TWM508010U - Light emitting diode bulb - Google Patents
Light emitting diode bulb Download PDFInfo
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- TWM508010U TWM508010U TW104201411U TW104201411U TWM508010U TW M508010 U TWM508010 U TW M508010U TW 104201411 U TW104201411 U TW 104201411U TW 104201411 U TW104201411 U TW 104201411U TW M508010 U TWM508010 U TW M508010U
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Description
本新型係有關一種燈泡,尤指一種發光二極體燈泡。The present invention relates to a light bulb, especially a light-emitting diode bulb.
自然光來自於太陽,而為了排除對黑暗的不便與恐懼,人類發展出了人工照明,從火炬到愛迪生的白熾燈泡,再進一步衍生出螢光燈管、發光二極體等照明技術。雖然目前照明最常使用的為螢光燈,但發光二極體因為有著節能省電、環保、體積小、壽命長、響應快、抗震性好等優點,已逐漸應用於日常生活之中,從指示燈、一般照明、商用照明到背光源、車用照明等,都可看見發光二極體的應用,故發光二極體可以說是未來最有潛力的照明光源。Natural light comes from the sun, and in order to eliminate the inconvenience and fear of darkness, humans have developed artificial lighting, from the torch to Edison's incandescent bulbs, and further derived from fluorescent tubes, light-emitting diodes and other lighting technologies. Although the most commonly used lighting is fluorescent light, the light-emitting diode has been gradually applied to daily life because of its advantages of energy saving, environmental protection, small size, long life, fast response, and good shock resistance. Indicator lights, general lighting, commercial lighting to backlights, automotive lighting, etc., can be seen in the application of light-emitting diodes, so the light-emitting diode can be said to be the most promising lighting source in the future.
但由於發光二極體的出光效率容易受到高溫的影響而下降,因此需要搭配散熱裝置一起使用,如中華民國新型專利第M489970號之「可提高散熱效果的發光二極體燈泡」,其包含有一散熱燈杯、一組接端、一座體、至少一發光二極體元件與至少一透光件。該散熱燈杯包含有一開口端以及一連通該開口端的裝配空間,該座體設置於該裝配空間內,該發光二極體設置於該座體相鄰該開口端之一側,該透光件設置於該散熱燈杯的該開口端,該組接端設置於該散熱燈杯遠離該開口端之一端,利用該座體大面積的接觸該散熱燈杯,並於該散熱燈杯的外側面形成散熱鰭片,提高導熱效率。However, since the light-emitting efficiency of the light-emitting diode is easily affected by the high temperature, it is required to be used together with a heat-dissipating device, such as the "Light-emitting diode bulb for improving the heat dissipation effect" of the Republic of China No. M489970, which includes a heat sink cup, a set of ends, a body, at least one light emitting diode element and at least one light transmissive member. The heat dissipation lamp cup includes an open end and an assembly space that communicates with the open end. The base body is disposed in the assembly space, and the light emitting diode is disposed on a side of the open end of the seat body, the light transmitting member Provided on the open end of the heat-dissipating lamp cup, the set of the connecting end is disposed at one end of the heat-dissipating lamp cup away from the open end, and the large-area contact of the heat-dissipating lamp cup with the seat body and the outer side of the heat-dissipating lamp cup Form heat sink fins to improve heat transfer efficiency.
由於該散熱燈杯外露,且由金屬材料所製成,運作一段時間後,該散熱燈杯的溫度會提高,若使用者此時不小心觸碰到該散熱燈杯則會造成燙傷,又因金屬質地較為堅硬,於替換燈泡時,容易被散熱鰭片刮傷。Since the heat-dissipating lamp cup is exposed and made of a metal material, the temperature of the heat-dissipating lamp cup is increased after a period of operation, and if the user accidentally touches the heat-dissipating lamp cup, the scald may be caused. The metal texture is relatively hard and is easily scratched by the fins when replacing the bulb.
本新型之主要目的,在於解決因散熱燈杯外露,使用者於使用時容易造成燙傷或刮傷等問題。The main purpose of the novel is to solve the problem that the user is likely to cause burns or scratches when using the heat-dissipating lamp cup.
為達上述目的,本新型提供一種發光二極體燈泡,包含有一塑膠殼體、一散熱件、一發光模組、一透光罩、一電源連接座以及一導電件。該塑膠殼體包含有一中空通道,該中空通道形成一內壁,該散熱件固定設置於該內壁表面,該發光模組包含有一固設於該散熱件的基板以及一設置於該基板遠離該散熱件之一側的發光二極體,該透光罩罩覆於該塑膠殼體相鄰該發光模組之一側,並形成一容置該發光二極體的容置空間,該電源連接座連接於該塑膠殼體遠離該透光罩之一側,並透過該導電件電性連接該發光模組。To achieve the above objective, the present invention provides a light-emitting diode bulb comprising a plastic case, a heat sink, a light-emitting module, a light-transmissive cover, a power connection base, and a conductive member. The plastic housing includes a hollow passage, the hollow passage defines an inner wall, and the heat dissipating member is fixedly disposed on the inner wall surface. The light emitting module includes a substrate fixed to the heat dissipating member and a substrate disposed away from the heat dissipating member. a light-emitting diode on one side of the heat sink, the light-transmissive cover covering one side of the plastic housing adjacent to the light-emitting module, and forming a receiving space for accommodating the light-emitting diode, the power connection The housing is connected to the plastic housing away from the side of the transparent cover, and is electrically connected to the light emitting module through the conductive member.
由上述說明可知,本新型具有以下特點:It can be seen from the above description that the novel has the following characteristics:
一、藉由將該塑膠殼體設置於該散熱件之外,可以防止使用者於使用時被該散熱件燙傷或刮傷,並保持原本的散熱效能。1. By disposing the plastic case outside the heat dissipating member, it is possible to prevent the user from being burned or scratched by the heat dissipating member during use, and maintaining the original heat dissipating performance.
二、該塑膠殼體較該散熱件好看、大方,且可依據不同的場所使用不同顏色的塑膠殼體,使配色多樣化。Second, the plastic shell is better and more generous than the heat dissipating component, and the plastic shells of different colors can be used according to different places, so that the color matching is diversified.
有關本新型之詳細說明及技術內容,現就配合圖示說明如下:The detailed description and technical content of this new model are as follows:
請參閱「圖1」及「圖2」所示,本新型為一種發光二極體燈泡,包含有一塑膠殼體10、一散熱件20、一發光模組30、一透光罩40、一電源連接座50以及一導電件60。該塑膠殼體10包含有一中空通道11,並藉由該中空通道11形成一內壁12,該散熱件20為一中空的圓柱體,且該散熱件20之高度大於該散熱件20之外徑的三分之一,可以增加該散熱件20的散熱面積,提高散熱效能,並將該散熱件20固定設置於該內壁12表面,藉由將該散熱件20內藏於該塑膠殼體10內,可以防止使用者於燈泡運作時觸碰到該散熱件20而燙傷,且該塑膠殼體10較該散熱件20美觀、大方,並可以配合不同的場所而使用不同的顏色或彩色,使配色多樣化。該發光模組30包含有一固設於該散熱件20的基板31以及一設置於該基板31遠離該散熱件20之一側的發光二極體32,於本實施例中,該發光二極體32為複數個,並使用晶片直接封裝(Chip On Board,簡稱COB)的封裝技術,將該些發光二極體32封裝在一起,形成一發光二極體封裝板33,並可直接將熱傳導到基板31上以增加發光二極體32的散熱效能。該基板31包含有一穿孔311供該導電件60穿過,該散熱件20與該基板31可以利用螺絲或導熱膠固定,其中,該散熱件20相鄰該基板31之一側有一朝該塑膠殼體10之方向延伸的延伸散熱部21,該延伸散熱部21使該基板31與該散熱件20的接觸面積增加,提高散熱效率。Please refer to FIG. 1 and FIG. 2 , which is a light-emitting diode bulb, which comprises a plastic shell 10 , a heat sink 20 , a light-emitting module 30 , a light-transmitting cover 40 , and a power source . The connector 50 and a conductive member 60. The plastic housing 10 includes a hollow passage 11 , and an inner wall 12 is formed by the hollow passage 11 . The heat dissipation member 20 is a hollow cylinder, and the height of the heat dissipation member 20 is greater than the outer diameter of the heat dissipation member 20 . One third of the heat dissipation member 20 can be added to the surface of the inner wall 12 by the heat dissipation area of the heat sink 20, and the heat sink 20 is built in the plastic case 10. The plastic housing 10 can be prevented from being burned by touching the heat sink 20 when the light bulb is in operation, and the plastic housing 10 is more beautiful and generous than the heat sink 20, and can be used with different colors or colors in different places. Diversified color combinations. The light emitting module 30 includes a substrate 31 fixed to the heat sink 20 and a light emitting diode 32 disposed on a side of the substrate 31 away from the heat sink 20. In the embodiment, the light emitting diode 32 is a plurality of packages, and the LEDs are encapsulated together by a Chip On Board (COB) package to form a light-emitting diode package 33 and directly conduct heat to The substrate 31 is mounted to increase the heat dissipation performance of the LEDs 32. The substrate 31 includes a through hole 311 for the conductive member 60 to pass therethrough, and the heat dissipating member 20 and the substrate 31 can be fixed by using a screw or a thermal conductive adhesive, wherein the heat dissipating member 20 is adjacent to one side of the substrate 31 toward the plastic case. The extending heat dissipating portion 21 extending in the direction of the body 10 increases the contact area between the substrate 31 and the heat sink 20, thereby improving heat dissipation efficiency.
該透光罩40包含有一主體42以及一設置於該主體42表面的一霧化面43,並罩覆於該塑膠殼體10相鄰該發光模組30之一側,形成一容置該發光二極體32的容置空間41,當從該發光二極體32發射出的光線接觸到該霧化面43時,部份光線會被反射回來,最後再以不同的角度出射出該透光罩40,該透光罩40的最大周徑大於該透光罩40連接該塑膠殼體10的周徑,則可以增加光線的出光角度,以產生接近360度的全周光照明而沒有死角,而該霧化面43則可以使光均勻的散出。The light transmissive cover 40 includes a main body 42 and an atomizing surface 43 disposed on the surface of the main body 42 and is disposed on one side of the plastic housing 10 adjacent to the light emitting module 30 to form a light receiving portion. The accommodating space 41 of the diode 32, when the light emitted from the illuminating diode 32 contacts the atomizing surface 43, part of the light is reflected back, and finally the light is emitted at different angles. The cover 40, the maximum circumference of the transparent cover 40 is larger than the circumference of the transparent cover 40 connected to the plastic casing 10, thereby increasing the light exit angle to generate a full-circumference illumination of approximately 360 degrees without a dead angle. The atomizing surface 43 allows the light to be evenly dispersed.
該電源連接座50連接於該塑膠殼體10遠離該透光罩40之一側,並透過該導電件60穿過該穿孔311電性連接於該發光模組30。The power connector 50 is connected to the side of the transparent cover 40 and is electrically connected to the light module 30 through the through hole 311.
請參閱「圖3」所示,為本新型另一實施例之剖面示意圖,該散熱件20的外表面包含有複數個朝該塑膠殼體10方向延伸的散熱片22,該些散熱片22配合該散熱件20而呈現鋸齒狀的結構,藉由該些散熱片22的設置,使該散熱件20與該塑膠殼體10的接觸面積增大,提高散熱效率,且該塑膠殼體10配合該些散熱片22的設置,包含有複數個容置該些散熱片22的凹槽13,並可防止使用者於組裝或拆卸時被該些散熱片22刮傷。而依據使用需求,該些散熱片22亦可設計為長條狀、片狀或梯形的方式以達到特定的散熱及固定需求。Referring to FIG. 3, a cross-sectional view of another embodiment of the present invention, the outer surface of the heat dissipating member 20 includes a plurality of fins 22 extending toward the plastic housing 10, and the fins 22 are matched. The heat dissipating member 20 has a zigzag structure, and the contact area of the heat dissipating member 20 and the plastic housing 10 is increased by the arrangement of the heat dissipating fins 22, thereby improving heat dissipation efficiency, and the plastic housing 10 is matched with the The heat sinks 22 are provided with a plurality of recesses 13 for receiving the heat sinks 22, and can prevent the user from being scratched by the heat sinks 22 during assembly or disassembly. The heat sinks 22 can also be designed in a strip shape, a sheet shape or a trapezoidal shape to meet specific heat dissipation and fixing requirements.
綜上所述,本新型具有以下特點:In summary, the new model has the following characteristics:
一、 藉由將該散熱件內藏於該塑膠殼體內,可以防止使用者於使用時不慎觸碰到該散熱件而燙傷。1. The heat sink is built in the plastic case, so that the user can be prevented from being burnt by accidentally touching the heat sink during use.
二、 該塑膠殼體較該散熱件美觀、大方,並可以配合不同的場所而使用不同的顏色或彩色,使配色多樣化。Second, the plastic housing is more beautiful and generous than the heat dissipating component, and can use different colors or colors in combination with different places to make the color matching diversified.
三、 藉由該散熱件之高度大於該散熱件之外徑的三分之一,可以增加該散熱件的散熱面積,提高散熱效能。3. The height of the heat dissipating member is greater than one third of the outer diameter of the heat dissipating member, so that the heat dissipating area of the heat dissipating member can be increased, and the heat dissipating performance can be improved.
四、 透過該延伸散熱部的設置,使該基板與該散熱件的接觸面積增加,提高散熱效率。4. The contact area of the substrate and the heat sink is increased by the arrangement of the extending heat dissipation portion, thereby improving heat dissipation efficiency.
五、 透過該透光罩的最大周徑大於該透光罩連接該塑膠殼體的周徑,可以增加光線的出光角度,產生接近360度的全周光照明而沒有死角。5. The maximum circumference of the transparent cover is larger than the circumference of the transparent cover connected to the plastic casing, so that the light exit angle can be increased, and the full-circumference illumination of nearly 360 degrees is generated without dead angle.
六、 藉由該些散熱片的設置,使該散熱件與該塑膠殼體的接觸面積增大,提高散熱效率。6. The arrangement of the heat sinks increases the contact area between the heat sink and the plastic housing, thereby improving heat dissipation efficiency.
七、 該塑膠殼體配合該些散熱片的設置,包含有複數個容置該些散熱片的凹槽,可以防止使用者於組裝或拆卸時被該些散熱片刮傷。7. The plastic housing is provided with the heat sinks, and includes a plurality of recesses for receiving the heat sinks to prevent the user from being scratched by the heat sinks during assembly or disassembly.
八、 利用晶片直接封裝(Chip On Board,簡稱COB)的封裝技術,可以增加發光二極體的散熱效能。8. The package technology of Chip On Board (COB) can increase the heat dissipation performance of the LED.
九、 依據不同的使用需求,該些散熱片亦可設計為長條狀、片狀或梯形的方式以達到特定的散熱及固定需求。IX. According to different usage requirements, the heat sinks can also be designed in the form of strips, sheets or trapezoids to achieve specific heat dissipation and fixing requirements.
10‧‧‧塑膠殼體
11‧‧‧中空通道
12‧‧‧內壁
13‧‧‧凹槽
20‧‧‧散熱件
21‧‧‧延伸散熱部
22‧‧‧散熱片
30‧‧‧發光模組
31‧‧‧基板
311‧‧‧穿孔
32‧‧‧發光二極體
33‧‧‧發光二極體封裝板
40‧‧‧透光罩
41‧‧‧容置空間
42‧‧‧主體
43‧‧‧霧化面
50‧‧‧電源連接座
60‧‧‧導電件10‧‧‧Plastic shell
11‧‧‧ hollow channel
12‧‧‧ inner wall
13‧‧‧ Groove
20‧‧‧ Heat sink
21‧‧‧Extended heat sink
22‧‧‧ Heat sink
30‧‧‧Lighting module
31‧‧‧Substrate
311‧‧‧Perforation
32‧‧‧Lighting diode
33‧‧‧Light Diode Encapsulated Board
40‧‧‧Transparent cover
41‧‧‧ accommodating space
42‧‧‧ Subject
43‧‧‧Atomized surface
50‧‧‧Power connector
60‧‧‧Electrical parts
圖1,為本新型之分解示意圖。 圖2,為本新型之剖面示意圖。 圖3,為本新型另一實施例之剖面示意圖。Figure 1 is an exploded perspective view of the present invention. Figure 2 is a schematic cross-sectional view of the present invention. Fig. 3 is a schematic cross-sectional view showing another embodiment of the present invention.
10‧‧‧塑膠殼體 10‧‧‧Plastic shell
11‧‧‧中空通道 11‧‧‧ hollow channel
12‧‧‧內壁 12‧‧‧ inner wall
20‧‧‧散熱件 20‧‧‧ Heat sink
21‧‧‧延伸散熱部 21‧‧‧Extended heat sink
30‧‧‧發光模組 30‧‧‧Lighting module
31‧‧‧基板 31‧‧‧Substrate
311‧‧‧穿孔 311‧‧‧Perforation
33‧‧‧發光二極體封裝板 33‧‧‧Light Diode Encapsulated Board
40‧‧‧透光罩 40‧‧‧Transparent cover
50‧‧‧電源連接座 50‧‧‧Power connector
60‧‧‧導電件 60‧‧‧Electrical parts
Claims (8)
Priority Applications (1)
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TW104201411U TWM508010U (en) | 2015-01-29 | 2015-01-29 | Light emitting diode bulb |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW104201411U TWM508010U (en) | 2015-01-29 | 2015-01-29 | Light emitting diode bulb |
Publications (1)
Publication Number | Publication Date |
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TWM508010U true TWM508010U (en) | 2015-09-01 |
Family
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TW104201411U TWM508010U (en) | 2015-01-29 | 2015-01-29 | Light emitting diode bulb |
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TW (1) | TWM508010U (en) |
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2015
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