TW201940828A - Vapor chamber - Google Patents

Abstract

The present disclosure relates to a vapor chamber. The vapor chamber includes a lower shell plate and an upper shell plate. The lower shell plate has an inner bottom wall. The inner bottom wall extends with a first peripheral wall and has multiple first protrusions. The first peripheral wall has a first top surface, each first protrusion has a first end surface, and the first top surface and the first end surfaces are arranged on the same plane. The upper shell plate covers on and seal the lower shell plate. The upper shell plate has an inner top wall, the inner top wall extends with a second peripheral wall and has a plurality of second protrusions, the second peripheral wall has a second top surface, and each second protrusion has a second end surface. The second top surface and the second end surfaces are arranged on the same plane. The first top surface is connected with the second top surface. Each first end surface and each second end surface abut against each other, and structural strength of the vapor chamber is thereby reinforced.

Description

Uniform temperature plate structure

The present invention relates to a heat dissipation device, and in particular, to a temperature equalizing plate structure.

The function and working principle of the Vapor Chamber is the same as that of the heat pipe. It mainly uses the working fluid enclosed in the plate-shaped cavity to perform evaporation and condensation cycles, so that the heat of the heating element can be quickly and uniformly used by the temperature equalizing board. Absorption, so that the temperature equalizing plate has the function of rapid heat conduction and heat diffusion.

However, with the pursuit of lightness, thinness, and shortness of modern electronic products, the volume of the temperature equalizing plate is also required to become thinner and thinner, but the smaller the volume of the temperature equalizing plate, the lower the structural strength. Therefore, how to strengthen the structural strength of the temperature equalization board is one of the focuses of the research and development of the industry.

In view of this, the present inventors have devoted themselves to the above-mentioned prior art, researched intensively and cooperated with the application of theories to try their best to solve the above problems, which has become the goal of the inventors' development.

The invention provides a temperature equalizing plate structure, which uses a joint surface of a first outer peripheral wall and a second outer peripheral wall and abutment surfaces of each first protruding pillar and each second protruding pillar to be on the same plane, so that the temperature equalizing plate The structural assembly's stress or thermal expansion and contraction deformation are evenly distributed on the same plane, thereby strengthening the structural strength of the isothermal plate structure.

In an embodiment of the present invention, the present invention provides a temperature-equalizing plate structure including a lower shell plate having an inner bottom wall, the inner bottom wall extending with a first outer peripheral wall and a plurality of first protruding columns, the first The outer peripheral wall has a first top surface, and each of the first protruding posts has a first end surface, and the first top surface and each of the first end surfaces are located on the same plane; and an upper shell plate, which is sealed by the sealing cover. A lower shell plate, the upper shell plate having an inner top wall, the inner top wall extending with a second outer peripheral wall and a plurality of second protruding columns, the second outer peripheral wall having a second top surface, each of the second protrusions The post has a second end surface, the second top surface and each of the second end surfaces are located on the same plane, the first top surface and the second top surface are joined to each other, each of the first end surfaces and each of the second end surfaces are mutually Abut.

Based on the above, the height of the first outer peripheral wall and the height of each first protruding pillar are smaller than the height of the second outer peripheral wall and the height of each second protruding pillar, that is, the space inside the upper shell plate is larger than the space inside the lower shell plate. The space inside the shell plate is the condensation space of the working fluid, so as to increase the condensation efficiency of the temperature equalizing plate structure.

The detailed description and technical content of the present invention will be described below in conjunction with the drawings, but the drawings are for illustrative purposes only, and are not intended to limit the present invention.

Please refer to FIG. 1 to FIG. 3. The present invention provides a temperature equalizing plate structure. The temperature equalizing plate structure 10 mainly includes a lower shell plate 1 and an upper shell plate 2.

The lower shell plate 1 has an inner bottom wall 11, a first outer peripheral wall 12 extending from the inner bottom wall 11, and a plurality of first protruding posts 13, the first outer peripheral wall 12 has a first top surface 121, each of the first protruding posts 13 has a first end surface 131, and the first top surface 121 and each first end surface 131 are located on the same plane. Among them, the plurality of first protruding pillars 13 are integrally extended upward from the inner bottom wall 11. The plurality of first protruding pillars 13 and the inner bottom wall 11 are formed by etching to reduce the influence of the interface thermal group. The height h1 of the first outer peripheral wall 12 and The height h2 of each of the first protruding posts 13 is equal.

The upper shell plate 2 is sealingly covered on the lower shell plate 1. The upper shell plate 2 has an inner top wall 21, which extends a second outer peripheral wall 22 and has a plurality of second protruding posts 23. The second outer peripheral wall 22 has A second top surface 221, each second protruding post 23 has a second end surface 231, the second top 221 and each second end surface 231 are located on the same plane, and the first top surface 121 and the second top surface 221 are welded The first and second ends 131 and 231 are in contact with each other. Wherein, each of the first protruding pillars 13 and each of the second protruding pillars 23 is a circular pillar, but it is not limited thereto.

The detailed description is as follows. The plurality of second protruding pillars 23 are integrally formed from the inner top wall 21 downward. The plurality of second protruding pillars 23 and the inner top wall 21 are formed by etching to reduce the influence of the interface thermal group. The height h3 is equal to the height h4 of each of the second protruding posts 23, and the height h1 of the first peripheral wall 12 and the height h2 of each of the first protruding posts 13 are equal to the height h3 of the second peripheral wall 22 and the height of each of the second protruding posts 23 h4.

The isothermal plate structure 10 of the present invention further includes a capillary structure 3 and a working fluid. The capillary structure 3 covers the inner bottom wall 11, the inner side of the first outer peripheral wall 12, the plurality of first protruding posts 13, the inner top wall 21, the first The capillary structure 3 is filled with the working fluid on the inner side of the two outer peripheral walls 22 and on the plurality of second protruding posts 23. The capillary structure 3 is composed of one or more kinds of sintered powder bodies, metal meshes, fibrous bodies, and grooves.

The isothermal plate structure 10 of the present invention further includes a solder 5. The lower shell plate 1 and the upper shell plate 2 have a cavity s inside, and the first outer peripheral wall 12 and the second outer peripheral wall 22 are provided with a division of the communication cavity s. The air holes 4 and the solder 5 are filled and closed in the degassing holes 4, so that the cavity s forms a closed space.

As shown in FIG. 1 to FIG. 3, the use state of the isothermal plate structure 10 of the present invention is that the inner bottom wall 11 of the lower shell plate 1 has a plurality of first protruding columns 13, and the inner top wall 21 of the lower shell plate 2 has The plurality of second protruding columns 23, the plurality of first protruding columns 13 and the plurality of second protruding columns 23 are supported between the lower shell plate 1 and the lower shell plate 2 to prevent the lower shell plate 1 and the lower shell plate 2 from being depressed or deformed, and The first top surface 121 of the first outer peripheral wall 12 and the first end surface 131 of each first protruding post 13 are located on the same plane, and the second top 221 of the second outer peripheral wall 22 and the second end surface of each second protruding post 23. 231 are on the same plane, that is, the joint surface of the first outer peripheral wall 12 and the second outer peripheral wall 22 and the abutment surface of each first protruding pillar 13 and each second protruding pillar 23 are on the same plane, so that the temperature equalizing plate The stress of assembly of structure 10 or the deformation of thermal expansion and contraction are evenly distributed on the same plane, thereby strengthening the structural strength of the isothermal plate structure 10.

Please refer to FIG. 4, which is a second embodiment of the isothermal plate structure 10 of the present invention. The second embodiment is substantially the same as the first embodiment. The second embodiment differs from the first embodiment in the upper shell plate 2 The space inside is larger than the space inside the lower shell plate 1.

Further explanation is as follows, the height h1 of the first outer peripheral wall 12 is equal to the height h2 of each first protruding post 13, the height h3 of the second outer peripheral wall 22 is equal to the height h4 of each second protruding post 23, but the first outer peripheral wall 12 The height h1 and the height h2 of each first protruding pillar 13 are smaller than the height h3 of the second outer peripheral wall 22 and the height h4 of each second protruding pillar 23, that is, the space inside the upper shell plate 2 is larger than the space inside the lower shell plate 1. Therefore, since the space inside the upper shell plate 2 is the condensation space of the working fluid, when the space inside the upper shell plate 2 is larger than the space inside the lower shell plate 1, the condensation efficiency of the temperature equalizing plate structure 10 can be increased.

Similarly, the height h1 of the first outer peripheral wall 12 and the height h2 of each first protruding post 13 are greater than the height h3 of the second outer peripheral wall 22 and the height h4 of each second protruding post 23, that is, the space inside the lower shell plate 1 is greater than The space inside the upper shell plate 2 is because the space inside the lower shell plate 1 is a heat-absorbing space for the working fluid. Therefore, when the space inside the lower shell plate 1 is larger than the space inside the upper shell plate 2, an increase in the temperature equalizing plate structure 10 can be achieved. Endothermic efficiency.

Please refer to FIG. 5, which is a third embodiment of the isothermal plate structure 10 of the present invention. The third embodiment is substantially the same as the first embodiment. The third embodiment differs from the first embodiment in the first protruding post. 13 and the second protruding post 23 are formed differently.

The detailed description is as follows. The plurality of first protruding posts 13 in this embodiment are fixed to the inner bottom wall 11 by welding, and the plurality of second protruding posts 23 are fixed to the inner top wall 21 by welding. Thereby, the plurality of first protruding pillars 13 and the plurality of second protruding pillars 23 are supported between the lower shell plate 1 and the lower shell plate 2 to prevent the lower shell plate 1 and the lower shell plate 2 from being depressed or deformed, so as to be the same as the first Functions and effects of an embodiment.

Please refer to FIGS. 6 to 7, which are the fourth to sixth embodiments of the isothermal plate structure 10 of the present invention. The fourth to sixth embodiments are substantially the same as the first embodiment, and the fourth to sixth embodiments are the same as the first embodiment. The example differs in that the shapes of the first protruding post 13 and the second protruding post 23 are different.

As shown in FIG. 6, each of the first protruding columns 13 and each of the second protruding columns 23 are wing-shaped columns; as shown in FIG. 7, each of the first protruding columns 13 and each of the second protruding columns 23 are respectively An elliptical column; as shown in FIG. 8, the outer peripheral edges of each of the first protruding columns 13 and each of the second protruding columns 23 respectively have a plurality of wavy side walls 6. Therefore, each of the first protruding pillars 13 and each of the second protruding pillars 23 may be a circular cylinder, an elliptical cylinder, a wing-shaped cylinder, or a polygonal cylinder, and the like. Four to six embodiments are limiting.

Wherein, as shown in FIGS. 1 and 7, when each of the first protruding columns 13 and each of the second protruding columns 23 is a circular column or an elliptical column, the outer periphery of the circular column or the elliptical column does not have any angular ends. Therefore, the flow resistance inside the chamber s is reduced, so that the working fluid can flow more smoothly inside the chamber s, so as to improve the heat dissipation efficiency of the isothermal plate structure 10.

In addition, as shown in FIG. 8, when the outer peripheral edges of each of the first protruding pillars 13 and each of the second protruding pillars 23 have wave-shaped side walls 6, the wave-shaped wave-shaped side walls 6 have a flow guiding effect, allowing working fluid to flow. It can flow more smoothly inside the chamber s and accelerate the heat exchange efficiency.

In summary, the temperature equalizing plate structure of the present invention has not been seen in similar products and publicly used, and has industrial applicability, novelty, and progress, which fully meets the patent application requirements, and applies in accordance with the patent law. Investigate and grant the patent in this case to protect the rights of the inventor.

10‧‧‧ Uniform temperature plate structure

1‧‧‧ lower shell plate

11‧‧‧ inner bottom wall

12‧‧‧ the first peripheral wall

121‧‧‧ the first top surface

13‧‧‧ the first protruding column

131‧‧‧first end face

2‧‧‧ Upper shell plate

21‧‧‧Inner top wall

22‧‧‧ Second peripheral wall

221‧‧‧Second top surface

23‧‧‧Second protruding column

231‧‧‧Second end face

3‧‧‧ Capillary structure

4‧‧‧ deaeration hole

5‧‧‧solder

6‧‧‧ wavy sidewall

h1, h2, h3, h4‧‧‧ height

s‧‧‧ chamber

FIG. 1 is an exploded perspective view of the first embodiment of the temperature-equalizing plate structure of the present invention.

FIG. 2 is a perspective assembled view of the first embodiment of the temperature-equalizing plate structure of the present invention.

FIG. 3 is a schematic cross-sectional view of a first embodiment of a temperature equalizing plate structure of the present invention.

FIG. 4 is a schematic cross-sectional view of a second embodiment of the isothermal plate structure of the present invention.

FIG. 5 is a schematic cross-sectional view of a third embodiment of the isothermal plate structure of the present invention.

FIG. 6 is a schematic perspective view of a fourth embodiment of the temperature equalizing plate structure of the present invention.

FIG. 7 is a schematic perspective view of a fifth embodiment of a temperature equalizing plate structure of the present invention.

FIG. 8 is a schematic top view of a sixth embodiment of the temperature-equalizing plate structure of the present invention.

Claims (10)

A temperature-equalizing plate structure includes: a lower shell plate having an inner bottom wall, the inner bottom wall extending with a first outer peripheral wall and a plurality of first protruding columns, the first outer peripheral wall having a first top surface, each The first protruding pillar has a first end surface, and the first top surface is located on the same plane as each of the first end surfaces; and an upper shell plate is sealed to the lower shell plate, and the upper shell plate has an inner surface. A top wall, the inner top wall extending with a second outer peripheral wall and a plurality of second protruding columns, the second outer peripheral wall having a second top surface, each of the second protruding columns having a second end surface, the second top The surface is on the same plane as each of the second end surfaces, the first top surface and the second top surface are engaged with each other, and each of the first end surfaces and each of the second end surfaces are in contact with each other. The isothermal plate structure according to claim 1, wherein the height of the first peripheral wall is equal to the height of each of the first protruding columns, and the height of the second peripheral wall is equal to the height of each of the second protruding columns, the The height of the first peripheral wall and the height of each of the first protruding posts are equal to the height of the second peripheral wall and the height of each of the second protruding posts. The isothermal plate structure according to claim 1, wherein the height of the first peripheral wall is equal to the height of each of the first protruding columns, and the height of the second peripheral wall is equal to the height of each of the second protruding columns, the The height of the first peripheral wall and the height of each of the first protruding posts are smaller than the height of the second peripheral wall and the height of each of the second protruding posts. The isothermal plate structure according to claim 1, wherein the height of the first peripheral wall is equal to the height of each of the first protruding columns, and the height of the second peripheral wall is equal to the height of each of the second protruding columns, the The height of the first peripheral wall and the height of each of the first protruding posts are greater than the height of the second peripheral wall and the height of each of the second protruding posts. The temperature-equalizing plate structure according to 3 or 4, wherein the plurality of first protruding columns are integrally formed from the inner bottom wall upwardly, and the plurality of second protruding columns are integrally formed from the inner top wall downwardly. The isothermal plate structure according to claim 5, wherein the plurality of first protruding pillars and the inner bottom wall are formed by etching processing, and the plurality of second protruding pillars and the inner top wall are formed by etching processing. The temperature-equalizing plate structure according to 3 or 4, wherein each of the first protruding pillars and each of the second protruding pillars are a circular pillar, an elliptical pillar, a wing-shaped pillar, or a polygonal pillar. The temperature-equalizing plate structure according to 3 or 4, wherein the outer peripheral edges of each of the first protruding pillars and each of the second protruding pillars respectively have a plurality of wavy side walls. The isothermal plate structure according to 3 or 4, further comprising a capillary structure and a working fluid, the capillary structure covering the inner bottom wall, the inner side of the first outer peripheral wall, the plurality of first protruding columns, and the inner top The capillary structure is filled with the working fluid on the wall, the inner side of the second outer peripheral wall, and the plurality of second protruding posts. The temperature-equalizing plate structure according to 3 or 4, further comprising a solder, the lower shell plate and the upper shell plate have a cavity inside, and the first outer peripheral wall and the second outer peripheral wall are provided together to communicate with the cavity. A degassing hole, the solder is filled and closed in the degassing hole.