CN202948971U

CN202948971U - Integrated packaging structure for light-emitting diode (LED)

Info

Publication number: CN202948971U
Application number: CN 201220636250
Authority: CN
Inventors: 何文铭; 唐秋熙; 童庆锋; 申小飞
Original assignee: FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Current assignee: FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2012-11-28
Filing date: 2012-11-28
Publication date: 2013-05-22
Anticipated expiration: 2022-11-28

Abstract

The utility model relates to an LED lamp, in particular to an integrated packaging structure for an LED. The integrated packaging structure comprises a substrate, at least one reflection cup and a printed circuit board (PCB) slot are machined on the substrate, and at least one LED chip is fixed in the reflection cup, a PCB is mounted in the PCB slot. The LED chip is connected with the PCB, and the reflection cup and the substrate are in an integrated structure. By means of the integrated packaging structure, the cooling effect and the luminous efficiency of the LED lamp can be improved.

Description

The LED encapsulating structure of integration packaging

Technical field

The utility model relates to a kind of LED light fixture and makes the field, relates in particular to a kind of LED encapsulating structure of integration packaging.

Background technology

The universal light sources such as luminous flux and the incandescent lamp of tradition LED and fluorescent lamp are compared, and distance is very far away; LED will enter lighting field, and top priority is its luminous efficiency, luminous flux to be increased to the grade of existing lighting source; Due to improving constantly of LED chip input power, the encapsulation technology of power-type LED is had higher requirement.

For the requirement of lighting field to light source, illumination is faced with following challenge with the encapsulation of power-type LED: 1. higher luminous efficiency; 2. higher single light flux; 3. better optical characteristics (light directive property, colour temperature, color rendering etc.); 4. larger input power; 5. higher reliability (lower failure rate, longer life-span etc.); 6. lower luminous flux cost; The luminous efficiency of LED is to determine by the light extraction efficiency of the luminous efficiency of chip and encapsulating structure is common, and the main path that improves the LED luminous efficiency has: the luminous efficiency that 1. improves chip; 2. the light that chip is sent extracts effectively; The light that 3. will extract is derived outside the LED body efficiently; 4. improve the launching efficiency (for white light) of fluorescent material; 5. reduce the thermal resistance of LED.

The heat dissipation design of LED light source relates generally to the following aspects: light source is generally to adopt packaged LED lamp pearl array one by one on aluminium base at present, introduce COB(chip on board in the high light efficiency LED illumination) the direct encapsulation technology of substrate, not only can effectively reduce heat deposits and can not get scattering and disappearing in light source inside, and connect by the series-parallel chip chamber of various ways, indirectly reduce the chip power current density, reduce the generation of heat.

strip large-area metal aluminium base by brand-new design, and based on the thermal stress Cushioning Design, with chip direct and metal substrate binding by crystal-bonding adhesive, having reduced traditional low-power light source must be by the weld layer link of additional one deck FR4/ alumina-base material, simplify the passage of heat, heat is transmitted on radiator by metal aluminum substrate directly (we also can be by strengthening the area of aluminium base, play the effect of a part of radiator), design by separating purification simultaneously circuit and metallic plate are isolated fully, single-minded heat conduction path and current pathway are not disturbed mutually, effectively reaching thermoelectricity separates.

The radiator structure design: the heat that LED produces will accumulate in LED inside, and the junction temperature of chip will seriously raise, and luminous efficiency will sharply descend, and reliability (as life-span, gamut etc.) will degenerate; The high heat of high temperature will make the inner mechanical stress that produces of LED encapsulating structure simultaneously, may cause a series of integrity problem; So solving heat dissipation problem is the most important thing of improving the LED reliability; The heating of LED self raises the junction temperature of chip, causes the decline of chip light emitting efficient; Power-type LED must have good radiator structure, makes the heat of LED inside be exported as best one can as early as possible and to dissipate, and to reduce the junction temperature of chip, improves its luminous efficiency.

The utility model content

The technical problems to be solved in the utility model is to provide the LED encapsulating structure of the integration packaging of a kind of radiating effect of the LED of raising light fixture and luminous efficiency.

The utility model is achieved in that a kind of LED encapsulating structure of integration packaging, comprise substrate, be processed with at least one reflector and pcb board groove on described substrate, be fixed with at least one LED chip in reflector, in the pcb board groove, pcb board is installed, LED chip is connecting pcb board, and described reflector and substrate are integrated.

Described substrate plating surface is shaped with highly reflective coatint.

Described LED chip is bonded in bottom reflector by heat-conducting glue.

Described LED chip area accounts for the area of reflector bottom≤30%, the interval 〉=2mm between the LED chip.

The described reflector degree of depth is 1mm-3mm, and the reflector bottom margin is provided with chamfering.

Described reflector edge is provided with opening, and opening direction is towards the PCB plate.

Adopt aluminum conductor to connect between described LED chip, the aluminum conductor diameter is 0.5mm-1.5mm.

Described LED chip adopts parallel way to connect in same reflector.

Described LED chip adopts series system to connect in different reflectors.

The described PCB board slot degree of depth is identical with the PCB plate height, upper surface and substrate surface difference in height≤0.1mm after PCB plate embedding PCB board slot.

The processing mode of described reflector is die casting, welding or turning.

Described substrate surface fineness≤1.6.

The LED encapsulating structure of the utility model integration packaging has the following advantages: adopt and basically processing micropore, and the design of reflector of the present utility model and the arrangement mode of LED chip, can make the heat of LED inside can be rapidly, derive fully and dissipate, the junction temperature of LED chip is lowered, improve its luminous efficiency, greatly improved the radiating effect of LED light fixture.

Description of drawings

In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.

Fig. 1 is the plan structure schematic diagram of the LED encapsulating structure of the utility model integration packaging.

Embodiment

Below in conjunction with specific embodiment, the utility model is described in detail.

see also shown in Figure 1, it is the LED encapsulating structure of a kind of integration packaging described in the utility model, comprise circular substrate 15, be processed with 6 reflectors 12 and PCB board slot on circular substrate 15, fix 6 LED chips 11 with insulating heat-conductive glue in each reflector 12, pcb board 16 is installed in the pcb board groove, LED chip 11 is connecting pcb board 16, substrate 15 plated surfaces are shaped with highly reflective coatint, LED chip 11 is bonded in reflector 12 bottoms by heat-conducting glue, adopt aluminum conductor 14 to connect between LED chip 11, aluminum conductor 14 diameters are 1mm, LED chip 11 adopts parallel way to connect in same reflector 12, LED chip 11 adopts series system to connect in different reflectors 12, it is 30% that LED chip 11 areas account for reflector 12 bottom areas, be spaced apart 3mm between LED chip 11, reflector 12 degree of depth are 2mm, reflector 12 bottom margins are provided with chamfering, the PCB board slot degree of depth is highly identical with PCB plate 16, after PCB plate 16 embedding PCB board slots, upper surface and substrate 15 surface height difference are 0.1mm, there is opening at each reflector 12 edges, opening direction is towards PCB plate 16, the processing mode of described reflector 12 is die casting, welding or turning, described substrate 15 surface smoothnesses are 1.6.

Claims

1. the LED encapsulating structure of an integration packaging, comprise substrate, it is characterized in that: be processed with at least one reflector and pcb board groove on described substrate, be fixed with at least one LED chip in reflector, in the pcb board groove, pcb board is installed, LED chip is connecting pcb board, and described reflector and substrate are integrated.

2. the LED encapsulating structure of integration packaging according to claim 1, it is characterized in that: described substrate plating surface is shaped with highly reflective coatint.

3. the LED encapsulating structure of integration packaging according to claim 1 is characterized in that: described LED chip is bonded in the reflector bottom by heat-conducting glue.

4. the LED encapsulating structure of integration packaging according to claim 3 is characterized in that: described LED chip area accounts for the area of reflector bottom≤30%, the interval 〉=2mm between the LED chip.

5. the LED encapsulating structure of integration packaging according to claim 1, it is characterized in that: the described reflector degree of depth is 1mm-3mm, and the reflector bottom margin is provided with chamfering.

6. the LED encapsulating structure of integration packaging according to claim 5 is characterized in that: described reflector edge is provided with opening, and opening direction is towards the PCB plate.

7. the LED encapsulating structure of integration packaging according to claim 1 is characterized in that: adopt aluminum conductor to connect between described LED chip, the aluminum conductor diameter is 0.5mm-1.5mm.

8. the LED encapsulating structure of integration packaging according to claim 1 is characterized in that: described LED chip adopts parallel way to connect in same reflector.

9. the LED encapsulating structure of integration packaging according to claim 1 is characterized in that: described LED chip adopts series system to connect in different reflectors.

10. the LED encapsulating structure of integration packaging according to claim 1, it is characterized in that: the described PCB board slot degree of depth is identical with the PCB plate height.