M345952 .八、新型說明： 【新型所屬之技術領域】 本創作關於一種具均勻及辅助散熱功效的燈具組合結構。 【先前技術】 常見的發光二極體（LED，LightEmittingDiodes)依其型態及結構 約可區分為SMD型、燈泡型等多種型態，其中，該燈泡型發光二極體 主要是由至少-發光晶片10 (-般稱裸晶片）以及二互為平行且相互 _對應的導線架η、12所組成(如第！圖所示），發光晶#1()黏著在其 中之一導線架12上’該發光晶片丨〇並透過一金屬絲13與另一導線架 11電性連接’使導線架11、12間形成一封閉狀的電性迴路後，再利 用-絕緣娜14將上述之該等齡封裝為—燈雜，僅露出各導線架 1卜12之引腳11卜12卜而直接焊接在電路板或是铭基板上，而該 SMD型發光二極冑，顧名思義，是黏|於電路板或是銘基板表面（圖中 未示）。 ❿ 上述各種發光-極體具體積λΙ、、低耗電及冑亮度的優勢， 而可大量地使用於各式照明設備當中，如路燈、桌燈、車燈等設備等 •等，但，現今發光二極體無法克服的缺點，便是易產生高熱，若無散 ’·熱措施則無法適時地將熱能導出外部，容易影響發光二極體的壽命。 早期常見的發光二極體燈具，大多會裳設大面積的散熱鰭片ci 來排除各發光二極體L1所產生的熱能(如第2圖所示），但，該等散熱 ，片C1谷易因過重或是體積過大等因素，而侷限燈具所能裝設場合， 長』使用下’熱此亦谷易堆積在散熱鰭片ci的中央位置匸，而無法朝 5 M345952 易受到熱 周圍降溫’使得位在散熱鰭片Cl中央位置的發光二極體u 能，而影響其效能。 現今業界發展出-種發光二極體燈泡L2(如第3及4圖所示），兮 燈泡L2自身韻立散鱗以2，雜解虹频綠糾積於中/ 錄C關題’但’燈泡L2與燈泡L2間距須保持—如御，否則 容易因輕雜，而賴__泡L2，導致各駿泡U 效果受到嚴重的_。 為此’如何有效解決上述散熱問題，乃為本創作所鑽研的課題。 【新型内容】 本創作之主要目的在提供—種具均勻及輔助散熱功效的燈具組 合結構係包含： —多個發光二極體單元，各單元至少具備一散熱鰭片組、至少一發光 7G件以及-用以驅動發光元件點亮的燈光驅動電路；以及， -燈具組，其表面設有多悔光燈座’用以固定並提供適當電源 修規格予前述之各發光二極體單元； 燈具組合結構之主要特徵在於： ’ 各發光二輔燈泡之散熱鰭>{間緊密地連接-高導紐質的散 ‘熱板’用靖各散熱則上之熱能，有效地傳導至散熱板； 如此一來，即可提供更大散熱面積及更加均勻化的散熱功效。 依據前述之主要概’其巾該散熱板可設為反絲面，用以反射 各發光二極體單元的光線。 依據刚述之主要特徵’其中該散熱板上設有多個孔部，用以緊密地 M345952 套接前述之各發光二極體單元。 為一===:Γ㈣多組散熱繼排列 熱片環狀排列為一立體造型時，該等當鮮散 體狀的頸部，用以與該散熱板上所設之孔部相套接二之凹部形成一立 依據前敎主要雛，其巾概敏之雜，於本渐中並不加 以侷限，視該燈具組的實際造型而定。 【實施方式】 1有關本創偶上述之目的，所_之技術手段及其餘功效，兹舉 較佳實施例，必配合圖示加以說明如下·· 請參閱第5圖，第5圖為本創作具輔助散熱功效的燈具組合結構 的組合示意圖。 如該等圖所示，本創作提供一種具辅助散熱功效的燈具組合結 構’其包含··多個發光二極體單元2〇以及一燈具組3〇，該燈具組3〇 _上具有多個燈座31，用卩固定並提供適當電源規格予各發光二極體單 元20點亮；其中， 忒4發光二極體單元20分別包含一散熱鰭片組21、至少一發光 -元件22以及一燈光驅動電路（圖中未示）；該散熱鰭片組21由多片散 熱片211環狀排列成一立體狀的鰭片燈罩，該散熱鰭片組21内並設有 至少一發光元件22以及一燈光驅動電路，用以點亮該等發光元件22 ; 而该燈具組30外觀造型並不加以侷限’但其一表面設有多個發光 燈座31 ’用以固定並提供適當電源規格予前述之各個發光二極體單元 7 M345952 • 20點亮，該等發光燈座31排列方式與所需數量，本創作並不加以侷 限，一般來說，該等燈座31排列為矩陣狀較佳，燈座31數量視發光 二極體單元20以及燈具所需之亮度而定，而本創作主要特徵在於： 各個發光二極體單元20所專屬之散熱鰭片組21間，設有一高導 熱材質所構成的散熱板40來作一連接，該散熱板40上設有多個穿孔 41，用以緊密地套接散熱鰭片組21上，並使各散熱鰭片組21上之熱 能有效地傳導至該散熱板40上，藉此，令各散熱鰭片組21能有效地 馨達到均溫，以及提供更大散熱面積的雙重功效，避免因熱能過於集中 於某處，而影響各發光二極體效能與壽命。 本創作所述之散熱鰭片組21由多組散熱片211環狀排列為一立體 造型之外，各散熱片211外側設有凹部212，當該等散熱片211環狀 排列為一立體造型時，該等散熱片2Π上之凹部212將形成一頸部造 型23’與該散熱板40上所f免之穿孔41緊密地套接為一體(如第5圖所 不）’此外，該等散熱板40係由高導熱材質如鋁、銅等構成，且該散 _熱板的造型於本創作並不純侷限，視燈具組之整體造型而定，該散 熱板40表面可進-步作表面處理，如電鍍拋光處理，使散熱板表面為 •-反光面’反射各發光二極料元所料之猶，令摘作之燈具的 -光線，更為均勻明亮所示(圖中未示）。 本創作已藉上述較佳實施例加以，以上所述者，僅為本創作 之較佳的實施例，並非用來限定本創作之實施範圍。 凡依本創作申請專利細所述之肋特徵及精神所為之均等變化 與修飾，均應包含在本創作之申請專利範圍内。 8 M345952 【圖式簡單說明】 第1圖為習知燈泡型發光二極體結構示意圖； 第2圖為習知之具大型散熱鰭片的結構結構示意圖； 第3圖為習知之具散熱鰭片燈炮結構示意圖； 第4圖為習知之具散熱鰭片燈炮組裝於燈具之示意圖；以及， 第5圖為本創作具輔助散熱功效的燈具組合結構的組合示意圖。 【主要元件符號說明】 _發光晶片 10 導線架 η、12 引腳 in、121 金屬絲 13 絕緣封膠 14 發光二極體單元 20 散熱鰭片組 21 #散熱片 211 凹部 212 、發光元件 22 -頸部造型 23 燈具組 30 發光燈座 31 散熱板 40 穿孔 41 9 M345952M345952. Eight, new description: [New technical field] This creation is about a combination of lamps with uniform and auxiliary heat dissipation. [Prior Art] The common LEDs (Light Emitting Diodes) can be classified into SMD type and bulb type according to their types and structures. The bulb type LED is mainly composed of at least - light. The wafer 10 (collectively referred to as a bare wafer) and the two mutually parallel lead frames η, 12 (as shown in Fig.), the luminescent crystal #1() is adhered to one of the lead frames 12 'The illuminating chip is electrically connected to the other lead frame 11 through a wire 13', so that a closed electrical circuit is formed between the lead frames 11, 12, and then the above-mentioned The age package is - the lamp is mixed, only the lead wires of the lead frame 1 12 are exposed and directly soldered on the circuit board or the Ming substrate, and the SMD type light-emitting diode is, as the name suggests, is a glue | Plate or surface of the substrate (not shown). ❿ The above various illuminating-polar bodies have the advantages of λΙ, low power consumption and 胄 brightness, and can be widely used in various types of lighting equipment, such as street lamps, table lamps, lamps, etc., but nowadays The shortcoming that the light-emitting diode can't overcome is that it is easy to generate high heat. If there is no heat treatment, the heat energy can not be exported to the outside in time, which easily affects the life of the light-emitting diode. Most of the early common LED lamps will have a large area of heat sink fins ci to eliminate the heat generated by each LED L1 (as shown in Figure 2). However, these heat dissipation, film C1 valley It is easy to overweight or oversized, and the limited lamps can be installed. The long use of the 'hot' is also easy to accumulate in the central position of the fins ci, but it is not easy to cool around 5 M345952. 'Enting the light-emitting diode u in the center of the heat-dissipating fins C, which affects its performance. Nowadays, the industry has developed a kind of light-emitting diode bulb L2 (as shown in Figures 3 and 4), the light bulb L2 has its own rhyme and scales to 2, and the miscellaneous solution of the rainbow frequency is accumulating in the middle / record C. 'The distance between the bulb L2 and the bulb L2 must be kept - such as Royal, otherwise it is easy to be light and mixed, and Lai __ bubble L2, resulting in serious effects of each bubble U. To this end, how to effectively solve the above-mentioned heat dissipation problem is the subject of this research. [New content] The main purpose of this creation is to provide a uniform structure with a uniform and auxiliary heat dissipation system comprising: - a plurality of light-emitting diode units, each unit having at least one heat-dissipating fin set and at least one light-emitting 7G piece And a light driving circuit for driving the light-emitting element to illuminate; and - a lamp set having a plurality of light-reducing lamp holders on the surface thereof for fixing and providing a proper power supply repair specification to each of the foregoing light-emitting diode units; The main features of the combined structure are: 'The heat-dissipating fins of each light-emitting two auxiliary bulbs>{the tightly connected-high-conductivity-dispersion 'hot plate' is effectively transmitted to the heat dissipation plate by the heat energy of the heat dissipation of the Jing; In this way, a larger heat dissipation area and a more uniform heat dissipation effect can be provided. According to the above-mentioned main outline, the heat sink can be set as a reverse surface for reflecting the light of each of the light-emitting diode units. According to the main feature just described, wherein the heat dissipating plate is provided with a plurality of holes for closely fitting the respective light emitting diode units to the M345952. When a group of ===:Γ(4) sets of heat-dissipating heat-distributing heat sheets are arranged in a three-dimensional shape, the fresh-shaped loose-shaped necks are sleeved with the holes provided on the heat-dissipating plates. The concave part is formed according to the main stalk of the front scorpion, and the sensation of the towel is not limited in this gradual, depending on the actual shape of the luminaire group. [Embodiment] 1 For the purpose of the above-mentioned purpose, the technical means and the remaining functions, the preferred embodiment will be described with reference to the following figures. · Please refer to Figure 5, Figure 5 is the creation A schematic diagram of a combination of luminaire assembly structures with auxiliary heat dissipation. As shown in the figures, the present invention provides a luminaire assembly structure with an auxiliary heat dissipation function, which comprises a plurality of illuminating diode units 2 〇 and a luminaire group 3 〇 having a plurality of luminaire groups 3 〇 The lamp holder 31 is fixed by a crucible and provided with a suitable power supply specification for each of the LED units 20 to be illuminated; wherein the LED unit 20 includes a heat dissipation fin group 21, at least one light-emitting element 22, and a light-emitting diode unit a light-emitting circuit (not shown); the heat-dissipating fin group 21 is annularly arranged by a plurality of fins 211 to form a three-dimensional fin shroud, and the heat-dissipating fin group 21 is provided with at least one light-emitting element 22 and a a lighting driving circuit for illuminating the light-emitting elements 22; and the appearance of the lamp assembly 30 is not limited to 'but a plurality of light-emitting sockets 31' are provided on one surface thereof for fixing and providing appropriate power supply specifications to the foregoing Each of the light-emitting diode units 7 M345952 • 20 is lit, and the arrangement of the light-emitting lamp holders 31 and the required number are not limited. In general, the lamp holders 31 are arranged in a matrix shape, and the lamps are preferably arranged. Block 31 number of light-emitting diodes The unit 20 and the required brightness of the luminaire, and the main feature of the present invention is that: a heat dissipating fin 40 composed of a highly thermally conductive material is provided between the heat dissipating fin groups 21 of each of the illuminating diode units 20 for making a connection. The heat dissipation plate 40 is provided with a plurality of through holes 41 for closely fitting the heat dissipation fin groups 21, and the heat energy on each of the heat dissipation fin groups 21 is effectively transmitted to the heat dissipation plate 40, thereby The heat-dissipating fin group 21 can effectively achieve the uniform temperature and provide a double heat-dissipating area, so as to avoid the heat energy being concentrated too much in some places, thereby affecting the performance and life of each light-emitting diode. The heat dissipating fin group 21 of the present invention is arranged in a ring shape by a plurality of sets of fins 211, and a recessed portion 212 is disposed outside each of the fins 211. When the fins 211 are annularly arranged in a three-dimensional shape The recesses 212 on the fins 2 will form a neck shape 23' which is tightly integrated with the perforations 41 of the heat sink 40 (as shown in FIG. 5). Moreover, the heat dissipation The plate 40 is made of a high thermal conductive material such as aluminum, copper, etc., and the shape of the dispersing_hot plate is not purely limited in this creation. Depending on the overall shape of the lamp set, the surface of the heat dissipating plate 40 can be surface-treated. For example, electroplating and polishing treatment, so that the surface of the heat dissipating plate is reflected by the reflective surface of each of the light-emitting diode materials, so that the light of the lamp is more uniform and bright (not shown). The present invention has been described in the above preferred embodiments, and the above description is only a preferred embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Equivalent changes and modifications to the characteristics and spirit of the ribs as described in this patent application shall be included in the scope of the patent application for this creation. 8 M345952 [Simple description of the diagram] Figure 1 is a schematic view of the structure of a conventional bulb-type light-emitting diode; Figure 2 is a schematic view of a conventional structure with large heat-dissipating fins; Figure 3 is a conventional heat-dissipating fin light Schematic diagram of the gun structure; Fig. 4 is a schematic view of a conventional heat sink fin light gun assembled in the lamp; and, Fig. 5 is a schematic diagram of the combination of the lamp assembly structure with auxiliary heat dissipation effect. [Main component symbol description] _ illuminating wafer 10 lead frame η, 12 pin in, 121 wire 13 insulating seal 14 light emitting diode unit 20 heat sink fin group 21 # heat sink 211 recess 212, light emitting element 22 - neck Part modeling 23 luminaire group 30 illuminating lamp holder 31 heat sink 40 perforation 41 9 M345952
發光二極體 L1 發光二極體燈泡 L2 中央位置 C 散熱鰭片 C1 距離 DLED Diode L1 LED Bulb L2 Center Position C Heat Sink C1 Distance D
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