TWI644074B - Three-dimensional heat transmission device - Google Patents

Abstract

A three-dimensional heat transfer device includes: a temperature equalizing plate and at least one heat pipe. The temperature equalizing plate has a first plate body and a second plate body opposite to each other, the inner surface of the first plate body is provided with a first capillary structure; the heat pipe is provided with a second capillary structure, and the second capillary structure has a protrusion A contact portion exposed outside the heat pipe, the heat pipe is erected and inserted through the second plate body, and the contact portion extends into the temperature equalization plate and is connected to the first capillary structure to connect the first and second capillary structures to each other. Thereby, the overall three-dimensional heat transfer purpose can be achieved, and the heat dissipation effect of the uniform temperature plate plus the heat pipe can be fully exerted.

Description

Stereoscopic heat transfer device

The present invention relates to a heat transfer device, and more particularly to a three-dimensional heat transfer device.

With regard to heat transfer, in order to dissipate the heat generated by the heating element, the existing heat transfer device uses a heat conducting plate with a heat pipe to transfer heat, and uses a heat sink (for example, a fin and a fan) for heat dissipation, which is roughly as follows:

The heat conducting plate is in contact with the heat generating component, and the heat pipe is connected between the heat conducting plate and the heat sink to transfer the heat generated by the heat generating component to the heat conducting plate, and then the heat is transferred to the heat sink through the heat pipe to dissipate heat.

However, the heat conducting plate and the heat pipe in the existing heat transfer device are operated independently of each other, and the capillary structure of the heat conducting plate is not connected with the capillary structure of the heat pipe, so that the individual heat conducting plates or the heat pipes are only flat individual transmissions. Heat, not monolithic heat transfer, in other words, the heat dissipation effect has not yet been fully realized.

Therefore, how to design a invention which can improve the above-mentioned defects is a major problem that the inventors of the present invention are trying to solve.

The object of the present invention is to provide a three-dimensional heat transfer device, which can make the capillary structure of the heat pipe and the capillary structure of the temperature equalizing plate communicate with each other, thereby achieving the overall three-dimensional heat transfer purpose, and fully exerting the heat dissipation of the temperature equalizing plate and the heat pipe. effect.

In order to achieve the above object, the present invention provides a three-dimensional heat transfer device comprising: a temperature equalizing plate having a first plate body and a second plate body opposite to each other, the first plate body having a first inner surface a capillary structure; and a heat pipe having a second capillary structure therein, the second capillary structure having a contact portion protruding outside the heat pipe, the heat pipe being inserted into the second plate body to make the contact portion Extending into the temperature equalization plate and connecting to the first capillary structure to allow the first capillary structure and the second capillary structure to communicate with each other.

The present invention provides another three-dimensional heat transfer device, comprising: a temperature equalizing plate having a first plate body and a second plate body opposite to each other, the first plate body having a first capillary structure on the inner surface thereof; a heat pipe having a second capillary structure and having an inner segment, the inner segment opening an opening, the second capillary structure having a contact portion exposed in the opening, the heat pipe being inserted through the second plate The inner segment extends into the temperature equalization plate, and the contact portion is connected to the first capillary structure via the opening to allow the first capillary structure and the second capillary structure to communicate with each other.

Compared with the prior art, the present invention has the following effects: the second capillary structure of the heat pipe can be connected and communicated with the first capillary structure of the temperature equalizing plate, thereby achieving the overall stereo heat transfer purpose, and fully exerting the temperature equalizing plate plus The heat pipe should have a heat dissipation effect.

1‧‧‧Wall plate

10‧‧‧ chamber

11‧‧‧ first board

12‧‧‧Second plate

121‧‧‧ jack

122‧‧‧Flange

13‧‧‧First capillary structure

14‧‧‧ Third capillary structure

2, 2a‧‧‧ heat pipe

21‧‧‧Second capillary structure

211‧‧‧Capillary

2111‧‧‧Exposed section

212‧‧‧Contacts

22‧‧‧ openings

23‧‧‧Steam channel

24‧‧ ‧ gap

25‧‧‧ inner wall

27‧‧‧Second capillary structure

2711‧‧‧Internal section

2712‧‧‧External segment

272‧‧‧Contacts

3‧‧‧Fin group

Fig. 1 is an exploded perspective view showing a first embodiment of the present invention.

Figure 2 is a perspective assembled view of the first embodiment of the present invention.

Figure 3 is a perspective view of the heat pipe in the first embodiment of the present invention from another perspective.

Figure 4 is a cross-sectional view of the first embodiment of the present invention in accordance with Figure 2 and a partial enlarged view thereof.

Figure 5 is an exploded perspective view of a second embodiment of the present invention.

Figure 6A is a perspective view of a first heat pipe in a second embodiment of the present invention.

Figure 6B is a perspective view of another perspective view of a second heat pipe in the second embodiment of the present invention.

Figure 7 is a cross-sectional view showing a second embodiment of the present invention after combination and a partial enlarged view thereof.

The detailed description and technical content of the present invention are set forth below with reference to the accompanying drawings.

The present invention provides a three-dimensional heat transfer device, which is a first embodiment of the present invention as shown in FIGS. 1 to 4, and is a second embodiment of the present invention as shown in FIGS. 5 to 7.

As shown in FIG. 1 to FIG. 4, the first embodiment of the three-dimensional heat transfer device of the present invention comprises: a temperature equalizing plate 1, at least one heat pipe 2, and a working fluid flowing between the temperature equalizing plate 1 and the heat pipe 2. (not shown).

The temperature equalizing plate 1 has a first plate body 11 and a second plate body 12 opposite to each other, and a chamber 10 is formed between the first and second plates 11 and 12. The temperature equalizing plate 1 may be an integrally formed structure or a combined forming structure. In the present embodiment, the combined forming structure is taken as an example, that is, the second plate body 12 may be combined with the first plate body 11 . To form a temperature equalizing plate 1 having a chamber 10 therein.

The inner surface of the first plate body 11 is provided with a first capillary structure 13, and the inner surface of the second plate body 12 is provided with a third capillary structure 14 (see FIG. 4). The first and third capillary structures 13, 14 are connected to each other. relatively. The first and third capillary structures 13 and 14 may be a powder sintered body, a ceramic sintered body, a metal mesh or a metal groove, and the like, which is not limited by the present invention. However, in some embodiments, the inner surface of the second plate body 12 is not provided with the third capillary structure 14, that is, only the inner surface of the first plate body 11 is provided with a capillary structure (ie, the first capillary structure 13).

The second plate body 12 is provided with at least one insertion hole 121. In the present embodiment, a plurality of insertion holes 121 are provided as an example for description. Therefore, the heat pipe 2 also has a corresponding number. In addition, the second plate body 12 has a flange 122 extending around the circumference of the position corresponding to each of the insertion holes 121 to facilitate the fixing of the heat pipe.

The heat pipe 2 is a hollow tube having a second capillary structure 21 therein. The second capillary structure 21 has a contact portion 212 that protrudes outside the heat pipe 2 and is exposed. In the present embodiment, one end of the heat pipe 2 (hereinafter referred to as a piercing end, an unsigned component symbol) has an opening 22 (see FIG. 3), and the second capillary structure 21 includes two bristles spaced side by side as shown in FIG. The body 211 has a vapor passage 23 formed between the blister bodies 211, and each of the blister bodies 211 has an exposed portion 2111, and the contact portion 212 is composed of the exposed portions 2111 of the blister 211. The heat pipe 2 can communicate the steam passage 23 with the chamber 10 by means of the contact portion 212. The second capillary structure 21 may be a powder sintered body, a ceramic sintered body, a metal mesh, or a metal groove. The present invention is not limited thereto, and in the present embodiment, a powder sintered body will be described as an example.

Each heat pipe 2 is inserted and erected on the second plate body 12 corresponding to the position of each of the insertion holes 121, and the heat pipe 2 is inserted through the insertion end thereof to expose the opening 22 in the chamber 10, and the contact portion of the second capillary structure 21 212 then protrudes through the opening 22 and is thus exposed, causing the contact portion 212 to extend into the chamber 10 and to the first capillary structure 13 to allow the first and second capillary structures 13, 21 to communicate with each other.

In the present embodiment, the insertion end of the heat pipe 2 is inserted into the bottom of the chamber 10 as an example, so that the contact portion 212 can be securely abutted against the first capillary structure 13, thereby allowing the first and second capillaries. The structures 13, 21 are in communication with each other.

The heat pipes 2 are interspersed and fixed to the second plate body 12 in various feasible manners, for example, the outer pipe walls of the heat pipes 2 are attached and welded to the flange 122 to improve the heat pipe 2 and the temperature equalizing plate 1 Structural stability. Each heat pipe 2 can be vertically inserted into the second plate body 12, or can have an angle of 70-110 degrees between the heat pipe 2 and the second plate body 12, but the heat pipe 2 is vertically inserted or has the angle included. And the second plate body 12 are mutually intersected.

As shown in FIG. 2 and FIG. 4, the heat pipe 2 is inserted into the chamber 10 of the temperature equalizing plate 1 in a standing manner, and the second capillary structure 21 in the heat pipe 2 and the first capillary in the temperature equalizing plate 1 are provided. Since the structures 13 abut each other and communicate with each other, it is possible to achieve the overall three-dimensional heat transfer purpose and fully exert the desired heat dissipation effect.

In addition, the bristles 211 of the second capillary structure 21 and the two exposed segments 2111 are spaced apart from each other to form a steam passage 23, so when the heat pipe 2 abuts the first capillary structure 13 with the contact portion 212, The steam passage 23 can be used to circulate the steam, so that the hollow interior of the heat pipe 2 and the chamber 10 of the temperature equalizing plate 1 are also in communication with each other, thereby further improving the heat dissipation effect. Of course, the exposed contact portion 212 extending beyond the heat pipe 2, after extending into the chamber 10, will inevitably cause the portion of the heat pipe 2 for the contact portion 212 to communicate with the chamber 10, thus achieving Similar to the effect of the steam passage 23.

The second capillary structure 21 of each heat pipe 2 can be abutted and communicated with the first capillary structure 13, and can of course be connected and communicated with the third capillary structure 14 (not shown); of course, the second capillary As long as the structure 21 abuts and communicates with the first capillary structure 13, it can exert the desired heat dissipation effect.

Further, as shown in FIG. 2, the three-dimensional heat transfer device of the present invention may further include a fin group 3. The fin group 3 is mounted on the heat pipe 2 so that heat on the heat pipe 2 can be transferred to the fin group 3, thereby facilitating dissipation of heat on the fin group 3 by a fan not shown.

5 to 7 show a second embodiment of the three-dimensional heat transfer device of the present invention. The second embodiment is substantially the same as the first embodiment described above, except that the heat pipe 2a of the second embodiment is different from the first embodiment. The heat pipe 2 of the embodiment will be described in detail below.

The heat pipe 2a is also hollow, and a second capillary structure 27 is also disposed therein. The second capillary structure 27 may be a powder sintered body, a ceramic sintered body, a metal mesh or a metal trench, etc., and the present invention is not limited. In the present embodiment, a metal trench is taken as an example (see FIG. 7), and The metal groove is formed in a hollow shape around the inner tube wall 25 of the heat pipe 2a in a circumferential manner.

The heat pipe 2a (shown in FIG. 7) includes an inner segment 2711 located in the chamber 10, an outer segment 2712 located outside the chamber 10, and a connection between the inner and outer segments 2711, 2712 and the flange 122. Connect A plug-in segment (not labeled with a component symbol). A portion of the inner portion 2711 defines an opening 22, and the shape of the opening 22 may be a circular shape, a square shape, or a teardrop shape. The present invention is not limited, and the opening 22 may be a pipe end (ie, the insertion end of the heat pipe 2a). ) Expanded to the tube body and has the effect of circulating steam (as shown in Figure 6A); or you can open the opening 22 first, and then open a large number of notches 24 directly in the tube body (as shown in Figure 5 or Figure 6B). These notches 24 are regarded as steam ports for circulating steam. Specifically, the openings 22 are opened at the free ends of the inner segments 2711 (that is, the insertion ends of the heat pipes 2a), and the notches 24 are opened in the inner portion 2711 (that is, the heat pipes). The body of 2a is connected to each other adjacent to the opening 22, so that the notch 24 can be regarded as a steam port for circulating steam.

The heat pipe in the second embodiment of the present invention may be the first heat pipe 2a shown in FIG. 6A or the second heat pipe 2a shown in FIG. 6B, which is not limited in practice. In the second embodiment, The second heat pipe 2a shown in FIG. 6B will be described as an example.

The second capillary structure 27 has a contact portion 272 exposed in the opening 22. In the embodiment, the contact portion 272 is an end edge of the second capillary structure 27 corresponding to the position of the opening 22, and can be aligned or slightly Retracted into the free end of the inner section 2711 (or: within the insertion end of the heat pipe 2a).

The heat pipe 2a is also erected and inserted into the second plate body 12, and the inner portion 2711 extends into the chamber 10, so that the contact portion 272 can be connected to the first capillary structure 13 via the opening 22 to allow the first and second capillary structures 13, 27 are connected to each other. Specifically, the inner segment 2711 abuts the first capillary structure 13 with its free end, and the contact portion 272 abuts the first capillary structure 13 together with the inner segment 2711.

In summary, the present invention has the following effects as compared with the prior art: the second capillary structures 21, 27 of the heat pipes 2, 2a can be connected and communicated with the first capillary structure 13 of the temperature equalizing plate 1 to achieve a unitary The purpose of the three-dimensional heat transfer is to fully exert the heat dissipation effect of the uniform temperature plate 1 plus the heat pipes 2, 2a.

In addition, the present invention has other effects: the hollow interior of the heat pipes 2, 2a and the temperature equalizing plate 1 are designed by the steam passage 23 which is formed by the two capillary bodies 211 being spaced apart from each other or the opening 22 is provided in the heat pipe 2a. The chambers 10 are also in communication with each other, thereby further improving the heat dissipation effect. Of course, sticking out to the heat pipe 2 The exposed contact portion 212, after extending into the chamber 10, will inevitably cause the portion of the heat pipe 2 for the contact portion 212 to communicate with the chamber 10, thus achieving an effect similar to the steam passage 23. .

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structural changes of the present invention and the contents of the drawings are all included in the present invention. Within the scope of the rights, it is given to Chen Ming.

Claims (12)

A three-dimensional heat transfer device comprising: a temperature equalizing plate having a first plate body and a second plate body opposite to each other, the first plate body having a first capillary structure on the inner surface thereof; and a heat pipe therein a second capillary structure is provided, the second capillary structure has a contact portion protruding from the heat pipe and exposed, the heat pipe is inserted into the second plate body, and the contact portion extends into the temperature equalization plate and is connected The first capillary structure and the second capillary structure are connected to each other in the first capillary structure, and the second capillary structure comprises a diaper body which is spaced apart from each other and is independent, and a vapor passage is formed between the two capillary bodies. The three-dimensional heat transfer device of claim 1, wherein the heat pipe has an opening, the opening is exposed in the temperature equalizing plate, and the contact portion protrudes through the opening to be exposed. The three-dimensional heat transfer device of claim 1, wherein the contact portion protrudes from one end of the heat pipe and is exposed, the heat pipe abuts the first capillary structure with the contact portion to allow the first capillary structure and The second capillary structures are in communication with each other. The three-dimensional heat transfer device of claim 1, wherein the heat pipe is inserted into the bottom in the temperature equalizing plate, so that the contact portion of the heat pipe securely abuts the first capillary structure to allow the first capillary structure And the second capillary structure are in communication with each other. The three-dimensional heat transfer device of claim 1, wherein the blister bodies each have an exposed section, and the contact portion includes each of the exposed segments of the blister. A three-dimensional heat transfer device comprising: a temperature equalizing plate having a first plate body and a second plate body opposite to each other, the inner surface of the first plate body being provided with a first capillary structure; a heat pipe having a second capillary structure and having an inner segment, the inner segment opening an opening, the second capillary structure having a contact portion exposed in the opening, the heat pipe being inserted through the second plate The inner segment extends into the temperature equalization plate, the contact portion is connected to the first capillary structure via the opening to allow the first capillary structure and the second capillary structure to communicate with each other; and the inner segment is further open to each other The two gaps flow through the steam. The three-dimensional heat transfer device of claim 6, wherein a portion of the inner segment is fastened to the opening, the inner segment abuts the first capillary structure, the contact portion abuts the inner segment The first capillary structure and the second capillary structure are in communication with each other in the first capillary structure. The three-dimensional heat transfer device of claim 6, wherein the inner segment is further provided with at least one notch, and the at least one notch is adjacent to the opening to communicate with each other. The three-dimensional heat transfer device of claim 8, wherein the at least one notch is formed in a tube body of the inner portion of the heat pipe, and the opening is opened at a free end of the inner segment. The three-dimensional heat transfer device of claim 1 or 6, wherein the heat pipe is vertically inserted into the second plate or has an angle of 70 to 110 degrees with the second plate. The stereoscopic heat transfer device of claim 1 or 6, wherein the second plate body defines a socket, the heat pipe is inserted through the insertion hole, and the second plate body extends in a circle around the position of the insertion hole. A flange surrounding the heat pipe is further secured to the flange. The three-dimensional heat transfer device of claim 1 or 6, further comprising a fin set mounted on the heat pipe.