CN213958725U

CN213958725U - Transformer heat abstractor

Info

Publication number: CN213958725U
Application number: CN202120242973.1U
Authority: CN
Inventors: 张荣秋; 孙婷婷; 王文宗; 霍光涛
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-01-28
Filing date: 2021-01-28
Publication date: 2021-08-13
Anticipated expiration: 2031-01-28

Abstract

The utility model discloses a transformer heat abstractor relates to heat dissipation technical field, including transformer housing, baffle and sealed chamber, transformer housing's inside both sides are all fixed and are provided with the baffle, and transformer housing's inside both sides all are provided with sealed chamber, and sealed chamber separates through one of them baffle and transformer housing, and the inside packing in sealed chamber is provided with cold water. The utility model discloses a plurality of absorber plates conduct the inside heat of transformer housing to on the second heat-conducting plate, in the cold water of transmitting to sealed intracavity portion through second heat-conducting plate and first heat-conducting plate, a plurality of semiconductor cooler's cold junction is cooled down to the water of sealed intracavity portion simultaneously, thereby make the water of sealed intracavity portion can keep the temperature lower, and absorb the heat, and the semiconductor cooler passes through work, with heat conduction to the hot junction of cold junction, distribute away, whole heat dissipation in-process heat conduction is efficient, the radiating efficiency is improved, the radiating rate is fast.

Description

Transformer heat abstractor

Technical Field

The utility model relates to a heat dissipation technical field, in particular to transformer heat abstractor.

Background

The heat generated by the transformer in long-term continuous operation must be dissipated by the radiating fins connected around the transformer in time, if the temperature is too high, the function of the transformer is reduced, and even the transformer may be damaged, which causes great loss.

The inner surface and the outer surface of an oil guide pipe of the radiating fin of the existing large-scale transformer are designed in a plane mode, the contact area of the inner wall of the oil guide pipe and heat conduction oil is limited in a limited space, the efficiency of heat transfer is low, in addition, the contact area of the oil guide pipe and air is limited, the heat dissipation amount is extremely low, the heat dissipation is not facilitated, in addition, an oil chamber in the radiating fin is also of a plane structure, and the heat transfer efficiency is low.

Therefore, it is necessary to provide a heat sink for transformer to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a transformer heat abstractor to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a transformer heat dissipation device comprises a transformer shell, baffles and a sealing cavity, wherein the baffles are fixedly arranged on two sides of the interior of the transformer shell, the sealing cavity is arranged on two sides of the interior of the transformer shell and is separated from the transformer shell by one of the baffles, cold water is filled in the sealing cavity, heat insulation blocks are fixedly arranged on two sides of the transformer shell in a penetrating manner, a plurality of semiconductor refrigerators distributed in a rectangular array are fixedly arranged in the middle of each heat insulation block in a penetrating manner, cold ends of the semiconductor refrigerators are located in the sealing cavity, a plurality of first heat conduction plates distributed in the rectangular array are fixedly arranged on the baffles in a penetrating manner, a second heat conduction plate is fixedly arranged at one end, located in the transformer shell, of each first heat conduction plate, a heat absorption plate is fixedly arranged on one side of each second heat conduction plate, and a plurality of third heat conduction plates are fixedly arranged on the top end of the transformer shell in a penetrating manner, and the plurality of third heat-conducting plates are distributed in a rectangular array.

Preferably, a plurality of heat dissipation plates which are vertically arranged are fixedly arranged at the hot end of the semiconductor refrigerator, and the plurality of heat dissipation plates are distributed at equal intervals.

Preferably, the second heat-conducting plate is provided with a plurality of, and a plurality of second heat-conducting plates are equidistant distribution.

Preferably, the second heat-conducting plates are all arranged in a wave shape, and a sealing layer is arranged at the joint between the first heat-conducting plate and the baffle.

Preferably, a sealing ring is arranged at the joint between the semiconductor refrigerator and the heat insulation block, side plates are fixedly arranged at the bottom ends of the two sides of the transformer shell, and a heat radiation fan is arranged in the middle of each side plate.

Preferably, the bottom end of the transformer shell is fixedly provided with a base, and the bottom end of the base is fixedly provided with a plurality of damping bulges distributed in a rectangular array.

The utility model discloses a technological effect and advantage:

1. the utility model discloses a plurality of absorber plates conduct the heat of transformer housing inside to the second heat-conducting plate, in the cold water of transmitting to the sealed intracavity portion through second heat-conducting plate and first heat-conducting plate, the cold junction of a plurality of semiconductor refrigerators cools down the water of sealed intracavity portion simultaneously, thereby make the water of sealed intracavity portion can keep the temperature lower, and absorb the heat, and the semiconductor refrigerator distributes the heat conduction of cold junction to the hot junction through work, go out, the heat conduction efficiency is high in the whole heat dissipation process, has improved the radiating efficiency, and the radiating speed is fast;

2. the utility model discloses a setting of two curb plates and radiator fan, two radiator fan can blow the heat dissipation to a plurality of semiconductor cooler's hot junction for the radiating efficiency in semiconductor cooler hot junction prevents the overheated damage of semiconductor cooler.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic side view of the semiconductor refrigerator of the present invention.

Fig. 3 is a schematic structural diagram of a in fig. 1 according to the present invention.

In the figure: 1. a transformer housing; 2. a baffle plate; 3. sealing the cavity; 4. a heat insulation block; 5. a semiconductor refrigerator; 6. a first heat-conducting plate; 7. a second heat-conducting plate; 8. a heat absorbing plate; 9. a third heat-conducting plate; 10. a heat dissipation plate; 11. a side plate; 12. a heat radiation fan; 13. a base; 14. a sealing layer; 15. a damping projection.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a transformer heat dissipation device as shown in figures 1-3, which comprises a transformer casing 1, baffles 2 and a sealed cavity 3, wherein the baffles 2 are fixedly arranged on both sides of the interior of the transformer casing 1, the sealed cavity 3 is arranged on both sides of the interior of the transformer casing 1, and the sealed cavity 3 is separated from the transformer casing 1 by one of the baffles 2, cold water is filled in the sealed cavity 3, heat insulation blocks 4 are fixedly arranged on both sides of the transformer casing 1 in a penetrating manner, a plurality of semiconductor refrigerators 5 distributed in a rectangular array are fixedly arranged in the middle of the heat insulation blocks 4 in a penetrating manner, cold ends of the semiconductor refrigerators 5 are positioned in the sealed cavity 3, a plurality of first heat conduction plates 6 distributed in a rectangular array are fixedly arranged on the baffles 2 in a penetrating manner, and one ends of the plurality of first heat conduction plates 6 positioned in the transformer casing 1 are fixedly provided with a second heat conduction plate 7, the second heat conducting plate 7 is provided with a plurality of heat conducting plates 7 which are distributed at equal intervals, the second heat conducting plates 7 are all arranged in a wave shape, the second heat conducting plates 7 are arranged in a wave shape, the contact area can be increased, the heat absorption efficiency is improved, a heat absorbing plate 8 is fixedly arranged on one side of each second heat conducting plate 7, a plurality of third heat conducting plates 9 are fixedly arranged at the top end of the transformer shell 1 in a penetrating mode, the third heat conducting plates 9 are distributed in a rectangular array mode, heat in the transformer shell 1 is conducted to the second heat conducting plates 7 through the heat absorbing plates 8, cold water transmitted to the inside of the sealing cavity 3 through the second heat conducting plates 7 and the first heat conducting plates 6 is cooled through the cold ends of the semiconductor refrigerators 5, and therefore the water in the sealing cavity 3 can keep low in temperature and absorb heat, and semiconductor cooler 5 is through work, with the heat conduction of cold junction to the hot junction, distribute away, and heat conduction efficiency is high in the whole heat dissipation process, has improved the radiating efficiency, and the radiating rate is fast.

Further, the fixed heating panel 10 that is a plurality of vertical settings that is provided with of hot junction of semiconductor cooler 5, and a plurality of heating panel 10 are equidistant distribution, transformer housing 1's both sides bottom is all fixed and is provided with curb plate 11, the mid-mounting of curb plate 11 is provided with radiator fan 12, and through the setting of two curb plates 11 and radiator fan 12, two radiator fan 12 can be to the hot junction of a plurality of semiconductor cooler 5 heat dissipation of blowing for the radiating efficiency at semiconductor cooler 5 hot junction prevents semiconductor cooler 5 overheat damage, transformer housing 1's bottom mounting is provided with base 13, base 13's bottom mounting is provided with a plurality of protruding 15 of damping that are the distribution of rectangle array, and through the setting of a plurality of protruding 15 of damping, can increase frictional force, is favorable to improving transformer housing 1's stability.

Secondly, a sealing layer 14 is arranged at the joint between the first heat conducting plate 6 and the baffle 2, a sealing ring is arranged at the joint between the semiconductor refrigerator 5 and the heat insulation block 4, and water in the sealing cavity 3 can be prevented from flowing out through the arrangement of the sealing layer 14 and the sealing ring.

The utility model discloses the theory of operation:

when in use, the heat inside the transformer shell 1 is conducted to the second heat conducting plate 7 through the heat absorbing plates 8, the heat on the second heat conducting plate 7 is conducted to the first heat conducting plate 6, because the water temperature inside the sealed cavity 3 is lower, the heat on the first heat conducting plate 6 can be absorbed by the cold water inside the sealed cavity 3, meanwhile, the heat inside the transformer shell 1 is radiated outwards through the heat conducting of the third heat conducting plates 9, and the semiconductor refrigerators 5 work, when the semiconductor refrigerators 5 work, the heat at the cold end is conducted to the hot end, the heat is radiated outwards through the heat radiating plates 10, the cold end absorbs the heat in the water inside the sealed cavity 3, thereby keeping the water temperature inside the sealed cavity 3 lower, continuously absorbing the heat of the first heat conducting plates 6, the heat conduction efficiency in the whole heat radiating process is high, and the heat radiating efficiency is improved, the heat dissipation speed is fast, and meanwhile, the two heat dissipation fans 12 work to blow and dissipate heat of the hot ends of the plurality of semiconductor refrigerators 5.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a transformer heat abstractor which characterized in that: including transformer housing (1), baffle (2) and sealed chamber (3), the inside both sides of transformer housing (1) are all fixed and are provided with baffle (2), the inside both sides of transformer housing (1) all are provided with sealed chamber (3), and sealed chamber (3) separate through one of them baffle (2) and transformer housing (1), the inside packing of sealed chamber (3) is provided with cold water, the both sides of transformer housing (1) are all fixed to run through and are provided with thermoblock (4), the fixed semiconductor refrigeration ware (5) that are the distribution of rectangular array that run through in middle part of thermoblock (4), and the cold junction of semiconductor refrigeration ware (5) is located inside sealed chamber (3), fixed run through on baffle (2) and be provided with a plurality of first heat-conducting plates (6) that are the distribution of rectangular array, and a plurality of first heat-conducting plates (6) are located the fixed second heat-conducting plate (7) that is provided with of the one end of transformer housing (1) inside The heat absorption plate (8) is fixedly arranged on one side of the second heat conduction plate (7), a plurality of third heat conduction plates (9) are fixedly arranged on the top end of the transformer shell (1) in a penetrating mode, and the third heat conduction plates (9) are distributed in a rectangular array mode.

2. The heat dissipating device for a transformer as claimed in claim 1, wherein: the heat end of the semiconductor refrigerator (5) is fixedly provided with a plurality of vertically arranged heat dissipation plates (10), and the heat dissipation plates (10) are distributed at equal intervals.

3. The heat dissipating device for a transformer according to claim 2, wherein: the second heat-conducting plate (7) is provided with a plurality of, and a plurality of second heat-conducting plates (7) are the equidistant distribution.

4. The heat dissipating device of a transformer as claimed in claim 3, wherein: the second heat-conducting plates (7) are all arranged in a wave shape, and sealing layers (14) are arranged at the connecting positions between the first heat-conducting plates (6) and the baffle plates (2).

5. The heat dissipating device for a transformer according to claim 4, wherein: the transformer is characterized in that a sealing ring is arranged at the joint between the semiconductor refrigerator (5) and the heat insulation block (4), side plates (11) are fixedly arranged at the bottom ends of the two sides of the transformer shell (1), and a heat radiation fan (12) is arranged in the middle of each side plate (11).

6. The heat dissipating device for a transformer according to claim 5, wherein: the bottom mounting of transformer casing (1) is provided with base (13), the bottom mounting of base (13) is provided with a plurality of damping arch (15) that are the distribution of rectangle array.