TWI575784B - Opto-mechanical module - Google Patents
Opto-mechanical module Download PDFInfo
- Publication number
- TWI575784B TWI575784B TW103125642A TW103125642A TWI575784B TW I575784 B TWI575784 B TW I575784B TW 103125642 A TW103125642 A TW 103125642A TW 103125642 A TW103125642 A TW 103125642A TW I575784 B TWI575784 B TW I575784B
- Authority
- TW
- Taiwan
- Prior art keywords
- power line
- side wall
- line contact
- module
- optomechanical module
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 238000003825 pressing Methods 0.000 claims description 35
- 239000005357 flat glass Substances 0.000 claims description 14
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
本發明係有關一種光機模組結構，特別是一種以發光二極體燈板直接作為光機模組之底板的光機模組結構。 The invention relates to a structure of a optomechanical module, in particular to a optomechanical module structure in which a illuminating diode lamp plate is directly used as a bottom plate of a optomechanical module.
一種光機模組係指可將光源以均勻擴散之方式投射至外界，使光源所照射之物體可於物體表面呈現均勻的亮度，以及避免光源對人體眼部產生反射眩光或直接眩光影響。早期的光機模組大都使用燈泡作為發光源，近年來隨著發光二極體(LED)之製造技術日趨成熟，不但可有多種顏色選擇，而且又具有環保、省電、壽命長等實用優點，已逐漸取代傳統燈泡。 A optomechanical module means that the light source can be uniformly diffused to the outside, so that the object illuminated by the light source can exhibit uniform brightness on the surface of the object, and the light source can be prevented from being reflected glare or direct glare on the human eye. Most of the early optomechanical modules used bulbs as the light source. In recent years, with the maturity of the manufacturing technology of LEDs, not only can there be multiple color choices, but also practical advantages such as environmental protection, power saving and long life. Has gradually replaced traditional light bulbs.
如圖1所示，習知的光機模組10在製作上通常會先將LED發光體12封裝至封裝基板14中形成封裝單元16，之後再將封裝單元16固定至具有電路連結及散熱特性之底板18(如鋁板、銅板或均溫板)上，並利用一壓圈20將透鏡22或平面玻璃鎖附在底板18上，並使與LED發光體12電性連接之電線(圖中未示)經由一防水接頭24穿設過壓圈20而外接至電源線26。此種光機模組10的缺點之一為LED發光體12發光所產生的熱必須經由封裝基板14而後再透過底板18散熱至後續所加裝之散熱器(圖中未示)中，其中多了一道底板18形成的熱阻容易阻礙了 熱的傳導，無法滿足在高功率光機模組的應用上所需之高導熱需求，使得光機模組容易因散熱效率不佳而影響其壽命。 As shown in FIG. 1 , the conventional optomechanical module 10 is usually packaged into the package substrate 14 to form the package unit 16 , and then the package unit 16 is fixed to have circuit connection and heat dissipation characteristics. a bottom plate 18 (such as an aluminum plate, a copper plate or a temperature equalizing plate), and a lens 22 or a flat glass is attached to the bottom plate 18 by a pressing ring 20, and the electric wire electrically connected to the LED illuminant 12 is not provided. The power supply line 26 is externally connected via a waterproof joint 24 through the pressure ring 20 . One of the disadvantages of the illuminating device module 10 is that the heat generated by the illuminating body 12 of the LED illuminator 12 must be dissipated through the package substrate 14 and then radiated through the bottom plate 18 to a subsequently installed heat sink (not shown). The thermal resistance formed by a bottom plate 18 is easily hindered. The heat conduction cannot meet the high heat conduction requirement required in the application of the high-power optical module, so that the optical module is likely to affect its life due to poor heat dissipation efficiency.
另一方面，如圖1所示，傳統光機模組10需使用防水接頭24穿設過壓圈20以將LED發光體12的電源線26接出，此種需要防水接頭24的設計造成光機模組10的體積無法縮小，且因防水接頭24的穿設壓圈20而使得漏水機率增加，又光機模組10配件多且組裝成本高，使得製程成本無法有效降低。 On the other hand, as shown in FIG. 1 , the conventional optomechanical module 10 needs to pass through the pressure ring 20 using the waterproof joint 24 to take out the power line 26 of the LED illuminator 12 , and the design of the waterproof joint 24 is required to cause light. The volume of the machine module 10 cannot be reduced, and the leakage probability is increased due to the penetration of the pressure ring 20 of the waterproof joint 24. The assembly of the optomechanical module 10 is high and the assembly cost is high, so that the process cost cannot be effectively reduced.
為了解決上述問題，本發明目的之一係提供一種光機模組，其係直接以發光二極體燈板作為光機模組的底板，讓發光二極體燈板直接導熱到後續光機模組所加裝之散熱器中，由於減少了傳統光機模組之底板的設計，使得LED發光體所產生的熱能可有效進行熱傳導，而具有較佳之散熱效率。 In order to solve the above problems, one of the objects of the present invention is to provide a optomechanical module, which directly uses a light-emitting diode lamp plate as a bottom plate of a optomechanical module, and allows the illuminating diode lamp plate to directly conduct heat to the subsequent illuminator module. In the heat sink installed in the group, the heat energy generated by the LED illuminator can effectively conduct heat conduction due to the reduction of the design of the bottom plate of the conventional optomechanical module, and has better heat dissipation efficiency.
本發明目的之一係提供一種光機模組，其係直接將電源線接點組設置於壓圈外或壓圈外側面，因此只需於電源線接點組與電源線焊接之後以點膠等其他方式形成一防水結構，即可達到電源線接點組的防水效果，相較於傳統需使用防水接頭之光機模組而言，本發明光機模組可減少漏水的產生，且減少組裝配件及簡化組裝流程，進而具有降低成本的優點。 One of the objectives of the present invention is to provide a optomechanical module, which directly sets the power line contact group outside the pressure ring or the outer side of the pressure ring, so that it only needs to be dispensed after the power line contact group is soldered to the power line. By forming a waterproof structure by other means, the waterproof effect of the power line contact group can be achieved, and the optical module of the present invention can reduce the occurrence of water leakage and reduce the light-emitting module of the conventional waterproof connector. Assembling accessories and simplifying the assembly process, which has the advantage of reducing costs.
另一方面使用光機模組的優勢是在如損壞時只需將光機模組拆下來更換，不須將整組燈具拆卸下來，對於需要高空作業之路燈/天井燈/投光燈等將可以大幅節省施工費用。 On the other hand, the advantage of using the optomechanical module is that it only needs to be removed and replaced when the optomechanical module is damaged. It is not necessary to disassemble the entire set of luminaires. For streetlights/panlow lights/projection lights that require aerial work, etc. Significant savings in construction costs.
為了達到上述目的，本發明一實施例之光機模組包含：一發光二極體燈板及一透光罩體，其中發光二極體燈板係直接作為光機模組的一底板。發 光二極體燈板包含：一導熱基板具有一上表面；至少一LED發光體設置於上表面並與導熱基板電性連接；一電源線接點組設置於上表面，並與LED發光體電性連接，電源線接點組係供焊接一電源線；以及一防水結構包覆電源線接點組。透光罩體包含一本體及一固定部環設於本體之底緣，固定部設置於上表面，使本體罩設LED發光體，且電源線接點組位於透光罩體外。 In order to achieve the above object, a optomechanical module according to an embodiment of the invention comprises: a light-emitting diode lamp plate and a light-transmitting cover body, wherein the light-emitting diode lamp plate directly serves as a bottom plate of the optomechanical module. hair The light diode plate comprises: a heat conducting substrate having an upper surface; at least one LED illuminator disposed on the upper surface and electrically connected to the heat conducting substrate; a power line contact group disposed on the upper surface and electrically connected to the LED illuminator The connection, the power line contact group is for soldering a power line; and the waterproof structure covers the power line contact group. The transparent cover body comprises a body and a fixing portion ringed on the bottom edge of the body, the fixing portion is disposed on the upper surface, the body is covered with the LED illuminant, and the power line contact group is located outside the transparent cover.
本發明又一實施例之光機模組包含一發光二極體燈板、一光杯以及一透光罩體，其中發光二極體燈板係直接作為光機模組的一底板。發光二極體燈板包含：一導熱基板具有一上表面；至少一LED發光體設置於上表面並與導熱基板電性連接；一電源線接點組設置於上表面，並與LED發光體電性連接，電源線接點組係供焊接一電源線；以及一防水結構，包覆電源線接點組。光杯包含一底部及一側壁環繞底部，底部設置於導熱基板上，且底部形成有至少一開孔，使LED發光體顯露於光杯內。透光罩體設置於光杯之側壁的頂緣，使透光罩體罩設LED發光體，且電源線接點組位於透光罩體外。 The optomechanical module of the embodiment of the present invention comprises a light-emitting diode lamp board, a light cup and a light-transmitting cover body, wherein the light-emitting diode light board is directly used as a bottom plate of the light machine module. The light-emitting diode lamp board comprises: a heat-conducting substrate having an upper surface; at least one LED light-emitting body is disposed on the upper surface and electrically connected to the heat-conductive substrate; a power line contact group is disposed on the upper surface, and is electrically connected to the LED light-emitting body Sex connection, the power line contact group is for welding a power line; and a waterproof structure, covering the power line contact group. The light cup comprises a bottom and a side wall surrounding the bottom, the bottom is disposed on the heat conductive substrate, and the bottom is formed with at least one opening to expose the LED illuminator in the light cup. The transparent cover is disposed on the top edge of the sidewall of the light cup, so that the transparent cover is covered with the LED illuminant, and the power line contact group is located outside the transparent cover.
10‧‧‧光機模組 10‧‧‧ optomechanical module
12‧‧‧LED發光體 12‧‧‧LED illuminator
14‧‧‧封裝基板 14‧‧‧Package substrate
16‧‧‧封裝單元 16‧‧‧Package unit
18‧‧‧底板 18‧‧‧floor
20‧‧‧壓圈 20‧‧‧压圈
22‧‧‧透鏡 22‧‧‧ lens
24‧‧‧防水接頭 24‧‧‧Waterproof connector
26‧‧‧電源線 26‧‧‧Power cord
30‧‧‧光機模組 30‧‧‧ optomechanical module
32‧‧‧發光二極體燈板 32‧‧‧Lighting diode board
34‧‧‧透光罩體 34‧‧‧Light cover
36‧‧‧導熱基板 36‧‧‧thermal substrate
361‧‧‧上表面 361‧‧‧ upper surface
38‧‧‧LED發光體 38‧‧‧LED illuminator
40‧‧‧電源線接點組 40‧‧‧Power cord contact group
42‧‧‧防水結構 42‧‧‧Waterproof structure
44‧‧‧電源線 44‧‧‧Power cord
48‧‧‧本體 48‧‧‧Ontology
50‧‧‧固定部 50‧‧‧ Fixed Department
501‧‧‧頂面 501‧‧‧ top surface
502‧‧‧底面 502‧‧‧ bottom
52‧‧‧防水膠 52‧‧‧Waterproof glue
54‧‧‧壓圈 54‧‧‧压圈
541‧‧‧壓制部 541‧‧‧Depression
542‧‧‧側壁部 542‧‧‧ Side wall
543‧‧‧底部 543‧‧‧ bottom
544‧‧‧凹槽 544‧‧‧ Groove
56‧‧‧防水膠墊 56‧‧‧Waterproof pad
58‧‧‧光杯 58‧‧‧ light cup
581‧‧‧底部 581‧‧‧ bottom
582‧‧‧側壁 582‧‧‧ side wall
60‧‧‧平面玻璃 60‧‧‧Flat glass
圖1所示為傳統一種光機模組之結構示意圖。 FIG. 1 is a schematic structural view of a conventional optical module.
圖2所示為本發明一第一實施例光機模組之結構示意圖。 FIG. 2 is a schematic structural view of a optomechanical module according to a first embodiment of the present invention.
圖3A所示為本發明一第二實施例光機模組之結構示意圖。 FIG. 3A is a schematic structural view of a optomechanical module according to a second embodiment of the present invention.
圖3B所示為本發明一第三實施例光機模組之結構示意圖。 FIG. 3B is a schematic structural view of a optomechanical module according to a third embodiment of the present invention.
圖4A所示為本發明一第四實施例光機模組之結構示意圖。 4A is a schematic structural view of a optomechanical module according to a fourth embodiment of the present invention.
圖4B所示為本發明一第五實施例光機模組之結構示意圖。 4B is a schematic structural view of a optomechanical module according to a fifth embodiment of the present invention.
圖5所示為本發明一第六實施例光機模組之結構示意圖。 FIG. 5 is a schematic structural view of a optomechanical module according to a sixth embodiment of the present invention.
其詳細說明如下，所述較佳實施例僅做一說明非用以限定本發明。 The detailed description is as follows, and the preferred embodiment is not intended to limit the invention.
圖2所示為本發明一第一實施例光機模組之結構示意圖，如圖2所示，光機模組30包含：一發光二極體燈板32及一透光罩體34。發光二極體燈板32包含一導熱基板36，具有一上表面361；至少一LED發光體38設置於上表面361且與導熱基板36電性連接；一電源線接點組40設置於導熱基板36之上表面361；以及一防水結構42用以包覆電源線接點組40。於一實施例中，電源線接點組40係設置於上表面361，以供焊接至一電源線44，且防水結構42係為一以灌膠方式形成之膠體。透光罩體34包含一本體48及一固定部50環設於本體48的底緣，於一實施例中本體48係為一透鏡，惟不限於此，根據發光需求，本體48亦可為一平面玻璃。透光罩體34之固定部50係設置於導熱基板36之上表面361，使得本體48罩設住LED發光體38，又電源線接點組40位於透光罩體34之外。 2 is a schematic structural view of a optomechanical module according to a first embodiment of the present invention. As shown in FIG. 2, the optomechanical module 30 includes: a light-emitting diode lamp panel 32 and a light-transmitting cover 34. The light-emitting diode board 32 includes a heat-conducting substrate 36 having an upper surface 361. At least one LED light-emitting body 38 is disposed on the upper surface 361 and electrically connected to the heat-conductive substrate 36. A power line contact group 40 is disposed on the heat-conductive substrate. 36 upper surface 361; and a waterproof structure 42 for covering the power line contact set 40. In one embodiment, the power line contact group 40 is disposed on the upper surface 361 for soldering to a power line 44, and the waterproof structure 42 is a glue formed by potting. The light-transmitting cover body 34 includes a body 48 and a fixing portion 50 which is disposed on the bottom edge of the body 48. In one embodiment, the body 48 is a lens, but is not limited thereto. The body 48 may also be a light-emitting requirement. Flat glass. The fixing portion 50 of the transparent cover 34 is disposed on the upper surface 361 of the heat-conducting substrate 36 such that the body 48 covers the LED illuminator 38, and the power line contact group 40 is located outside the transparent cover 34.
接續上述說明，請繼續參閱圖2所示，透光罩體34之固定部50係以一防水膠52黏著於導熱基板36的上表面361。惟不限於此，圖3A所示為本發明一第二實施例光機模組之結構示意圖，如圖所示，光機模組30更包含一壓圈54，壓圈54包含一水平之壓制部541及一側壁部542往下縱向設置於壓制部541的側緣，壓制部541及側壁部542係為一體成形者，壓圈54係環設於透光罩體34之本體48的外圍，其中壓制部541壓設於透光罩體34之固定部50的頂面501，側壁部542環繞固定部50之週緣並利用複數螺絲(圖中未示)將側壁部542鎖固於導熱基板36，以使透光罩體34定位於導熱基板36的上表面。其中為了加強防水效果，於壓圈54 之壓制部541與固定部50的頂面501之間、及固定部50的底面502與導熱基板36之上表面361之間，更可分別設置一防水膠墊56。 Following the above description, please continue to refer to FIG. 2 , the fixing portion 50 of the transparent cover 34 is adhered to the upper surface 361 of the heat conductive substrate 36 by a waterproof rubber 52 . FIG. 3A is a schematic structural view of a optomechanical module according to a second embodiment of the present invention. As shown, the optomechanical module 30 further includes a pressing ring 54 that includes a horizontal pressing. The portion 541 and the side wall portion 542 are disposed longitudinally on the side edge of the pressing portion 541. The pressing portion 541 and the side wall portion 542 are integrally formed, and the pressing ring 54 is disposed on the outer periphery of the body 48 of the transparent cover 34. The pressing portion 541 is press-fitted on the top surface 501 of the fixing portion 50 of the transparent cover 34. The side wall portion 542 surrounds the periphery of the fixing portion 50 and locks the side wall portion 542 to the heat conductive substrate 36 by using a plurality of screws (not shown). The light transmissive cover 34 is positioned on the upper surface of the thermally conductive substrate 36. In order to enhance the waterproof effect, in the pressure ring 54 A waterproof rubber pad 56 may be further disposed between the pressing portion 541 and the top surface 501 of the fixing portion 50, and between the bottom surface 502 of the fixing portion 50 and the upper surface 361 of the heat conductive substrate 36.
圖3B所示為本發明一第三實施例光機模組之結構示意圖，其與圖3A所示之光機模組的差異在於壓圈54之側壁部542的底部543與導熱基板36之上表面361之間亦設有一防水膠墊56。在上述第一、第二及第三實施例之光機模組30中，發光二極體燈板32的尺寸大於透光罩體34或壓圈54的尺寸，且電源線接點組40及其防水結構42係位於透光罩體34或壓圈54之外，以供焊接至電源線44。 3B is a schematic structural view of a optomechanical module according to a third embodiment of the present invention. The difference from the optomechanical module shown in FIG. 3A is that the bottom portion 543 of the side wall portion 542 of the pressure ring 54 is above the heat conductive substrate 36. A waterproof rubber pad 56 is also disposed between the surfaces 361. In the optomechanical module 30 of the first, second and third embodiments, the size of the illuminating diode lamp 32 is larger than the size of the transparent cover 34 or the pressing ring 54, and the power line contact group 40 and The waterproof structure 42 is located outside the light transmissive cover 34 or the pressing ring 54 for soldering to the power cord 44.
圖4A所示為本發明一第四實施例光機模組之結構示意圖，如圖所示，光機模組30包含一發光二極體燈板32、一透光罩體34及一壓圈54，其中發光二極體燈板32之結構已於上述實施例中描述，於此不再贅述；壓圈54包含一水平之壓制部541及一側壁部542往下縱向設置於壓制部541的側緣，壓制部541及側壁部542係為一體成形者，其中於側壁部542的外側面底緣設置一凹槽544，凹槽544的尺寸與包覆電源線接點組40之防水結構42的尺寸一致；透光罩體34包含一本體48及一固定部50環設於本體48的底緣，固定部50受到壓圈54之壓制部541的壓設且壓圈54之側壁部542鎖固於導熱基板36，以便將透光罩體34固定於導熱基板36之上表面361，其中受到防水結構42包覆之電源線接點組40係容置於側壁部542之凹槽544中。又為了加強防水效果，於壓圈54之壓制部541與固定部50的頂面501之間、及固定部50的底面502與導熱基板36之上表面361之間，更可分別設置防水膠墊56。 4A is a schematic structural view of a optomechanical module according to a fourth embodiment of the present invention. As shown in the figure, the optomechanical module 30 includes a light-emitting diode lamp board 32, a light-transmitting cover body 34 and a pressing ring. The structure of the light-emitting diode lamp board 32 has been described in the above embodiment, and will not be described herein. The press ring 54 includes a horizontal pressing portion 541 and a side wall portion 542 disposed longitudinally downwardly from the pressing portion 541. The side edge, the pressing portion 541 and the side wall portion 542 are integrally formed, wherein a groove 544 is formed on the bottom edge of the outer side surface of the side wall portion 542, and the size of the groove 544 and the waterproof structure 42 covering the power line contact group 40 The transparent cover 34 includes a body 48 and a fixing portion 50 which is annularly disposed on the bottom edge of the body 48. The fixing portion 50 is pressed by the pressing portion 541 of the pressing ring 54 and the side wall portion 542 of the pressing ring 54 is locked. The heat-conducting substrate 36 is fixed to the upper surface 361 of the heat-conducting substrate 36, and the power line contact group 40 covered by the waterproof structure 42 is received in the groove 544 of the side wall portion 542. In order to enhance the waterproof effect, a waterproof rubber pad may be separately disposed between the pressing portion 541 of the pressing ring 54 and the top surface 501 of the fixing portion 50, and between the bottom surface 502 of the fixing portion 50 and the upper surface 361 of the heat-conducting substrate 36. 56.
圖4B所示為本發明一第五實施例光機模組之結構示意圖，其與圖4A所示之光機模組的差異在於壓圈54之側壁部542的底部543與導熱基板36之上表面361之間亦設有一防水膠墊56。在第四及第五實施例之光機模組中，發光二 極體燈板32的尺寸係與壓圈54之側壁部542環繞的尺寸一致，且電源線接點組40及其防水結構42係位於側壁部542之凹槽544內，以供焊接至電源線44。 4B is a schematic structural view of a optomechanical module according to a fifth embodiment of the present invention. The difference from the optomechanical module shown in FIG. 4A is that the bottom portion 543 of the side wall portion 542 of the pressure ring 54 is above the heat conductive substrate 36. A waterproof rubber pad 56 is also disposed between the surfaces 361. In the optomechanical module of the fourth and fifth embodiments, the illuminating two The size of the pole body plate 32 is the same as the size of the side wall portion 542 of the pressing ring 54, and the power line contact group 40 and its waterproof structure 42 are located in the groove 544 of the side wall portion 542 for soldering to the power line. 44.
圖5所示為本發明一第六實施例光機模組之結構示意圖，如圖所示，光機模組30包含一發光二極體燈板32、一光杯58、一透光罩體34及一壓圈54。其中發光二極體燈板32之結構已於上述實施例中描述，於此不再贅述；光杯58包含一底部581及一側壁582環繞底部581，光杯58之底部581定位導熱基板36上，且底部581形成有至少一開孔(圖中未示)，使LED發光體38顯露於光杯58內；又透明罩體34係設置於光杯58之側壁582的頂緣，於一實施例中，透明罩體34係為一平面玻璃60，光杯58之側壁582的頂緣用以抵著平面玻璃60的底面；壓圈54具有一水平之壓制部541及一側壁部542往下縱向設置於壓制部541的側緣，側壁部542的高度係對應於光杯58的縱向高度，壓制部541用以壓設平面玻璃60的頂面周邊，且側壁部542環繞平面玻璃60及光杯58的週緣，並利用複數螺絲(圖中未示)將側壁部542鎖固於導熱基板36上，藉以將光杯58及光杯58上的平面玻璃60固定於發光二極體燈板32上。 FIG. 5 is a schematic structural view of a optomechanical module according to a sixth embodiment of the present invention. As shown in the figure, the optomechanical module 30 includes a light-emitting diode lamp board 32, a light cup 58, and a transparent cover. 34 and a pressure ring 54. The structure of the LED board 32 is described in the above embodiment, and is not described here. The cup 58 includes a bottom 581 and a side wall 582 surrounding the bottom 581. The bottom 581 of the cup 58 is positioned on the heat-conducting substrate 36. The bottom portion 581 is formed with at least one opening (not shown) to expose the LED illuminator 38 in the light cup 58. The transparent cover 34 is disposed on the top edge of the side wall 582 of the light cup 58. For example, the transparent cover 34 is a flat glass 60, and the top edge of the side wall 582 of the light cup 58 is used to abut against the bottom surface of the flat glass 60. The pressing ring 54 has a horizontal pressing portion 541 and a side wall portion 542 downward. The longitudinal direction of the side wall portion 542 corresponds to the longitudinal height of the light cup 58 , the pressing portion 541 is used to press the top surface of the flat glass 60 , and the side wall portion 542 surrounds the flat glass 60 and the light. The peripheral edge of the cup 58 is fixed to the heat-conducting substrate 36 by a plurality of screws (not shown) to fix the flat glass 60 on the light cup 58 and the light cup 58 to the light-emitting diode board 32. on.
請繼續參閱圖5所示，壓制部541與平面玻璃60的頂面之間、及側壁部542的底部543與導熱基板36的上表面361之間分別設置有一防水膠墊56。又於一實施例中，壓圈54之側壁部542的外側面底緣設置一凹槽544，以供容置電源線接點組40及其防水結構42；惟不限於此，於另一實施例中，電源線接點組及其防水結構亦可位於壓圈之外。 Referring to FIG. 5, a waterproof rubber pad 56 is disposed between the pressing portion 541 and the top surface of the flat glass 60, and between the bottom portion 543 of the side wall portion 542 and the upper surface 361 of the heat conductive substrate 36. In another embodiment, the bottom edge of the outer side surface of the side wall portion 542 of the pressing ring 54 is provided with a recess 544 for receiving the power line contact group 40 and the waterproof structure 42 thereof; but not limited thereto, in another implementation In the example, the power line contact group and its waterproof structure may also be located outside the pressure ring.
在上述實施例中，導熱基板包含一金屬板上形成複數個微凸塊；以及一電路層上形成有複數開口，電路層係設置於金屬板上，且使得微凸塊經由電路層之開口露出，以供於微凸塊上設置LED發光體，且LED發光體以導線電性 連接至電路層，此種導熱基板可用以設置LED發光體，且由於導熱基板本身導熱速率快、熱容大，因此可以直接取代傳統均溫板的功能。 In the above embodiment, the thermally conductive substrate comprises a plurality of microbumps formed on a metal plate; and a plurality of openings are formed on the circuit layer, the circuit layer is disposed on the metal plate, and the microbumps are exposed through the opening of the circuit layer For providing LED illuminants on the microbumps, and the LED illuminants are electrically conductive Connected to the circuit layer, such a heat-conducting substrate can be used to set the LED illuminator, and since the heat-conducting substrate itself has a high thermal conductivity and a large heat capacity, it can directly replace the function of the conventional tempering plate.
在本發明中，光機模組係直接以發光二極體燈板作為光機模組的底板，讓發光二極體燈板直接導熱到後續光機模組所加裝之散熱器中，由於減少了傳統光機模組之底板的設計，使得LED發光體所產生的熱能可有效進行熱傳導，而具有較佳之散熱效率。另一方面，由於本發明光機模組係直接將電源線接點組設置於壓圈外或壓圈外側面，只需於電源線接點組與電源線焊接之後以點膠等其他方式形成一防水結構，即可達到電源線接點組的防水效果，相較於傳統需使用防水接頭之光機模組而言，本發明光機模組可減少漏水的產生，且減少組裝配件及簡化組裝流程，進而具有降低成本的優點。 In the present invention, the optomechanical module directly uses the illuminating diode lamp plate as the bottom plate of the optomechanical module, so that the illuminating diode lamp plate directly conducts heat to the heat sink installed in the subsequent optomechanical module, due to The design of the bottom plate of the conventional optomechanical module is reduced, so that the thermal energy generated by the LED illuminator can effectively conduct heat conduction, and has better heat dissipation efficiency. On the other hand, since the optomechanical module of the present invention directly sets the power line contact group outside the pressure ring or the outer side of the pressure ring, it only needs to be formed by other means such as dispensing after the power line contact group and the power line are soldered. A waterproof structure can achieve the waterproof effect of the power line contact group. Compared with the traditional optical module that needs to use the waterproof joint, the optomechanical module of the invention can reduce the occurrence of water leakage, and reduce assembly parts and simplification. The assembly process, in turn, has the advantage of reducing costs.
另一方面使用光機模組的優勢是在如損壞時只需將光機模組拆下來更換，不須將整組燈具拆卸下來，對於需要高空作業之路燈/天井燈/投光燈等將可以大幅節省施工費用。 On the other hand, the advantage of using the optomechanical module is that it only needs to be removed and replaced when the optomechanical module is damaged. It is not necessary to disassemble the entire set of luminaires. For streetlights/panlow lights/projection lights that require aerial work, etc. Significant savings in construction costs.
以上所述之實施例僅係為說明本發明之技術思想及特點，其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施，當不能以之限定本發明之專利範圍，即大凡依本發明所揭示之精神所作之均等變化或修飾，仍應涵蓋在本發明之專利範圍內。 The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.
30‧‧‧光機模組 30‧‧‧ optomechanical module
32‧‧‧發光二極體燈板 32‧‧‧Lighting diode board
34‧‧‧透光罩體 34‧‧‧Light cover
36‧‧‧導熱基板 36‧‧‧thermal substrate
361‧‧‧上表面 361‧‧‧ upper surface
40‧‧‧電源線接點組 40‧‧‧Power cord contact group
42‧‧‧防水結構 42‧‧‧Waterproof structure
44‧‧‧電源線 44‧‧‧Power cord
48‧‧‧本體 48‧‧‧Ontology
50‧‧‧固定部 50‧‧‧ Fixed Department
501‧‧‧頂面 501‧‧‧ top surface
54‧‧‧壓圈 54‧‧‧压圈
541‧‧‧壓制部 541‧‧‧Depression
542‧‧‧側壁部 542‧‧‧ Side wall
544‧‧‧凹槽 544‧‧‧ Groove
56‧‧‧防水膠墊 56‧‧‧Waterproof pad
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103125642A TWI575784B (en) | 2014-07-28 | 2014-07-28 | Opto-mechanical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103125642A TWI575784B (en) | 2014-07-28 | 2014-07-28 | Opto-mechanical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201605080A TW201605080A (en) | 2016-02-01 |
| TWI575784B true TWI575784B (en) | 2017-03-21 |
Family
ID=55809731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103125642A TWI575784B (en) | 2014-07-28 | 2014-07-28 | Opto-mechanical module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI575784B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI643361B (en) * | 2016-12-30 | 2018-12-01 | 菱生精密工業股份有限公司 | Remote sensor packaging method |
| TW201828505A (en) * | 2017-01-20 | 2018-08-01 | 聯京光電股份有限公司 | Optoelectronic package and fabricating the same |
| TWI805385B (en) * | 2022-05-31 | 2023-06-11 | 世頂企業有限公司 | LED light bar fixing structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200708682A (en) * | 2005-08-29 | 2007-03-01 | Cock Rooster Lighting Co Ltd | Light-emitting lamp |
| TWM396917U (en) * | 2010-08-27 | 2011-01-21 | Wen-Jin Chen | Improved structure for modularized LED device |
| TWM445125U (en) * | 2012-08-21 | 2013-01-11 | Chin-Wen Wang | Wrapped type light engine |
| TW201418625A (en) * | 2012-11-13 | 2014-05-16 | Delta Electronics Inc | Lens unit,lighting module,and illuminant device |
-
2014
- 2014-07-28 TW TW103125642A patent/TWI575784B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200708682A (en) * | 2005-08-29 | 2007-03-01 | Cock Rooster Lighting Co Ltd | Light-emitting lamp |
| TWM396917U (en) * | 2010-08-27 | 2011-01-21 | Wen-Jin Chen | Improved structure for modularized LED device |
| TWM445125U (en) * | 2012-08-21 | 2013-01-11 | Chin-Wen Wang | Wrapped type light engine |
| TW201418625A (en) * | 2012-11-13 | 2014-05-16 | Delta Electronics Inc | Lens unit,lighting module,and illuminant device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201605080A (en) | 2016-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3159158U (en) | LED lighting device with good illumination brightness | |
| TWI461629B (en) | Illuminating apparatus and illuminating module thereof | |
| KR101057771B1 (en) | LED lighting device | |
| CN100580306C (en) | High-brightness LED illuminating light fitting and its manufacture | |
| TWI575784B (en) | Opto-mechanical module | |
| JP2010225409A (en) | Bulb-type light-emitting diode illumination lamp | |
| TW201506296A (en) | Light emitting diode bulb | |
| TWM340415U (en) | Illumination device | |
| KR101082587B1 (en) | Illuminator using led | |
| CN105588025B (en) | LED lighting device | |
| TWI559053B (en) | Light source device adapted to a direct-type backlight module and display device | |
| TW201510426A (en) | LED lamp with heat dissipating structures | |
| TWI539111B (en) | Three-dimensional circuit board and a light emitting diode lamp having the three-dimensional circuit board | |
| CN207778079U (en) | Unit in a kind of high light transmission and integral heat dissipation LED lamp | |
| CN201666482U (en) | Light-emitting diode lamp capable of being assembled automatically | |
| US20130099668A1 (en) | Led lamp with an air-permeable shell for heat dissipation | |
| CN204114650U (en) | Insulating radiation COB bulb lamp device | |
| TWM450681U (en) | Structure of LED lamp | |
| TWI442004B (en) | Light source module | |
| TWI544170B (en) | Light emitting diode bulb | |
| JP6945191B2 (en) | Mounting structure of light source board | |
| TW201105905A (en) | LED lamp | |
| CN203231148U (en) | LED (Light Emitting Diode) lighting device | |
| TWI440797B (en) | LED bulb structure | |
| TWM449239U (en) | Peripheral lighting lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |