CN107403775A - A kind of microchannel heat sink and electronic equipment - Google Patents
A kind of microchannel heat sink and electronic equipment Download PDFInfo
- Publication number
- CN107403775A CN107403775A CN201710606766.8A CN201710606766A CN107403775A CN 107403775 A CN107403775 A CN 107403775A CN 201710606766 A CN201710606766 A CN 201710606766A CN 107403775 A CN107403775 A CN 107403775A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- heat sink
- housing
- microchannel heat
- cooling medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of microchannel heat sink and electronic equipment.Heat abstractor includes housing, cover plate and multiple radiation tooths；There is the inner chamber of upper end open in the housing, the cover plate lid is located at the housing upper end, to close the opening, the housing both sides are respectively arranged with the cooling medium inlet connected with the inner chamber and cooling medium outlet, the cover plate lower end is provided with multiple radiation tooths, multiple radiation tooth rectangular array arrangements, the heteropleural Edge Distance of two adjacent radiation tooths in the horizontal is 0.2 to 1 times of heteropleural Edge Distance in the vertical.Microchannel heat sink provided by the invention can improve the radiating effect to high hot-fluid electronic device, improve the Performance And Reliability of electronic equipment.
Description
Technical field
The present invention relates to technical field of integrated circuits, more particularly to a kind of microchannel heat sink and electronic equipment.
Background technology
The fast development of integrated circuit, sharply increase the heat flow density of electronic device, the conventional air-cooled and cold radiating of liquid
Limited in one's ability, microchannel heat dissipation technology is arisen at the historic moment.The characteristics of microchannel heat sink is：The space width that radiates is small, between cog flowing
Boundary layer is thin, and the heat exchange area of unit volume is big.The radiation tooth of conventional microchannel heat sink is mostly strip rectangular teeth, cooling
Medium flows in the fluid passage between two adjacent strip rectangular teeths, and radiation tooth design is simpler.But working
When, because between cog boundary layer is fully developed, cooling medium stream dynamic stability, the radiating effect of heat abstractor back segment is undesirable.
The content of the invention
In order to improve the radiating effect to high hot-fluid electronic device, the Performance And Reliability of electronic equipment is improved, the present invention
A kind of microchannel heat sink and electronic equipment are provided.
On the one hand, the present invention provides a kind of microchannel heat sink, including housing, cover plate and multiple radiation tooths；The shell
There is the inner chamber of upper end open in vivo, the cover plate lid is located at the housing upper end, to close the opening, the housing both sides
The cooling medium inlet connected with the inner chamber and cooling medium outlet are respectively arranged with, the cover plate lower end is provided with multiple institutes
State radiation tooth, multiple radiation tooth rectangular array arrangements, the heteropleural edge of two adjacent radiation tooths in the horizontal
Distance is 0.2 to 1 times of heteropleural Edge Distance in the vertical.
The beneficial effects of the invention are as follows：The present invention sets multiple radiation tooths inside microchannel heat sink, and two adjacent
Radiation tooth in the vertical at intervals of main fluid passageway, in the horizontal at intervals of auxiliary fluid passage, cooling medium is from entering
During the outlet of mouth flow direction, mainly flowed in main fluid passageway, Secondary Flow, Secondary Flow will be constantly produced under pressure-driven
Mainly it will be flowed in auxiliary fluid passage, because auxiliary fluid channel width and main fluid passageway width have certain proportion relation,
Between cog boundary layer will be made to develop again, more heats can be taken away, make radiating effect be improved significantly.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the radiation tooth is the quadrangular that cross section is rhombus, and the scope of an interior angle of the rhombus is 30 °
To 70 °.
It is using the above-mentioned further beneficial effect of scheme：Radiation tooth is arranged to rhombus column structure, and the one of rhombus
Individual interior angle is arranged in certain limit, i.e., the angle of auxiliary fluid passage and main fluid passageway is arranged into 30 ° to 70 °, will make to dissipate
Thermal effect is more preferable, and after tested, radiating effect can improve 20% or so.
Further, the housing is fixedly connected with the cover plate by vacuum brazing.
It is using the above-mentioned further beneficial effect of scheme：Fixed connection structure makes construction for heat radiating device more stable, right
The electronic device for needing to radiate influences smaller.
Further, the material of the housing, the cover plate and the radiation tooth is copper or aluminium.
It is using the above-mentioned further beneficial effect of scheme：Copper and aluminium are respectively provided with excellent radiating efficiency and the capacity of heat transmission,
Can be heat abstractor radiating effect it is more preferable.
Further, cooling medium flows into the inner chamber from the cooling medium inlet, exports and flows out from the cooling medium
The inner chamber, the cooling medium are coolant or cooling air.
It is using the above-mentioned further beneficial effect of scheme：The cooling medium of flowing, which will be taken away by heat exchange in inner chamber, to be dissipated
Heat on hot tooth, according to being actually needed different cooling mediums can be selected to be radiated.
On the other hand, the present invention also provides a kind of electronic equipment, including at least one electronic device and above-mentioned microchannel dissipate
Thermal, the electronic device are welded in the cover plate upper end.
The beneficial effects of the invention are as follows：Electronic device is welded in the cover plate upper end of above-mentioned microchannel heat sink, not only
It is fixedly secured electronic device, moreover it is possible to effectively to reduce thermal contact resistance, improve the Performance And Reliability of electronic equipment.
Brief description of the drawings
Fig. 1 is a kind of dimensional structure diagram of microchannel heat sink provided in an embodiment of the present invention；
Fig. 2 is a kind of dimensional structure diagram of the housing of microchannel heat sink provided in an embodiment of the present invention；
Fig. 3 is the stereochemical structure signal of the radiation tooth and cover plate of a kind of microchannel heat sink provided in an embodiment of the present invention
Figure；
Fig. 4 is the planar structure signal of the radiation tooth and cover plate of a kind of microchannel heat sink provided in an embodiment of the present invention
Figure.
In accompanying drawing, the list of parts representated by each label is as follows：
1st, cooling medium inlet, 2, cooling medium outlet, 3, housing, 4, cover plate, 5, radiation tooth.
Embodiment
The principle and feature of the present invention are described below in conjunction with accompanying drawing, the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the present invention.
The embodiments of the invention provide a kind of microchannel heat sink.As shown in Figures 1 to 3, the heat abstractor includes housing
3rd, cover plate 4 and multiple radiation tooths 5.There is the inner chamber of upper end open, cover plate 4 is covered on the upper end of housing 3, to close in housing 3
Opening is stated, the both sides of housing 3 are respectively arranged with the cooling medium inlet 1 connected with inner chamber and cooling medium outlet 2, the lower end of cover plate 4
It is provided with multiple radiation tooths 5, the multiple rectangular array of radiation tooth 5 arrangements, the heteropleural side of two adjacent radiation tooths 5 in the horizontal
Edge distance is 0.2 to 1 times of heteropleural Edge Distance in the vertical.For example, can be 0.2,0.3,0.4,0.5,0.6,0.7,
0.8th, 0.9 or 1 times.
Specifically, when microchannel heat sink works, cooling medium is entered by cooling medium inlet 1 in the inner chamber of housing 3,
Cooling medium flows through the radiation tooth 5 of rhombus column shape, after with radiation tooth 5 heat exchange occurs for cooling medium, by the stream of cooling medium outlet 2
Go out, the heat of the electronic device on cover plate 4 can be taken away.Wherein, cooling medium can be coolant or cooling air.
As shown in figure 4, radiation tooth 5 is the quadrangular that cross section is rhombus, the scope of an interior angle of rhombus be 30 ° extremely
70°。
Specifically, two adjacent radiation tooths 5 in the vertical at intervals of main fluid passageway, make the main fluid passageway width be
X, in the horizontal at intervals of auxiliary fluid passage, it is Y to make auxiliary fluid channel width.Wherein, it is horizontal for cooling medium inlet 1 and cold
But the center line connecting direction of media outlet 2.An interior angle for making the diamond-shaped cross-section of radiation tooth 5 is Z.Wherein, 0.2X≤Y≤X,
30°≤Z≤70°.Cooling medium mainly flows in main fluid passageway, driven in pressure during from the outlet of import flow direction
Secondary Flow will be constantly produced under dynamic, Secondary Flow mainly will flow in auxiliary fluid passage.By being carried out to rhombus column radiation tooth
Above-mentioned parameter is set, and radiation tooth boundary layer will be made to develop again, can take away more heats, radiating effect will be made substantially to be changed
It is kind, it can improve 20% or so through software simulation and experiment test, radiating effect.
Housing 3 is fixedly connected with the housing of cover plate 4 by vacuum brazing.Radiation tooth 5 is with cover plate 4 by one piece of metal material processing
Form.
The material of housing 3, cover plate 4 and radiation tooth 5 is copper, aluminium or other metals, alloy, is preferably red copper.
The embodiments of the invention provide a kind of electronic equipment.The electronic equipment includes at least one electronic device and above-mentioned
Microchannel heat sink, electronic device are welded in the upper end of cover plate 4.
Electronic device is welded in the cover plate upper end of above-mentioned microchannel heat sink, is not only fixedly secured electronic device,
Thermal contact resistance can also be effectively reduced, improves the Performance And Reliability of electronic equipment.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (6)
1. a kind of microchannel heat sink, it is characterised in that including housing (3), cover plate (4) and multiple radiation tooths (5)；The shell
There is the inner chamber of upper end open, the cover plate (4) is covered on the housing (3) upper end, to close the opening, institute in body (3)
State housing (3) both sides and be respectively arranged with the cooling medium inlet (1) connected with the inner chamber and cooling medium outlet (2), it is described
Cover plate (4) lower end is provided with multiple radiation tooths (5), multiple radiation tooth (5) rectangular arrays arrangements, and two adjacent
The heteropleural Edge Distance of the radiation tooth (5) in the horizontal is 0.2 to 1 times of heteropleural Edge Distance in the vertical.
2. microchannel heat sink according to claim 1, it is characterised in that the radiation tooth (5) is that cross section is water chestnut
The quadrangular of shape, the scope of an interior angle of the rhombus is 30 ° to 70 °.
3. microchannel heat sink according to claim 2, it is characterised in that the housing (3) is logical with the cover plate (4)
Vacuum brazing is crossed to be fixedly connected.
4. according to the microchannel heat sink described in any one of claims 1 to 3, it is characterised in that the housing (3), described
The material of cover plate (4) and the radiation tooth (5) is copper or aluminium.
5. according to the microchannel heat sink described in any one of claims 1 to 3, it is characterised in that cooling medium is from described cold
But medium entrance (1) flows into the inner chamber, flows out the inner chamber from cooling medium outlet (2), the cooling medium is cold
But liquid or cooling air.
6. a kind of electronic equipment, it is characterised in that including at least one electronic device and as described in any one of claim 1 to 5
Microchannel heat sink, the electronic device is welded in the cover plate (4) upper end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606766.8A CN107403775B (en) | 2017-07-24 | 2017-07-24 | Micro-channel heat dissipation device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606766.8A CN107403775B (en) | 2017-07-24 | 2017-07-24 | Micro-channel heat dissipation device and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107403775A true CN107403775A (en) | 2017-11-28 |
| CN107403775B CN107403775B (en) | 2020-01-14 |
Family
ID=60401465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710606766.8A Active CN107403775B (en) | 2017-07-24 | 2017-07-24 | Micro-channel heat dissipation device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107403775B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019231399A1 (en) * | 2018-05-28 | 2019-12-05 | National University Of Singapore | A heat sink assembly |
| CN114005800A (en) * | 2021-09-29 | 2022-02-01 | 苏州浪潮智能科技有限公司 | Micro-channel structure for radiating edge server chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026948A (en) * | 2007-03-26 | 2007-08-29 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN104658992A (en) * | 2015-02-13 | 2015-05-27 | 西安电子科技大学 | Novel micro heat sink provided with pin-fin array |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
-
2017
- 2017-07-24 CN CN201710606766.8A patent/CN107403775B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026948A (en) * | 2007-03-26 | 2007-08-29 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN104658992A (en) * | 2015-02-13 | 2015-05-27 | 西安电子科技大学 | Novel micro heat sink provided with pin-fin array |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019231399A1 (en) * | 2018-05-28 | 2019-12-05 | National University Of Singapore | A heat sink assembly |
| CN114005800A (en) * | 2021-09-29 | 2022-02-01 | 苏州浪潮智能科技有限公司 | Micro-channel structure for radiating edge server chip |
| CN114005800B (en) * | 2021-09-29 | 2024-01-23 | 苏州浪潮智能科技有限公司 | Microchannel structure for heat dissipation of edge server chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107403775B (en) | 2020-01-14 |
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