal conductive sheet 02. The thermal energy 09 of the first layer of heat sink 021 is transferred inside itself, wherein part of the thermal energy 09 is transferred to the outside air, and the other part is transferred to the first space 0211; the thermal energy 09 of the second layer of the heat sink 022 is partially transmitted to The first space 0211 is transferred to the second space 0221, and the thermal energy 09 of the first space 0211 is diffused to the outside through the heat dissipation vent 08 on the first layer heat sink 021, and may also pass through the second layer heat sink 022, The third layer heat sink 023, the fourth layer heat sink 024, and the heat dissipation vent 08 on the fifth layer heat sink are diffused to the outside. The thermal energy 09 on the third layer heat sink 023 is diffused to the second space 0221 and the third space Between 0231, the thermal energy 09 of the third space 0231 is partially diffused to the outside through the heat dissipation vent 08 on the second heat sink 022 and the first heat sink 021, and the other portion passes through the fourth heat sink 024 and the fifth. The heat dissipation vent 08 on the layer heat sink 025 diffuses to the outside. The same applies to the heat dissipation method of the fourth layer heat sink 024 and the fifth layer heat sink 025. The heat dissipation principle of other shapes of LED lighting fixtures is also the same.
当然， 以上的实施例只是在于说明而不是限制本实用新型， 以上所述仅是 本实用新型的较佳实施例， 故凡依本实用新型申请范围所述的方法所做的等效 变化或修饰， 均包括于本实用新型申请范围内。  Rather, the above embodiments are merely illustrative and not restrictive, and the above description is only a preferred embodiment of the present invention, and equivalent variations or modifications made by the methods described in the scope of the present application. , are included in the scope of the application of the present invention.

Claims

权 利 要 求 书 Claim
1、 一种 LED照明灯具的多层散热结构， 包括电路板、 LED芯片、 灯罩和散 热总体， 其特征在于： 所述散热器总体包括导热片和具有多层结构的散热体且 该散热体上设有散热通气孔。  A multi-layer heat dissipation structure for an LED lighting fixture, comprising a circuit board, an LED chip, a lamp cover, and a heat dissipation overall, wherein: the heat sink generally comprises a heat conductive sheet and a heat sink having a multi-layer structure and the heat sink With heat dissipation vents.
2、根据权利要求 1所述的一种 LED照明灯具的多层散热结构，其特征在于: 所述的散热体通过导热片与电路板连接， 其形状和结构可根据 LED芯片的分布 及电路板的结构而有所不同， 可为锯齿状或波纹状， 并且散热体延展出来的部 分与电路板、灯罩构成一闭合空间， LED芯片分布在电路板上并处于该闭合空间 内。  2 . The multi-layer heat dissipation structure of an LED lighting fixture according to claim 1 , wherein: the heat dissipating body is connected to the circuit board through the heat conducting sheet, and the shape and structure thereof can be according to the distribution of the LED chip and the circuit board. The structure is different, and may be serrated or corrugated, and the extended portion of the heat sink forms a closed space with the circuit board and the lamp cover, and the LED chip is distributed on the circuit board and is in the closed space.
3、根据权利要求 2所述的一种 LED照明灯具的多层散热结构，其特征在于: 所述的散热体具有 N层结构 （N为大于或等于 2的整数）， 依次由内向外数， 最 里面的为第一层散热体， 接着是第二层散热体， 依次类推， 各层散热体之间留 有一定的空间， 第一层散热体和第二层散热体之间的空间为第一空间， 第二层 散热体与第三层散热体之间的空间为第二空间， 依次类推。  The multi-layer heat dissipation structure of an LED lighting fixture according to claim 2, wherein: the heat dissipating body has an N-layer structure (N is an integer greater than or equal to 2), and is sequentially numbered from inside to outside. The innermost part is the first layer of heat sink, followed by the second layer of heat sink, and so on, there is a certain space between the heat sinks of each layer, and the space between the first layer of heat sink and the second layer of heat sink is the first In a space, the space between the second layer heat sink and the third layer heat sink is the second space, and so on.
4、根据权利要求 3所述的一种 LED照明灯具的多层散热结构，其特征在于: 所述散热体的材质为铜、 铝、 铁、 不锈钢或导热陶瓷。  The multi-layer heat dissipation structure of an LED lighting fixture according to claim 3, wherein the heat dissipating body is made of copper, aluminum, iron, stainless steel or a thermally conductive ceramic.
PCT/CN2010/075289 2009-10-22 2010-07-20 Multilayered heat-dissipating structure for led illumination lamp WO2011047565A1 (en)

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