CN111725156A - Integrated circuit heat dissipation device - Google Patents
Integrated circuit heat dissipation device Download PDFInfo
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- CN111725156A CN111725156A CN202010504417.7A CN202010504417A CN111725156A CN 111725156 A CN111725156 A CN 111725156A CN 202010504417 A CN202010504417 A CN 202010504417A CN 111725156 A CN111725156 A CN 111725156A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 120
- 238000010521 absorption reaction Methods 0.000 claims abstract description 72
- 230000007704 transition Effects 0.000 claims abstract description 29
- 238000007664 blowing Methods 0.000 claims abstract description 28
- 239000004020 conductor Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004484 Briquette Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat sink for integrated circuit, the heat sink includes; the heat dissipation plate is of a single-face blowing structure and comprises a cavity for circulating superconducting working medium; the heat dissipation plate further includes: the heat dissipation device comprises a heat dissipation end, a heat absorption end and a transition section for connecting the heat dissipation end and the heat absorption end; the heat absorption end comprises a contact area attached to the circuit board chip; on the horizontal plane, the position of the heat dissipation end is higher than that of the heat absorption end; the heat absorption end is configured to deviate from a symmetry axis of the width direction of the heat dissipation end, and the contact area is located on the symmetry axis of the width direction of the heat absorption end; a loop enabling the superconducting working medium to flow in a fixed flow direction between the heat dissipation end and the heat absorption end is formed among the transition section, the heat absorption end and the heat dissipation end; and the heat dissipation device also comprises a fixing piece used for fixing the circuit board and the heat absorption end.
Description
Technical Field
The present invention relates to the field of heat dissipation, and more particularly, to a heat dissipation device for an integrated circuit.
Background
With the rapid advance of technology in recent years, the integrated circuits of electronic products are developed more and more rapidly, the computing speed of various CPUs, GPUs, processors, integrated modules and the like is increased more and more, and the heat productivity of the integrated circuits is increased more and more. At present, the traditional heat dissipation method is to adopt an insert radiator with an aluminum profile structure, or install a fan on the insert radiator to accelerate heat dissipation. However, this heat dissipation method is not suitable for a circuit structure with a large volume, a large noise, and a high heating power and a limited installation space, and although the prior art adopts water cooling, aluminum profile matching with a heat pipe or VC, the technical problem can not be effectively solved. For example, in recent years, the control circuit of the inverter air conditioner and the inverter air conditioner outdoor unit adopts a traditional heat dissipation mode, the circuit structure has large heat productivity and bad working environment, the heat dissipation of the aluminum profile insert sheet structure also has the problems that dust deposition between insert sheet profiles affects heat dissipation and the like, and the air conditioner outdoor unit does not have too much space to install a heat dissipation device with higher power.
Therefore, a new heat dissipation device for integrated circuit is needed.
Disclosure of Invention
The invention aims to provide an integrated circuit heat dissipation device, which is used for solving at least one of the problems in the prior art;
in order to achieve the purpose, the invention adopts the following technical scheme:
a first aspect of the present invention provides an integrated circuit heat dissipation device, comprising:
the heat dissipation plate is of a single-face blowing structure and comprises a cavity for circulating superconducting working medium;
the heat dissipation plate further includes: the heat dissipation device comprises a heat dissipation end, a heat absorption end and a transition section for connecting the heat dissipation end and the heat absorption end; wherein,
the heat absorption end comprises a contact area attached to the circuit board chip;
on the horizontal plane, the position of the heat dissipation end is higher than that of the heat absorption end;
the heat absorption end is configured to deviate from a symmetry axis of the width direction of the heat dissipation end, and the contact area is located on the symmetry axis of the width direction of the heat absorption end;
a loop enabling the superconducting working medium to flow in a fixed flow direction between the heat dissipation end and the heat absorption end is formed among the transition section, the heat absorption end and the heat dissipation end; and
the heat dissipation device further comprises a fixing piece used for fixing the circuit board and the heat absorption end.
In an alternative embodiment, the heat sink end further comprises a non-contact region located on one side of the contact region, and the pressure of the contact region is greater than the pressure of the non-contact region.
In an alternative embodiment, the heat sink end comprises: the inflation plane is an expansion surface opposite to the inflation plane, and any one of the inflation plane and the expansion surface is attached to the circuit board.
In an optional embodiment, the fixing member includes a pressing block for fixing the heat absorbing end to the circuit board, wherein the pressing block is provided with a groove for accommodating the heat absorbing end.
In an alternative embodiment, the ballast is a tab heat sink.
In an alternative embodiment, the width of the transition section is less than the width of the heat sink end and the heat sink end.
In an alternative embodiment, the transition section cavity includes a plurality of transition passages for connecting the heat sink end cavity and the heat sink end cavity.
In an alternative embodiment, the fixing member is a thermally conductive material and is disposed between the heat sink and the circuit board.
In an optional embodiment, in the horizontal plane, the fixing member is provided with a through groove, and the heat absorbing end is disposed in the through groove.
In an alternative embodiment, the heat dissipation plate is of a single-sided inflation structure or a double-sided inflation structure.
The invention has the following beneficial effects:
the integrated heat dissipation device provided by the invention forms a dual circulating heat dissipation system by setting the position relationship between the heat absorption end and the heat dissipation end and utilizing the gravity and the pressure of the superconducting working medium, can realize passive heat dissipation without a power source, effectively improves the heat dissipation efficiency, and has the advantages of simple structure, small installation space, high heat dissipation power and the like.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram illustrating a heat dissipation plate according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a heat sink end of a heat dissipation plate according to an embodiment of the present invention;
FIG. 3 illustrates a side view of an integrated circuit heat dissipation device provided by an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating one embodiment of an integrated circuit heat sink in accordance with the present invention;
FIG. 5 is a schematic diagram illustrating one embodiment of an integrated circuit heat sink in accordance with the present invention;
FIG. 6 is a schematic diagram illustrating one embodiment of an integrated circuit heat sink in accordance with the present invention;
FIG. 7 is a schematic diagram illustrating one embodiment of an integrated circuit heat sink in accordance with the present invention;
FIG. 8 is a schematic diagram illustrating one embodiment of an integrated circuit heat sink in accordance with the present invention;
FIG. 9 is a schematic diagram illustrating one embodiment of an integrated circuit heat sink in accordance with the present invention;
FIG. 10 illustrates a top view of one embodiment of an integrated circuit heat dissipation device, in accordance with an embodiment of the present invention;
reference numerals:
a heat dissipation plate 1; a heat dissipation end 11; a heat dissipating end blow up plane 111; a heat dissipating end bulging surface 112; a heat sink end cavity 113; a heat dissipation end runner 114; a heat sink end 12; a heat sink end cavity 123; a blowing plane 121; an expanding surface 122; a heat sink end flow passage 124; a transition section 13; a transition passage 131; a working medium flushing port 14; a circuit board 2; a circuit board chip 21; a fixing member 3; a briquette 31; a stair structure 311; a stair-structure vertical face 3111; step structure level 3112.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
One embodiment of the present invention discloses an integrated circuit heat dissipation device, as shown in fig. 1, 3 and 10, the integrated circuit heat dissipation device includes:
the heat dissipation plate 1 with the single-face blowing structure comprises a cavity for circulating a superconducting working medium, wherein the heat dissipation plate 1 is of a single-face blowing structure;
the heat dissipation plate 1 further includes: the heat dissipation device comprises a heat dissipation end 11, a heat absorption end 12 and a transition section 13 connecting the heat dissipation end 11 and the heat absorption end 12; the heat absorption end 12 comprises a contact area attached to the circuit board chip 21; wherein,
on the horizontal plane, the position of the heat dissipation end 11 is higher than that of the heat absorption end 12;
the heat absorbing end 12 is configured to be deviated from a symmetry axis of the width direction of the heat dissipating end 11, and the contact region is located at the symmetry axis deviated from the width direction of the heat absorbing end 12;
a loop enabling the superconducting working medium to flow in a fixed flow direction between the heat dissipation end 11 and the heat absorption end 12 is formed among the transition section 13, the heat absorption end 12 and the heat dissipation end 11;
the heat dissipation device further comprises a fixing member 3 for fixing the circuit board 2 and the heat absorption end 12.
The integrated heat dissipation device provided by the invention forms a dual circulating heat dissipation system by setting the position relationship between the heat absorption end and the heat dissipation end and utilizing the gravity and the pressure of the superconducting working medium, can realize passive heat dissipation without a power source, effectively improves the heat dissipation efficiency, and has the advantages of simple structure, small installation space, high heat dissipation power and the like.
As shown in fig. 3, the position of the heat dissipating end 11 is higher than the position of the heat absorbing end 12, an elevation angle α exists between the heat absorbing end and the heat dissipating end, and a certain height difference h exists between the two ends, so that the superconducting working medium at the heat dissipating end can automatically flow to the heat absorbing end lower than the height of the superconducting working medium under the influence of self gravity, and since the heat absorbing end 12 is fixed to the heat generating circuit board 2, when the circuit board 2 generates heat, the superconducting working medium at the heat absorbing end can be heated, boiled and gasified, and then float up to the heat dissipating end 11, and the superconducting working medium condenses after the heat dissipating end 11 dissipates heat, and flows back to the heat absorbing end 12 under the action of gravity, thereby forming a passive cycle of the whole heat absorbing and dissipating process, and the passive heat dissipation of.
In some optional implementations of this embodiment, the heat sink end further includes a non-contact region located on a side of the contact region; the pressure of the contact zone is greater than the pressure of the non-contact zone.
In a specific example shown in fig. 10, the heat dissipation plate is manufactured by using a blowing process, a loop is formed between the transition section 13, the heat absorption end 12 and the heat dissipation end 11, so that the superconducting working medium flows in a fixed flow direction between the heat dissipation end 11 and the heat absorption end 12, the flow direction of the superconducting working medium is shown by an arrow in fig. 10, the heat absorption end 12 is attached to the circuit board, and the circuit board chip 21 is located in a contact region of the heat absorption end. As shown in fig. 3, the heat dissipating end and the heat absorbing end have a height difference in a horizontal plane, so that an elevation angle exists between the heat dissipating end and the heat absorbing end. As shown in fig. 10, the heat absorbing end 12 is deviated from the symmetry axis of the width direction of the heat dissipating end 11, and the contact area is located at the symmetry axis deviated from the width direction of the heat absorbing end 12; namely, the contact area of the heat absorption end and the chip is eccentrically arranged on the heat absorption end.
And a superconducting working medium is filled in a cavity in the heat dissipation plate 1, and the superconducting working medium circularly flows through a transition section and a loop between the heat absorption end and the heat dissipation end. When the chip 21 heats, the superconducting working medium is heated and gasified, flows to the heat dissipation end along the arrow direction, dissipates heat and condenses into liquid after the temperature of the heat dissipation end is reduced, and the liquid superconducting working medium at the heat dissipation end rapidly flows back to the heat absorption end under the action of gravity because the height difference exists between the heat dissipation end and the heat absorption end on the horizontal plane.
Because the chip is eccentrically arranged at the heat absorption end, the temperature of the contact area with the chip is higher, the temperature of the non-contact area at the other side is lower, and the temperature difference exists between the contact area and the non-contact area, so that the pressure of the superconducting working medium in the contact area with the higher temperature is relatively large, further the superconducting working medium forms a circulating flow loop along the flow direction shown in figure 10, and the superconducting working medium is enabled to double accelerate the circulating heat dissipation system under the action of gravity and pressure difference, so that the heat dissipation effect can be furthest realized, the heat dissipation efficiency is effectively improved, the whole heat dissipation process can be realized without any power source, and the energy is saved.
It should be noted that, in the heat dissipation end of the heat dissipation plate in the example of fig. 10, not all the cavities are configured, and in order to form the loop-shaped pipeline, an avoidance area is further provided on the heat dissipation end, and the design is determined by those skilled in the art according to the practical application, and does not prevent those skilled in the art from defining the cavity structure of the embodiment of the present invention.
In some optional implementations of this embodiment, the heat sink end includes: the inflation plane is an expansion surface corresponding to the inflation plane, and any one of the inflation plane and the expansion surface is attached to the circuit board.
As shown in fig. 2, the heat absorbing end forms a single-sided inflation structure through an inflation process, and includes: the superconducting heat source comprises a heat absorption end blowing plane 121 and a heat absorption end blowing surface 122 opposite to the heat absorption end blowing plane 121, wherein the heat absorption end blowing surface 122 is convex relative to the heat absorption end blowing plane 121, and a heat absorption end cavity 123 for superconducting working medium circulation is configured on the heat absorption end. The expansion surface 122 and the expansion plane 121 form a heat absorption end runner 124 for the flow of the superconducting working medium.
In the specific example of the present invention, any one of the heat absorbing end inflation plane 121 and the heat absorbing end inflation plane 122 may be attached to the circuit board, as shown in fig. 3, the heat absorbing end inflation plane 122 is attached to the circuit board, the heat absorbing end 12 is disposed between the circuit board 2 and the pressing block 31, the heat absorbing end inflation plane 122 is attached to the circuit board 2, and the fastening screw presses the heat absorbing end 12 of the heat dissipating plate onto the circuit board 2 in an interference fit manner, so as to ensure that the heat dissipating plate is closely attached to the heat generating portion of the circuit board 2. In the example shown in fig. 4, the heat absorbing end blowing plane 111 is attached to the circuit board 2, the heat absorbing end 12 is disposed between the circuit board 2 and the pressing block 31, and the heat absorbing end blowing plane 121 is bonded to the circuit board 2, so as to reduce thermal resistance as much as possible during the heat conduction process and attach the heat absorbing end 12 to the circuit board 2 as closely as possible. The heat dissipation device of the embodiment of the invention has the advantages of enhanced universality.
In a specific example, as shown in fig. 1, the structure of the heat dissipation end is consistent with that of the heat absorption end, and also includes a blown structure formed by a blowing process, and also includes a heat dissipation end blowing plane 111 and a heat dissipation end blowing plane 112 of the structure shown in fig. 2, and a heat dissipation end cavity 113 for superconducting working medium circulation is also configured on the heat dissipation end, and a heat dissipation end runner 114 for superconducting working medium flow is also formed between the heat dissipation end blowing plane 112 and the heat dissipation end blowing plane 111. And a working medium flushing port 14 for blowing and injecting the superconducting working medium is formed on the heat dissipation end 11.
As shown in fig. 1, the transition section 13 not only connects the heat dissipation end 11 and the heat absorption end 12, but also connects the heat dissipation end cavity 113 and the heat absorption end cavity 123 through the transition section cavity to form a flow loop for superconducting working medium circulation. The transition section cavity, the heat dissipation end cavity and the heat absorption end cavity jointly form the cavity of the heat dissipation plate in the embodiment of the invention.
In some optional implementations of the present embodiment, the fixing member 3 includes a pressing block 31 for fixing the heat absorbing end 12 on the circuit board 2, wherein the pressing block 31 is provided with a groove for accommodating the heat absorbing end 12. In a specific example, the pressing block 31 fixes the heat absorbing end 12 on the circuit board 2 in an interference fit manner to achieve close fitting between the circuit board and the heat dissipating plate, thereby improving heat dissipating efficiency.
As shown in fig. 4, the pressing block 31 is provided with a groove for accommodating the heat absorbing end 12, and the depth of the groove is slightly smaller than the bulging height of the heat absorbing end to realize the tight fit between the heat absorbing end 12 and the circuit board 2, and the heat absorbing end 12 of the heat dissipating plate is tightly pressed on the circuit board 2 by the fastening screw in an interference fit manner, so as to further ensure the tight fit between the heat dissipating plate and the heating portion of the circuit board 2.
As shown in fig. 5, in some optional implementations of this embodiment, the pressing block is an insert heat sink, and the insert profile heat sink can further improve heat dissipation.
As shown in fig. 6, in another specific example, the groove further includes a step structure 311, and the step structure 311 is used for forming a contact surface closely attached to the surface of the heat absorption end 12 of the heat dissipation plate. The step structure 311 includes a step structure horizontal surface 3112 in contact with the heat absorbing end swelling surface 122 and a step structure vertical surface 3111 perpendicular to the swelling surface. In this example, the heat sink blowing plane 121 is attached to the circuit board 2, and the heat sink 12 is disposed above the surface of the circuit board 2. The distance between the horizontal plane 3112 of the stepped structure and the blowing plane 121 of the heat absorbing end is smaller than the distance between the blowing plane 122 of the heat absorbing end and the blowing plane 121 of the heat absorbing end, so that the pressing block 31 is tightly attached to the surface of the heat absorbing end. The pressing block 31 is fixed on the circuit board 2 by a fastening screw to realize the close contact between the heat absorption end 12 and the heat generating circuit board 2, thereby further improving the heat dissipation efficiency.
As shown in fig. 3, in some optional implementations of the present embodiment, the width of the transition section 13 is smaller than the widths of the heat absorbing end 12 and the heat dissipating end 11. That is, the heat absorbing end, the transition section and the heat dissipating end sequentially form the length direction of the heat dissipating plate 1 from left to right, the direction perpendicular to the length direction is the width direction of the heat dissipating plate, that is, the X direction shown in fig. 10, and as shown in fig. 10, the width of the transition section 13 is smaller than the widths of the heat absorbing end 12 and the heat dissipating end 11. Because the transition section is a bending area and is a narrow straight line passage, the width of the transition section can ensure that the speed and the volume of the superconducting working medium are not influenced when the superconducting working medium passes through the bending area of the transition passage. The heat absorption end 12 and the heat dissipation end 11 are connected by an arc-shaped transition portion.
As shown in fig. 3, in some optional implementations of the present embodiment, the transition-section cavity includes a plurality of transition passages 131 for connecting the heat-dissipating end cavity 113 and the heat-absorbing end cavity 123, so as to form a loop in which the superconducting working medium rapidly circulates between the heat-dissipating end cavity 113 and the heat-absorbing end cavity 123.
As shown in fig. 7, in some optional implementations of the present embodiment, the fixing member 3 is a heat conductive material, and the fixing member 3 is disposed between the heat sink end 12 and the circuit board 2. The fixing part 3 of a heat conduction material is welded or bonded between the heat absorption end 12 of the heat dissipation plate 1 and the circuit board 2 and used for conducting heat of the circuit board 2, in a specific example, the fixing part 3 is a metal aluminum profile, and also can be a metal plate with good flatness of a flat die, and the heat absorption end 1 and the circuit board 2 are tightly attached through the heat conduction material.
As shown in fig. 8, in some optional implementations of this embodiment, in a horizontal plane, the fixing member 3 is provided with a through slot, and the heat absorbing end 12 is disposed in the through slot.
The fixing part 3 is provided with a through hole for installing a heat absorption end 12 of the heat dissipation plate. In a specific example, as shown in the figure, the fixing member 3 is an insert radiator, and the fixing member 3 is provided with an inverted T-shaped through groove for installing a heat absorption end, the thickness of the protruding ends on two sides of a first-shaped groove on the horizontal plane of the inverted T-shaped through groove is equal to the thickness of the bulging surface of the heat absorption end from the blowing plane of the heat absorption end, the height of a l-shaped groove on the vertical plane of the inverted T-shaped through groove is equal to the blowing thickness of the heat absorption end, the heat absorption end 12 is installed in the inverted T-shaped through groove of the fixing member 3 in an interference fit manner, superconducting working medium is flushed into the cavity of the heat dissipation plate 1, when heat is absorbed, the superconducting working medium is gasified and expanded, the internal pressure of the heat absorption end 12 is increased and expanded, and the heat absorption.
As shown in fig. 9, in some optional implementations of this embodiment, the heat absorbing end of the heat dissipating plate is in a single-sided inflation structure or a double-sided inflation structure. The shape of the through groove formed in the fixing member 3 at this time is set by the structure of the heat absorbing end, the shape and size of the swelling portion of the heat absorbing end can be arbitrarily arranged, and the shape of the through groove formed in the fixing member 3 is configured to match with the swelling portion. The heat absorption end cavity of the double-faced blowing structure is larger, and the superconducting working medium contained in the double-faced blowing structure is more, so that the heat dissipation effect is further enhanced.
In summary, the integrated heat dissipation device provided in the above embodiments forms a dual circulating heat dissipation system by using the gravity and pressure of the superconducting working medium, has the advantages of simple structure, small installation space, high heat dissipation power, and the like, can realize the circulating flow of the internal refrigeration superconducting working medium without a power source, can stably and quickly guide heat out of the circuit board integrated module, and ensures that the circuit board integrated circuit works normally.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (10)
1. An integrated circuit heat dissipation device, comprising;
the heat dissipation plate is of a single-face blowing structure and comprises a cavity for circulating superconducting working medium;
the heat dissipation plate further includes: the heat dissipation device comprises a heat dissipation end, a heat absorption end and a transition section for connecting the heat dissipation end and the heat absorption end; wherein,
the heat absorption end comprises a contact area attached to the circuit board chip;
on the horizontal plane, the position of the heat dissipation end is higher than that of the heat absorption end;
the heat absorption end is configured to deviate from a symmetry axis of the width direction of the heat dissipation end, and the contact area is located on the symmetry axis of the width direction of the heat absorption end;
a loop enabling the superconducting working medium to flow in a fixed flow direction between the heat dissipation end and the heat absorption end is formed among the transition section, the heat absorption end and the heat dissipation end; and
the heat dissipation device further comprises a fixing piece used for fixing the circuit board and the heat absorption end.
2. The device of claim 1, wherein the heat sink end further comprises a non-contact region on one side of the contact region, the contact region having a pressure greater than a pressure of the non-contact region.
3. The apparatus of claim 1,
the heat sink end includes: the inflation plane is an expansion surface opposite to the inflation plane, and any one of the inflation plane and the expansion surface is attached to the circuit board.
4. The apparatus of claim 1, wherein the fixing member comprises a pressing block for fixing the heat sink to the circuit board, wherein the pressing block defines a recess for receiving the heat sink.
5. The apparatus of claim 4, wherein the ballast is a tab heat sink.
6. The device of claim 1, wherein the transition section has a width less than a width of the heat sink end and the heat sink end.
7. The apparatus of claim 1, wherein the transition section cavity comprises a plurality of transition passages for connecting the heat sink end cavity and the heat sink end cavity.
8. The apparatus of claim 1, wherein the mounting member is a thermally conductive material disposed between the heat sink end and the circuit board.
9. The apparatus of claim 1, wherein the fixture defines a channel in a horizontal plane, and the heat sink end is disposed within the channel.
10. The apparatus of claim 9, wherein the heat dissipation plate is a single-sided or double-sided blown structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010504417.7A CN111725156A (en) | 2020-06-05 | 2020-06-05 | Integrated circuit heat dissipation device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010504417.7A CN111725156A (en) | 2020-06-05 | 2020-06-05 | Integrated circuit heat dissipation device |
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| CN111725156A true CN111725156A (en) | 2020-09-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113115575A (en) * | 2021-04-19 | 2021-07-13 | 佛山市液冷时代科技有限公司 | Liquid cooling heat dissipation module formed by three-layer plate integrated blowing and manufacturing method thereof |
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