M349460 八、新型說明： 【新型所屬之技術領域】 一種半導體 本新型是有關於一種發光裝置，特別是才t 發光燈具。 【先前技術】 一般的鹵素燈具有光線柔和、亮廑离 儿厌间的特性，因此常 作為聚光用的投射照明燈具，除了照明的 J邛用，還可以投 射在畫作或攝影等美術創作上，讓居家環境具有氣氛；然 而，因為齒素燈的燈泡溫度相當高，需要附加能減低輻： 熱或避免溫度過高造成損壞的防護裝置，且十分耗電，不 符合環保節能的要求。 目前市面上已推出各式的半導體發光元件，包括取代 鹵素燈的白光LED或超高亮度白光LED，其具有冷光、使 用壽命長、省電且無污染的優點。另外，一般發光燈具搭 配的燈罩造型多十分單調，無法提昇整體的價值感，且一 般的燈罩本體無法直接令燈泡貼附及散熱。 【新型内容】 本新型是以陶瓷殼體取代傳統燈罩，讓半導體發光元 件藉由陶瓷殼體達到散熱的效果。 因此，本新型之目的，即在提供一種具有陶瓷殼體的 半導體發光燈。 於是，本新型的半導體發光燈具包含一半導體發光模 組、一電路模組及一陶瓷殼體。 該陶瓷殼體具有一圍繞壁及一位於該圍繞壁内侧的間 5 M349460 隔壁，該圍繞壁外侧形成有突起的複數散熱鰭片且界定有 至少一開口，該間隔壁具有一朝向該開口的頂面及一相反 於該頂面的底面；該半導體發光模組貼緊地設於該間隔壁 頂面；該電路模組設於該間隔壁底面，耦接該半導體發光 模組並驅動該半導體發光模組發光。 由於本新型是使用半導體發光模組以及陶瓷殼體取代 傳統燈罩，不但可在陶瓷殼體上增加裝飾以提昇美感，且 半導體發光模組也可藉由陶瓷殼體達到散熱的效果，可提 昇整體的價值感且兼具實用性。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之較佳實施例的詳細說明中，將可清楚 的呈現。 參閱圖1 ’本新型的半導體發光燈具丨〇〇的較佳實施例 包含一半導體發光模組丨、一電路模組2、一陶瓷殼體3、 複數固定兀件4、-聚光透鏡5及-封蓋6。 本較佳實施例中，半導體發光模組1具有-發光元件 u及-金屬製的印刷電路板12;印刷電路板12的第一面 121“用於焊接發光元件1卜第二面設置有-導熱片15;電 路杈組2耦接並驅動半導體發光模組12發光。 “ ^固定凡件4是一鉚釘，用以將半導體發光模組1及 電路m彼此固接’但是也可不使用鉚釘，而是以膠合 的方式將半導體發光模⑯1及電路模組2彼此固接，因此 不以使用固定元件4為限制。 M349460 參閱圖2’陶瓷殼體3具有一圍繞壁31及一位於圍繞 壁31内側的間隔壁32，圍繞壁31具有一大徑段311、一小 徑段312及一連接大徑段311及小徑段312的連接段313， 且圍繞壁31之大徑段311、小徑段312及連接段313及間 隔壁32整體為—體成型。 圍繞壁31的大徑段311界定有一開口 3〇，且該開口 3〇 设有封蓋6加以密封（此封蓋6亦可不使用），大徑段3丨丨内 面及間隔壁32之頂面321界定有一第一容室31〇，第一容 室310内是供容設聚光透鏡5、半導體發光模組丨，其中聚 光透鏡5的作用是讓發光元件u產生的光束能聚集發光。 間隔壁32位於大徑段311及小徑段312之間的内侧， 間隔壁32具有一朝向開口 3〇的頂面321及一相反於頂面 321的底面322，間隔壁32是印刷電路板12的第二面122 及導熱片15組設於其上。 本較佳實施例中，導熱片15是一石墨片，或可以是鋁 片、銅片等具高傳導熱的材質，此導熱片15的面積需大於 印刷電路板12,主要是將半導體發光模組丨產生的熱能傳 導給間隔壁32,但導熱片15之應用為最佳實施例，不用亦 可；陶瓷殼體3介於大徑段311及小徑段312之間的連接段 313的外表面具有突起的複數散熱鰭片331(如圖y，讓半導 體發光模組1藉由間隔壁32及散熱鰭片331傳導熱能達到 散熱的效果。 圍繞壁31的小徑段312内面及間隔壁32之底面322 界定有一第二容室320,第二容室32〇是供電路模組2電性 M349460 連接半導體發光模組1地組設於第二容室32〇 ;由於陶瓷殼 體3將發光元件U及電路模組2等元件整個包覆起來使 整體較為美觀。 參閲圖1及圖3，半導體發光燈具100的電路模組2相 反於間隔壁32的另一侧具有一電源接頭21，因此可方便的 組裝在一壁燈燈座7上，燈座7具有對應於電源接頭2ι的 插孔（圖未示），除了用在壁燈燈座7上，半導體發光燈具 100也可以安裝在例如托燈、吸頂燈、吊燈、檯燈、立燈、 特殊造型燈、聚光燈與照明燈使用的燈座，因此應用層面 將可更為廣泛。此外，也可在陶瓷殼體3上的特殊圖騰或 文字（如圖3)，讓半導體發光燈具1〇〇能表現出更具特色的 設計外觀。 除了前述的結構，本新型的半導體發光燈具1〇〇組設 在開口 30的封蓋6亦可以改為一情境濾光片，情境濾光片 可將原本的白光營造出五光十色的效果。 參閱圖4至圖7，其主要的原理為情境濾光片分別在〇 度、7度、15度及30度的入射光角度下，會有不同的光譜 響應；參閱圖8至圖11(如附件），該情境滤光片依據不同角 度之光譜響應特性及發光元件u本身在+6〇〇至_6〇Q之間 的發散角度在一平面上可營造出多種顏色。 歸納上述，本新型的半導體發光燈具1〇〇採用半導體 發光模組1可節省耗電，且半導體發光模組1可藉由陶瓷 忒體3達到散熱的效果，也可在陶瓷殼體3上增加裝飾以 提昇美感，提昇了整體的價值感且兼具實用性，加上封蓋6 M349460 疋採用情境濾光片，因此使用本新型的半導體發光燈具100 將帶給讓居家環境更為多色彩的氣氛。 惟以上所述者’僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一部份剖視圖，說明本新型的半導體發光燈具 的較佳實施例的各元件的分解狀態； 圖2是一部份剖視圖，說明該較佳實施例的各元件的 組合狀態； 圖3疋一立體圖，說明該較佳實施例具有電源接頭可 組裝在壁燈用的燈座上；及 圖4至圖7分別為不同角度之光譜響應圖，說明該較 佳實施例具有之情境濾光片分別在◦度、7度、15度及如 度的入射光角度下具有不同的光譜響應。 M349460 【主要元件符號說明】 100.......半導體發光燈具 311 .......大徑段 1 ..........半導體發光模組 312.......小徑段 11....... …發光元件 12....... …印刷電路板 121 …. …第一面 122 .… …第二面 15....... …導熱片 2 ........ …電路模組 21...... …電源接頭 3 ........ …陶瓷殼體 30....... …開口 31....... …圍繞壁 310 ·_··. …第一容室M349460 VIII. New description: [New technology field] A semiconductor This invention relates to a light-emitting device, in particular to a light-emitting lamp. [Prior Art] The general halogen lamp has the characteristics of soft light, bright and sinuous, so it is often used as a projection lighting fixture for collecting light. In addition to lighting, it can also be projected on art creation such as painting or photography. To make the home environment have an atmosphere; however, because the bulb temperature of the tooth lamp is quite high, it is necessary to add a protective device that can reduce the heat caused by heat or avoid excessive temperature, and is very power-consuming and does not meet the requirements of environmental protection and energy conservation. Various types of semiconductor light-emitting elements have been introduced on the market, including white LEDs or ultra-high brightness white LEDs that replace halogen lamps, which have the advantages of cold light, long service life, power saving, and no pollution. In addition, the shape of the lampshade that is generally used in the illuminating lamp is so monotonous that it cannot enhance the overall value of the lamp, and the general lampshade body cannot directly attach and dissipate the bulb. [New content] This new type replaces the traditional lampshade with a ceramic shell, so that the semiconductor light-emitting element can achieve heat dissipation by the ceramic shell. Accordingly, it is an object of the present invention to provide a semiconductor light-emitting lamp having a ceramic housing. Therefore, the novel semiconductor light-emitting lamp comprises a semiconductor light-emitting module, a circuit module and a ceramic casing. The ceramic housing has a surrounding wall and a partition 5 M349460 partition wall on the inner side of the surrounding wall, the outer wall of the surrounding wall is formed with a plurality of protruding fins and defines at least one opening, the partition wall has a top facing the opening The semiconductor light emitting module is disposed on the bottom surface of the partition wall; the circuit module is disposed on the bottom surface of the partition wall, coupled to the semiconductor light emitting module and driving the semiconductor light emitting The module emits light. Since the present invention replaces the conventional lampshade with a semiconductor light-emitting module and a ceramic casing, not only can the decoration be added to the ceramic casing to enhance the aesthetics, but the semiconductor light-emitting module can also achieve the heat dissipation effect by the ceramic casing, thereby improving the overall The sense of value and practicality. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to FIG. 1 , a preferred embodiment of the semiconductor light-emitting device of the present invention comprises a semiconductor light-emitting module, a circuit module 2, a ceramic housing 3, a plurality of fixed components 4, a collecting lens 5, and - Cover 6. In the preferred embodiment, the semiconductor light-emitting module 1 has a light-emitting element u and a metal printed circuit board 12; the first surface 121 of the printed circuit board 12 is used to solder the light-emitting element 1 and the second surface is provided with - The heat conducting sheet 15 is coupled to the circuit unit 2 and drives the semiconductor light emitting module 12 to emit light. “The fixed part 4 is a rivet for fixing the semiconductor light emitting module 1 and the circuit m to each other', but the rivet may not be used. Rather, the semiconductor light-emitting mold 161 and the circuit module 2 are fixed to each other by gluing, and thus the fixing member 4 is not limited. M349460 Referring to Fig. 2, the ceramic housing 3 has a surrounding wall 31 and a partition wall 32 on the inner side of the surrounding wall 31. The surrounding wall 31 has a large diameter section 311, a small diameter section 312 and a connecting large diameter section 311 and small. The connecting section 313 of the diameter section 312 and the large diameter section 311, the small diameter section 312, the connecting section 313 and the partition wall 32 surrounding the wall 31 are integrally formed. An opening 3〇 is defined around the large diameter section 311 of the wall 31, and the opening 3 is provided with a cover 6 for sealing (the cover 6 may not be used), and the inner surface of the large diameter section 3 and the top surface of the partition wall 32. 321 defines a first chamber 31 〇. The first chamber 310 is provided with a condensing lens 5 and a semiconductor illuminating module 丨. The concentrating lens 5 functions to allow the light beam generated by the illuminating element u to condense and emit light. The partition wall 32 is located inside the large diameter section 311 and the small diameter section 312. The partition wall 32 has a top surface 321 facing the opening 3〇 and a bottom surface 322 opposite to the top surface 321, and the partition wall 32 is the printed circuit board 12. The second side 122 and the thermal pad 15 are assembled thereon. In the preferred embodiment, the heat conductive sheet 15 is a graphite sheet, or may be a material with high heat conduction such as aluminum sheet or copper sheet. The area of the heat conductive sheet 15 needs to be larger than that of the printed circuit board 12, mainly for the semiconductor light emitting mold. The heat generated by the stack is transmitted to the partition wall 32, but the application of the heat conductive sheet 15 is a preferred embodiment, and it is not necessary; the ceramic shell 3 is outside the joint portion 313 between the large diameter section 311 and the small diameter section 312. The plurality of heat dissipation fins 331 having protrusions on the surface (as shown in FIG. y, the semiconductor light-emitting module 1 transmits thermal energy through the partition walls 32 and the heat dissipation fins 331 to achieve heat dissipation. The inner surface of the small diameter section 312 surrounding the wall 31 and the partition wall 32 The bottom surface 322 defines a second chamber 320. The second chamber 32 is provided for the circuit module 2 to electrically connect the semiconductor light-emitting module 1 to the second chamber 32. The ceramic housing 3 will emit light. The components U and the circuit module 2 are entirely covered to make the overall appearance more beautiful. Referring to FIG. 1 and FIG. 3, the circuit module 2 of the semiconductor light-emitting device 100 has a power connector 21 opposite to the other side of the partition wall 32. Therefore, it can be conveniently assembled on a wall lamp holder 7, the lamp holder 7 There is a jack (not shown) corresponding to the power connector 2ι. In addition to being used on the lamp holder 7, the semiconductor lighting fixture 100 can also be mounted on, for example, a lamp, a ceiling lamp, a chandelier, a desk lamp, a standing lamp, a special modeling lamp, The lamp holders used in spotlights and illuminators can be used in a wider range of applications. In addition, special totems or texts on the ceramic housing 3 (see Figure 3) allow semiconductor luminaires to exhibit even more In addition to the foregoing structure, the cover of the novel semiconductor light-emitting lamp 1A disposed in the opening 30 can also be changed into a situation filter, and the situation filter can create the original white light. The effect of the five colors is as follows. Referring to Figure 4 to Figure 7, the main principle is that the ambient filter will have different spectral responses at incident angles of 7 degrees, 15 degrees and 30 degrees respectively; see Figure 8 to Figure 11 (as attached), the context filter can create a variety of colors on a plane according to the spectral response characteristics of different angles and the divergence angle of the light-emitting element u itself between +6 〇〇 and _6 〇Q. Above, this The semiconductor light-emitting lamp 1 adopts the semiconductor light-emitting module 1 to save power consumption, and the semiconductor light-emitting module 1 can achieve the heat-dissipating effect by the ceramic body 3, and can also add decoration on the ceramic shell 3 to enhance the aesthetics. It enhances the overall value and practicality, and with the cover 6 M349460 情 using the context filter, the use of this new type of semiconductor luminaire 100 will bring a more colorful atmosphere to the home environment. The present invention is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the novel patent application scope and the novel description content are still It is within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a partial cross-sectional view showing the exploded state of the components of the preferred embodiment of the semiconductor light-emitting fixture of the present invention; Figure 2 is a partial cross-sectional view showing the components of the preferred embodiment FIG. 3 is a perspective view showing the preferred embodiment having a power connector that can be assembled on a lamp holder for wall lamps; and FIGS. 4 to 7 respectively showing spectral responses at different angles, illustrating the preferred embodiment. The context filter has different spectral responses at incident, optical angles of 7 degrees, 15 degrees, and degrees. M349460 [Description of main component symbols] 100.......Semiconductor illuminating lamps 311 .... Large diameter section 1 ..........Semiconductor lighting module 312..... .. small diameter section 11.......light emitting element 12.......printed circuit board 121 .... ... first side 122 .... ... second side 15.. ...thermal sheet 2 ........ circuit module 21 ... ... power connector 3 ........ ... ceramic housing 30 .... ... opening 31 ....... ...around the wall 310 ·_··. ...the first chamber
313.......連接段 32.........間隔壁 320 .......第二容室 321 .......頂面 322 .......底面 331……散熱鰭片 4 ..........固定元件 5 ..........聚光透鏡 6 ..........封蓋 7 ..........壁燈燈座313.......connecting section 32.........partition wall 320.......second chamber 321 .......top surface 322 ..... .. bottom surface 331 ... heat sink fin 4 ..... fixing element 5 ..... concentrating lens 6 .......... cover 7 .......... wall lamp holder
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