CN1328799C - Modification for heat conduction and luminosity upgrading structure of LED - Google Patents

Abstract

The present invention relates to an improvement of a heat conducting and luminosity enhancing structure of a luminous diode, which is mainly composed of a support frame unit which is formed in an integral mode, wherein the unit comprises a central part for fixing a bowl cup of a crystal wafer, a negative electrode part which comprises two mutually connected support frames, at least conducting wire which is connected with the crystal wafer, a positive electrode part, etc. The present invention is characterized in that the support frame unit is provided with at least one central part to divide the negative electrode part and the positive electrode part in a non-straight cutting mode, and opposite longitudinal cutting end faces are generated between the negative electrode part and the positive electrode part; the central part is provided with a chamber or form a first layer of bowl cup and an elongate wall which is slopes upwards; a concave part is arranged on the cup bottom of the first layer of bowl cup, and forms a second layer of bowl cup for bearing at least one light emitting crystal wafer so as to improve the condensation effects of the luminous diode.

Description

The heat conduction of light-emitting diode and brightness promote structure

Technical field

The present invention relates to light-emitting diode, the heat conduction and the brightness of especially relevant a kind of light-emitting diode promote structure.

Background of invention

At present relevant LED support mainly includes: by the negative electrode pin that a sheet metal forms, its upper end comprises a groove with the set chip, and is made up of the parts such as an anode pin that another sheet metal forms; Be to be a known technology, for example, TaiWan, China patent announcement No. 506626 " light-emitting diode structure improvement ", announce No. 488616 " LED support ", announce No. 441860 novel patents such as " support of light-emitting diode improve structure " of No. 486153 " LED support " and bulletin, all announcement has above-mentioned typical traditional structure in succession.

In above-mentioned patent case, demonstrate the improvement of relevant LED support aspect structural design, or promote problems such as its function, come the value on the increase industry, for example, announce No. 506626 " light-emitting diode structure improvement ", it mainly is to be provided with at least one light-emitting diode chip for backlight unit in negative electrode pin upper end, and this light-emitting diode chip for backlight unit is to be connected to anode pin upper end with a lead, be packaged with colloid in addition and in this negative electrode pin and anode pin upper end, it is characterized in that the cylinder end face that is shaped as of this colloid convexes with a convex globoidal; For another No. 488616 " LED support " of bulletin, it is to go out most equidistant carrier units that link to each other on the sheet metal of conduction continuously, each carrier unit includes the junction surface and the central portion of opposition, wherein the junction surface is for the usefulness that connects lead, central portion is to extend a bearing towards the junction surface for the set chip, this junction surface and central portion one end further stretch out, form first, second pin and the 3rd, the 4th pin, for the usefulness of connecting circuit, the heat that produces when making chip operation can distribute rapidly by above-mentioned pin, to improve the radiating efficiency of light-emitting diode; Announce No. 486153 " LED support " for another example, it mainly is to go out most equidistant carrier units that link to each other on the sheet metal that conducts electricity continuously, each carrier unit includes first pin and second pin of opposition, wherein first pin upper end forms one first contact, for the usefulness that connects first lead, second pin upper end comprises a groove with the set chip, it is characterized in that this groove outside further extends upward formation one second contact, usefulness for connecting second lead makes the other end of first and second leads can be connected to chip respectively; And for example announce No. 441860 " support of light-emitting diode improves structure ", its support is with copper, metal materials such as iron are one-body molded, be formed with the structure of one bowl of cup at its top, its bowl cup the bowl end at straight supporting face for the bearing luminescence chip, enclose on the limit of supporting face and then to be formed with the skew wall face that extends obliquely, upwards penetrate in order to beam reflection luminescence chip, it is characterized in that this skew wall face holds more than the height after stepping on exceeding luminescence chip, close up and form an optically focused zone person to bowl cup top with the straight form of vertical apprentice; Yet allly before quoted as proof in the case by above-mentioned, can find, all be packaged with a transparent body in all known traditional LED LAMP support upper ends, and glass adhesion glue that all areal extents of the end are covered with about thick about 20 μ m-100 μ m at negative electrode bowl cup (divides elargol again, white glues, insulating cement) comes then led chip, but also both counteract the main cause of luminous waste heat heat loss through conduction because of this, because it is no matter big, low power led chip, the at different levels different direct ratio thermals source that in conducting is lighted, all generate because of the power difference, and whether can will have a strong impact on producible illumination effect of this light-emitting diode or illumination efficiency rapidly with this thermal source heat loss through conduction; But the resin (A of adhesion glue that the bottom applies and top, side package, B glue) all that chip is tight, the careful huge seal (the high multiple of its ratio is in the molecule and the atom of chip material) that is encapsulated as, cause LED LAMP brightness, quality, efficient, the life-span all can't be brought into play due high efficiency function.

For example, No. 441860 " support of light-emitting diode improves structure " patent case of above-mentioned bulletin, though enclosing, its limit that has been disclosed in supporting face forms upwardly extending skew wall face, notion in order to the ejaculation of light beam, but it is very big that the transparent body volume of its encapsulation also becomes relatively, not only occupies bigger packaging space, simultaneously, its heat loss through conduction efficient is also because of forming the above-mentioned huge seal that is encapsulated as, and becomes relatively poor.

Therefore, how to change their structural design or organizational patterns, to increase area of dissipation, and how to improve simultaneously or solve and above-mentionedly increase bowl cup height for the spotlight effect of reaching diode, strengthen the bad problems such as shortcoming of heat radiation that caused but cause the encapsulation scope, in each above-mentioned reference or patent case, be not prompted or disclose.

Summary of the invention

Therefore, heat conduction and brightness that main purpose of the present invention provides a kind of light-emitting diode promote structure, it mainly is the zone at negative electrode pin upper end, do the change of space structure, dwindle sealing in the volume ratio of chip, promptly include a portion greater than chip (can rounded, square, rhombus etc.) at least again and at a groove of described recess outside at bowl cup bottommost with bowl cup contact-making surface; Make described light-emitting diode when encapsulation, the scope of this encapsulating material is limited within the recess and groove of this bowl cup: and surface tension and described recess and groove formation organization configurations because of encapsulating material make packaging effect more firm; Simultaneously, make this encapsulation scope be reduced to minimum as far as possible, and save cost than old law.Moreover this light-emitting diode body exterior is not coated by encapsulating material, and the heat that the chip that bowl cup is carried is accumulated during because of work will partly be conducted to outside release by described body and negative electrode pin etc. rapidly.

Another object of the present invention provides described multiple field (bowl cup and recess thereof) structure, the inclination wall of cup of this bowl cup can optionally extend its length, to reduce the light scatter of diode, in order to increase spotlight effect, but can must not increase the volume of encapsulation relatively as known person.

A further object of the present invention provides a kind of supporting structure of light-emitting diode, its mainly be at the casting or the integrated carrier unit of powder metallurgy mode, this unit portion includes negative pole part and anode portion body region, produce different and respect to one another cut end areas with the split path of planning with a non-vertical cut, these end faces make above-mentioned unit portion have a cooling surface area greater than known person simultaneously; Especially the described split path of planning is to extend along this diode profile periphery to arrange, and can keep outside the integraty (promptly not cut) of bowl cup, more can obtain the configuration area than the jorum cup, the bigger or chip of volume more for bearing comes the diode in response to various different rated power.

The heat conduction of a kind of light-emitting diode provided by the present invention and brightness promote structure, mainly constituted with integrally formed carrier unit, this unit includes a central portion in order to the bowl cup of fixed chip, include a negative pole part of two stands at least with interconnecting, and a described chip of at least one lead and an anode portion etc. constitute; Wherein:

This central portion is provided with a chamber, forms a ground floor bowl cup, at the bottom of one glass of described ground floor bowl cup and between a rim of a cup of this bowl cup, has a wall that is inclined upwardly and extends; The cup end of this ground floor bowl cup, be provided with a recess, forms a second layer bowl cup, at least one luminescence chip of bearing.

The heat conduction of described light-emitting diode and brightness promote structure, and it is provided with a groove between this ground floor bowl cup and second layer bowl cup.

Described carrier unit is a cylinder.

Described carrier unit is a square.

Described negative pole part is a solid.

Described negative pole part is a hollow body.

Define a groove chamber in the described negative pole part.

The inner edge surface of described groove chamber has the tissue of a geometric profile.

Described groove chamber be made as cylindrical.

Described groove chamber is to be made as square column type.

Described groove chamber is a flaring column shape outwardly.

Described groove chamber internal surface is provided with the heat radiation ditch, uses the increase area of dissipation.

The lateral surface of described negative pole part and anode portion is provided with the heat radiation ditch, uses the increase area of dissipation.

The present invention is that the heat conduction and the brightness of relevant a kind of light-emitting diode promotes structure, its advantage is meant structural design and the organizational patterns that changes on the cathode anchor, enable to increase the effect of heat radiation and light efficiency (optically focused), and then can significantly promote effect, brightness, reliability and the useful life of the heat radiation of light-emitting diode.

Description of drawings

Figure 1A is a schematic top plan view of the present invention;

Figure 1B is the schematic appearance of Figure 1A;

Fig. 1 C is the generalized section of Figure 1B;

Fig. 1 D is the three-dimensional sectional schematic diagram of Figure 1B;

Fig. 1 E is another embodiment of the present invention schematic diagram;

Fig. 1 F is yet another embodiment of the invention schematic diagram;

Fig. 1 G is further embodiment of this invention schematic diagram;

Fig. 2 A is that illustration is implemented in the correction of Figure 1A;

Fig. 2 B is the section plan after Figure 1B embodiment encapsulation;

Fig. 2 C is the section plan after Fig. 1 C embodiment encapsulation;

Fig. 2 D is the section plan after Fig. 1 D embodiment encapsulation;

Fig. 2 E is that illustration is implemented in the correction of Fig. 1 E;

Fig. 2 F is that illustration is implemented in the correction of Fig. 1 F;

Fig. 2 G is that illustration is implemented in the correction of Fig. 1 G;

Fig. 3 A is the vertical view of a correction embodiment of the present invention;

Fig. 3 B is the vertical view of a correction embodiment of the present invention;

Fig. 3 C is the vertical view of a correction embodiment of the present invention;

Fig. 3 D is the stereogram of Fig. 3 A;

Fig. 3 E is the stereogram of Fig. 3 B;

Fig. 3 F is the stereogram of Fig. 3 C;

Fig. 4 A is the vertical view of a correction embodiment of the present invention;

Fig. 4 B is the vertical view of a correction embodiment of the present invention;

Fig. 4 C is the vertical view of a correction embodiment of the present invention;

Fig. 4 D is the stereogram of Fig. 4 A;

Fig. 4 E is the stereogram of Fig. 4 B;

Fig. 4 F is the stereogram of Fig. 4 C;

Fig. 5 A is the schematic top plan view of the another kind of possible embodiments of the present invention;

Fig. 5 B is the schematic appearance of Fig. 5 A;

Fig. 5 C is the generalized section of Fig. 5 B;

Fig. 5 D is the three-dimensional sectional schematic diagram of Fig. 5 B;

Fig. 5 E is another embodiment of the present invention schematic diagram;

Fig. 5 F is yet another embodiment of the invention schematic diagram;

Fig. 5 G is the present invention's time embodiment schematic diagram;

Fig. 6 A is the schematic top plan view of the another kind of possible embodiments of the present invention;

Fig. 6 B is the schematic appearance of Fig. 6 A;

Fig. 6 C is the generalized section of Fig. 6 B;

Fig. 6 D is the three-dimensional sectional schematic diagram of Fig. 6 B;

Fig. 6 E is another embodiment of the present invention schematic diagram;

Fig. 6 F is yet another embodiment of the invention schematic diagram;

Fig. 6 G is the present invention's time embodiment schematic diagram;

Fig. 7 A is the vertical view of a correction embodiment of the present invention;

Fig. 7 B is the vertical view of a correction embodiment of the present invention;

Fig. 7 C is the vertical view of a correction embodiment of the present invention;

Fig. 7 D is the stereogram of Fig. 7 A;

Fig. 7 E is the stereogram of Fig. 7 B;

Fig. 7 F figure is the stereogram of Fig. 7 C;

Fig. 8 A is the vertical view of a correction embodiment of the present invention;

Fig. 8 B is the vertical view of a correction embodiment of the present invention;

Fig. 8 C is the vertical view of a correction embodiment of the present invention;

Fig. 8 D is the stereogram of Fig. 8 A;

Fig. 8 E is the stereogram of Fig. 8 B;

Fig. 8 F is the stereogram of Fig. 8 C;

Fig. 9 is that the groove chamber that carrier unit 10 of the present invention is defined forms the three-dimensional sectional schematic diagram of gradually expanded form outwardly.

The figure number explanation

10 carrier units

10A first support

10B second support

10C the 3rd support

10D the 4th support

The A1 first area

The A2 second area

A3 the 3rd zone

A4 the 4th zone

The C central portion

11 negative pole parts

113A ground floor bowl cup

The M1 rim of a cup

At the bottom of the E1 cup

The W1 wall of cup

The G1 groove

A W cup ancient piece of jade, round, flat and with a hole in its centre

113B second layer bowl cup

114 solids

The 114A ditch that dispels the heat

115 hollow bodies

The 115A cylinder

116 male and fomale(M﹠F)s

117 flanges

12 anode portion

13 luminescence chips

14 pins

15,15 ' how much sections

15a, the 15b end face

Embodiment

For detailed construction of the present invention, application principle, effect and effect please refer to the explanation that accompanying drawing is done, and can be understood completely.

Please join Figure 1A, 1B and 1C, the heat conduction of light-emitting diode of the present invention and brightness promote structure, mainly be at one first support 10A, one second support 10B, one the 3rd support 10C, and one the 4th support 10D institute carrier unit 10 on defining jointly, described carrier unit 10 is fit to injection, the integrally formed cylinder that is set as of mode such as die casting or powder metallurgy, forms such as square, and the lateral surface of this carrier unit 10 can be set as even surface, or establish design with heat radiation ditch 114A (figure number is to be indicated in Fig. 2) that sag and swell or peak valley link to each other.The central portion C of this carrier unit 10 is provided with a chamber, form a ground floor bowl cup 113A, at the bottom of one glass of described ground floor bowl cup 113A between the rim of a cup M1 of E1 and this bowl cup 113A, has a wall W1 who is inclined upwardly and extends, this glass ancient piece of jade, round, flat and with a hole in its centre W1 is in a feasible embodiment, be optionally to extend its length, in order to increase the spotlight effect of described diode; The cup end E1 of this ground floor bowl cup 113A is provided with a recess, forms a second layer bowl cup 113B, at least one luminescence chip 15 of bearing; Between this ground floor bowl cup 113A and the second layer bowl cup 113B, include a groove G1, allow described diode when encapsulation, the encapsulating material of being poured into a mould, because of surface tension of itself and the tissue layout of described second layer bowl cup 113B and this groove G1, make encapsulating structure and effect more firm, also because this tension force effect and encapsulating material water the control of fluence, form a minimum encapsulation scope easily, to save cost.And the coating scope of this encapsulating material is limited within described second layer bowl cup 113B and this groove G1; Therefore, the length of wall W1 as above-mentioned ground floor bowl cup 113A for being inclined upwardly and extending with an angle, can not be restricted, and can stop liquid encapsulating material to outdiffusion, therefore, the body of this light-emitting diode and outside not packed material coat, the heat that the luminescence chip 13 that this second layer bowl cup 113B is carried the time is accumulated because of work gets these carrier unit 10 bodies of mat, negative pole part 11, anode portion 12, the first support 10A, the second support 10B, the 3rd support 10C and 10D the 4th support etc., the body exterior that this heat is conducted to this light-emitting diode is dissipated, compare known person and can't take into account the shortcoming of spotlight effect and radiating efficiency simultaneously, can achieve a solution by structural configuration of the present invention and spatial shape.

Adopt in the preferred embodiment in the present invention, be to comprise at least one how much sections 15, please join Figure 1A, 2A, show that this geometry section 15 is one side continuities from this carrier unit 10, with the profile cut near ground floor bowl cup 113A, another relative edge's termination by this carrier unit 10 makes described carrier unit 10 divide into a negative pole part 11 and an anode portion 12 two parts then.Therefore, this negative pole part 11 has end face 15A respect to one another on a vertical guide, 15B with anode portion 12; This end face 15a, 15b are the structures that obviously forms a cooling surface area bigger than known structure, that is above-mentioned area of dissipation removes this negative pole part 11 and the anode portion 12, has more comprised described end face 15a, and the area of 15b is summed up.The one side of described luminescence chip 13 is close to this negative pole part 11, and the another side of this luminescence chip 15 is connected to anode portion 12 with at least one lead, to constitute a complete loops: wherein said support 10A, 10B, 10C and 10D are fit to be made as long pin 14 kenel persons, this support 10A, 10B is integrally formed kenels that are connected with described negative pole part 11, this support 10C and 10D also are one of the forming with described anode portion 12 and are connected, and described stent length and the quantity that is connected with this negative pole part 11 or anode portion 12 can increase and decrease according to need.Please join Fig. 2 A, 2B, provide another feasible embodiment, under for the notion that makes described carrier unit 10 increase cooling surface areas, make the surface of these carrier unit 10 bodies, axial formation peak valley along each limit of this carrier unit 10 is arranged the geometry or the saw-toothed profile tissue of kenel continuously, to form the heat radiation ditch 114A of careful sag and swell, increases cooling surface area to promote radiating efficiency.

The present invention can be set as the negative pole part 11 of described carrier unit 10 one and implement body 114 (as Fig. 1 D) or hollow body 115 (as Fig. 1 E), the groove chamber defined of this hollow body 115 can be extended the cylinder 115A (as Fig. 1 G) of a vacant state downwards again, in order to cross-ventilation and increase cooling surface area.In the embodiment of a correction, surface within the hollow body 115 of the carrier unit 10 of square and cuboid or the cylinder 115A also can be provided with the tissue of most male and fomale(M﹠F)s 116 (please join Fig. 1 G), increases area of dissipation.

Typically, said structure design mainly is the bowl cup 113A profile peripheral paths cutting along carrier unit 10, forming this negative pole part 11 and anode portion 12, and the opposing end surface 15a in the vertical of described anode and cathode portion 11,12,15b; Therefore, the cooling surface area of this carrier unit 10 is obviously increased, and helps to promote its radiating effect.In the explanation of the foregoing description, make the explanation of this embodiment and graphic, also can derive following feature and condition:

Figure 1A, 3A, 7A is the specific embodiment of at least one how much sections 15 of teaching or 15 '; Therefore, this carrier unit 10 has been distinguished plural zone, at Fig. 3 A, among the 7A, is to have comprised a first area A1, a second area A2, one the 3rd regional A3, one the 4th regional A4.It also reflects described each regional A1, and A2, A3, A4 form crooked cutting end face 15a respect to one another because of how much sections 15,15 ' of this non-vertical cut shape respectively, and 15b makes the cooling surface area sum total of this carrier unit 10 be increased as best one can

Each how much section 15 or 15 ' should can keep described bowl cup 113A, the integrality of 113B on the one hand along the outline of this carrier unit 10 at least; On the other hand, can allow this bowl cup 113A, 113B is on the cut zone that is disposed, have large-size or area, because relatively, can make this bowl cup 113A, at least one luminescence chip 13 (not shown in the diagram) of the implanted set of 113B, change along with luminescence chip 13 quantity, can make the electronics information device of described light-emitting diode in response to multiple luminous power or colour switching (for example ruddiness, gold-tinted, the luminescence chip 13 of different colours such as blue light are implanted in same second layer bowl cup 113B), and make described carrier unit 10 under equal volume, have big range of application.

Within above-mentioned carrier unit 10 defines, can adopt the design of solid or hollow state, and, this 10 carrier unit surface, each 15,15 ' how much formed end face of section, the parts such as inside that this carrier unit 10 is defined, can select to arrange this geometric shape or saw-toothed profile tissue, to increase whole cooling surface area.

As shown in the figure, the groove chamber is the groove that a section is geometry.The groove chamber that above-mentioned carrier unit 10 is defined be level off to one cylindric: yet, other form is taked in this groove chamber, as circular cone (please join Fig. 9) or square or other geometry or other gradually expanded form outwardly, will be understandable; In like manner, above-mentioned this peak valley or other form of zigzag harvesting of tissue, for example: correction is changed in geometrical constructions such as concave and flange, also belongs to the design that can be deduced or derive.

Comprehensive the above as can be known, the heat conduction of light-emitting diode of the present invention and brightness promote structure, make the cooling surface area of this light-emitting diode be increased as far as possible, not only has usability on the industry, and its structure is also different with known person with the design of spatial shape, do not see the situation of public use before this, really can produce be better than known person the function and the advantage that can't possess, really manifested sizable progressive, close in the regulation of the relevant important document of the novel patent of Patent Law, patent is filed an application in the whence in accordance with the law, sincerely please grants standard early, is that institute is to expecting.

Need Chen Mingzhe, the above is the present invention's one preferable specific embodiment, if comply with the change that conception of the present invention is done, for example: the number of holders increase and decrease, bowl cup stratum number etc., the function of its generation is not when exceeding specification yet and illustrating contained spiritual, all should be within the scope of the invention, zygote Chen Ming.

Claims (12)

1, a kind of heat conduction of light-emitting diode and brightness promote structure, mainly constituted with integrally formed carrier unit, this unit includes a central portion in order to the bowl cup of fixed chip, include a negative pole part of two stands at least with interconnecting, and at least one lead connects described chip and an anode portion constitutes; It is characterized in that:

This central portion is provided with a chamber, forms a ground floor bowl cup, at the bottom of one glass of described ground floor bowl cup and between a rim of a cup of this bowl cup, has a wall that is inclined upwardly and extends; The cup end of this ground floor bowl cup, be provided with a recess, forms a second layer bowl cup, at least one luminescence chip of bearing;

Be provided with a groove between this ground floor bowl cup and second layer bowl cup.

2, heat conduction and the brightness according to the described light-emitting diode of claim 1 promotes structure, it is characterized in that carrier unit is a cylinder.

3, heat conduction and the brightness according to the described light-emitting diode of claim 1 promotes structure, it is characterized in that carrier unit is a square.

4, heat conduction and the brightness according to the described light-emitting diode of claim 1 promotes structure, it is characterized in that negative pole part is a solid.

5, heat conduction and the brightness according to the described light-emitting diode of claim 1 promotes structure, it is characterized in that negative pole part is a hollow body.

6, heat conduction and the brightness according to the described light-emitting diode of claim 5 promotes structure, it is characterized in that defining in the negative pole part groove chamber.

7, heat conduction and the brightness according to the described light-emitting diode of claim 6 promotes structure, it is characterized in that the groove chamber is the groove that a section is geometry.

8, promote structure according to the heat conduction of the described light-emitting diode of claim 6 and brightness, it is characterized in that the groove chamber be made as cylindrical.

9, heat conduction and the brightness according to the described light-emitting diode of claim 6 promotes structure, it is characterized in that the groove chamber is to be made as square column type.

10, promote structure according to the heat conduction of the described light-emitting diode of claim 6 and brightness, it is characterized in that the groove chamber is a flaring column shape outwardly.

11, heat conduction and the brightness according to the described light-emitting diode of claim 6 promotes structure, it is characterized in that the groove chamber internal surface is provided with the heat radiation ditch, to increase area of dissipation.

12, heat conduction and the brightness according to the described light-emitting diode of claim 1 promotes structure, it is characterized in that the lateral surface of negative pole part and anode portion is provided with the heat radiation ditch, to increase area of dissipation.

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