CN100355095C

CN100355095C - An improved supporting stand structure having heat radiation and photopolymerization for LED

Info

Publication number: CN100355095C
Application number: CNB031374956A
Authority: CN
Inventors: 陈聪欣
Original assignee: Individual
Current assignee: Individual
Priority date: 2003-06-25
Filing date: 2003-06-25
Publication date: 2007-12-12
Anticipated expiration: 2023-06-25
Also published as: CN1567600A

Abstract

The present invention relates to an improved structure of a supporting frame of a light emitting dipolar body, which has the actions of heat radiation and light condensation. The improved structure comprises a support frame unit which comprises a main area of a negative electrode and a main area of a positive electrode. The improved structure is characterized in that the top end realm of the support frame unit is provided with a cavity chamber, and the main area of a negative electrode on the bottom end face of the cavity chamber is provided with a concave cup seat for fixing a crystal wafer; an annular groove is formed between the bottom end face of the cavity chamber and the cup seat to make the support frame unit generate multiple effects of light condensation. Essentially, because the support frame unit divides the main area of a negative electrode and the main area of a positive electrode in a non-straight cutting mode, a longitudinal cutting plane is generated between the main area of a negative electrode and the main area of a positive electrode; the heat radiation surface area of the unit is markedly enhanced, and the main area of a negative electrode is provided with the cup seat with a bigger arrangement area for being provided with more and bigger light emitting crystal wafers.

Description

A kind of LED support structure-improved with the effect of heat radiation optically focused

Technical field

The present invention relates to a kind of improvement with light-emitting diode support structure of heat radiation optically focused effect, be particularly related at the split path of carrier unit with a non-vertical cut, produce bigger cutting end face, and carrier unit forms a chamber and makes the light-emitting diode in the cup can produce the structure-improved of multiple optically focused effect.

Background technology

At present relevant LED support mainly comprises: by the negative electrode pin that a sheet metal forms, its upper end comprises a groove with fixed chip, and is made up of the parts such as an anode pin that another sheet metal forms; One known technology, for example, notification number is 506626, name is called: the light-emitting diode structure improvement; Notification number is 488616, and name is called: LED support; Notification number is 486153, and name is called: LED support and notification number are 441860, and name is called: the novel patent in Taiwan of the support structure-improved of light-emitting diode etc., all disclose the traditional structure with above-mentioned allusion quotation shape in succession.

In above-mentioned patent case, demonstrate the improvement of relevant LED support aspect structural design, or promote problems such as its function, come the value on the increase industry, for example, notification number is 506626 and is called: the light-emitting diode structure improvement, it mainly is to be provided with at least one light-emitting diode chip for backlight unit in negative electrode pin upper end, and this light-emitting diode chip for backlight unit is connected to anode pin upper end with a lead, and, it is characterized in that the cylinder end face that is shaped as of this colloid convexes with a convex globoidal in this negative electrode pin and anode pin upper end encapsulation colloid; For another notification number is 488616, name is called LED support, it is to go out a plurality of equidistant carrier units that link to each other on the sheet metal of conduction continuously, each carrier unit comprises the junction surface and the central portion of opposition, wherein the junction surface is for the usefulness that connects lead, central portion extends a bearing for fixed chip towards the junction surface, this junction surface and central portion two ends further stretch out, form first, second pin and the 3rd, the 4th pin, usefulness for connecting circuit, the heat that produces when making chip operation can distribute rapidly by above-mentioned pin, to improve the radiating efficiency of light-emitting diode; Notification number is 486153 and is called for another example: LED support.It mainly is to go out a plurality of equidistant carrier units that link to each other on conductive metal sheet continuously, each carrier unit comprises first pin and second pin of opposition, wherein first pin upper end forms one first contact, for the usefulness that connects first lead, second pin upper end comprises a groove with fixed chip, it is characterized in that this groove outside further extends upward formation one second contact, the usefulness for connecting second lead makes the other end of first and second leads can be connected to chip respectively; And for example notification number is 441860, name is called: the support structure-improved of light-emitting diode, its support is integrally formed with metal materials such as copper, iron, form the structure of one bowl of cup at its top, its bowl cup the bowl end at straight supporting face for the bearing luminescence chip, enclose on the limit of supporting face and then to be formed with the skew wall face that extends obliquely, upwards penetrate in order to beam reflection luminescence chip, it is characterized in that more than the height of this skew wall face after exceeding the luminescence chip bearing, close up and form a light harvesting section to bowl cup top with vertical steep form; Yet allly before quoted as proof in the case by above-mentioned, can find, all be packaged with a transparent body in all known traditional LED LAMP support upper ends, and glass viscose glue that all areal extents of the end are covered with about thick about 20 μ m-100 μ m at negative electrode bowl cup (divides elargol again, white glues, insulating cement) comes then led chip, but both also are the main causes that counteracts luminous waste heat heat loss through conduction these, because it is no matter big, low power led chip, at different levels different direct ratio thermals source that in conducting is lighted, all generate and whether can will have a strong impact on producible illumination effect of this light-emitting diode or illumination efficiency rapidly with this thermal source heat loss through conduction because of power is different; But the resin (A, B glue) of viscose glue that the bottom applies and top, side package causes LED LAMP brightness, quality, efficient, life-span all can't bring into play due high efficiency all with tight, the careful huge seal (its ratio high power is in the molecule and the atom of chip material) that is encapsulated as of chip.

For example: above-mentioned notification number is 441860, name is called the structure improved patent case of support of light-emitting diode, though enclosing, its limit that has been disclosed in supporting face forms upwardly extending skew wall face, ejaculation in order to light beam, but the transparent body volume of its encapsulation, it is very big also to become relatively, not only occupies bigger packaging space, simultaneously its heat loss through conduction efficient is also because of forming the above-mentioned huge seal that is encapsulated as, and becomes relatively poor.

Therefore, how to change their structural design or tissue morphology, to increase area of dissipation, but and how to improve simultaneously or solve and above-mentionedly cause an encapsulation scope and strengthen the bad problems such as shortcoming of heat radiation that caused for the spotlight effect of reaching diode increases bowl cup height, in each above-mentioned reference or patent case, be not prompted or disclose.

Summary of the invention

Therefore, main purpose of the present invention provides a kind of improvement with light-emitting diode support structure of heat radiation optically focused effect, it mainly is to make described carrier unit form a multiple layer structure, and the cup periphery is being formed a ring-shaped groove, and can be beneficial to the fixing of small size sealing: the interior periphery of this carrier unit forms chamber, producing the effect of multiple optically focused, and make described sealing smaller volume, and significantly increase the area of heat radiation.And, make a non-vertical cut split path by described carrier unit, what form a corresponding vertical plane between negative electrode or anode body district has one at interval but do not contact, and sets up the tissue of a bigger heat-delivery surface kind; Or make negative electrode be set as a hollow body, or hollow body extends to form the design of geometry column downwards, can increase the convection current of air; Form outside horizontally extending periphery in the lower end in negative electrode or anode body district again, this periphery can be flattened on the conductive metal film of circuit board, makes this carrier unit and periphery, sets up a cooling mechanism jointly with described conductive metal film.

Description of drawings

Figure 1A is the schematic perspective view of the present invention's two divisional plane carrier units.

Figure 1B is the generalized section of Figure 1A solid carrier unit of the present invention.

Fig. 1 C is the generalized section of Figure 1A hollow body carrier unit of the present invention

Fig. 1 D is Figure 1A hollow body carrier unit tool of the present invention generalized section in the poor hole of flaring columnar shape outwardly.

Fig. 2 A is the schematic perspective view of the cold and hot shunting cylinder of carrier unit tool of the present invention's two divisional planes.

Fig. 2 B is the generalized section of Fig. 2 A of the present invention.

Fig. 3 A is the schematic perspective view of the carrier unit of the present invention's four divisional planes.

Fig. 3 B is the generalized section of Fig. 3 A solid of the present invention.

Fig. 3 C is the generalized section of Fig. 3 A hollow body of the present invention.

Fig. 4 A is the schematic perspective view of the cold and hot shunting cylinder of the present invention's four divisional plane carrier unit tools.

Fig. 4 B is the generalized section of Fig. 4 A of the present invention.

Fig. 5 A is the schematic perspective view of the carrier unit of circular two divisional planes of the present invention.

Fig. 5 B flows to the schematic perspective view of body for the cold and hot branch of the circular two divisional plane carrier unit tools of the present invention.

Fig. 5 C is the schematic perspective view of the circular four divisional plane carrier units of the present invention.

Fig. 5 D is the schematic perspective view of the cold and hot shunting cylinder of the circular four divisional plane carrier unit tools of the present invention.

Fig. 6 A is the schematic perspective view of the carrier unit of square two divisional planes of the present invention.

Fig. 6 B is the generalized section of Fig. 6 A hollow body of the present invention.

Fig. 6 C is the generalized section of Fig. 6 A hollow body tool extending column of the present invention.

Fig. 6 D is the generalized section of Fig. 6 A hollow body inwall tool male and fomale(M﹠F) of the present invention.

Fig. 6 E is the generalized section of Fig. 6 A hollow body tool extending column of the present invention and inwall tool male and fomale(M﹠F).

Fig. 6 F is Fig. 6 A hollow body tool extending column of the present invention and the inwall tool generalized section of flaring columnar shape slotted eye outwardly.

Fig. 7 A is the embodiment schematic perspective view of the carrier unit of the square two divisional plane body region tool heat conduction ditches of the present invention.

Fig. 7 B is Fig. 7 A hollow body generalized section of the present invention.

Fig. 7 C is the generalized section of Fig. 7 A tool extending column of the present invention.

Fig. 7 D is the generalized section of Fig. 7 A hollow body inwall tool male and fomale(M﹠F) of the present invention.

Fig. 7 E is the generalized section of Fig. 7 A tool extensibility of the present invention and inwall tool male and fomale(M﹠F).

Fig. 8 A is the embodiment schematic perspective view of the carrier unit of the square body region of the present invention's two divisional planes and the equal tool heat conduction of lower end periphery ditch.

Fig. 8 B is the embodiment generalized section of Fig. 8 A hollow body of the present invention.

Fig. 8 C is the generalized section of Fig. 8 A tool extending column of the present invention.

Fig. 8 D is the embodiment generalized section of Fig. 8 A hollow body inwall tool male and fomale(M﹠F) of the present invention.

Fig. 8 E is the generalized section of Fig. 8 A tool extending column of the present invention and inwall tool male and fomale(M﹠F).

Fig. 8 F is Fig. 8 A tool extending column of the present invention and is the generalized section of cone.

Fig. 9 A is not had an embodiment schematic perspective view of heat conduction ditch for the square main support unit of the present invention's four divisional planes.

Fig. 9 B is the three-dimensional signal circle of the embodiment of square main support unit main body district's tool heat conduction ditch of the present invention's four divisional planes.

Fig. 9 C is the square main support unit main body district of the present invention's four divisional planes and the embodiment schematic perspective view of lower end periphery tool heat conduction ditch.

Figure 10 A is the first embodiment floor map of carrier unit round tip divisional plane of the present invention.

Figure 10 B is the second embodiment floor map of carrier unit round tip divisional plane of the present invention.

Figure 10 C is the 3rd embodiment floor map of carrier unit round tip divisional plane of the present invention.

Figure 10 D is the 4th embodiment floor map of carrier unit round tip divisional plane of the present invention.

Figure 10 E is the 5th embodiment floor map of carrier unit round tip divisional plane of the present invention.

Figure 10 F is the 6th embodiment floor map of carrier unit round tip divisional plane of the present invention.

Figure 10 G is the 7th embodiment floor map of carrier unit round tip divisional plane of the present invention.

Figure 11 A is the first embodiment floor map of the square top of carrier unit of the present invention divisional plane.

Figure 11 B is the second embodiment floor map of the square top of carrier unit of the present invention divisional plane.

Figure 11 C is the 3rd embodiment floor map of the square top of carrier unit of the present invention divisional plane.

Figure 11 D is the 4th embodiment floor map of the square top of carrier unit of the present invention divisional plane.

Figure 11 E is the 5th embodiment floor map of the square top of carrier unit of the present invention divisional plane.

Figure 11 F is the 6th embodiment floor map of the square top of carrier unit of the present invention divisional plane.

Figure 11 G is the 7th embodiment floor map of the square top of carrier unit of the present invention divisional plane.

Figure 12 A is the first embodiment floor map of the transparent sealing of carrier unit round tip of the present invention.

Figure 12 B is the second embodiment floor map of the transparent sealing of carrier unit round tip of the present invention.

Figure 12 C is the 3rd embodiment plane signal circle of the transparent sealing of carrier unit round tip of the present invention.

Figure 12 D is the 4th embodiment floor map of the transparent sealing of carrier unit round tip of the present invention.

Figure 12 E is the first embodiment floor map of the carrier unit of the present invention transparent sealing in square top.

Figure 12 F is the second embodiment floor map of the carrier unit of the present invention transparent sealing in square top.

Figure 12 G is the 3rd embodiment floor map of the bright sealing of carrier unit of the present invention square top speed.

Figure 12 H is the 4th embodiment floor map of the carrier unit of the present invention transparent sealing in square top.

Element number and title contrast in the stationary

10 carrier units

101 chambers

102 ring-shaped grooves

103 peripheries

11 cathode body districts

111 cups

112 luminescence chips

113 solids

114 hollow bodies

115 cylinders

116 convex-concave surfaces

12 anode body districts

13 pins

14 heat conduction ditches

15 sealings

Execution mode

As for detailed construction of the present invention, application principle, effect and effect then please refer to the explanation that diagram is done, and can be understood completely.

See also Figure 1A to Fig. 1 D and Fig. 6 A to Fig. 6 F, as shown in these figures, can obviously find out, a kind of improvement of light-emitting diode support structure, be with the made carrier unit of integrally formed technology, this carrier unit 10 is provided with a cathode body district 11 and at least one anode body district 12, and at least one luminescence chip 112 (seeing also Figure 12 A to Figure 12 H) is to anchor in the cup 111 in cathode body district 11, be connected to anode body district 12 through a lead, extend a pin 13 at least in each body region 11,12; It is characterized in that: the chamber 101 that forms an indent on these carrier unit 10 tops, be provided with the cup 111 of indent in this chamber 101 bottom faces central authorities cathode body district 11, and also form the ring-shaped groove 102 of an indent between chamber 101 bottom faces and the cup 11, this carrier unit 10 is cut apart anode and cathode body region 11,12 with the form of non-vertical cut again, make to produce a vertical cutting area betwixt, to promote its radiating effect; Again in negative electrode or anode body district 11,12 lower end forms outside horizontally extending periphery 103, this periphery 103 can be flattened on the conductive metal film of circuit board, make this carrier unit 10 and periphery 103, set up a cooling mechanism jointly with described conductive metal film: and, chamber 1101 and ring-shaped groove 102 according to described formation one indent, this makes described diode when encapsulation, the encapsulating material of being poured into a mould, because of the surface tension of itself and the tissue layout of described chamber 101 and ring-shaped groove 102, make encapsulating structure and effect more firm, also, form a minimum encapsulation scope, to save cost because this tension force effect and encapsulating material water the control of fluence.And the coverage of this encapsulating material is limited within described indent cup 111 and the ring-shaped groove 102, therefore, can extend upward as the wall of above-mentioned chamber 101 and obtains more known better daylighting effect.Moreover, the partitioning scheme of above-mentioned non-vertical cut (seeing also Figure 10 A to Figure 10 G and Figure 11 A to Figure 11 G), make this carrier unit 10 have cutting section respect to one another on a vertical guide, described cutting section has obviously formed the structure of a cooling surface area summation than known structure bigger, again because of the form of cutting apart of this non-vertical cut, be that profile extension along cup 111 passes through, can keep the integrality of described cup 111 on the one hand; On the other hand, can allow this cup 111 on the cut zone of described configuration, have large-size or area, and make this cathode body district have bigger arrangement areas, for the bigger or more luminescence chip 112 of bearing.

Forms such as that above-mentioned carrier unit 10 can be set as is cylindrical, elliptical cylinder-shape, square body and rectangular body (for example Figure 1A, Fig. 2 A, Fig. 3 A, Fig. 4 A, with Fig. 6 A, Fig. 7 A, Fig. 8 A, Fig. 9 A to Fig. 9 C), the lateral surface of each

body region

11,12 can be set as smooth surface, or plane, or be provided with the design (seeing also Fig. 5 A to Fig. 5 D, Fig. 7 A to Fig. 7 E and Fig. 8 A to Fig. 8 F) of the heat conduction ditch 14 of convex-concave surface, and the medial surface of each

body region

11,12 is the corresponding big vertical plane and not contacting of being parallel to each other.

The present invention is cylindrical, the cathode body district 11 of the carrier unit of elliptical cylinder-shape 10 and anode body district 12, all can form a solid 113 (as Figure 1B and Fig. 3 B) or have the hollow body 114 (as Fig. 1 C, Fig. 1 D, Fig. 2 B, Fig. 3 C, Fig. 4 B) that generates at least one open tubular column outwardly, this hollow body 114 can extend the cylinder 115 (as Fig. 2 B and Fig. 4 B) of a vacant state downwards again, because open tubular column wherein enters the generation convection current in order to air; Carrier unit 10 at square body and rectangular body also can be made as hollow body 114 (as Fig. 6 B, Fig. 6 D, Fig. 7 B, Fig. 7 D, Fig. 8 B, Fig. 8 D), and this hollow body 114 is extended with cylinder 115 (as Fig. 6 C, Fig. 6 E, Fig. 6 F, Fig. 7 C, Fig. 7 E, Fig. 8 C, Fig. 8 E, Fig. 8 F), and the inner surface of this hollow body 114 and cylinder 115 can be provided with a plurality of convex-concave surfaces 116 (as Fig. 6 D, Fig. 6 E, Fig. 7 D, Fig. 7 E, Fig. 8 D, Fig. 8 E) again to increase area of dissipation; Above-mentioned again open tubular column form is removed and can also can be designed to the poor hole of other any columnar shapes of flaring outwardly on demand, for example cone or square cone as preceding being made as circular cylindrical shape or square column.

Design by said structure, make carrier unit 10 form the chamber 101 of an indent and the partitioning scheme of non-vertical cut, make work that this carrier unit 10 can produce multiple optically focused in order to the scattering that reduces light, increase area of dissipation and make this cathode body district have the cup 111 of bigger arrangement areas, for the bigger or more luminescence chip 112 of bearing, its degree of depth of described again chamber 101 lifting on demand adjusts.For example in the embodiments of the invention, two divisional planes or four divisional planes (please join Figure 10 A to Figure 10 G and Figure 11 A to Figure 11 G) are arranged, especially when outer peripheral edges are cut apart, can produce bigger cup 111, and make 10 liang of interpolars of carrier unit have large-area space, can effectively improve heat sinking function; Additional cathode body region 11 is set as hollow body 114 again in addition, or outer surface is provided with heat conduction ditch 14, more can increases radiating efficiency; Form outward extending horizontal periphery 103 when body region 11,12 lower ends of carrier unit 10 again, this periphery 103 can be smooth on the conductive metal film of circuit board when pegging graft, and also can increase the effect of heat radiation; Again because of the transparent sealing 15 of encapsulation by limit in above-mentioned ring-shaped groove 102, can make sealed volume reduce (as Figure 12 A to Figure 12 H), relative just reducing intercepts heat conducting sealing use amount, can improve heat radiation and lighting power so certainly.

Comprehensive the above as can be known, the improvement of the dual high efficiency and heat radiation support of light-emitting diode of the present invention, the situation of not only not seeing public use before this, and really can produce the function that is better than traditional similar shape support.

The above is the present invention's one preferable specific embodiment, if comply with the change that conception of the present invention is done, and the function of its generation, when not exceeding specification yet and illustrating contained spiritual, all should be in protection scope of the present invention.

Claims

1, a kind of LED support structure-improved with the effect of heat radiation optically focused, comprise a carrier unit, this unit comprises cathode body district and anode body district, and at least one luminescence chip anchors in the cup in cathode body district, be connected to the anode body district through a lead, extend a pin at least in each body region; It is characterized in that: the chamber that forms an indent on this carrier unit top, be provided with the cup of indent in this chamber bottom face central authorities cathode body district, and also form the ring-shaped groove of an indent between chamber bottom face and the cup, this carrier unit is cut apart the anode and cathode body region with the form of non-vertical cut, make to produce a vertical cutting area betwixt, to promote its radiating effect; And, according to the chamber of described formation one indent and the partitioning scheme of non-vertical cut, the effect that makes this carrier unit can produce multiple optically focused, the cup that increases area of dissipation and make this cathode body district have bigger arrangement areas is for bigger or more luminescence chip is set.

2, the LED support structure-improved with the effect of heat radiation optically focused according to claim 1, it is characterized in that: described cathode body district is a solid.

3, the LED support structure-improved with the effect of heat radiation optically focused according to claim 1, it is characterized in that: described cathode body district is a hollow body.

4, the LED support structure-improved with the effect of heat radiation optically focused according to claim 3 is characterized in that: the open tubular column of the inside position of described hollow body for generating outwardly.

5, the LED support structure-improved with the effect of heat radiation optically focused according to claim 4, it is characterized in that: the inside position of described hollow body is for conical.

6, the LED support structure-improved with the effect of heat radiation optically focused according to claim 4 is characterized in that: the inside position side's of being taper of described hollow body.

7, according to claim 3 or 4 or 5 or 6 described LED support structure-improveds with the effect of heat radiation optically focused, it is characterized in that: the hollow body lower end in described cathode body district extends to form the hollow cylinder of a cold and hot convection current downwards.

8, the LED support structure-improved with the effect of heat radiation optically focused according to claim 7, it is characterized in that: the inwall of described inside position and hollow cylinder is provided with convex-concave surface.

9, according to claim 1 or 2 or 3 or 4 or 5 or 6 described LED support structure-improveds with the effect of heat radiation optically focused, it is characterized in that: the lateral surface of described negative electrode and anode is provided with the heat conduction ditch.

10, the LED support structure-improved with the effect of heat radiation optically focused according to claim 7, it is characterized in that: the lateral surface of described negative electrode and anode is provided with the heat conduction ditch, and the lateral surface of described negative electrode and anode is provided with the heat conduction ditch, to increase area of dissipation.

11, the LED support structure-improved with the effect of heat radiation optically focused according to claim 3, it is characterized in that: the inside site surface of described hollow body is provided with a plurality of convex-concave surfaces, the inside site surface of described hollow body is provided with a plurality of convex-concave surfaces, to increase area of dissipation.

12, the LED support structure-improved with the effect of heat radiation optically focused according to claim 4, it is characterized in that: described hollow body is provided with a plurality of convex-concave surfaces down to the inner surface of cold and hot convection current hollow cylinder, to increase area of dissipation.

13, according to claim 1 or 2 or 3 or 4 or 5 or 6 described LED support structure-improveds with the effect of heat radiation optically focused, it is characterized in that: the sealing of described unit is in ring-shaped groove.