M404312 f ,t 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種薄形面發光式LED光源模組，尤適用 於照明設備之領域，包括結合於汽、機車之燈具或家用燈具 上’使LED燈板之厚度可製設為薄質，容易與小型化產品作 結合。 【先前技術】 • LED (Light Emitting Diode，發光二極體）堪稱為新世 紀照明的主要因素，是因為LE：D具有使用壽命長、耗電量省、 低泺染…等優點特性，所以視為照明工業革命的關鍵，因此 被眾多國家列入為重點發展的新產業。M404312 f , t V. New description: [New technical field] This creation is about a thin-shaped surface-emitting LED light source module, especially suitable for the field of lighting equipment, including lamps, locomotive lamps or household lamps. The upper part makes the thickness of the LED panel thin and can be easily combined with miniaturized products. [Prior Art] • LED (Light Emitting Diode) is the main factor in the lighting of the new century. Because LE:D has the advantages of long service life, low power consumption, low dyeing, etc. As the key to the lighting industry revolution, it has been listed as a new industry with a focus on development.
目前市面上可以看到普遍使用的LED燈製品，大多是交 通用的號諸、警示標總或營業場所之燈飾及廣告看板的指示 - 性照明，使用於這些場合所需的LED燈製品其較不需要求LED • 她的厚度規格，因這些led燈製品的體積較大，空間不受 到限制。 然而’對於—般汽、機車之燈具或家用燈具而言，體積 上的規袼要麵其㈣應消費者接受度的考量，㈣常見傳 統⑽光源模組1Q的結構如第7圖示為於—載板Η的一 =置至少-LED發光源12,且該等LED發光源12主要由至 少y LED晶片⑵、一晶杯結構122及一封裝部⑵所組成， 再从焊接料與該餘u上的各個轉⑴躲連接。其 3 中，該載板11為常見之PCB電路板或者是具有導熱特性的金 屬材質而製成’且該載板11可視需要而製成不同形狀、尺寸， 以便後續組裝時之電性連接用途。 然而，該等LE1D發光源12係間接組裝於該載板Η上， 致該等LE1D發光源12產生之熱量僅能透過接觸部位進行間接 導熱，受賴傳導的溫度梯度遞減’其散熱效果自然也受到 限制。再者，該光源模組1〇係透過封裝該等LED發光源12， 以及將該等LED發光源12焊接於該載板u等手續而製成， 其製程繁j貞而會提高製造成本。 是以，本案採了-_新的直接導熱統模組結構，利 用COB(Chip on board)封袈的加工方式將料⑽晶片直接 封裝於-具有電性絕緣效果的载體上，並_ —導電元件而 與該等⑽晶片電性連接，達到簡化了結構而降低製造成本， 且該等LED ;錄_合佈建於—整個面積的載體上，使 發光效果具相乘之功效，並可大幅降低殘影。 本創作人有鑑於此，期能提供一種薄形面發光式光 源模組，可將LED燈板的厚度為料，且即使是小面積的 燈板亦能採全面發絲態樣提供發光魏，林解所欲研 創之創作動機。 【新型内容】 度製為薄質’且於所設燈板面__域採全面發光的面狀 發光態樣提供發光功效，並可大幅降低殘影，整體更具發光 高亮度效果。 ~ 本創作之另-目的，在提供-種薄形面發光式LED光源 模組’可將LED燈板的厚度製為薄f，且小面積的燈板採全 面發光而更顧於結合在小型化產品，例如汽車室内燈、機 車燈座或者是家用檯燈、攜帶式照明燈具上，以達更佳的照 明效用。 為達上述目的’本創作所設計的薄形面發光式⑽光源 模組， —前蓋及一底 包括設有一 LED燈板、一 PCB電路板、 板所組成；所述之led燈板由-載體、複數個LED晶片及一 封裝面層所組成，職縣面於各LED W之間塗佈設有絕 緣層，載體於-端部設有電源接線，而複數個LED晶片則設 置於該載體上，各led晶片分別電性連接於電源接線，而封 裝面層設於載體上且包覆LED晶片； 該PCB電路板上設有多數個電子元件形成完整的電路， 載體上所設f源接軸電路板相賴，電路板—端設有正負 極電源線； ' 該前盍於前魏有—透雜，絲端騎設有多數個卡 扣，使LED燈板及PCBt路板可結合置入於前蓋内凹部中； 該底板於對應卡扣所設位置形成有凹槽，使底板可扣合 固定於前蓋底部； M404312 組合時，使led燈板結合於PCB電路板後，設置於前蓋 内凹部中，再利用底板扣合於前蓋底端，使LED燈板受固定 於前蓋中而結合。 藉此’使LED燈板結合於PCB電路板後，設置於一前蓋 内凹部中’再利用一底板扣合於前蓋底端，使LED燈板受固 定於前蓋中而結合。達到使LED燈板利用COB(Chip on board) 加工技術將LED晶片直接封裝於該載體上，進而簡化結構且 能降低製造成本之目的，同時於單一載體上可同時設置多數 顆的LE：D晶片，使各LE：D晶片的排列間距極小，即左右間隔 之間距約為一個LED晶片大小，而前後排列間隔之間距約為 一個至五個LED晶片大小，藉此利用各LED晶片發光度上產 生重疊性，因此而形成為一種面發光式的高度發光效果，並 可大幅降低殘影；並因整體LED光源模組採薄質製成，故其 容易與小型化產品作結合，創造出產業上更廣泛的適用性。 本創作之其他特點及具體實施例可於以下配合附圖之詳 細說明中，進一步瞭解。 【實施方式】 請參第1〜3 ®所本創作之薄形面發光式LED光源 模組20設有一 LED燈板21、一 PCB電路板22、一前蓋23及 一底板24所組成，請參第2圖所示，該led燈板2〇，係由一 載體201、複數個LED晶片202及一封裝面層203所組成，該 載體201表面於各LED晶片202之間塗佈設有絕緣層2〇4,載 6 M404312 體201於一端部設有電源接線205。所述之封裝面層2⑽係選 用已知的透明膠或螢光膠，以包覆封裝該等LED晶片2〇2提 供保護作用。各LED晶片202，設置於該載體20〗上各[ED 晶片202分別電性連接於電源接線205。 本創作係先將各個LED晶片202固設於該載體2〇1表面， 再經由打線之手段而與該載體20]其上電源接線2〇5連接， 此加工方法係採與一般co队Chip 〇n b〇ard)的方式相同而 使各個LED晶片202直接封裝於該載體2〇1上，不但能夠達 到簡化結構而降低製造成本之目的，且該等LED晶片2〇2所 «χ數里較多，故該載體2〇1亦能直接作散熱，而於單一載體 201上可同時設置多數顆的LE)D晶片2〇2，使各led晶片的排 列間距極小’如第3圖式實施例情左右間隔之間距約為一At present, the commonly used LED lighting products can be seen on the market, most of which are the indicators for transportation, the warning labels or the lighting of the business premises and the indications of the advertising billboards. The lighting products used in these occasions are more suitable for LED lighting products. No need to ask for LEDs • Her thickness specifications, because of the large size of these led light products, space is not limited. However, for the general-purpose steam, locomotive lamps or household lamps, the volume regulation should be considered. (4) The consumer acceptance should be considered. (4) The common traditional (10) light source module 1Q structure is shown in Figure 7. - one of the carrier Η = at least - LED illuminating source 12, and the LED illuminating source 12 is mainly composed of at least y LED chip (2), a crystal cup structure 122 and a package portion (2), and then from the solder material and the remaining Each turn on u (1) hides the connection. In the third embodiment, the carrier board 11 is made of a common PCB circuit board or a metal material having thermal conductivity characteristics, and the carrier board 11 can be formed into different shapes and sizes as needed, so as to be electrically connected for subsequent assembly. . However, the LE1D illumination sources 12 are indirectly assembled on the carrier plate, so that the heat generated by the LE1D illumination sources 12 can only be indirectly thermally transmitted through the contact portions, and the temperature gradient of the conduction conduction is decremented. restricted. Furthermore, the light source module 1 is manufactured by encapsulating the LED light source 12 and soldering the LED light source 12 to the carrier board u, and the manufacturing process is complicated. Therefore, this case adopts the new direct thermal conductivity module structure, which uses the COB (Chip on Board) sealing method to directly package the material (10) wafer on the carrier with electrical insulation effect, and _ The conductive elements are electrically connected to the (10) wafers, so that the structure is simplified and the manufacturing cost is reduced, and the LEDs are built on the carrier of the entire area, so that the luminous effects are multiplied, and Dramatically reduce the afterimage. In view of this, the present creator can provide a thin-shaped surface light-emitting light source module, which can make the thickness of the LED light board material, and even a small-area light board can adopt the full hairline state to provide illumination. Lin Jie's creative motives for research and development. [New content] The degree is thin and the light-emitting effect is provided in the illuminating surface of the lamp panel surface, which can fully reduce the residual image, and the overall illumination is brighter and brighter. ~ Another purpose of this creation is to provide a thin-faced light-emitting LED light source module that can make the thickness of the LED light board thin, and the small-area light board is fully illuminated and more compact in combination. Chemical products, such as automotive interior lights, locomotive lamp holders or household table lamps, portable lighting fixtures, for better lighting effects. The thin-surface illuminated (10) light source module designed to achieve the above purpose, the front cover and the bottom comprise an LED light board, a PCB circuit board and a board; the led light board consists of - The carrier, the plurality of LED chips and a package surface layer are formed, the occupational county surface is coated with an insulating layer between the LEDs W, the carrier is provided with a power supply line at the end, and a plurality of LED chips are disposed on the carrier The LED chips are electrically connected to the power supply wiring, and the package surface layer is disposed on the carrier and covers the LED chip; the PCB circuit board is provided with a plurality of electronic components to form a complete circuit, and the f source is provided on the carrier. The axis circuit board depends on each other, and the circuit board is provided with positive and negative power lines; 'The front 盍 盍 前 有 — 透 透 透 , , , , , , , , , , 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝 丝The bottom plate is formed in the concave portion of the front cover; the bottom plate is formed with a groove at a position corresponding to the buckle, so that the bottom plate can be fastened and fixed to the bottom of the front cover; when the M404312 is combined, the LED light plate is coupled to the PCB circuit board, and is disposed on the bottom plate In the inner recess of the front cover, the bottom plate is fastened to the bottom end of the front cover. LED light receiving plate fixed to the front cover and binding. Therefore, after the LED lamp board is coupled to the PCB circuit board, it is disposed in a recess in the front cover, and then the bottom plate is fastened to the bottom end of the front cover by a bottom plate, so that the LED light board is fixed in the front cover and combined. The LED light board can be directly packaged on the carrier by COB (Chip on Board) processing technology, thereby simplifying the structure and reducing the manufacturing cost, and simultaneously setting a plurality of LE:D chips on a single carrier. Therefore, the arrangement pitch of each LE:D wafer is extremely small, that is, the distance between the left and right spacers is about one LED wafer size, and the distance between the front and rear alignment intervals is about one to five LED wafer sizes, thereby utilizing the luminosity of each LED chip. The overlap is formed into a surface-emitting high-luminance effect, and the image sticking can be greatly reduced; and because the overall LED light source module is thinned, it is easy to combine with the miniaturized product to create an industry. More broad applicability. Other features and specific embodiments of the present invention can be further understood from the following detailed description in conjunction with the accompanying drawings. [Embodiment] Please refer to the thin-surface light-emitting LED light source module 20 of the first to third embodiments, which is composed of an LED light board 21, a PCB circuit board 22, a front cover 23 and a bottom plate 24. As shown in FIG. 2, the LED lamp panel 2 is composed of a carrier 201, a plurality of LED chips 202, and a package surface layer 203. The surface of the carrier 201 is coated with insulation between the LED chips 202. Layer 2〇4, Load 6 M404312 Body 201 is provided with a power supply connection 205 at one end. The encapsulating surface layer 2 (10) is made of a known transparent or fluorescent glue to provide a protective effect by encapsulating the LED chips 2〇2. Each of the LED chips 202 is disposed on the carrier 20 and each of the [ED wafers 202] is electrically connected to the power supply wiring 205. In the present invention, each LED chip 202 is first fixed on the surface of the carrier 2〇1, and then connected to the carrier 20] via the wire bonding method. The processing method is adopted by the general co team Chip 〇 The manner of nb〇ard) is the same, and each LED chip 202 is directly packaged on the carrier 2〇1, which not only achieves the purpose of simplifying the structure but also reduces the manufacturing cost, and the LED chips 2〇2 are more Therefore, the carrier 2〇1 can also directly dissipate heat, and a plurality of LE)D wafers 2〇2 can be simultaneously disposed on the single carrier 201, so that the arrangement pitch of each led wafer is extremely small as in the third embodiment. The distance between the left and right intervals is about one
個LED晶片大小，而前後排列間隔之間距約為一個至五個LED 晶片大小，藉此利用各LE：D晶片202發光度上產生重疊性， 因而可大巾自降低殘影，因此而形成為—種面發光式的高度發 光效果。 且令絕緣層204佈設於各個LED晶片202之間’如第2 圖中實施例該載體201於表面設有一框部2〇6，使LED晶片 202及封裝面層2〇3設於該框部2〇6中，而電源接線2〇5連接 於PCB電路板22上。 *月參第2圖所示，該pcb電路板22上設有多數個電子元 件形成完整的電路，载體201上所設電源接線205與電路板 7 M404312 22相連結，電路板22 —端設有正負極電源線22卜 請參第1、4圖所示，該前蓋23於前端設有一透空槽 231，於底端周緣設有多數個卡扣232，使LED燈板2〇及pcB 電路板22可結合置入於前蓋23内凹部233中。另外，該底 板24於對應卡扣232所設位置形成有凹槽241，使底板24 可扣合固定於前蓋23底部’該底板於板體上設有散熱孔 242。當組合時，使LED燈板21結合於PCB電路板22後，設 置於前蓋23内凹部233中’再利用底板24扣合於前蓋23底 端’使LED燈板21受固定於前蓋23中而結合。 請參第4、5、6圖所示，當本創作之面發光LED光源 模組20製成後，其達到使led光源模組之厚度可製設為薄質 狀，因此而容易與小型化產品作結合。如第5圖中所示，其 LED光源模組可結合設計製成於車用室内燈3〇，其因LED燈 版21上設有多數的LE：D晶片2〇2，其LED燈板採面發光式高 效發光效果，因而可提供一極佳的照明。又如第6圖所示， 其因本創作之面發光式LE：D光源模組20為可製成薄質，因此 亦容易與一輕巧折疊式家用檯燈40結合，而使生產的檯燈適 合於折疊後攜帶旅行。 綜上所述，本創作確可達到創作之預期目的，提供一種 薄質面發光式LED光源模組，使發光後呈現出的光源效果為 面發光式，可大幅降低殘影，具有較高的發光特性，且其薄 質LED光源模組的設計，使運用於小型化產品結合時，更増 8 M404312 . · 進開發上的適雜，具有實_值缺，爰依法提出專利申 請。 惟以上所述者’僅為柄型讀缝施_已，當不能 以此限林新财狀顧；故，錢本新㈣請專利範圍 及新型說明如容所作之簡單料效變化與修飾，皆應仍屬 本新型專利涵蓋之範圍内。 【圖式簡單說明】 第1圖為本創作面發光LE：I)光源模組之元件分解圖。 第2圖為本創作LED燈板與PCB電路板之構造分解圖。 第3圖為本創作LED燈板與PCB電路板組合後外觀圖。 第4圖為本創作面發光LED光源模組組合後外觀圖。 第5圖為本創作面發光LE：D光源模組應用於車内燈示範例圖。 第6圖為本創作面發光LED光源模組應用於室内檯燈示範例 圖。 矛/圖為一習闬傳統led光源模組的結構示意圖s 【主要元件符號說明】 1 0..傳統LED光源模組 1工.·载板 1 2…LED發光源 1 2 1.. LED晶片 1 2 2 ·.晶杯結構 1 2 3..封裝部 2 0..面發光LED光源模組 2 1.. LED燈板 2 2 ·. PCB電路板 9 M404312 2 3..前蓋 2 Ο 1..載體 2 Ο 3..封裝面層 2 0 5..電源接線 2 2 1..電源線 2 3 1..透空槽 2 3 3..内凹部 2 4 1..凹槽 3 0..車用室内燈 4 家用檯燈 4..底板 0 2.. LED 晶片 0 4..絕緣層 0 6..框部 3 2..卡扣 4 2..散熱孔The size of the LED chips, and the distance between the front and rear arrays is about one to five LED chip sizes, thereby utilizing the overlap of the luminosity of each LE:D wafer 202, so that the large towel can reduce the residual image, thereby forming - High luminous effect of a kind of surface illumination. And the insulating layer 204 is disposed between the LED chips 202. As shown in the second embodiment, the carrier 201 is provided with a frame portion 2〇6 on the surface, so that the LED chip 202 and the package surface layer 2〇3 are disposed on the frame portion. 2〇6, and the power supply wiring 2〇5 is connected to the PCB circuit board 22. * As shown in Fig. 2, the pcb circuit board 22 is provided with a plurality of electronic components to form a complete circuit. The power supply wiring 205 provided on the carrier 201 is connected to the circuit board 7 M404312 22, and the circuit board 22 is provided at the end. There are positive and negative power supply lines 22, as shown in Figures 1 and 4, the front cover 23 is provided with a through-hole 231 at the front end, and a plurality of buckles 232 are provided on the periphery of the bottom end to make the LED light board 2 and pcB The circuit board 22 can be incorporated into the recess 233 in the front cover 23. In addition, the bottom plate 24 is formed with a recess 241 at a position corresponding to the corresponding buckle 232, so that the bottom plate 24 can be fastened and fixed to the bottom of the front cover 23. The bottom plate is provided with a heat dissipation hole 242 on the plate body. When combined, after the LED light board 21 is coupled to the PCB circuit board 22, the recessed portion 233 is disposed in the recess 233 of the front cover 23, and the bottom plate 24 is fastened to the bottom end of the front cover 23 to fix the LED light board 21 to the front cover. 23 and combined. Referring to Figures 4, 5, and 6 , when the surface-emitting LED light source module 20 of the present invention is made, the thickness of the LED light source module can be made thin, so that it is easy to be miniaturized. The product is combined. As shown in FIG. 5, the LED light source module can be combined and designed into the interior light of the vehicle, and the LED light plate 21 is provided with a plurality of LE:D chips 2〇2, and the LED light plate is adopted. The surface-emitting high-efficiency illuminating effect provides an excellent illumination. As shown in FIG. 6, the surface-illuminated LE:D light source module 20 of the present invention can be made thin, so it is easy to combine with a lightweight folding household table lamp 40, so that the table lamp produced is suitable for Carry and travel after folding. In summary, the creation can achieve the intended purpose of creation, providing a thin-surface illuminated LED light source module, so that the light source effect after the illumination is surface-emitting, which can greatly reduce the residual image, and has a high The illuminating characteristics, and the design of its thin LED light source module, make it suitable for the combination of miniaturized products, more 増 8 M404312. · Into the development of the appropriate, there is a real lack of value, 提出 legally filed a patent application. However, the above-mentioned ones are only for the shank type of reading _ already, when it is not possible to limit the new wealth of the forest; therefore, Qian Benxin (4) the patent scope and the new description of the simple material effect changes and modifications should be It is still within the scope of this new patent. [Simple description of the figure] The first figure is an exploded view of the element of the creative surface illumination LE:I) light source module. The second figure is an exploded view of the structure of the LED light board and the PCB circuit board. The third picture shows the appearance of the combination of the LED light board and the PCB circuit board. The fourth picture is the external view of the combination of the creative surface light-emitting LED light source module. Fig. 5 is a diagram showing an example of a creative light-emitting LE:D light source module applied to an interior light. Fig. 6 is a diagram showing an example of the application of the surface-emitting LED light source module to the indoor table lamp. The spear/picture is a schematic diagram of a conventional LED light source module. [Main component symbol description] 1 0.. Traditional LED light source module 1 work. · Carrier board 1 2... LED light source 1 2 1.. LED chip 1 2 2 ·.Crystal cup structure 1 2 3..Packing part 2 0..Surface light emitting LED light source module 2 1.. LED light board 2 2 ·. PCB circuit board 9 M404312 2 3. Front cover 2 Ο 1 .. Carrier 2 Ο 3.. Package surface layer 2 0 5. Power supply wiring 2 2 1. Power supply line 2 3 1. Empty space 2 3 3. Inner recess 2 4 1.. Groove 3 0. .Car interior light 4 Home desk lamp 4..Bottom plate 0 2.. LED chip 0 4. Insulation layer 0 6.. Frame part 3. 2. Buckle 4 2. Cooling hole