TW474032B - High brightness LED - Google Patents

Abstract

A high brightness LED is disclosed, which comprises: a base stand of high conductivity, high thermal conductivity alloy copper material, one or more concave cups are disposed on its top for implanting the chip, one or more concave grooves are disposed at the edge of the base stand for installing the insulating wire (positive electrode), there is a protruded large volume base stand pillar under the base stand installed at the perpendicular corresponding position of the concave cup at the implanted location of chip; one or more gold wires connecting to the chip and the insulating wire (positive electrode); and encapsulant to encapsulate the chip, gold wire on the base stand; thereby the generated heat by the chip can be dissipated through the base stand so that the chip won't be overheated and the brightness of LED can be increased.

Description

474032

-1 ^ .89123245 V. Description of the invention (1) [Scope of application of the present invention] 'It is in line with economic billboards and various types of traffic lighting' The present invention aims to provide a large-brightness light-emitting diode with good heat dissipation and fruit effect. The polar body is particularly suitable for those who use it on the wide number, the rear light of the handlebar, the brake light or the indicator light. [Summary of previous techniques] In recent years, due to the promotion of global environmental protection concepts, reducing the amount of power generation is equivalent. Non-polluting energy sources [such as wind, tides, etc. are still being explored, and the use of solar energy is just the beginning. Therefore, when "open source" is not easy, "throttling" is the top priority of all countries. In order to reduce the global electricity consumption, the advanced countries have introduced the "white light plan". Looking around low-energy light-emitting diodes (LEDs for short), at present, apart from being used as indicators, it is difficult to use them for lighting. If LEDs can be used for lighting, it can not only achieve the purpose of saving power, but also A small step towards the realization of the environmental vision. However, after the light-emitting diode is powered on, the temperature of the internal chip (ch i) will increase. If it is overheated, it will immediately destroy the brightness. Once the brightness is reduced, it will age. If it is operated again at a lower temperature, its brightness cannot be restored. Physical phenomenon. Therefore, the manufacturers of light-emitting diodes will emphasize the limitation of the maximum current of the light-emitting diodes (preventing 0VERCURRENT) as shown in Figure 1. Conventional LEDs are made of thin iron or copper (about 0.5 m / m thickness) made of two-pole pins a and b, punched out on the top of one pin B

Page 5 474032

D connects the chip C with the other pin a, and finally seals the chip c and the gold wire D on the upper ends of the two-pole pins A and B with a sealant e to complete the production of the LED; 2 The heat dissipation is due to the thin pins Poor, in order to make the temperature of the shiny chip low = critical temperature of deterioration, so the LED is only suitable for the indicator light ^, change & of 'If it can improve the heat dissipation problem of LE d, you can use ED $ to The current that exceeds the critical temperature of deterioration, due to good heat dissipation and not overheating, causes it to emit brightness suitable for lighting, replacing high-energy consumption white heat lamps, to achieve power saving, and to expand the use of LEDs. [General summary of the present invention] _ The main purpose of the present invention is to provide a high-brightness light-emitting diode that improves its own heat dissipation ability. A secondary object of the present invention is to provide a high-brightness light-emitting diode which has a large brightness and can be used for display. .... Another object of the present invention is to provide a high-brightness light-emitting diode, and an innovative structure for rapid heat dissipation and brightness enhancement, which can replace high-energy-consumption incandescent lamps' to save electricity. Another purpose of the Ming Dynasty is to provide a kind of light-emitting diodes that can not only serve as indicator lights, but also can be used in advertising billboards, traffic signs, and other diversified commercial products. They include: The base is made of high-conductivity, heat-transmitting alloy copper, and one or more concave cups are provided at one of the upper part for implanting the chip, and one or more grooves are provided at the edge of the base. For the insulation wire (positive) connection, a large volume of the base post protrudes below the base, and is not in the vertical corresponding position of the concave cup where the chip is implanted;

IEH

One ^ or—more than one gold wire ’connects the chip to the insulated wire (positive, · ______________________ $ 6 pages 4/4032

< =, sealing, packaging the chip and the gold wire on the base; by this, the chip produces Λ τ,, and 畺 匕 radiates heat through the base, so that the chip does not overheat, and can be led The lighter. The following will explain the details, features, and functions of the present invention with a specific embodiment and accompanying drawings. [Description of the preferred embodiment] At the same time, referring to Figures 2a and 3, the present invention is mainly provided with: a base 1 1 with one or more recesses at one of the upper parts.

One 12 is used for implanting the chip 20, and one or more grooves are provided on the edge of the base 1 1 for the insulated wire 2 2 to be connected, and at the same time, a positioning is provided on the edge of the base 1 The notch 14 is used for production and processing positioning, and a large volume of the base cylinder 10 extends at the eccentric portion of the bottom of the base 11, and the eccentric portion is the concave cup 12 located at the implantation position of the wafer 20. Vertical corresponding position. In addition, the base 1 i of the present invention may be a square or hexagonal head in addition to the round head described above, as shown in Figs. 2b and 2c. One or more gold wires 2 1 are connected to the chip 20 and the insulated wires 2 2 (positive). The sealant 3 0 ′ encapsulates the wafer 20 and the gold wire 2 1 on the base 1 1, wherein the base 11 and the base pillar 10 are integrally forged, because the base 11 and the base pillar are integrally forged. 10 is set to be eccentric, so the three grooves 13 on the edge of the base 1 i are away from the base cylinder 1 0, and the insulated wire 2 2 placed in the groove 13 is pressed and processed (do n’t Excessive compression damages the insulation), so that the insulated wires 2 2 are fastened in the grooves 1 3, and the three corresponding concave cups 12 located at the opposite positions of the three insulated wires 2 2 are added with a silver box.

Page 7 474032 nil Day Amendment No. 89123245 V. Description of the invention (4) The monochromatic or differently colored wafers 20 are sequentially implanted, so that gold f is placed on the wafers 20 and insulated wires 2 2 'in the traditional way. The glued-in film is immersed in the glued mold 20 and the pedestal work completed by wire immersion into the glue mold to form the LED 1 covered with the sealant 30 on the outside. As described above, the LED i of the present invention has a base pillar body ι .... Compared with the legs of conventional LEDs, its volume is at least 50 times that of conventional LEDs, so its heat dissipation efficiency is also lower than that of conventional LEDs. Well, in order to increase the heat dissipation capacity of the above ... 外设, there is a heat dissipation substrate 4 0, which is a metal plate with low hardness ^ 1, and C-shaped inserts are provided at its four corners: ^ 牌 而There is a screw hole in the center. The size of the C-shaped embedded hole 41 is set to match the diameter of the base body ο, so that the base pillar 10 of the LED can be soiled, and the shaped embedded hole 41 is tightly fitted and contacted. And the heat dissipation base: the wire is screwed on the non-conductive connecting piece 42, so the 'bad piece' in the LED 1 is generated by 02! = The heat energy is dissipated through the base 11 and the base pillar ",,) The base 11 can further guide the heat to the larger-volume heat-dissipating substrate 40, so as to form a secondary diffusion: and then add a fan 50 as the case may be, by the effect of wind ^ 'heat. In order to prevent one LED 1 from being damaged and affect all two, the LED of the present invention can be connected in a parallel and shared manner as shown in the following paragraphs! A string,

Page 8 Ran 'Because the wafer 2 implanted in LED 1 has the same color, if three wafers 20 of different colors are implanted, it should be an early color or a jj sighing that there are two different color circuits, χ 1 coffee丨 丨-; ~~ "is used for advertising 474032

When the board is turned on, the Kanban board 60 can produce different color changes (such as three different colors of red, yellow, and green) through the control circuit, as shown in Figures 5a-5c, and the advertisement board 60 is more visible. The led 1 can also act on the traffic lights of the parent number, effectively extending the life of the traffic lights, and at the same time can save electricity. In addition, in the heat dissipation substrate 4 of the present invention, the C-shaped recessed hole 4 丄 can be changed to a screw hole, and a screw hole is provided at the bottom of the base pillar i 0, and the base is secured by a screw and a gasket. The cylinder 10 is screwed onto the heat-dissipating substrate 40 (as shown in FIG. 4c), and the effect of secondary heat dissipation can also be achieved. As can be seen from the above, the structure according to the present invention has the following practical advantages: 1. It has a heat dissipation surface area that is dozens of times that of conventional LEDs.

That is, it has a good heat dissipation effect (once heat dissipation). At the same time, a plurality of chips of different colors can be set in one LE D at the same time, and a variety of different colors of light can be emitted. 3 4, can be E-based, from Wen, Li and another D chip board combination to form two limits on the degree of heat dissipation, this can be a variety of at the same time can be described above only improved

The heat generated by the preset is re-heated at a fast speed and can be made clear. The different colors of L can be extended. The traditional L of the present invention has a large number of thermal energy extensions. ’Therefore, the current increases the current E D to make color changes. Reveal a heat sinking substrate with embedded holes, which will make the conductive L base cylinder and larger volume of heat sinking Led. The heat sinking surface area will make it clearer that the LED will not reach the threshold to produce brighter light. Advertising signboards or traffic signs, can make the advertising signboards more visible. For example, they do not dissipate heat. The new large-dimension light-emitting diodes have poor structure and are limited by the lack of critical temperature.

474032 Case No. 89123245 / Month '/ Revision V. Invention Description (6) is lost, and it provides a LED structure with good heat dissipation effect, long life and high brightness. It has novelty and excellent market competitiveness, and has industry Based on the value of use, the invention patent application was filed according to law.

Page 10 474032 Case No. 89123245 η Revision Simple description of the drawing [Simplified description of the drawing] Fig. 1 is a sectional view of a conventional LED. Figures 2a-2c are top views of different shaped bases of the present invention. Fig. 3 is a sectional view of an embodiment of the present invention. Figure 4a is a schematic diagram of the present invention combined with a heat dissipation substrate. Figure 4b is the wiring diagram of Figure 4. Figure 4c is another application example of the present invention combined with a heat sink substrate. Figures 5a-5c are schematic diagrams of the present invention acting on advertising boards to emit different colors. [Comparison of component numbers and names in the drawing] A, pin (positive) B, pin (negative) B1, concave cup C, chip D, gold wire E, sealant

1.L E D

Page 11

Claims (1)

474032 j W7t7 A high-brightness light-emitting diode, which includes: a base made of high-conductivity, high-thermal-conductivity alloy copper, and one or more concave cups at one position above the base for implanting a chip One or more grooves are provided on the edge of the base for the insulated wires to pass through. A large volume of base pillars extend below the base, which are located at the vertical corresponding positions of the concave cups where the wafer is implanted; Or more than one gold wire, connecting the chip and the insulated wire (positive electrode); and sealing glue, packaging the chip and the gold wire on the base; thereby, the heat generated by the chip can be passed through the base and the base post The body dissipates heat, so that the chip does not overheat, and it can increase the brightness of the LED. 2. The high-brightness light-emitting diode described in item 1 of the scope of patent application, in which the base column system is set at an eccentric position. 3. The high-brightness light-emitting diode as described in item i of the patent application scope, wherein the base is provided with a plurality of concave cups, and the concave cup is provided with a chip cylinder of the same color to improve the use of LEDs. Brightness. 4. The high-brightness light-emitting diodes described in item 3 of the scope of the patent application, in which wafers of the same color can share a single insulated wire (positive electrode). 5. The high-brightness light-emitting diode described in item 1 of the scope of the patent application, wherein the base is provided with a plurality of concave cups, and different color chips are arranged in the concave cup to share a base cylinder, and the control circuit is borrowed. (Control circ -uit) Controls the lighting of the chip, so that it can be lit as a single color chip, or two or more different color chips are lit at the same time or at the same time, so that L Page 12 4V4032 E D color can be used for a variety of changes. '' 6. The large-brightness light-emitting diodes described in item 1, 3, or 5 of the scope of the patent application. When used, a large-volume heat-dissipating substrate is provided, and most of the large-redundant light-emitting diodes are borrowed from its base. Combined with the heat dissipation substrate to achieve the effect of secondary heat dissipation to the side of the diode. 7 The high-brightness light-emitting diode as described in item 6 of the patent application scope of the patent can be used on one side (or one end) of the heat sink, and a small fan ′ is provided to achieve the effect of re-radiating. 8. According to the high-brightness light-emitting diode described in item 6 of the scope of the patent application, the four corners of the heat sink substrate are each provided with c-shaped recessed holes for fitting the base cylinder, and the center is provided with a screw hole for the screw. Suitable for non-conductive connection pieces. 9. A high-brightness light-emitting diode, including a base, which is made of high-conductivity, high-thermal-conductivity alloy copper, and one or more concave cups are provided at one position above the base for implantation of chips. One or more grooves are provided on the edge of the base for insulation, and the wires pass through. A large volume of the base cylinder extends below the base, and the second is the vertical corresponding position of the concave cup located at the wafer implantation place. The bottom of the base pillar is set as a cone; one or more gold wires are connected to the chip and the insulated positive electrode); and Jingjing 10 sealant is used to package the chip and gold wire on the base; , So that the heat generated can be dissipated by the base and the base cylinder, so that the sheet does not overheat, and can increase the brightness of the LED. The high-brightness light-emitting diode described in item 9 of the scope of patent application, in $ 13 pages At this time, a large-volume heat-dissipating substrate is provided, and a plurality of diodes and brackets are 'bumped onto the heat-dissipating substrate by a cone preset at the bottom of the base' to achieve secondary heat dissipation to the side of the diode Effective person. 11. According to the large-brightness light-emitting diode described in item 10 of the scope of patent application, the heat-dissipating substrate is provided with an embedded hole for the base pillar to fit in place. 12. The high-brightness light-emitting diode as described in item No. 丨 0 of the patent application range, when in use, a small fan 'can be set on one side (or one end) of the heat-dissipating substrate to achieve the effect of re-radiating. 1 3. The high-brightness light-emitting diodes described in item 1, 3, 5 or 9 of the scope of patent applications are for advertising signage lights, traffic lights, vehicle rear lights, brake lights or direction indicators. By. Page 14