CN212266583U - Cooling device for mobile phone shell mold - Google Patents
Cooling device for mobile phone shell mold Download PDFInfo
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- CN212266583U CN212266583U CN202020985361.7U CN202020985361U CN212266583U CN 212266583 U CN212266583 U CN 212266583U CN 202020985361 U CN202020985361 U CN 202020985361U CN 212266583 U CN212266583 U CN 212266583U
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- heat insulation
- heat
- box body
- insulation box
- conductor
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Abstract
The utility model discloses a cooling device for a mould of a mobile phone shell, which comprises a heat insulation box body, a semiconductor refrigeration sheet and a heat conductor arranged in the heat insulation box body; the heat insulation box body and the heat conductor are both rectangular bodies, and the heat conductor is hermetically fixed in the heat insulation box body; the semiconductor refrigeration pieces are respectively embedded in the four side walls and the top wall of the heat insulation box body, the refrigeration end face of each semiconductor refrigeration piece is positioned in the heat insulation box body and is attached to the outer surface of the heat conductor, and the heat production end face of each semiconductor refrigeration piece is positioned outside the heat insulation box body; a plurality of rows of S-shaped bent channels are arranged in the heat conductor, every two adjacent rows of channels are connected in a conduction manner, and the channels at the two extreme sides are respectively provided with a joint penetrating through the side wall of the heat conductor; the two joints extend out through the side wall of the heat insulation box body. The utility model discloses a cell phone mold's improvement cooling effect shortens cell-phone shell shaping time, improves production efficiency.
Description
Technical Field
The utility model relates to a cell-phone mould technical field, concretely relates to a cooling device for cell-phone shell mould.
Background
The plastics cell-phone shell adopts the injection molding machine to make, and the injection molding machine forms complete cell-phone shell back in with the raw materials injection die cavity, need cool off the molding cycle in order to shorten the cell-phone shell to the mould. The material injection time is generally short and the cooling time is long, and the time required to produce a mobile phone case is substantially determined by the cooling time. The existing cooling mode is to add a cooling pipe in the mold and continuously feed low-temperature cooling liquid into the cooling system for cooling.
The basic principle of the existing cooling system is that the cooling liquid after absorbing heat is introduced into a heat exchanger, the heat exchanger utilizes a fan to dissipate heat, and the cooling liquid discharged from the heat exchanger is introduced into a mold to cool the hand casing, so that the circulation is carried out. However, the heat exchanger has some disadvantages, such as the phenomenon that the cooling liquid can not start to dissipate heat after being introduced into the heat exchanger, and the cooling is delayed. The heat dissipation situation also belongs to passive heat dissipation, and the cooling effect is not ideal, so that the forming time cannot be further shortened, and the production efficiency is directly influenced.
SUMMERY OF THE UTILITY MODEL
The defects in the prior art are overcome, the cooling effect is improved, the forming time of the mobile phone shell is shortened, and the production efficiency is improved. The utility model provides a cooling device for a mould of a mobile phone shell, which comprises a heat insulation box body, a semiconductor refrigeration sheet and a heat conductor arranged in the heat insulation box body; the heat insulation box body and the heat conductor are rectangular in shape, and the heat conductor is hermetically fixed in the heat insulation box body; the semiconductor refrigeration pieces are respectively embedded in four side walls and the top wall of the heat insulation box body, the refrigeration end face of each semiconductor refrigeration piece is positioned in the heat insulation box body and is attached to the outer surface of the heat conductor, and the heat production end face of each semiconductor refrigeration piece is positioned outside the heat insulation box body;
a plurality of rows of S-shaped bent channels are arranged in the heat conductor, every two adjacent rows of channels are connected in a conduction manner, and the channels at the two extreme sides are respectively provided with a joint penetrating through the side wall of the heat conductor; the two joints penetrate through the side wall of the heat insulation box body to extend out, the temperature of the heat conductor is reduced through the semiconductor refrigerating sheet, and then the temperature of the cooling liquid flowing through the channel is reduced.
The beneficial effects of the utility model are embodied in:
connect and form the return circuit with the cooling tube intercommunication of cell-phone shell mould through two, the coolant liquid forms high temperature coolant liquid after absorbing the heat in the cooling tube, and the semiconductor refrigeration piece reduces the temperature of heat conductor, and the heat that releases becomes low temperature coolant liquid in the coolant liquid inflow passageway of high temperature, and low temperature coolant liquid flows into the cooling tube once more and absorbs the heat, circulates from this. Five semiconductor refrigeration pieces refrigerate simultaneously, and refrigeration efficiency is high. In addition, the heat conductor is made of copper materials, so that the heat transfer efficiency is improved, the temperature of the high-degree cooling liquid is reduced in a short time, and the phenomenon of cooling delay is avoided. And the semiconductor refrigeration piece reduces the problem of the heat conductor, and then absorbs the heat of the high-temperature cooling liquid, so that active heat dissipation is formed, and the cooling effect is greatly improved.
Preferably, the refrigerating end face of each semiconductor refrigerating sheet is provided with an aluminum radiator.
Preferably, the upper end of the aluminum radiator positioned on the top wall of the heat insulation box body is provided with a first fan, and the air exhaust end of the first fan faces upwards.
Preferably, the upper ends of the aluminum radiators on the side walls of the heat insulation box are provided with second fans, and the air exhaust ends of the second fans face downwards.
The first fan blows away the heat generated by the semiconductor refrigeration sheets on the top wall upwards, the heat generated by the semiconductor refrigeration sheets on the four side walls blows away downwards, the air inlet is formed in the middle of the heat insulation box body, and the air exhaust is formed in the upper portion and the lower portion. The whole heat dissipation structure is reasonable in distribution, hot air turbulence is avoided, and heat dissipation efficiency is improved.
Preferably, the aluminum radiator on the side wall of each heat insulation box body is provided with two second fans which are distributed side by side.
The heat dissipation efficiency of the two second fans is higher, and the heat dissipation speed of the radiator on the side wall is improved.
Preferably, the heat insulation device further comprises a heat insulation ring; and the peripheral side wall of each semiconductor refrigerating sheet is fixedly connected with one heat insulation ring for reducing heat convection between the refrigerating end face and the heat generating end face.
Because the distance between the refrigerating end face and the heat-generating end face of the semiconductor refrigerating sheet is short, the heat-insulating ring is additionally arranged between the refrigerating end face and the heat-generating end face, so that the heat transfer between the refrigerating end face and the heat-generating end face can be effectively avoided, and the refrigerating efficiency of the refrigerating end face and the heat-generating end face heat dissipation efficiency are improved.
Preferably, the top wall and the side wall of the heat insulation box body are provided with grooves opposite to the corresponding heat insulation rings, and part of each heat insulation ring extends into the corresponding groove.
The heat insulation ring is sunk into the side wall and the top wall of the heat insulation box, so that the heat insulation effect is further improved.
Preferably, the space between the heat insulation box body and the heat conductor is vacuum.
The heat insulation box body is made of high-temperature-resistant heat insulation materials, the heat conductor is made of copper materials, and the heat conductor and the heat insulation box are vacuumized, so that heat transfer between the heat insulation box body and the heat conductor is further reduced, and the refrigerating effect of the heat conductor is kept.
Preferably, the bottom wall of the heat insulation box body is provided with a base.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
FIG. 1 is a schematic structural diagram of the present embodiment;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic view of the top wall of FIG. 2 after the top wall of the heat sink and the second fan are hidden;
FIG. 4 is a schematic view showing the internal structure of the insulation box and the heat conductor in this embodiment;
fig. 5 is another schematic internal structure diagram of the heat insulating box and the heat conductor in the embodiment.
In the attached drawings, a heat insulation box body 1, a semiconductor refrigeration sheet 2, a heat conductor 3, a channel 4, a joint 5, a radiator 6, a first fan 7, a second fan 8, a heat insulation ring 9, a groove 10 and a base 11.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
The embodiment provides a cooling device for a mould of a mobile phone shell, which comprises a heat insulation box body 1, a semiconductor refrigeration sheet 2 and a heat conductor 3 arranged in the heat insulation box body 1. The heat insulation box body 1 and the heat conductor 3 are both rectangular bodies, and the heat insulation box body 1 is made of high-temperature-resistant heat insulation materials, such as composite silicate plates, glass fibers and the like. The heat conductor 3 adopts metal copper, and the space between the heat insulation box body 1 and the heat conductor 3 is vacuum, so that the heat transfer between the heat insulation box body and the heat conductor 3 is further reduced, and the refrigeration effect of the heat conductor 3 is favorably kept. As shown in fig. 4, the heat conductor 3 is provided with a plurality of rows of S-curved channels 4 inside. As shown in fig. 5, every two adjacent rows of channels 4 are connected in a conducting manner, and the channels 4 at the two extreme sides are respectively provided with a joint 5 penetrating through the side wall of the heat conductor 3; two of said joints 5 protrude through the side walls of the insulated box 1. Two joints 5 extend from the lower end of the heat conductor 3, and the two joints 5 are pressed between the bottom wall of the heat conductor 3 and the bottom wall of the heat insulation box 1 for hermetically fixing the heat conductor 3 in the heat insulation box 1. This prevents the heat conductor 3 from directly contacting the heat insulating box 1, thereby reducing heat transfer.
As shown in fig. 1 to fig. 3, the semiconductor chilling plates 2 are respectively embedded in four side walls and a top wall of the heat insulation box body 1, a chilling end face of each semiconductor chilling plate 2 is located inside the heat insulation box body 1 and attached to an outer surface of the heat conductor 3, and a heat generating end face of each semiconductor chilling plate 2 is located outside the heat insulation box body 1. The temperature of the heat conductor 3 is lowered by the semiconductor cooling fins 2, thereby lowering the temperature of the cooling liquid flowing through the channel 4. And in the air around the heat generated by the heat-generating end face of each semiconductor refrigerating sheet 2 is diffused, specifically, the refrigerating end face of each semiconductor refrigerating sheet 2 is provided with an aluminum radiator 6. The upper end of the aluminum radiator 6 positioned on the top wall of the heat insulation box body 1 is provided with a first fan 7, and the air exhaust end of the first fan 7 faces upwards. The upper ends of the aluminum radiators 6 on the side walls of the heat insulation box body 1 are respectively provided with a second fan 8, and the air exhaust end of the second fan 8 faces downwards. The aluminum radiator 6 on the side wall of each heat insulation box body 1 is provided with two second fans 8, and the two second fans 8 are distributed side by side. The first fan 7 blows away the heat generated by the semiconductor refrigeration sheets 2 on the top wall upwards, and the heat generated by the semiconductor refrigeration sheets 2 on the four side walls downwards, so that the air is supplied to the middle part of the heat insulation box body 1, and the air is exhausted from the upper part and the lower part. The whole heat dissipation structure is reasonable in distribution, hot air turbulence is avoided, and heat dissipation efficiency is improved. The two second fans 8 have higher heat dissipation efficiency, and the heat dissipation speed of the heat radiator 6 on the side wall is improved.
In order to further improve the refrigeration efficiency of the semiconductor refrigeration piece 2, the equipment also comprises a heat insulation ring 9; the side walls around each semiconductor refrigerating sheet 2 are fixedly connected with one heat insulation ring 9 for reducing heat convection between the refrigerating end face and the heat generating end face. Because the distance between the refrigerating end face and the heat-generating end face of the semiconductor refrigerating sheet 2 is short, the heat-insulating ring 9 is additionally arranged between the refrigerating end face and the heat-generating end face, so that the heat transfer between the refrigerating end face and the heat-generating end face can be effectively avoided, and the refrigerating efficiency of the refrigerating end face and the heat-generating end face heat dissipation efficiency are improved. The top wall and the side wall of the heat insulation box body 1 are provided with grooves 10 opposite to the corresponding heat insulation rings 9, and part of each heat insulation ring 9 extends into the corresponding groove 10. The heat insulation ring 9 is sunk into the side wall and the top wall of the heat insulation box, so that the contact between the side wall of the semiconductor refrigeration sheet 2 and the heat insulation ring 9 is enhanced, and the heat insulation effect is further improved. In addition, the bottom wall of the heat insulation box body 1 is provided with a base 11, and the base 11 is conveniently fixed on the ground.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (9)
1. A cooling device for a mold of a mobile phone case, characterized in that: comprises a heat insulation box body, a semiconductor refrigerating sheet and a heat conductor arranged in the heat insulation box body; the heat insulation box body and the heat conductor are rectangular in shape, and the heat conductor is hermetically fixed in the heat insulation box body; the semiconductor refrigeration pieces are respectively embedded in four side walls and the top wall of the heat insulation box body, the refrigeration end face of each semiconductor refrigeration piece is positioned in the heat insulation box body and is attached to the outer surface of the heat conductor, and the heat production end face of each semiconductor refrigeration piece is positioned outside the heat insulation box body;
a plurality of rows of S-shaped bent channels are arranged in the heat conductor, every two adjacent rows of channels are connected in a conduction manner, and the channels at the two extreme sides are respectively provided with a joint penetrating through the side wall of the heat conductor; the two joints penetrate through the side wall of the heat insulation box body to extend out, the temperature of the heat conductor is reduced through the semiconductor refrigerating sheet, and then the temperature of the cooling liquid flowing through the channel is reduced.
2. A cooling apparatus for a mould for a mobile phone casing as claimed in claim 1, wherein: and the refrigerating end face of each semiconductor refrigerating sheet is provided with an aluminum radiator.
3. A cooling apparatus for a mould for a mobile phone casing as claimed in claim 2, wherein: the upper end of the aluminum radiator positioned on the top wall of the heat insulation box body is provided with a first fan, and the air exhaust end of the first fan faces upwards.
4. A cooling apparatus for a mould for a mobile phone casing as claimed in claim 2, wherein: and the upper ends of the aluminum radiators positioned on the side walls of the heat insulation box bodies are respectively provided with a second fan, and the air exhaust end of each second fan faces downwards.
5. A cooling arrangement for a mould for a handset casing according to claim 4, characterised in that: the aluminum radiator on the side wall of each heat insulation box body is provided with two second fans which are distributed side by side.
6. A cooling apparatus for a mould for a mobile phone casing as claimed in claim 1, wherein: also comprises a heat insulation ring; and the peripheral side wall of each semiconductor refrigerating sheet is fixedly connected with one heat insulation ring for reducing heat convection between the refrigerating end face and the heat generating end face.
7. A cooling arrangement for a mould for a handset casing according to claim 6, characterised in that: the top wall and the side wall of the heat insulation box body are provided with grooves opposite to the corresponding heat insulation rings, and part of each heat insulation ring extends into the corresponding groove.
8. A cooling apparatus for a mould for a mobile phone casing as claimed in claim 1, wherein: the space between the heat insulation box body and the heat conductor is vacuum.
9. A cooling apparatus for a mould for a mobile phone casing as claimed in claim 1, wherein: the bottom wall of the heat insulation box body is provided with a base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020985361.7U CN212266583U (en) | 2020-06-02 | 2020-06-02 | Cooling device for mobile phone shell mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020985361.7U CN212266583U (en) | 2020-06-02 | 2020-06-02 | Cooling device for mobile phone shell mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212266583U true CN212266583U (en) | 2021-01-01 |
Family
ID=73880607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020985361.7U Expired - Fee Related CN212266583U (en) | 2020-06-02 | 2020-06-02 | Cooling device for mobile phone shell mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212266583U (en) |
-
2020
- 2020-06-02 CN CN202020985361.7U patent/CN212266583U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210101 |
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| CF01 | Termination of patent right due to non-payment of annual fee |