TWM593723U - Vapor chamber - Google Patents
Vapor chamber Download PDFInfo
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- TWM593723U TWM593723U TW108215530U TW108215530U TWM593723U TW M593723 U TWM593723 U TW M593723U TW 108215530 U TW108215530 U TW 108215530U TW 108215530 U TW108215530 U TW 108215530U TW M593723 U TWM593723 U TW M593723U
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Abstract
本新型係關於一種均溫板,其中均溫板包括殼體、毛細結構、至少二注液除氣管及工作流體,殼體包括下殼板及對應下殼板密接封合的上殼板,在上殼板和下殼板之間形成有單腔室;毛細結構佈設在單腔室內;各注液除氣管分別穿接殼體並且連通單腔室;工作流體設置在單腔室中。藉此,使工作流體能夠被均勻且廣泛的佈設在單腔室中。The present invention relates to a temperature equalizing plate, wherein the temperature equalizing plate includes a shell, a capillary structure, at least two liquid injection degassing pipes and a working fluid, the shell includes a lower shell plate and an upper shell plate corresponding to the lower shell plate, which are tightly sealed. A single chamber is formed between the upper shell plate and the lower shell plate; the capillary structure is arranged in the single chamber; each liquid injection degassing pipe penetrates the casing and communicates with the single chamber; the working fluid is set in the single chamber. Thereby, the working fluid can be uniformly and widely distributed in the single chamber.
Description
本新型係有關一種散熱技術,尤指一種均溫板。The new type is related to a heat dissipation technology, especially a temperature equalizing plate.
隨著電子元件的運算速度不斷提昇,其所產生的熱量亦越來越高,為了有效地解決高發熱量的問題,業界已將具有良好導熱特性的均溫板(Vapor Chamber)進行廣泛性的使用,但是現有的均溫板不論是導熱效能、製作成本和製作容易度等皆存在有改善的空間。As the computing speed of electronic components continues to increase, the heat generated by them is getting higher and higher. In order to effectively solve the problem of high heat generation, the industry has widely used the Vapor Chamber with good thermal conductivity characteristics (Vapor Chamber) However, there is room for improvement in the existing temperature-equalizing plates in terms of thermal conductivity, manufacturing cost and ease of manufacturing.
習知的均溫板,主要包括一上殼體和一下殼體,並在上殼體和下殼體的內部空間分別裝設有一毛細組織,其後再將上殼體和下殼體對應焊合,再將工作流體填入上殼體和下殼體內部,最後施以除氣封口等製程而完成。The conventional temperature equalizing plate mainly includes an upper shell and a lower shell, and a capillary structure is respectively installed in the inner space of the upper shell and the lower shell, and then the upper shell and the lower shell are welded correspondingly Then, the working fluid is filled into the upper shell and the lower shell, and finally the process of degassing and sealing is applied.
隨著電子裝置之熱源的形式不斷的推陳出新,應用於前述熱源之均溫板的形狀亦隨之產生改變,且工作流體的多寡亦會影響到其在進行汽、液變化的有限空間,即過多的工作流體將使汽化的空間被大幅度地縮小,過少的工作流體又將使內部產生空燒等不良狀況,因此對於現行大接觸表面積或特定形狀之均溫板,常會發生所填注的工作流體,無法均勻且廣泛的分佈於各殼體之內部空間,進而導致其導熱和散熱效果不彰等情形。As the form of the heat source of electronic devices continues to evolve, the shape of the temperature equalization plate applied to the aforementioned heat source also changes, and the amount of working fluid will also affect its limited space for vapor and liquid changes, that is, too much The working fluid will cause the vaporized space to be greatly reduced, and too little working fluid will cause internal combustion and other undesirable conditions. Therefore, for the current large contact surface area or the uniform temperature plate of a specific shape, the filled work will often occur The fluid cannot be evenly and widely distributed in the internal space of each shell, which leads to the situation of inefficient heat conduction and heat dissipation.
有鑑於此,本新型創作人遂針對上述現有技術的缺失,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本新型創作人改良之目標。In view of this, the creator of this new type of research focused on the lack of the above-mentioned existing technologies, and dedicatedly studied and cooperated with the application of academic principles to try to solve the above problems, which became the goal of improvement of this new type of creative.
本新型之一目的,在於提供一種均溫板,其係透過各注液除氣管的設置,從而使工作流體能夠被均勻且廣泛的佈設在單腔室中。An object of the present invention is to provide a temperature-equalizing plate, which is provided through each liquid injection and degassing tube, so that the working fluid can be uniformly and widely distributed in a single chamber.
為了達成上述之目的,本新型係提供一種均溫板,包括一殼體、一毛細結構、至少二注液除氣管及一工作流體,該殼體包括一下殼板及對應該下殼板密接封合的一上殼板,在該上殼板和該下殼板之間形成有一單腔室;該毛細結構佈設在該單腔室內;各該注液除氣管分別穿接該殼體並且連通該單腔室;該工作流體設置在該單腔室中。In order to achieve the above objective, the present invention provides a temperature-equalizing plate, which includes a shell, a capillary structure, at least two liquid injection degassing pipes, and a working fluid. The shell includes a lower shell plate and a sealing seal corresponding to the lower shell plate A combined upper shell plate, a single chamber is formed between the upper shell plate and the lower shell plate; the capillary structure is disposed in the single chamber; each of the liquid injection and degassing pipes respectively penetrates the shell and communicates with the Single chamber; the working fluid is arranged in the single chamber.
本新型還具有以下功效,藉由工作流體的均勻的佈設,進而能夠提昇均溫板的導熱和散熱效能,且能夠有效地防止內部的空燒等不良情況。透過各注液除氣管的平均設置,使工作流體的填注更為簡單,進而讓製作過程變得容易。The present invention also has the following effects. By evenly distributing the working fluid, the heat conduction and heat dissipation performance of the temperature equalizing plate can be improved, and the internal empty burning and other undesirable conditions can be effectively prevented. Through the average setting of the liquid injection and degassing tubes, the filling of the working fluid is simpler, which makes the manufacturing process easier.
有關本新型之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本新型加以限制者。The detailed description and technical content of the present invention are explained as follows in conjunction with the drawings. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention.
請參閱圖1和圖2所示,本新型提供一種均溫板,其主要包括一殼體10、一毛細結構20、至少二注液除氣管30及一工作流體40。Please refer to FIG. 1 and FIG. 2, the present invention provides a temperature equalizing plate, which mainly includes a
本實施例的殼體10大致呈一矩形狀,其主要包括一下殼板11及一上殼板12,下殼板11可為鋁、銅或其合金等導熱性良好的材料所製成,本實施例的下殼板11主要包括一底板111、一圍板112及一折緣板113,圍板112為從底板111的周緣彎折形成,折緣板113則是從圍板112的邊緣朝外彎折成型,在折緣板113間隔設置有二凹槽114。The
上殼板12亦可為鋁、銅或其合金等導熱性良好的材料所製成,其是對應於下殼板11密接並透過焊接方式予以封合,並在上殼板12和下殼板11的內部圍設有一單腔室A,另在上殼板12對應於前述各凹槽114位置分別沖設有一凹陷槽121。The
毛細結構20是佈設在下殼板11和上殼板12的內表面上並形成在前述單腔室A內,其可為一編織網、一金屬粉末燒結物或纖維束等具有毛細吸附力的物件。The
每一注液除氣管30是對應於前述的凹槽114和凹陷槽121穿接在殼體10的側邊,並且連通前述單腔室A,本實施例的各注液除氣管30是分別位在殼體10之同一側邊且等間隔配置。Each liquid injection and
工作流體40可為一純水,其是透過各注液除氣管30填入前述單腔室A中。The working
請參閱圖3所示,本實施例的殼體10A亦大致呈一矩形狀,其與上述實施例的差異在於,各注液除氣管30是分別位在殼體10A之二相互對邊且錯位配置。As shown in FIG. 3, the
請參閱圖4所示,本實施例的殼體10B為一U形,注液除氣管30的數量為三,其中的二注液除氣管30分別位在殼體10B之開口側的中間位置,另一注液除氣管30則位在殼體10B之封閉側的中間位置。Referring to FIG. 4, the
請參閱圖5所示,本實施例的殼體10C主要包括一第一矩形體101C、一第二矩形體102C和一第三矩形體103C所組成,其中第三矩形體103C、第二矩形體102C和第一矩形體101C是以錯位排列方式而形成一階梯狀,其中的一注液除氣管30是位在第一矩形體101C的一側邊上,另一注液除氣管30則是位在第三矩形體103C的一側邊上。Please refer to FIG. 5, the
請參閱圖6所示,本新型之均溫板製作方法,其方法步驟包括:Please refer to FIG. 6, the manufacturing method of the new type uniform temperature plate, the method steps include:
a)提供一殼體10,該殼體10具有一單腔室A及至少二注液除氣管30;a) Provide a
b)將一工作流體40從各該注液除氣管30分別填入該單腔室A中;進一步說明,工作流體40的填注方式,可以採用對其中的一注液除氣管30先進行注液,另一注液除氣管30則做為排氣,如此可將單腔室A內部的氣體輕易排出。亦可選用對二注液除氣管30同時填注工作流體40的方式來為之。b) Fill a working
c)對該殼體10施以一加熱製程而將該單腔室A內的氣體從各該注液除氣管30排出;進一步說明,可以採用對其中的一注液除氣管30做堵塞,進而以另一注液除氣管30做排氣,其後對殼體10靠近被堵塞的注液除氣管30的區域加熱,從而對前述被堵塞的注液除氣管30做排氣。亦可選用對二注液除氣管30同時做排氣方式來為之。c) Apply a heating process to the
d)對經步驟c)的各該注液除氣管30施以一封口加工。進一步說明,在完成前述除氣製程後,即可對各注液除氣管30施以一焊接封口的加工。d) Apply a seal to each of the liquid injection and degassing
綜上所述,本新型之均溫板及其製作方法,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障新型創作人之權利。In summary, this new type of temperature equalization board and its manufacturing method can indeed achieve the intended use, and solve the lack of knowledge, and because of its novelty and progress, it fully meets the requirements of the new patent application. Laws apply, please check and grant the patent in this case to protect the rights of new creators.
10、10A、10B、10C:殼體10, 10A, 10B, 10C: shell
11:下殼板11: Lower shell plate
111:底板111: bottom plate
112:圍板112: hoarding
113:折緣板113: Folded edge plate
114:凹槽114: groove
12:上殼板12: Upper shell plate
121:凹陷槽121: recessed groove
A:單腔室A: Single chamber
101C:第一矩形體101C: The first rectangular body
102C:第二矩形體102C: Second rectangular body
103C:第三矩形體103C: Third rectangular body
20:毛細結構20: Capillary structure
30:注液除氣管30: Liquid injection degassing tube
40:工作流體40: Working fluid
圖1係本新型均溫板之第一實施例分解圖。Fig. 1 is an exploded view of the first embodiment of the new temperature equalizing plate.
圖2係本新型均溫板之第一實施例組合俯視圖。FIG. 2 is a top plan view of the first embodiment of the new temperature equalizing plate.
圖3係本新型均溫板之第二實施例組合俯視圖。Fig. 3 is a plan view of the second embodiment of the new temperature equalizing plate in combination.
圖4係本新型均溫板之第三實施例組合俯視圖。FIG. 4 is a plan view of the third embodiment of the new temperature equalizing plate in combination.
圖5係本新型均溫板之第四實施例組合俯視圖。FIG. 5 is a plan view of the fourth embodiment of the new temperature equalizing board.
圖6係本新型均溫板製作方法流程圖。Fig. 6 is a flow chart of the manufacturing method of the new temperature equalizing board.
10:殼體 10: Shell
20:毛細結構 20: Capillary structure
30:注液除氣管 30: Liquid injection degassing tube
40:工作流體 40: Working fluid
Claims (5)
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TW108215530U TWM593723U (en) | 2019-11-22 | 2019-11-22 | Vapor chamber |
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TW108215530U TWM593723U (en) | 2019-11-22 | 2019-11-22 | Vapor chamber |
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TWM593723U true TWM593723U (en) | 2020-04-11 |
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TW108215530U TWM593723U (en) | 2019-11-22 | 2019-11-22 | Vapor chamber |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI749763B (en) * | 2020-09-11 | 2021-12-11 | 建準電機工業股份有限公司 | Vapor chamber and electronic device including the same |
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2019
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI749763B (en) * | 2020-09-11 | 2021-12-11 | 建準電機工業股份有限公司 | Vapor chamber and electronic device including the same |
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