CN113115575A - Liquid cooling heat dissipation module formed by three-layer plate integrated blowing and manufacturing method thereof - Google Patents
Liquid cooling heat dissipation module formed by three-layer plate integrated blowing and manufacturing method thereof Download PDFInfo
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- CN113115575A CN113115575A CN202110422836.0A CN202110422836A CN113115575A CN 113115575 A CN113115575 A CN 113115575A CN 202110422836 A CN202110422836 A CN 202110422836A CN 113115575 A CN113115575 A CN 113115575A
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- heat dissipation
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- liquid cooling
- liquid
- soaking plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a liquid cooling heat dissipation module formed by blowing three layers of plates in one piece and a manufacturing method thereof, which are characterized by comprising a liquid cooling plate, a heat dissipation substrate and a soaking plate; the liquid cooling plate, the heat dissipation substrate and the soaking plate are integrally formed by blowing; the shape of the soaking plate corresponds to that of the radiating substrate and is attached to the radiating substrate, and a phase-change working medium flow passage is formed between the soaking plate and the radiating substrate; the liquid cooling plate is attached to the other side of the heat dissipation substrate, and a liquid cooling flow channel is formed between the liquid cooling plate and the heat dissipation substrate. The invention integrally blows and forms the three-layer plate of the soaking plate, the radiating substrate and the liquid cooling plate by a blowing process, thereby reducing the thermal resistance and the leakage risk.
Description
Technical Field
The invention relates to the technical field of electronic product thermal management, in particular to a liquid cooling heat dissipation module formed by three-layer plate integrated blowing and forming and a manufacturing method thereof.
Background
The liquid cooling heat dissipation module is mainly applied to the heat management of electronic products, and compared with an air cooling heat dissipation module, the liquid cooling heat dissipation module has lower equivalent thermal resistance and can meet the heat management requirement of electronic power devices with high heat flow density. The liquid cooling heat radiation module is divided into direct liquid cooling and indirect liquid cooling, the current mainstream indirect liquid cooling heat radiation module is composed of high heat conduction materials such as a heat pipe and a vapor chamber plate and a liquid cooling plate, and the traditional manufacturing process of the heat pipe, the vapor chamber plate and the liquid cooling plate is complex and has higher manufacturing cost.
The aluminum soaking plate and the liquid cooling plate manufactured by adopting the inflation process are easy to process, have lower manufacturing cost and are convenient for batch production. The liquid cooling heat radiation module manufactured by the process has the problems that the connection problem between the soaking plate and the liquid cooling plate becomes difficult, and the problems of large thermal contact resistance and complex assembly are faced by adopting threaded connection; the welding connection is adopted, so that the problems that the precision is difficult to ensure in large-plane welding and the welding cost is high are faced. In addition, because the vapor chamber manufactured by the existing inflation process has no capillary structure inside, the performance of the vapor chamber is greatly reduced when the vapor chamber is horizontally placed or placed against gravity, and the diversity of the layout of the heat dissipation scheme of the electronic component is limited.
Disclosure of Invention
In order to overcome the defects of the conventional liquid cooling heat dissipation module in the application of heat management of electronic products, the invention mainly aims to provide a liquid cooling heat dissipation module formed by integrally blowing three layers of soaking plates, heat dissipation substrates and liquid cooling plates and a manufacturing method thereof.
The purpose of the invention is realized by the following technical scheme:
the utility model provides a three-layer board integrative inflation fashioned liquid cooling heat dissipation module, includes: liquid cooling plate, heat dissipation substrate and vapor chamber; the liquid cooling plate, the heat dissipation substrate and the soaking plate are integrally formed by blowing; the shape of the soaking plate corresponds to that of the radiating substrate and is attached to the radiating substrate, and a phase-change working medium flow passage is formed between the soaking plate and the radiating substrate; the liquid cooling plate is attached to the other side of the heat dissipation substrate, and a liquid cooling flow channel is formed between the liquid cooling plate and the heat dissipation substrate.
A manufacturing method of a liquid cooling heat dissipation module formed by three-layer plate integrated blowing comprises the following steps:
step S1, adopting aluminum plates as a soaking plate, a radiating substrate and a liquid cooling plate respectively, and printing a rolling inhibitor on the soaking plate and the liquid cooling plate respectively according to the shapes of runners of the soaking plate and the liquid cooling plate;
s2, sequentially placing a soaking plate, a heat dissipation substrate and a liquid cooling plate, and carrying out hot rolling and then cold rolling on the placed soaking plate, heat dissipation substrate and liquid cooling plate to form a composite plate from three metal plates;
step S3, annealing the composite board to eliminate stress, introducing high-pressure gas, under the action of the die and the high-pressure gas, swelling the part printed with the rolling inhibitor between the soaking plate and the radiating substrate to form a working medium flow channel, and swelling the part printed with the rolling inhibitor between the liquid cooling plate and the radiating substrate to form a liquid cooling flow channel;
step S4, welding process pipes at the end of the soaking plate to be used as a pumping and injecting port and a powder filling port, and welding the process pipes at the end of the liquid cooling plate to be used as an inlet and an outlet of cooling liquid;
step S5, the sintering core rod is extended into the working medium flow passage from the powder filling process port, and a certain gap is reserved between the sintering core rod and the inner wall of the soaking plate through the positioning of a clamp; pouring sintering powder into the working medium flow passage from the powder filling process port, fully oscillating to enable the sintering powder to be filled in a gap between the sintering core rod and the soaking plate, conveying the soaking plate after powder filling to a sintering box for high-temperature sintering, and taking out the sintering core rod after sintering;
and step S6, sealing and welding the powder filling port of the soaking plate, vacuumizing the pumping and injecting port, injecting the phase change working medium, and sealing and welding the pumping and injecting port.
One or more embodiments of the present invention may have the following advantages over the prior art:
the three-layer plate of the soaking plate, the radiating substrate and the liquid cooling plate is integrally formed in a blowing mode, so that the thermal resistance of the liquid cooling radiating module is greatly reduced, and the overall radiating performance of the radiating module is improved.
The capillary structure for promoting the backflow of the working medium is sintered inside the soaking plate of the liquid cooling heat dissipation module formed by integrally blowing the three layers of plates, so that the overall performance of the blowing type soaking plate is improved.
The liquid cooling heat dissipation module formed by the three-layer plate integrated blowing is simple in manufacturing process, flexible in module shape design, and lower in cost compared with liquid cooling heat dissipation modules in other modes, and mass production is easy to realize and changeable market requirements are met.
Drawings
FIG. 1 is a schematic view of a vapor chamber surface of a liquid-cooled heat dissipation module formed by blow molding three layers of plates;
FIG. 2 is a schematic diagram of a liquid-cooled panel of a liquid-cooled heat dissipation module formed by blowing three layers of panels;
FIG. 3 is a cross-sectional view of a flow channel of a liquid-cooled heat dissipation module formed by blowing three layers of plates;
fig. 4 is a schematic view of another embodiment of a three-layer liquid-cooled heat dissipation module formed by integral inflation.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings.
As shown in fig. 1, 2 and 3, the liquid cooling heat dissipation module formed by blowing three layers of plates integrally comprises a liquid cooling plate 1, a heat dissipation substrate 2 and a soaking plate 3; the liquid cooling plate, the heat dissipation substrate and the soaking plate are integrally formed by blowing; the shape of the soaking plate corresponds to that of the radiating substrate and is attached to the radiating substrate, and a phase-change working medium flow passage 42 is formed between the soaking plate and the radiating substrate; the liquid cooling plate 1 is attached to the other side of the heat dissipation substrate 2, a liquid cooling runner 43 is formed between the liquid cooling plate and the heat dissipation substrate, and the phase change working medium and the cooling liquid are separated by the heat dissipation substrate 2 to realize heat transfer. The heat dissipation substrate 2 is provided with a heat source region 21.
The liquid cooling plate 1 comprises a cooling liquid inlet 11 and a cooling liquid outlet 12 which are positioned on one side of the long side; the soaking plate is provided with a pumping and injecting port 34 and a powder filling port 35; the pumping and injecting port 34 is positioned on one side of the long side of the cooling section 33, and the powder filling port 35 is positioned on one side of the short side of the cooling section 33; the phase change working medium flow passage comprises a heated section 31, a bending section 32 and a cooling section 33; the heated section 31 is communicated with the cooling section 33 through a bending section 32.
The cold plate further comprises a plurality of support structures 44 located between the liquid cooling channels 43; the vapor chamber also includes a plurality of support structures 44 positioned between working medium flow passages 42; the shapes of the plurality of supporting structures positioned between the liquid cooling channels and the plurality of supporting structures positioned between the working medium flow channels are both circular and groove-shaped.
The heated section 31, the bending section 32 and the cooling section 33 include a plurality of sections, and the heated section, the bending section and the cooling section are communicated or a plurality of groups are respectively independent.
The bending sections 32 of the soaking plates 3 are parallel straight flow channels so as to reduce the influence of bending on the flow channels.
The parallel direct current channels comprise a plurality of soaking plates, and capillary structures 41 are sintered inside the soaking plates.
The liquid cooling flow channel is one or a plurality of composite channels of a parallel channel, a snake-shaped channel and a support array channel. The liquid cooling heat dissipation module is planar or various space shapes, and the space shapes include: bending into L-shaped, Z-shaped, N-shaped or other space structures. The cooling liquid adopted by the heat dissipation module is any one of purified water, mineral oil or special cooling liquid; the phase-change working medium adopted by the heat dissipation module is one or more of deionized water or various refrigerants.
The real-time example provides a method for manufacturing a liquid cooling heat dissipation module formed by integrally blowing three layers of plates, which comprises the following steps:
step S1, adopting aluminum plates as a soaking plate, a radiating substrate and a liquid cooling plate respectively, and printing a rolling inhibitor on the soaking plate and the liquid cooling plate respectively according to the shapes of runners of the soaking plate and the liquid cooling plate;
s2, sequentially placing a soaking plate, a heat dissipation substrate and a liquid cooling plate, and carrying out hot rolling and then cold rolling on the placed soaking plate, heat dissipation substrate and liquid cooling plate to form a composite plate from three metal plates;
step S3, annealing the composite board to eliminate stress, introducing high-pressure gas, under the action of the die and the high-pressure gas, swelling the part printed with the rolling inhibitor between the soaking plate and the radiating substrate to form a working medium flow channel, and swelling the part printed with the rolling inhibitor between the liquid cooling plate and the radiating substrate to form a liquid cooling flow channel;
step S4, welding process pipes at the end of the soaking plate to be used as a pumping port and a powder filling port, and welding the process pipes at the end of the liquid cooling plate to be used as an inlet and an outlet of cooling liquid so as to conveniently connect pipelines;
step S5, the sintering core rod is extended into the working medium flow passage from the powder filling process port, and a certain gap is reserved between the sintering core rod and the inner wall of the soaking plate through the positioning of a clamp; pouring sintering powder into the working medium flow passage from the powder filling process port, fully oscillating to enable the sintering powder to be filled in a gap between the sintering core rod and the soaking plate, conveying the soaking plate after powder filling to a sintering box for high-temperature sintering, and taking out the sintering core rod after sintering;
and step S6, sealing and welding the powder filling port of the soaking plate, vacuumizing the pumping and injecting port, injecting the phase change working medium, and sealing and welding the pumping and injecting port.
Example 2
The main structure of this embodiment is the same as that of embodiment 1, and the same parts are not described again, and the difference from embodiment 1 is:
as shown in fig. 4, the bending section of the soaking plate has two bends, and the whole heat dissipation module is bent into an approximate Z shape. The bending shape is beneficial to the liquid working medium of the cooling section of the soaking plate to quickly flow back to the heated section, and simultaneously, other electronic components on the circuit board can be avoided, and the integration level of the module is improved.
Although the embodiments of the present invention have been described above, the above descriptions are only for the convenience of understanding the present invention, and are not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A three-layer board integrated inflation formed liquid cooling heat dissipation module is characterized by comprising a liquid cooling board, a heat dissipation substrate and a soaking board; the liquid cooling plate, the heat dissipation substrate and the soaking plate are integrally formed by blowing; the shape of the soaking plate corresponds to that of the radiating substrate and is attached to the radiating substrate, and a phase-change working medium flow passage is formed between the soaking plate and the radiating substrate; the liquid cooling plate is attached to the other side of the heat dissipation substrate, and a liquid cooling flow channel is formed between the liquid cooling plate and the heat dissipation substrate.
2. The liquid-cooled heat dissipation module of claim 1, wherein the three-layer plate is formed by blow molding,
the liquid cooling plate 1 is provided with a cooling liquid inlet and a cooling liquid outlet;
the soaking plate is provided with a pumping and injecting port and a powder filling port;
the phase change working medium flow passage comprises a heated section, a bent section and a cooling section; the heated section is communicated with the cooling section through a bending section.
3. The liquid-cooled heat dissipation module of claim 1, wherein the three-layer plate is formed by blow molding,
the liquid cooling plate also comprises a plurality of supporting structures positioned between the liquid cooling runners;
the soaking plate also comprises a plurality of supporting structures positioned between the working medium runners;
the shapes of the plurality of supporting structures positioned between the liquid cooling channels and the plurality of supporting structures positioned between the working medium flow channels are both circular and groove-shaped.
4. The liquid-cooled heat dissipation module of claim 2, wherein the heated section, the bent section and the cooled section are connected or independent from each other.
5. The liquid-cooled heat dissipation module with three layers of plates formed by integral inflation as claimed in claim 2, wherein the bent sections of the soaking plate are parallel straight channels, the number of the parallel straight channels is several, and capillary structures are sintered inside the soaking plate.
6. The three-layer integrated blown liquid-cooled heat dissipation module of claim 1, wherein the liquid-cooled runner is one or more of a parallel channel, a serpentine channel, and a support array channel.
7. The liquid-cooled heat dissipation module of claim 1, wherein the liquid-cooled heat dissipation module is planar or has various spatial shapes.
8. The liquid-cooled heat dissipation module of claim 1, wherein the three-layer plate is formed by blow molding,
the cooling liquid adopted by the heat dissipation module is any one of purified water, mineral oil or special cooling liquid;
the phase-change working medium adopted by the heat dissipation module is one or more of deionized water or various refrigerants.
9. The method for manufacturing a three-layer integrated inflation-molded liquid-cooled heat dissipation module according to any one of claims 1 to 8, wherein the method comprises the following steps:
step S1, adopting aluminum plates as a soaking plate, a radiating substrate and a liquid cooling plate respectively, and printing a rolling inhibitor on the soaking plate and the liquid cooling plate respectively according to the shapes of runners of the soaking plate and the liquid cooling plate;
s2, sequentially placing a soaking plate, a heat dissipation substrate and a liquid cooling plate, and carrying out hot rolling and then cold rolling on the placed soaking plate, heat dissipation substrate and liquid cooling plate to form a composite plate from three metal plates;
step S3, annealing the composite board to eliminate stress, introducing high-pressure gas, under the action of the die and the high-pressure gas, swelling the part printed with the rolling inhibitor between the soaking plate and the radiating substrate to form a working medium flow channel, and swelling the part printed with the rolling inhibitor between the liquid cooling plate and the radiating substrate to form a liquid cooling flow channel;
step S4, welding process pipes at the end of the soaking plate to be used as a pumping and injecting port and a powder filling port, and welding the process pipes at the end of the liquid cooling plate to be used as an inlet and an outlet of cooling liquid;
step S5, the sintering core rod is extended into the working medium flow passage from the powder filling process port, and a certain gap is reserved between the sintering core rod and the inner wall of the soaking plate through the positioning of a clamp; pouring sintering powder into the working medium flow passage from the powder filling process port, fully oscillating to enable the sintering powder to be filled in a gap between the sintering core rod and the soaking plate, conveying the soaking plate after powder filling to a sintering box for high-temperature sintering, and taking out the sintering core rod after sintering;
and step S6, sealing and welding the powder filling port of the soaking plate, vacuumizing the pumping and injecting port, injecting the phase change working medium, and sealing and welding the pumping and injecting port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110422836.0A CN113115575A (en) | 2021-04-19 | 2021-04-19 | Liquid cooling heat dissipation module formed by three-layer plate integrated blowing and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110422836.0A CN113115575A (en) | 2021-04-19 | 2021-04-19 | Liquid cooling heat dissipation module formed by three-layer plate integrated blowing and manufacturing method thereof |
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| CN113115575A true CN113115575A (en) | 2021-07-13 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114025582A (en) * | 2021-11-23 | 2022-02-08 | 佛山市液冷时代科技有限公司 | 5G intelligent rod of collection AAU liquid cooling system |
| CN114734212A (en) * | 2022-05-18 | 2022-07-12 | 东莞新凯隆热能科技有限公司 | High-thermal-conductivity inflation plate and manufacturing process thereof |
| CN115802728A (en) * | 2023-01-31 | 2023-03-14 | 深圳威铂驰热技术有限公司 | Vacuum cavity vapor chamber for mobile terminal and processing mold thereof |
| CN116406140A (en) * | 2023-04-27 | 2023-07-07 | 华南理工大学 | Inflation type phase change device, heat dissipation system and electronic equipment |
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Application publication date: 20210713 |