GB2442074A - Heat sinking LED package - Google Patents

Heat sinking LED package Download PDF

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Publication number
GB2442074A
GB2442074A GB0707506A GB0707506A GB2442074A GB 2442074 A GB2442074 A GB 2442074A GB 0707506 A GB0707506 A GB 0707506A GB 0707506 A GB0707506 A GB 0707506A GB 2442074 A GB2442074 A GB 2442074A
Authority
GB
United Kingdom
Prior art keywords
heat sink
led module
groove
emitting diode
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0707506A
Other versions
GB0707506D0 (en
Inventor
Tai Yun
Ruey-Feng Tai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB0707506D0 publication Critical patent/GB0707506D0/en
Publication of GB2442074A publication Critical patent/GB2442074A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Abstract

A LED module includes a heat sink (1 fig 1) which is partially covered with an insulating layer A and has a groove 12 in a top recess 11. Mounting hole 13 are cut trough the heat sink (1) and a LED 2 is mounted in the groove 12. Metal conduction plates 131 are fastened to the heat sink (1) through holes 13 by upright pillars 132 and extend to the outside of the heat sink (1). Lead wires 21 connect the terminals of the LED 2 to the metal conduction plates 131. A light transmitting resin 4 is moulded on the groove 12 over the LED 2. A lens holder 3 is fastened top the heat sink (1) to hold an optical lens (33, fig 1) over the light transmitting resin 4.

Description

LED MODULE
BACKGROUND OF THE INVENTION
1. Field of the Invention:
The present invention relates to a LED (light emitting diode) and more Particularly, to a LED module that dissipates heat quickly during operation.
2. Description of the Related Art:
In recent decades, human beings consume energy heavily, resulting in an energy crisis. Nowadays, scientists in different Countries are trying hard to develop new energy and every-saving products: In Consequence, various petroleum substitutes have been developed, the utilization of solar power has been enhanced, and various low power consumption type fuel engines and motors and Power-saving lighting fixtures have been created. Nowadays, LEDs (light emitting diodes) have been intensively used to substitute for conventional incandescent bulbs and fluorescent bulbs in various fields for the advantage of low power Consumption.
The lower power consumption characteristic of LEDs is well known. Following fast development of semiconductor technology, high brightness LEDs are developed for use in many fields for illumination For example, LEDs have been intensively used in motor vehicles for vehicle lights.
However, a LED must be packaged with a light transmittance resin before application. Because a high brightness LED releases much heat during operation and is enclosed in the package, heat cannot be quickly dissipated during the operation.
SUMMARY OF THE INVENTION
The present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a LED (light emitting diode) module, which dissipates heat quickly during the operation of the LED (light emitting diode). According to one embodiment of the present invention, the LED module comprises a heat sink, which is partially covered with an insulative layer and has a groove in a top recess thereof, and a plurality of mounting through holes cut through the top and bottom sides, a LED mounted in the groove of the heat sink, metal COfldUto plates fastened to the mounting through holes and extended to the outside of the heat sink, lead wires respectively connected between the metal conduction plates and positive and negative terminals of the LED, a light transmittance resin molded on the groove over the LED, and a lens holder fastened to the heat sink to hold an optical lens Over the light transmittance resin.
According to another embodiment of the present invention, the LED module comprises a heat sink, the heat sink having a top side, a top groove in the top side, an insulative layer covered on the top side outside the groove; a metal thin film covered on the top groove; at least one light emitting diode respectively fixedly on the metal thin film; a plurality of metal Conduction plates affixed to the heat sink; a plurality of lead wires respectively connected between the metal COndto plates and positive and negative terminals of the at last one light emitting diode; and a light transmittance resin molded on the groove of the heat sink and covering the light emitting diode.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. I is an exploded view of a LED module in accordance with a first embodiment of the present invention.
FIG. 2 is a sectional assembly view of the LED module in accordance with the first embodiment of the present invention.
FIG. 2A is similar to FIG. 2 but showing the LED mounted on a metal thin film on the groove in the top recess of the heat sink.
FIG. 3 is a perspective assembly view of the LED module in accordance with the first embodiment of the present invention.
FIG. 4 is an exploded view of a LED module in accordance with a second embodiment of the present invention.
FIG. 5 is a sectional assembly view of the LED module in accordance with the second embodiment of the present invention.
FIG. 6 is a perspective assembly view of the LED module in accordance with the second embodiment of the present invention.
FJG. 7 is an exploded view of a LED module in accordance with a third embodiment of the present invention.
FIG. 8 is sectional assembly view of the LED module in accordance with the third embodiment of the present invention.
FIG. 9 is a perspective assembly view of the LED module in accordance with the third embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to FIGS. l-3, a LED module in accordance with a first embodiment of the present invention is shown comprising a heat sink 1, a LED (Light Emitting Diode) chip 2 mounted in the heat sink 1, and a lens holder 3 fastened to the heat sink 1 and holding an optical lens 33 corresponding to the LED chip 2. The heat sink 1 has a top recess 11, a groove 12 formed in the top recess 11 for the mounting of the LED chip 2, and a plurality of mounting through holes 13 cut through the top and bottom sides. Further, the top surface of the heat sink 1 is Covered with an insulation layer A. Further, a plurality of metal Conducting plates 131 are respectively fastened to the heat sink 1. The metal Conducting plates 131 each have an upright shank 132 respectively inserted from the bottom side of the heat sink I into the mounting through holes 13. After insertion of the upright shanks 132 into the mounting through holes 13, the top ends 133 of the upright shanks 132 are hammered down to affix the upright shanks 132 to the heat sink 1. Further, lead wires 21 are respectively connected between the positive and negative electrodes of the LED 2 and the upright shanks 132 of the metal Conducting plates 131. A light transmittance resin 4 is molded on the top recess 11 over the LED chip 2, keeping the LED chip 2 embedded in the light transmittance resin 4. The lend holder 3 has a plurality of bottom hooks 31 respectively hooked on the bottom edge of the heat sink 1, and a center opening 32. The optical lens 33 is fastened to the center Opening 32 of the lens holder 3. The heat sink 1 is made out of a metal material, for
S
example, gold, silver, copper, iron, aluminum, or their alloy that transfers heat energy efficiently. Further, a metal thin film 121 may be directly bonded to the groove 12 that is not covered by the insulatjve layer A so that the LED chip 2 can be directly fastened to the metal thin film 121. During the operation, heat energy is quickly transferred from the LED chip 2 to the heat sink I through the metal thin film 121 (see FIG. 2A). The metal thin film 121 can be a film of nickel gold alloy, nickel silver alloy, or nickel Copper alloy.
FIGS. 46 show a LED module in accordance with a second embodiment of the present invention. This embodiment is substantially similar to the aforesaid first embodiment with the exception that the heat sink I has a plurality of peripheral notches 14 for securing the bottom hooks 31 of the lens holder 3.
Further, the heat sink 1 has only two mounting through holes 13 for the mounting of two metal conducting plates 131.
FIGS. 7-9 show a LED module in accordance with a third embodiment of the present invention. According to this embodiment, the LED modUle comprises a heat sink 5, a LED (Light Emitting Diode) chip 2 mounted in the heat sink 5, and a lens holder 3 fastened to the heat sink 5 and holding an optical lens 33 corresponding to the LED chip 2. The heat sink 5 has a top center recess 52 for the mounting of the LED chip 2, a pluraJity of top border recesses 51 spaced around the top center recess 52, an upright rod 511 respectively disposed in each top border recess 51, and a plurality of peripheral bottom notches 53.
Further, the top surface of the heat sink S is covered with an insulation layer A. Further, a plurality of metal conducting plates 512 are respectively fastened to the top border recesses 51 of the heat sink 5 and extended to the periphery of the heat sink 5. The metal conducting plates 512 each have a vertical through hole 513 respectively coupled to the upright rod 511.
Further, lead wires 21 are respectively connected between the positive and negative electrodes of the LED chip 2 and the metal conducting plates 512. A light transmittance resin 4 is molded on the top side of the heat sink 5 over the LED chip 2, keeping IS the LED chip 2 embedded in the light transmittance resin 4. The lend holder 3 has a plurality of bottom hooks 31 respectively hooked on the peripheral bottom notches 53 of the heat sink 5, and a center opening 32. The optical lens 33 is fastened to the center opening 32 of the lens holder 3. Further, a locating frame 6 is sandwiched between the heat sink 5 and the lens holder 3, having a center opening 61 corresponding to the center opening 32 of the lens holder 3, and a plurality of inside notches 62 that accommodate the upright rods 511 respectively.
In the aforesaid embodiments, the lens holder 3 and the optical lens 33 are two independent members. Alternatively, the optical lens 33 can be formed integral with the lens holder 3. If desired, the lens holder 3 and the optical lens 33 can be eliminated from the LED module. Further, the LED module can be made carrying two or more LEDs 2.
Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention.

Claims (15)

  1. What the invention claimed is: 1. A LED module comprising: a heat sink,
    said heat sink having a top recess in a top side thereof, a groove in said top recess, and a plurality of S mounting through holes cut through top and bottom sides thereof and spaced around said groove; a light emitting diode chip fixedly mounted in said groove of said heat sink; a plurality of metal conduction plates affixed to said heat sink at a bottom side, said metal conducting plates each having an upright shank respectively affixed to the mounting through holes of said heat sink; a plurality of lead wires respectively connected between said metal conduction plates and positive and negative terminals of said light emitting diode chip; and a light transmittance resin molded on said groove of said heat sink and Covering said light emitting diode.
  2. 2. The LED module as claimed in claim 1, further comprising an insulative layer covered on at least one part of said heat sink.
  3. 3. The LED module as claimed in claim 1, wherein said groove of said heat sink has fixedly mounted therein at least one light emitting diode chip.
  4. 4. The LED module as claimed in claim I, wherein said heat sink is made of a metal material of high coefficient of heat transfer.
  5. 5. The LED module as claimed in claim 1, further comprising a lens holder fastened to said heat sink to hold an optical lens over said light transmittance resin, said lens holder having a plurality of bottom hooks respectively hooked on a bottom edge of said heat sink
  6. 6. The LED module as claimed in claim 5, wherein said optical lens is formed integral with a part of said lens holder.
  7. 7. A LED module comprising: a heat sink, said heat sink having a groove on one side thereof, and an insulative layer covered on the outer surface thereof beyond said groove; a metal thin film covered on said top groove; a light emitting diode chip fixedly mounted in said groove of said heat sink; a plurality of metal conduction plates affixed to said heat sink at a bottom side, said metal conducting plates each having an upright shank respectively affixed to the mounting through holes of said heat sink; a plurality of lead wires respectively connected between said metal Conduction plates and positive and negative terminals of said light emitting diode chip; and a light transmittance resin molded on said groove of said heat sink and covering said light emitting diode.
  8. 8. A LED module comprising: a heat sink, said heat sink having a top center recess, a plurality of top border recesses spaced around said top center recess, and a plurality of upright rods respectively disposed in said top border recesses, a light emitting diode chip fixedly mounted in said top center recess of said heat sink; a plurality of metal conduction plates affixed to said heat sink at a bottom side, said metal conducting plates each having a vertical through hole respectively coupled to said upright rods; a plurality of lead wires respectively connected between said metal conduction plates and positive and negative terminals of said light emitting diode; and a light transmittance resin molded on said groove of said heat sink and covering said light emitting diode.
  9. 9. The LED module as claimed in claim 8, wherein said heat sink is made of a metal material of high coefficient of heat transfer.
  10. 10. The LED module as claimed in claim 8, wherein said top center recess of said heat sink has fixedly mounted therein at least one light emitting diode chip.
  11. 11. The LED module as claimed in claim 8, wherein said upright rods of said top border recesses each have one metal COfldutjo plates mounted therein.
  12. 12. The LED module as claimed in claim 8, further comprising an insulative layer covered on at least one part of said heat sink.
  13. 13. The LED module as claimed in claim 8, further comprising a lens holder fastened to said heat sink and holding an optical lens over said light transmittance resin.
  14. 14. The LED module as claimed in claim 13, further comprising a locating frame sandwiched in between said lens holder and said heat sink, said locating frame having a center opening corresponding said light transmittance resin and a plurality of inside notches that accommodate said upright rods of said heat sink respectively.
  15. 15. The LED module as claimed in claim 13, wherein said optical lens is formed integral with a part of said lens older.
GB0707506A 2006-08-25 2007-04-18 Heat sinking LED package Withdrawn GB2442074A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095215085U TWM317075U (en) 2006-08-25 2006-08-25 Heat dissipation structure of light emitting diode

Publications (2)

Publication Number Publication Date
GB0707506D0 GB0707506D0 (en) 2007-05-30
GB2442074A true GB2442074A (en) 2008-03-26

Family

ID=38135021

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0707506A Withdrawn GB2442074A (en) 2006-08-25 2007-04-18 Heat sinking LED package

Country Status (5)

Country Link
DE (1) DE202007007581U1 (en)
FR (1) FR2905223A3 (en)
GB (1) GB2442074A (en)
NL (1) NL1033863C1 (en)
TW (1) TWM317075U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009255851A (en) * 2008-04-21 2009-11-05 Nippon Seiki Co Ltd Lighting device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008058494A1 (en) * 2008-11-21 2010-05-27 Neumüller Elektronik GmbH Ready-to-connect LED module body
DE102009024614A1 (en) * 2009-06-12 2010-12-16 Olsa S.P.A. Method for manufacturing lighting device for vehicle, involves providing illumination device with semiconductor light source for generating light and separate optical component for distribution of light
TW201114080A (en) * 2009-10-01 2011-04-16 Fortune Electronic Co Ltd GaN-series LED structure with heat-dissipating through-hole
WO2012036465A2 (en) * 2010-09-13 2012-03-22 Lee Dong-Soo Led light source structure with high illuminating power and improved heat dissipating characteristics
CN114122241B (en) * 2022-01-28 2022-05-13 江西鸿利光电有限公司 Light emitting device and method of manufacturing the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040061433A1 (en) * 2001-10-12 2004-04-01 Nichia Corporation, Corporation Of Japan Light emitting apparatus and method of manufacturing the same
WO2004107461A1 (en) * 2003-05-28 2004-12-09 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
US20050194601A1 (en) * 2001-04-17 2005-09-08 Ryoma Suenaga Light emitting device
WO2006022516A1 (en) * 2004-08-25 2006-03-02 Sailux, Inc. Light emitting device, light emitting device package structure, and method of manufacturing the light emitting device package structure
JP2006093470A (en) * 2004-09-24 2006-04-06 Toshiba Corp Lead frame, light-emitting device, and manufacturing method thereof
WO2006078462A2 (en) * 2005-01-14 2006-07-27 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050194601A1 (en) * 2001-04-17 2005-09-08 Ryoma Suenaga Light emitting device
US20040061433A1 (en) * 2001-10-12 2004-04-01 Nichia Corporation, Corporation Of Japan Light emitting apparatus and method of manufacturing the same
WO2004107461A1 (en) * 2003-05-28 2004-12-09 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
WO2006022516A1 (en) * 2004-08-25 2006-03-02 Sailux, Inc. Light emitting device, light emitting device package structure, and method of manufacturing the light emitting device package structure
JP2006093470A (en) * 2004-09-24 2006-04-06 Toshiba Corp Lead frame, light-emitting device, and manufacturing method thereof
WO2006078462A2 (en) * 2005-01-14 2006-07-27 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009255851A (en) * 2008-04-21 2009-11-05 Nippon Seiki Co Ltd Lighting device

Also Published As

Publication number Publication date
FR2905223A3 (en) 2008-02-29
NL1033863C1 (en) 2008-02-26
GB0707506D0 (en) 2007-05-30
TWM317075U (en) 2007-08-11
DE202007007581U1 (en) 2007-07-26

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