M375176 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種LED燈具，尤指一種具有環場照明的 LED燈具。 【先前技術】 [0002] 發光二極體（1 ight emi 11 ing diode ; LED)具有省電 、環保、使用壽命長、體積小、不易破損等優點，已逐 漸取代傳統光源而應用於汽車、通訊、消費性電子產品 等各種不同領域。然而，LED所發出的光線只能夠照射在 一定範圍内，因此，業界持續不斷地研發能夠產生360度 環場照明效果的燈具。台灣專利TWM306299號揭露一種 LED環射燈具結構100，如第一圖所示，在基座110的中 心處垂直豎立一柱體120，在柱體120的外圍表面上設有 數個直線排列的LED 130，藉由環繞柱體120所設置的多 個LED 130,可以產生360度的環場照明效果。 [0003] 然而，此種結構在實際操作時產生一些問題：為了達到 所需要的環場照明效果與亮度，因此必須增加LED 130的 數量，因而增加製造成本與組裝時間。另一方面，由於 LED 130的數量很多，加上這些LED 130排列緊密，所以 單靠柱體120無法充分散熱，致使LED 130的工作溫度很 高，而勢必影響LED 130的使用壽命，如此亦增加維修的 次數與成本。 [0004] 因此，如何解決上述之問題點，即成為本創作人所改良 之目標。 表單编號A0101 第3頁/共17頁 M375176 【新型内容】 [0005] 本創作之一目的，在於提供一種具有環場照明的LED燈具 ，其能夠使燈具的所有側面均具有足夠亮度，並產生360 度環場照明效果。 [0006] 為了達成上述之目的，本創作係提供一種具有環場照明 的LED燈具，包括：一燈座；一第一基板，固定於該燈座 上；一階梯結構，安裝在該第一基板上，該階梯結構包 含連接於該第一基板的一第一環框、連接於該第一環框 的一第二基板、及連接於該第二基板的一第二環框，該 第二環框的周緣尺寸小於該第一環框的周緣尺寸；以及 多數個LED，分別固定在該第一基板及該第二基板，並環 設圍繞於該第一環框及該第二環框外周圍。 [0007] 相較於先前技術，本創作具有以下功效： [0008] 1.由於本創作具有一階梯狀立體結構，並使多數個LED環 設圍繞於具有不同高度的第一基板、第二基板、及第三 基板上，所以整個燈具的所有侧面均具有足夠亮度，因 此可提供360度環場照明效果，且亦增加燈具的立體照明 範圍。 [0009] 2.由於本創作的LED是以階梯狀立體環狀排列，所以比起 習知技術中LED均緊密地排列在單一表面上，本創作的 LED分佈密度較小，LED所產生的熱量被第一環框及第二 環框傳導至第一基板，再配合第一基板背面所貼附的一 散熱器，使得本創作具有良好的導熱散熱效果，因此能 夠使LED維持在正常的工作溫度下而延長LED燈具的使用 表單編號A0101 第4頁/共17頁 M375176 壽命。 [0010] 3.由於第一環框與第二環框的外表面上分別設有反射層 ，所以LED發射到鄰近反射層上的光線會被該反射層朝向 燈具的外部反射出去，如此一來，可增加整個燈具側向 的總亮度。換句話說，由於本創作同時運用反射光線作 為一部分的照明光線，所以比起習知技術僅單純運用正 向發出的光線來說，本創作可以用較少數量的LED獲得相 同的亮度，如此一來，可減少製造成本與組裝時間。 【實施方式】 [0011] 有關本創作之詳細說明及技術内容，將配合圖式說明如 下，然而所附圖式僅作為說明用途，並非用於侷限本創 作。 [0012] 請參考第二圖，係為本創作之立體分解圖。本創作係提 供一種具有環場照明的LED燈具，主要包括：一燈座10、 一第一基板20、一階梯結構30、多數個LED 40、及一燈 罩50。另外，在第一基板20中與LED 40相反的表面上， 裝附有一散熱器60 (第二圖中省略並未顯示，請參閱第五 圖），此散熱器60係用於整個燈具的散熱，這一點稍後會 詳加敘述。 [0013] 在本創作的一實施例中，燈座10的上半部與燈罩50各成 型為互相配合的一中空半圓球體。燈罩50的邊緣設有多 個卡鉤51，燈座10的邊緣則設有供卡鉤51嵌固的多個卡 槽11，藉此燈座10與燈罩50兩者結合而形成所述LED燈 具的主體，並在兩者之間形成一容置空間。 表單編號A0101 第5頁/共17頁 [0014] 第一基板20為一圓板狀且内層具有金屬的印刷電路板 (Metal Core PCB，MCPCB)，其固定於燈座10上。燈 座10的内緣突設有多個凸塊12，可供第一基板20以焊接 或其他方式固定於燈座10上。第一基板20的直徑略小於 燈座10的内徑，因此第一基板20固定於燈座10上時並不 會覆蓋住卡槽11而妨礙燈座10與燈罩50之結合。 [0015] 階梯結構30安裝在第一基板20上，其包括：連接於第一 基板20的一第一環框31、連接於第一環框31的一第二基 板32、及連接於第二基板32的一第二環框33，其中第二 環框33的周緣尺寸小於第一環框31的周緣尺寸。 [0016] 第一環框31及第二環框33為例如鋁等導熱性佳的金屬所 製成，其壁體較厚，藉此增加導熱面積。類似於第一基 板20，第二基板32亦為一圓板狀為一圓板狀且内層具有 金屬的印刷電路板（MCPCB)。另外，在本實施例中，更包 括連接在第二環框33的一第三基板34。同樣地，第三基 板34亦為一圓板狀為一圓板狀且内層具有金屬的印刷電 路板（MCPCB)。所述LED 40分別固定在第一基板20、第 二基板32、及第三基板34上，並環設圍繞於第一環框31 及第二環框33外周圍。如第三圖所示，本創作明顯地形 成三層式階梯狀立體結構，而第四圖以局部剖面圖顯示 本創作的結構及其内部概略的電路配置。 [0017] 參考第五圖，第一環框31的外表面塗有一反射層311，第 二環框33的外表面塗有一反射層331，反射層311與331 均用以反射LED 40所發出的光線。反射層311與331例如 為一鏡面塗層，但其材質並未侷限於此。第一基板2 0上 表單编號A0101 第6頁/共17頁 M375.176 的LED 40所發出的光線能夠被鄰近的第一環框31上設置 的反射層311反射'到整個燈具的外部，而第二基板32上的 LED 40所發出的光線能夠被鄰近的第二環框33上設置的 反射層331反射到整個燈具的外部。另外，不管所使用的 LED 40為正向發光型LED或側射型LED，反射層311與 331都能夠將鄰近的LED 40所發出的光線局部朝向燈具 外部反射出去，而不會被第一環框31與第二環框33所吸 收《因此，本創作運用反射層311與331，可以增強燈具 側向的整體亮度。換句話說.，本創作可以運用較少數量 « 的LED 40，便能夠達到相同的亮度要求，如此一來，可 以減少製造成本與組裝時間。 [0018] 根據本創作，由於所有的LED 40並非擁擠地排列在同一 平面上，而是分別安裝在具有不同高度的第一基板20、 第二基板32及第三基板34上，並且LED 40所產生的熱量 ’被第一環框31與第二環框33傳導至第一基板20，然後透 過貼附於第一基板20的另一面上並容置於燈座10内的一 散熱器60將熱量散逸出去，而且，此散熱器60配合第一 基板20的形狀而被製作成圓環狀，以擴大散熱面積。因 此，本創作具有很好的傳熱與散熱效果。 [0019] 參考第六圖，根據本發明的另一實施例，其與第一實施 例的差異在於本實施例形成四層式階梯狀立體結構。明 確地說，可以根據燈座10與燈罩50之間的容置空間大小 ，以及所運用的LED 40之尺寸，而排列出四層、甚至五 層的立體結構。在第六圖中僅顯示四層式階梯狀立體結 構，其係在第一基板20與第一環框31之間額外設置一第 表單编號A0101 第7頁/共17頁 M375176 三環框35及一第四基板36，且第三環框35的外表面亦設 有一反射層351，藉此使LED 40排列成四層式階梯狀立 體結構。顯然地，由於LED 40的數量增加，所以此種結 構能夠提供更均勻且亮度更大的環場照明效果。當然， 同樣地，LED 40所產生的熱量被第一環框31、第二環框 33及第三環框35傳導至第一基板20，然後透過散熱器60 將熱量散逸出去，而達到良好的傳熱與散熱效果。 [0020] 綜上所述，當知本創作之具有環場照明的LED燈具已具有 產業利用性、新穎性與進步性，又本創作之構造亦未曾 見於同類產品及公開使用，完全符合新型專利申請要件 ，爰依專利法提出申請。 【圖式簡單說明】 [0021] [0022] [0023] [0024] [0025] 第一圖係習知環場照明燈具之立體圖。 第二圖係本創作LED燈具之分解立體圖。 第三圖係本創作LED燈具之立體組合圖。 第四圖係本創作LED燈具沿著第三圖的直線4-4所作之局 部剖面圖。 第五圖係本創作LED燈具處於工作狀態下之局部剖面圖 [0026] 第六圖係本創作LED燈具另一實施例處於工作狀態下之 局部剖面圖。 【主要元件符號說明】 [0027] 〈習知〉 表單編號A0101 第8頁/共17頁 M375.176M375176 V. New Description: [New Technology Field] [0001] This creation is about an LED lamp, especially an LED lamp with ring field illumination. [Prior Art] [0002] Light-emitting diodes (LEDs) have the advantages of power saving, environmental protection, long service life, small size, and are not easily damaged. They have gradually replaced traditional light sources and are used in automobiles and communications. , consumer electronics and other different fields. However, the light emitted by the LED can only be illuminated within a certain range, so the industry continues to develop lamps that produce 360-degree surround illumination. Taiwan Patent No. TWM306299 discloses an LED ring light fixture structure 100. As shown in the first figure, a column 120 is vertically erected at the center of the susceptor 110, and a plurality of linearly arranged LEDs 130 are disposed on the peripheral surface of the column 120. By the plurality of LEDs 130 disposed around the cylinder 120, a 360 degree ring field illumination effect can be produced. [0003] However, such a structure causes some problems in actual operation: in order to achieve the desired ring field illumination effect and brightness, it is necessary to increase the number of LEDs 130, thereby increasing manufacturing cost and assembly time. On the other hand, since the number of LEDs 130 is large, and these LEDs 130 are closely arranged, the column 120 alone cannot be sufficiently dissipated, so that the operating temperature of the LED 130 is high, which inevitably affects the service life of the LED 130, and thus increases. The number and cost of repairs. [0004] Therefore, how to solve the above problems becomes the goal of improvement by the present creator. Form No. A0101 Page 3 of 17 M375176 [New Content] [0005] One of the purposes of this creation is to provide an LED luminaire with a ring field illumination that enables sufficient brightness on all sides of the luminaire and produces 360 degree ring field lighting effect. [0006] In order to achieve the above object, the present invention provides an LED lamp with a ring field illumination, comprising: a lamp holder; a first substrate fixed to the lamp holder; and a stepped structure mounted on the first substrate The stepped structure includes a first ring frame connected to the first substrate, a second substrate connected to the first ring frame, and a second ring frame connected to the second substrate, the second ring The circumference of the frame is smaller than the circumference of the first ring frame; and a plurality of LEDs are respectively fixed on the first substrate and the second substrate, and are circumferentially surrounding the first ring frame and the outer periphery of the second ring frame . Compared with the prior art, the present invention has the following effects: [0008] 1. Since the creation has a stepped three-dimensional structure, and the plurality of LED rings are disposed around the first substrate and the second substrate having different heights. And the third substrate, so that all sides of the entire luminaire have sufficient brightness, so it can provide 360-degree ring field illumination, and also increase the stereo illumination range of the luminaire. [0009] 2. Since the LEDs of the present invention are arranged in a stepped three-dimensional ring shape, the LEDs of the present invention are less densely distributed and the heat generated by the LEDs is smaller than that of the prior art. Conducted by the first ring frame and the second ring frame to the first substrate, and then coupled with a heat sink attached to the back surface of the first substrate, the present invention has good heat dissipation and heat dissipation effect, thereby maintaining the LED at a normal operating temperature. The use of extended LED luminaires is shown in Form No. A0101 Page 4 of 17 M375176 Lifetime. [0010] 3. Since the outer surface of the first ring frame and the second ring frame are respectively provided with a reflective layer, the light emitted by the LED to the adjacent reflective layer is reflected by the reflective layer toward the outside of the lamp, so that Can increase the total brightness of the entire lamp laterally. In other words, since this creation uses reflected light as part of the illumination light, the creation can use the same amount of light to obtain the same brightness compared to the conventional technique. This can reduce manufacturing costs and assembly time. [Embodiment] The detailed description and technical contents of the present invention will be described below with reference to the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention. [0012] Please refer to the second figure, which is an exploded perspective view of the present invention. The present invention provides an LED lamp with a ring field illumination, which mainly comprises: a lamp holder 10, a first substrate 20, a step structure 30, a plurality of LEDs 40, and a lamp cover 50. In addition, on the surface of the first substrate 20 opposite to the LED 40, a heat sink 60 is attached (not shown in the second figure, please refer to the fifth figure), and the heat sink 60 is used for heat dissipation of the entire lamp. This will be described later in detail. [0013] In an embodiment of the present invention, the upper half of the socket 10 and the lampshade 50 are each shaped as a hollow semi-spherical sphere that cooperates with each other. The edge of the lamp cover 50 is provided with a plurality of hooks 51. The edge of the lamp holder 10 is provided with a plurality of card slots 11 for inserting the hooks 51. The lamp holder 10 and the lamp cover 50 are combined to form the LED lamp. The main body and form a space between the two. Form No. A0101 Page 5 of 17 [0014] The first substrate 20 is a disk-shaped and metal-clad printed circuit board (MCPCB) having an inner layer fixed to the socket 10. A plurality of bumps 12 are protruded from the inner edge of the socket 10 for the first substrate 20 to be soldered or otherwise fixed to the socket 10. The diameter of the first substrate 20 is slightly smaller than the inner diameter of the socket 10. Therefore, when the first substrate 20 is fixed to the socket 10, the card slot 11 is not covered and the combination of the socket 10 and the lamp cover 50 is hindered. The stepped structure 30 is mounted on the first substrate 20, and includes: a first ring frame 31 connected to the first substrate 20, a second substrate 32 connected to the first ring frame 31, and connected to the second A second ring frame 33 of the substrate 32, wherein the circumference of the second ring frame 33 is smaller than the circumference of the first ring frame 31. [0016] The first ring frame 31 and the second ring frame 33 are made of a metal having good thermal conductivity such as aluminum, and the wall thereof is thick, thereby increasing the heat transfer area. Similar to the first substrate 20, the second substrate 32 is also a printed circuit board (MCPCB) having a disk shape and a circular plate shape and an inner layer having a metal. In addition, in the embodiment, a third substrate 34 connected to the second ring frame 33 is further included. Similarly, the third substrate 34 is also a printed circuit board (MCPCB) having a disk shape and a circular plate shape and an inner layer having a metal. The LEDs 40 are respectively fixed on the first substrate 20, the second substrate 32, and the third substrate 34, and are surrounded by the outer circumferences of the first ring frame 31 and the second ring frame 33. As shown in the third figure, the creation is clearly formed into a three-layered stepped three-dimensional structure, and the fourth figure shows the structure of the creation and its internal schematic circuit configuration in a partial sectional view. [0017] Referring to the fifth figure, the outer surface of the first ring frame 31 is coated with a reflective layer 311, and the outer surface of the second ring frame 33 is coated with a reflective layer 331, and the reflective layers 311 and 331 are both used to reflect the LED 40 Light. The reflective layers 311 and 331 are, for example, a mirror coating, but the material thereof is not limited thereto. The light emitted by the LED 40 of the first substrate frame 30 on the first substrate 20 on the form number A0101, page 6 / page 17 of M375.176 can be reflected by the reflective layer 311 disposed on the adjacent first ring frame 31 to the outside of the entire lamp. The light emitted by the LEDs 40 on the second substrate 32 can be reflected by the reflective layer 331 disposed on the adjacent second ring frame 33 to the outside of the entire lamp. In addition, regardless of whether the LED 40 used is a forward-illuminated LED or a side-emitting LED, the reflective layers 311 and 331 can partially illuminate the light emitted by the adjacent LED 40 toward the outside of the luminaire without being blocked by the first ring. The frame 31 and the second ring frame 33 are absorbed. Therefore, the present invention uses the reflective layers 311 and 331 to enhance the overall brightness of the lamp laterally. In other words, this creation can achieve the same brightness requirements with a smaller number of LEDs 40, which can reduce manufacturing costs and assembly time. [0018] According to the present creation, since all of the LEDs 40 are not crowdedly arranged on the same plane, they are respectively mounted on the first substrate 20, the second substrate 32, and the third substrate 34 having different heights, and the LEDs 40 The generated heat is conducted to the first substrate 20 by the first ring frame 31 and the second ring frame 33, and then passes through a heat sink 60 attached to the other surface of the first substrate 20 and housed in the socket 10. The heat is dissipated, and the heat sink 60 is formed in an annular shape in accordance with the shape of the first substrate 20 to expand the heat dissipation area. Therefore, this creation has a good heat transfer and heat dissipation effect. [0019] Referring to a sixth embodiment, a difference from the first embodiment in accordance with another embodiment of the present invention is that the present embodiment forms a four-layered stepped solid structure. Specifically, four or even five layers of the three-dimensional structure can be arranged according to the size of the accommodation space between the lamp holder 10 and the lamp cover 50 and the size of the LED 40 to be used. In the sixth figure, only a four-layered stepped solid structure is shown, which is additionally provided with a first form number A0101, a seventh frame 20, a total of 17 pages, M375176, a three-ring frame 35, between the first substrate 20 and the first ring frame 31. And a fourth substrate 36, and the outer surface of the third ring frame 35 is also provided with a reflective layer 351, thereby arranging the LEDs 40 into a four-layer stepped three-dimensional structure. Obviously, since the number of LEDs 40 is increased, such a structure can provide a more uniform and brighter ring field illumination effect. Of course, the heat generated by the LED 40 is conducted to the first substrate 20 by the first ring frame 31, the second ring frame 33, and the third ring frame 35, and then the heat is dissipated through the heat sink 60 to achieve good performance. Heat transfer and heat dissipation. [0020] In summary, when the LED lamp with ambient lighting has been industrially utilized, novel and progressive, and the structure of the creation has not been seen in similar products and publicly used, fully complying with the new patent. Apply for the requirements and apply for the patent law. BRIEF DESCRIPTION OF THE DRAWINGS [0025] [0025] [0025] The first figure is a perspective view of a conventional ring field lighting fixture. The second picture is an exploded perspective view of the LED lamp of the present creation. The third picture is a three-dimensional combination of the LED lamps. The fourth figure is a partial cross-sectional view of the LED lamp of the present invention taken along line 4-4 of the third figure. The fifth figure is a partial cross-sectional view of the present LED lamp in an operating state. [0026] The sixth figure is a partial cross-sectional view of another embodiment of the present LED lamp in an operating state. [Explanation of Main Component Symbols] [0027] <Appreciation> Form No. A0101 Page 8 of 17 M375.176
[0028] 100 LED環射燈具結構 [0029] 110基座 [0030] 120柱體 [0031] 130 LED [0032] 〈本創作〉 [0033] 10燈座 [0034] 11卡槽 12 凸塊 [0035] 20第一基板 [0036] 30階梯結構 [0037] 31第一環框 311 反射層 [0038] 32第二基板 33 第二環框 [0039] 331反射層 34 第三基板 [0040] 35第三環框 351 反射層 [0041] 36第四基板 [0042] 40LED [0043] 50燈罩 51 卡鉤 [0044] 60散熱器 表單编號A0101 第9頁/共17頁100 LED ring light fixture structure [0029] 110 base [0030] 120 cylinder [0031] 130 LED [0032] <This creation> [0033] 10 lamp holder [0034] 11 card slot 12 bump [0035 20 first substrate [0036] 30 step structure [0037] 31 first ring frame 311 reflective layer [0038] 32 second substrate 33 second ring frame [0039] 331 reflective layer 34 third substrate [0040] 35 third Ring frame 351 reflective layer [0041] 36 fourth substrate [0042] 40LED [0043] 50 lampshade 51 hook [0044] 60 heat sink form number A0101 page 9 of 17