五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種LED照明燈具的散熱結構，尤 指一種LED照明燈具的多層散熱結構。 【先前技術】 k耆LED燈具運用的範圍越來越廣泛，對其製造工 藝的要求也越來越高’尤其是在散熱方面^普通的led 照明燈具（如PAR燈、MR16射燈、燈泡等）以一只或 多只LED安裝在燈杯中，利用燈杯進行散熱β此燈杯採 用的是一般的散熱材料或鋁製成的鰭片。這種結構的LED 照明燈具有較大的使用範圍，但由於原結構散熱效果不好 使產品壽命不長，而且鰭片型的鋁製燈杯使產品顯的特別 笨重。工作溫度對LED來說是很重要的，高於或低於其 正常工作溫度範圍，都會影響其使用效果和使用壽命，因 此，散熱問題得不到較好的解決，LED照明燈具的運用 就會受到很多限制》 【新型内容】 本創作之目的在於提供一種LED照明燈具的多層散 熱結構，用以解決散熱效果不佳之情況。 為解決散熱效果不佳之情況，本創作一種LED照明 燈具的多層散熱結構’係包括：一電路板、一 LED蕊片、 燈罩以及-散熱總體。該散熱總體更包括：一導熱片以 及一具有多層結構的散熱體；其中，該散熱體上設有一散 熱通氧孔。該散熱體之材質為銅、紹、鐵、不鏽鋼、或導 熱陶瓷其中之一。 上述之該導熱體通過導熱片與該電路板連接，其形狀 和釔構可根據該LED蕊片的分佈及該電路板的結構而有 所不同，可為鋸齒狀或波紋狀，並且該散熱體延展出來的 邛刀與該電路板、燈罩構成一閉合空間，該LED蕊片分 佈在該電路板上並處於該閉合空間之内。 上述之該散爐具有N層轉（N為大於或等於2 的正數）’依次由内向外數，最裡面的為第一層散熱體， ，著是第二層散熱體，依摘推，各層散熱體之間留有一 定的空間’第-層散纽和第二層賴體之_空間為第 -空間’第二層散無與第三層散触之間的空間為第二 空間’依次類推。 本創作-種LED _燈具㈣魏熱 點:⑴於該散熱體上設魏熱通氣孔，使得= 八的擴更有效；⑵該散熱體為多層散熱結構，充 積；（3)該散熱體_狀為織狀或波紋 狀，充5_有_如來增大絲 =:::τ路板、燈罩構成 放熱又了以對内部的LED蕊片起保護的作用。 【實施方式】 為了能更妓地·本_峨4之LED照明燈具 M391623 的多層散熱結構，以下將配合圖式詳細說明之。 請參閱圖一所示，圖一為本創作具有四層散熱結構的 MR16射燈剖視圖》該燈具有四層散熱體，通過導熱片02 與電路板01連接到一起，連接處的電路板01與第一層散 熱體021之間、以及各層散熱體之間都留有一定寬度的間 隙’以利於熱量的流散。 該第一散熱體021與第四散熱體024圍成一碗狀空 間，電路板01則位於該碗狀空間的底部，第二層散熱體 022與第三層散熱體〇23呈鋸齒狀分佈在其内部，有效的 擴大了散熱面積，其中，該第一層散熱體〇21與第二層散 熱體022之間的空間為第一空間0211，該第二層散熱體 022與第三層散熱體〇23之間的空間為第二空間〇221，第 二層散熱體023與第四層散熱體〇24之間的空間為第三空 間 0231 。 於各層散熱體（第一層散熱體〇21、第二層散熱體 022、第三層散熱體〇23、以及第四層散熱體〇24)上都分 佈有散熱通氣孔08，該散熱通氣孔〇8是經過鑽孔、沖孔、 锻造、侧、打穿等方式形成的。在第一層散熱體〇21 的中部有-卡d，對燈罩06進行卡合定位，再與電路板 〇1圍成-閉合空間10，可對處於内部的LED蕊片〇4起 保護的侧，更於該電路板G1上設有—透鏡G5分別覆蓋 於該LED蕊片〇4上》 請參閱圖二所示’圖二為本創作具有五層散熱結構的 麗6射燈剖棚。其結構大致與圖一之本創作具有四層 散熱結構的MR16射燈近似，不_在於增加了 —層錄: 5 M391623 狀的散熱體’也就是圖二_之第五層散熱體025。 請參閱圖三所示’圖三為本創作具有三層散熱結構的 PAR燈剖視圖。該第一層散熱體〇21的第一端通過導熱 片02與電路板〇1中部凸起的部分相連接，該第二層散熱 體022的一端通過導熱片〇2與電路板01中部旁的轉折處 相連接，該第三層散熱體023的一端與該電路板〇1的末 端相連接，它們的另一端都連接到燈頭。如此，該第一層 散熱體021之間就形成了第一空間〇211 ,該第一層散熱 體021與該第二層散熱體〇22之間就形成了第二空間 0221 ’該第二層散熱體022與該第三層散熱體〇23之間就 形成了第三空間0231。 該電路板01、燈罩06、以及第三層散熱體〇23為成 了閉合空間10’該閉合空間1〇有效的保護了處於其内部 該電路板01上之該LED蕊片04。該散熱體的形狀為波 紋狀，增大的散熱面積和其上的散熱通氣孔〇8使該LED 黑片04產生的熱量散發的更迅速。 請參閱圖四所示，圖三為本創作具有兩層散熱結構的 led燈泡剖視圖其巾’該LED燈泡只有兩層散熱結構， 第層政熱體021的一端通過導熱片〇2與該電路板〇1 的中間凸起的部分相連接，該第二層散熱體〇22也是通過 該導熱片02與該電路板〇1的末端相連接，它們的另一端 都接到燈贼。這錄熱錄顧t祕〇1力形狀和該 LED蕊片〇4的分佈而形成合適、美觀的外部形狀，即能 政熱又達到保護的作用。 請參閱圖五、圖六所示，圖五、圖六分別為本創作 6 LED照明燈具的多層散熱結構之散熱原理圖以及其熱原 理圖之局部放大圖。其中，當LED蕊片04開始工作，其 產生之熱能09會傳遞到該電路板01之上，再通過導熱片 02傳給各層散熱體。該第一層散熱體〇21的熱能〇9會在 自身内部進行傳遞’其中熱能〇9的一部份傳遞到外部空 氣中，另一部份則傳遞到該第一空間〇211 ;該第二層散 熱體022的熱能〇9—部份傳遞到該第一空間〇211，另一 部份則傳遞到該第二空間0221，該第一空間〇211的熱能 09則通過該第一層散熱體〇21上的散熱通氣孔〇8擴散到 外面’也可通過該第二層散熱體〇22、第三層散熱體〇23、 第四層散熱體024、以及第五層散熱體〇25上的該散熱通 氣孔08擴散到外界去。 該第二層散熱體023上的熱能〇9擴散到該第二空間 0221和該第三空間〇231，該第三空間〇231的熱能〇9 一 #伤通過該第二層散熱體022和該第一層散熱體021上的 該散熱通氣孔G8擴散到外界去，另—部份則通過該第四 層散熱體024和該第五層散熱體〇25上的該散熱通氣孔 〇8擴制外界去。該第四層散熱體〇24和該第五層散熱 體025的散熱方式亦是如此β其他形狀的LED照明燈具 的散熱原理也與此相同。 唯以上所述之實施例不應用於限制本創作之可應用 乾園’本創作之保護範圍應以本創作之申請專利範圍内容 所界定技術精神及其均等變化所含括之範圍為主者。即大 凡依本創”料现騎做之解魏及料，仍將不 失本創作之要義所在，亦不脫離本創作之精神和範園，故 M391623 都應視為本創作的進一步實施狀、兄 【圖式簡單說明】 圖係為本創作具有四層散熱結構的射燈剖 視圖。 圖二係為本創作具有五層散熱結構的MR16射燈剖 視圖。 圖三係為本齡具有三層散賊構的燈剖視 圖。 圖四係為本創作具有兩層散熱結構的LED燈泡剖視 圖。 圖五係為本創作led _燈具料層散熱結 熱原理圖。 圖六係為圖五散熱原理圖之局部放大圖。 【主要元件符號說明】 01〜電路板 02〜導熱片 04〜LED蕊片 05〜透鏡 06〜燈罩 08〜散熱通氣孔 10〜閉合空間 021〜第一層散熱體V. New description: [New technology field] This creation department relates to the heat dissipation structure of an LED lighting fixture, especially a multilayer heat dissipation structure of an LED lighting fixture. [Prior Art] The range of applications for k耆LED lamps is more and more extensive, and the requirements for their manufacturing processes are getting higher and higher', especially in terms of heat dissipation. ^General LED lighting fixtures (such as PAR lamps, MR16 spotlights, bulbs, etc.) One or more LEDs are mounted in the lamp cup, and the lamp cup is used for heat dissipation. The lamp cup is made of a general heat dissipation material or a fin made of aluminum. The LED illuminator of this structure has a large range of use, but due to the poor heat dissipation effect of the original structure, the product life is not long, and the fin type aluminum lamp cup makes the product particularly cumbersome. The working temperature is very important for the LED. Above or below its normal operating temperature range, it will affect its use effect and service life. Therefore, the heat dissipation problem cannot be solved well, and the LED lighting fixture will be used. A lot of restrictions" [New content] The purpose of this creation is to provide a multi-layer heat dissipation structure for LED lighting fixtures to solve the problem of poor heat dissipation. In order to solve the problem of poor heat dissipation, the multi-layer heat dissipation structure of the LED lighting fixture comprises: a circuit board, a LED chip, a lampshade and a heat dissipation overall. The heat dissipation body further includes: a heat conducting sheet and a heat dissipating body having a multi-layer structure; wherein the heat dissipating body is provided with a heat radiating through hole. The heat sink is made of one of copper, slag, iron, stainless steel, or heat conductive ceramics. The heat conductor is connected to the circuit board through a heat conductive sheet, and the shape and structure thereof may be different according to the distribution of the LED chip and the structure of the circuit board, and may be zigzag or corrugated, and the heat sink The extended file and the circuit board and the lamp cover form a closed space, and the LED chip is distributed on the circuit board and is within the closed space. The above-mentioned powder furnace has N-layer rotation (N is a positive number greater than or equal to 2) 'the number is sequentially from the inside to the outside, the innermost is the first layer of the heat sink, and the second layer is the heat sink, according to the push, each layer There is a certain space between the heat sinks. The space between the first layer and the second layer is the first space. The space between the second layer and the third layer is the second space. analogy. This creation - kind of LED _ luminaire (four) Wei hotspot: (1) set the Wei heat vent on the heat sink, making the expansion of = eight more effective; (2) the heat sink is a multi-layer heat dissipation structure, filling; (3) the heat sink _ The shape is woven or corrugated, and the filling of the wire =::: τ road plate and the lampshade constitute an exothermic heat to protect the inner LED chip. [Embodiment] In order to make the multilayer heat dissipation structure of the LED lighting fixture M391623 of the present invention more detailed, the following will be described in detail with reference to the drawings. Referring to FIG. 1 , FIG. 1 is a cross-sectional view of an MR16 spotlight having a four-layer heat dissipation structure. The lamp has four layers of heat sinks connected to the circuit board 01 through the heat conductive sheet 02, and the circuit board 01 at the joint is A gap of a certain width is left between the first layer of heat sinks 021 and between the heat sinks of the layers to facilitate heat dissipation. The first heat sink 021 and the fourth heat sink 024 enclose a bowl-shaped space, the circuit board 01 is located at the bottom of the bowl space, and the second layer heat sink 022 and the third layer heat sink 23 are arranged in a zigzag manner. The space between the first layer of the heat sink body 21 and the second layer heat sink 022 is the first space 0211, and the second layer heat sink 022 and the third layer heat sink are effectively enlarged. The space between the crucibles 23 is the second space 〇221, and the space between the second layer radiator 023 and the fourth layer radiator 〇24 is the third space 0231. A heat dissipation vent 08 is disposed on each of the heat sinks (the first heat sink body 21, the second heat sink body 022, the third layer heat sink body 23, and the fourth layer heat sink body 24). 〇8 is formed by drilling, punching, forging, side, and puncture. In the middle of the first layer of heat sinks 21, there is a card d, which is engaged with the lamp cover 06, and then encloses the circuit board 成1 with a closed space 10, which can protect the inner side of the LED chip 〇4. Further, the circuit board G1 is provided with a lens G5 covering the LED chip 〇4 respectively. Please refer to FIG. 2, which is a splicing shed with a five-layer heat dissipation structure. Its structure is roughly similar to that of the MR16 spotlight with four layers of heat dissipation in Figure 1. It is not added - the layer is recorded: 5 M391623 shaped heat sink is also the fifth layer of heat sink 025 of Figure 2. Please refer to Figure 3. Figure 3 is a cross-sectional view of a PAR lamp with a three-layer heat dissipation structure. The first end of the first layer heat sink 21 is connected to the convex portion of the middle portion of the circuit board 1 through the heat conductive sheet 02. One end of the second layer heat sink 022 passes through the heat conductive sheet 〇2 and the middle portion of the circuit board 01. The corners are connected, one end of the third layer heat sink 023 is connected to the end of the circuit board ,1, and the other ends are connected to the lamp cap. Thus, a first space 〇 211 is formed between the first layer of heat sinks 021, and a second space 0221 'the second layer is formed between the first layer of heat sinks 021 and the second layer of heat sinks 22 A third space 0231 is formed between the heat sink 022 and the third layer heat sink 23 . The circuit board 01, the lamp cover 06, and the third layer heat sink body 23 are formed into a closed space 10' which effectively protects the LED chip 04 on the circuit board 01 therein. The heat dissipating body has a corrugated shape, and the increased heat dissipating area and the heat dissipating vent 8 thereon cause the heat generated by the LED black sheet 04 to be emitted more rapidly. Referring to FIG. 4, FIG. 3 is a cross-sectional view of a led bulb having a two-layer heat dissipation structure. The LED bulb has only two layers of heat dissipation structure, and one end of the first layer of the thermal body 021 passes through the thermal conductive sheet 〇2 and the circuit board. The intermediate raised portions of the crucible 1 are connected, and the second layer of the heat sink 22 is also connected to the end of the circuit board 1 through the thermal pad 02, and the other ends are connected to the lamp thief. This recording record shows the shape of the force and the distribution of the LED chip 〇4 to form a suitable and aesthetically pleasing external shape, that is, the heat of the heat can be protected. Please refer to Figure 5 and Figure 6. Figure 5 and Figure 6 are respectively the heat dissipation schematic diagram of the multi-layer heat dissipation structure of the 6 LED lighting fixture and a partial enlarged view of the thermal principle diagram. Wherein, when the LED chip 04 starts to work, the generated thermal energy 09 is transmitted to the circuit board 01, and then transmitted to the heat sinks of the respective layers through the thermal conductive sheet 02. The thermal energy 〇9 of the first layer of heat sinks 21 is transmitted inside itself, wherein a part of the heat energy 〇9 is transferred to the outside air, and the other part is transmitted to the first space 〇211; the second The thermal energy 〇9 of the layer heat sink 022 is partially transferred to the first space 〇211, and the other part is transferred to the second space 0221. The thermal energy 09 of the first space 〇211 passes through the first layer heat sink. The heat dissipation vent 8 on the 〇21 is diffused to the outside', and can also pass through the second layer heat sink 22, the third layer heat sink 23, the fourth layer heat sink 024, and the fifth layer heat sink 〇25. The heat dissipation vent 08 is diffused to the outside. The thermal energy 〇9 on the second layer heat sink 023 is diffused into the second space 0221 and the third space 〇231, and the thermal energy 〇9_# of the third space 〇231 passes through the second layer heat sink 022 and the The heat dissipation vent G8 on the first layer heat sink 021 is diffused to the outside, and the other portion is expanded by the fourth layer heat sink 024 and the heat dissipation vent 8 on the fifth layer heat sink 25 Go outside. The heat dissipation of the fourth layer of heat sinks 24 and the fifth layer of heat sinks 025 is also the same as that of other shapes of LED lighting fixtures. The above-mentioned embodiments are not intended to limit the applicability of the present invention. The scope of protection of this creation should be based on the technical spirit defined by the scope of the patent application scope of this creation and the scope of its equal changes. That is to say, M391623 should be regarded as a further implementation of this creation, and the brothers should not lose the essence of this creation, and will not deviate from the spirit of this creation and the Fan Garden. [Simple diagram of the diagram] The diagram is a cross-sectional view of a spotlight with a four-layer heat dissipation structure. Figure 2 is a cross-sectional view of a MR16 spotlight with a five-layer heat dissipation structure. Figure 3 is a three-layered thief of this age. Fig. 4 is a cross-sectional view of the LED bulb with two layers of heat dissipation structure. Fig. 5 is a schematic diagram of the heat dissipation junction of the LED layer of the creation. Fig. 6 is a partial enlarged view of the heat dissipation schematic diagram of Fig. 5. [Main component symbol description] 01 to circuit board 02 to thermal conductive sheet 04 to LED chip 05 to lens 06 to lamp cover 08 to heat dissipation vent 10 to closed space 021 to first layer heat sink