CN213991458U - Liquid cooling heat abstractor and have this liquid cooling heat abstractor's liquid cooling system - Google Patents
Liquid cooling heat abstractor and have this liquid cooling heat abstractor's liquid cooling system Download PDFInfo
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- CN213991458U CN213991458U CN202022632442.1U CN202022632442U CN213991458U CN 213991458 U CN213991458 U CN 213991458U CN 202022632442 U CN202022632442 U CN 202022632442U CN 213991458 U CN213991458 U CN 213991458U
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- liquid
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- circulating
- heat
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- 239000007788 liquid Substances 0.000 title claims abstract description 179
- 238000001816 cooling Methods 0.000 title claims abstract description 62
- 230000008859 change Effects 0.000 claims abstract description 95
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 239000012530 fluid Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 5
- 239000012071 phase Substances 0.000 description 73
- 238000010521 absorption reaction Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- 239000007791 liquid phase Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000018199 S phase Effects 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Abstract
The utility model provides a liquid cooling heat abstractor for solve the not good problem of current water-cooling head radiating efficiency. The method comprises the following steps: a base; the shell is combined with the base, a phase change chamber is formed between the shell and the base, and the phase change chamber is filled with phase change liquid; and a circulating tube for circulating a circulating liquid, the circulating tube having a heat absorbing section located in the phase change chamber and contacting the phase change liquid.
Description
Technical Field
The utility model discloses a heat abstractor and have this heat abstractor's cooling system, especially one kind leads heat energy to circulating liquid through phase change liquid, and this circulating liquid can be in the liquid cooling heat abstractor of inside circulation and have this liquid cooling heat abstractor's liquid cooling system.
Background
In addition to the miniaturization of the device, the amount of heat generated by the device is also greatly increased, and the amount of heat generated during the operation is considerable. The corresponding heat exchange devices are arranged aiming at various electronic heating components so as to maintain the normal operation of the electronic heating components at the allowable temperature.
For high-power electronic heating components, a water cooling head is generally used to assist in heat dissipation, the existing water cooling head has a base and an upper cover, the base can contact a heat source, the upper cover and the base are combined to form a cavity, the cavity is filled with a flowing liquid, the flowing liquid flows in from a liquid inlet hole of the upper cover, and the flowing liquid flows out from a liquid outlet hole of the upper cover; therefore, the heat energy at the heat source can be transferred into the chamber from the base, and then the heat energy at the heat source is taken away by the circulating flow of the flowing liquid so as to achieve the purpose of heat dissipation.
Above-mentioned current water-cooling head, because this mobile liquid passes through this liquid inlet, this cavity and this liquid outlet circulation flow, does not form the closed condition in this cavity for this mobile liquid can't utilize the change mechanism of gas-liquid phase to reach heat transfer, and the radiating effect of this mobile liquid to this heat source is limited, makes this mobile liquid be difficult to dispel the heat to this heat source effectively, leads to the radiating efficiency not good.
In view of the above, there is still a need for improvement of the existing water cooling head.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention provides a liquid cooling heat dissipation device, which can utilize the change mechanism of gas-liquid phase to realize heat transfer.
The utility model discloses a next purpose provides a liquid cooling heat abstractor, can promote the radiating effect.
It is still another object of the present invention to provide a liquid cooling heat sink, which can improve the heat exchange efficiency.
It is still another object of the present invention to provide a liquid cooling heat sink, which can improve the convenience of assembly.
In the present invention, the directions or the similar terms thereof, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., refer to the directions of the drawings, and the directions or the similar terms thereof are only used to assist the explanation and understanding of the embodiments of the present invention, but not to limit the present invention.
The components and members described throughout the present invention use the wording "one" or "one" only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.
The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.
The utility model discloses a liquid cooling heat abstractor, include: a base; the shell is combined with the base, a phase change chamber is formed between the shell and the base, and the phase change chamber is filled with phase change liquid; and a circulating tube for circulating a circulating liquid, the circulating tube having a heat absorbing section located in the phase change chamber and contacting the phase change liquid.
The utility model discloses a liquid cooling system, include: at least one liquid-cooled heat sink, the base configured to contact a heat source; a pump; a cooling unit; and a pipe assembly, which connects the circulating pipe of the liquid cooling heat sink, the pump and the cooling unit in series, and the pump makes the circulating liquid flow circularly when operating.
Therefore, the utility model discloses a liquid cooling heat abstractor and liquid cooling system who has this liquid cooling heat abstractor, can absorb the heat energy of this heat source department by the phase change liquid in this phase change chamber, phase change liquid in this phase change chamber can follow liquid absorption heat energy and evaporate into the gaseous state, make this phase change liquid can utilize the change mechanism of gas-liquid phase to realize heat transfer, and can absorb the heat energy in this phase change chamber rapidly through the circulating fluid in this circulating pipe, make the phase change liquid in this phase change chamber can be rapidly by gaseous state condensation become liquid heat absorption, make the circulating fluid in this circulating pipe can further cool down to the phase change liquid in this phase change chamber, can realize providing good radiating efficiency's efficiency. And through the operation of the pump, the heat energy at the heat source can be taken away and cooled when passing through the cooling unit, and is guided to the liquid cooling heat dissipation device again after being cooled, so that the circulation is continuous, the heat source can be effectively cooled, and the heat dissipation efficiency is improved.
The utility model discloses a liquid cooling heat abstractor can include a concave part that the apron seals this base in addition, can form a work cavity between this concave part and this apron, and this work cavity does not communicate with this phase change cavity, and this work cavity can fill a working fluid. Therefore, the working liquid in the working chamber can absorb heat energy from a liquid state and evaporate into a gaseous state, and the working liquid in the working chamber can rapidly absorb the heat energy at the heat source and then transfer the heat energy to the phase change liquid, so that the heat dissipation effect is improved.
The utility model discloses a liquid cooling heat abstractor can include in addition that a porous structure layer is located this apron, this phase change liquid of this porous structure layer contact. Therefore, the contact area between the porous structure layer and the phase change liquid can be increased, and the heat exchange efficiency is improved.
The utility model discloses a liquid cooling heat abstractor can include a heat radiation fin unit in addition, and this heat radiation fin unit can be located this phase change cavity and contact this phase change liquid and this heat absorption section. Therefore, the heat energy of the heat absorption section and the phase change liquid can have more contact areas, and the heat dissipation effect is improved.
The utility model discloses a liquid cooling heat abstractor can include in addition that a porous structure layer is located this base, this phase change liquid of this porous structure layer contact. Therefore, the contact area between the porous structure layer and the phase change liquid can be increased, and the heat exchange efficiency is improved.
Wherein the porous structure layer can be formed by sintering copper powder. Therefore, the porous layer structure has fine and uniform pores and has the effect of improving the heat dissipation effect.
Wherein, the circulating pipe can be provided with a liquid inlet section and a liquid outlet section which are respectively connected with the two ends of the heat absorption section. Therefore, the structure is simple and convenient to assemble, and has the effect of improving the assembly convenience.
Wherein, the liquid inlet section and the liquid outlet section can be arranged at the same side of the shell cover. Therefore, the circulating pipe can be easily assembled, aligned, adjusted in height difference or evaded other components, can be matched with various installation spaces, and has the effect of improving the use convenience.
Wherein, the heat absorbing section can have a plurality of bending parts. Therefore, the heat absorption section and the circulating liquid can have more contact areas, and the heat dissipation effect is improved.
Drawings
FIG. 1: the utility model discloses an exploded perspective view of a first embodiment;
FIG. 2: the combined top view of the first embodiment of the present invention;
FIG. 3: a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4: a cross-sectional view of a second embodiment of the present invention;
FIG. 5: an exploded perspective view of a third embodiment of the present invention;
FIG. 6: a cross-sectional view of a third embodiment of the present invention;
FIG. 7: an exploded perspective view of a fourth embodiment of the present invention;
FIG. 8: the utility model comprises a liquid cooling heat dissipation system structure of a liquid cooling heat dissipation device;
FIG. 9: the utility model discloses liquid cooling system's pumping is located the section view in the phase change cavity.
Description of the reference numerals
[ utility model ] to solve the problems
1: base
1a top surface
1b bottom surface
11: concave part
2: casing
21: ring edge
3: circulation pipe
31 heat absorption section
31a bent part
32 liquid inlet section
33 liquid outlet section
4: cover plate
5 porous structure layer
6 radiating fin unit
H is heat source
J liquid cooling heat sink
L is phase change liquid
P is the pump
Q cooling unit
Q1 Fan Assembly
Q2 fin assembly
R is circulating liquid
S phase change chamber
T working chamber
U-shaped pipe fitting group
U1 pipe fitting
U2 pipe fitting
U3 pipe fitting
U4 pipe fitting
W is working liquid.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail as follows:
referring to fig. 1, a first embodiment of the liquid cooling heat dissipation device of the present invention includes a base 1, a housing 2 and a circulation pipe 3, wherein the housing 2 is combined with the base 1, and a part of the circulation pipe 3 is located in a space formed by the base 1 and the housing 2.
The base 1 can be made of metal material with high thermal conductivity, such as copper or aluminum, and the forming manner of the base 1 is not limited, for example: the base 1 may be formed by stamping, which simplifies the manufacturing process, and the base 1 may have a top surface 1a and a bottom surface 1b opposite to each other, and the bottom surface 1b may be used to directly or indirectly connect to a heat source H (as shown in fig. 3). The type of the base 1 is not limited in the present invention, for example: the base 1 may be generally in the shape of a sheet; in the present embodiment, the base 1 may have a recess 11, the recess 11 may be located on the top surface 1a, and the recess 11 may face the housing 2.
Referring to fig. 1, 2 and 3, preferably, the base 1 may further include a cover plate 4, such that the cover plate 4 may close the recess 11, and a working chamber T may be formed between the recess 11 and the cover plate 4. Wherein, the combination mode of this apron 4 and this base 1 the utility model discloses do not restrict, for example: the cover plate 4 can be selectively bonded, embedded or locked to the base 1; in this embodiment, the cover plate 4 is selected to be laser welded on the top surface 1a of the base 1, so that the cover plate 4 and the base 1 can be firmly welded without generating a gap, thereby enhancing the bonding strength between the cover plate 4 and the base 1.
Referring to fig. 3, the working chamber T may be filled with a working fluid W, which may be water, alcohol or other low boiling point liquid; preferably, the working liquid W may be a non-conductive liquid, and the working liquid W may absorb heat from a liquid state to evaporate into a gaseous state, so as to achieve heat transfer by using a change mechanism of a gas-liquid phase of the working liquid W; and through being the confined state in this work cavity T, can avoid losing after this working fluid W forms the gaseous state to and avoid inside because the air occupies, compress to the space behind this working fluid W formation gaseous state, and then influence the radiating efficiency.
Referring to fig. 1 and 3, the housing 2 may be a rectangular casing with an open lower end, the housing 2 may have an annular edge 21, the annular edge 21 may be combined with the top surface 1a of the base 1, a phase change chamber S is formed between the housing 2 and the base 1, and the phase change chamber S is not communicated with the working chamber T. Wherein, the combination mode of this clamshell 2 and this base 1 the utility model discloses do not put the restriction, for example: the housing 2 can be selectively bonded, embedded or locked to the base 1; in this embodiment, the laser welding of the housing 2 to the top surface 1a of the base 1 is selected to ensure that the housing 2 and the base 1 can be welded and combined without generating a gap, so as to enhance the bonding strength between the base 1 and the housing 2.
Referring to fig. 3, the phase change chamber S is filled with a phase change liquid L, and since the phase change chamber S is not communicated with the working chamber T, the phase change liquid L can be prevented from being mixed with the working liquid W, and the phase change liquid L can be water, alcohol or other liquid with low boiling point; preferably, the phase-change liquid L may be a non-conductive liquid, and the phase-change liquid L may absorb heat from a liquid state to evaporate into a gaseous state, so as to achieve heat transfer by using a change mechanism of a gas-liquid phase of the phase-change liquid L; and through the closed state in the phase change chamber S, the phase change liquid L can be prevented from losing after being formed into a gaseous state, and the space of the phase change liquid L after being compressed into the gaseous state due to the occupation of air in the phase change liquid L can be prevented from further influencing the heat dissipation efficiency.
Referring to fig. 1 and 3, the circulation tube 3 is used for circulating a circulation liquid R, the circulation tube 3 has a heat absorption section 31, the heat absorption section 31 is located in the phase change chamber S and contacts the phase change liquid L, the heat absorption section 31 can be formed in a straight line shape or a curved shape, the present invention is not limited thereto, in this embodiment, the heat absorption section 31 can have a plurality of bending portions 31a, so that the heat absorption section 31 can be formed in a plurality of U-shaped forms; therefore, the heat absorbing section 31 and the phase change liquid L can have a large contact area, and the heat absorbing section 31 can rapidly transfer the heat energy of the phase change liquid L to the circulating liquid R, so that the heat dissipation effect can be improved. The interior of the circulation tube 3 is not connected to the phase change chamber S, so that the circulation liquid R and the phase change liquid L are prevented from mixing.
In addition, the circulating tube 3 may have a liquid inlet section 32 and a liquid outlet section 33, the liquid inlet section 32 and the liquid outlet section 33 are respectively connected to two ends of the heat absorbing section 31, the liquid inlet section 32 and the liquid outlet section 33 are respectively disposed on two opposite sides of the housing 2, the liquid inlet section 32 is used for the circulating liquid R to flow into the phase change chamber S, and the liquid outlet section 33 is used for the circulating liquid R to flow out in a direction away from the phase change chamber S. The composition of the circulating liquid R is not limited in the present invention, and in this embodiment, the circulating liquid R may be water, for example.
Referring to fig. 4, which is a second embodiment of the liquid cooling heat dissipation device of the present invention, the liquid cooling heat dissipation device J may further include a porous structure layer 5 located on the cover plate 4, the porous structure layer 5 may be completely located in the phase change chamber S, and the porous structure layer 5 may contact the phase change liquid L; through the arrangement of the porous structure layer 5, the contact area between the porous structure layer 5 and the phase change liquid L can be increased, the heat exchange efficiency can be improved, and the heat dissipation efficiency can be further improved. Wherein the porous structure layer 5 can be made by a powder sintering (powder sintering) process, such as: this porous structure layer 5 can be formed for sintering by the copper powder, or lay the copper mesh in this apron 4 with the tin cream and weld the etc. again, the utility model discloses all not restrict, as long as can form porous structure can.
Referring to fig. 5 and fig. 6, which are illustrations of a third embodiment of the liquid-cooled heat dissipation device of the present invention, the porous structure layer 5 may be located on the base 1, and the porous structure layer 5 may contact the phase-change liquid L. In detail, the position of the porous structure layer 5 is not limited by the present invention, for example: the porous structure layer 5 can be directly arranged on the top surface 1a of the base 1, so that the porous structure layer 5 can completely protrude out of the top surface 1 a; alternatively, as shown in fig. 6, the porous structure layer 5 may be disposed in the recess 11 formed by the top surface 1a, so that a part of the porous structure layer 5 may protrude from the top surface 1 a. Through the arrangement of the porous structure layer 5, the contact area between the porous structure layer 5 and the phase change liquid L can be increased, the heat exchange efficiency can be improved, and the heat dissipation efficiency can be further improved.
The liquid-cooled heat sink J may further comprise a heat sink fin unit 6, and the heat sink fin unit 6 may be located in the phase change chamber S. In detail, the heat sink fin unit 6 is preferably made of a metal material with high thermal conductivity, the heat sink fin unit 6 can be combined with the heat absorbing section 31, so that the heat sink fin unit 6 and the heat absorbing section 31 can be arranged in a staggered manner, and the heat sink fin unit 6 can contact the phase change liquid L; by the arrangement of the heat dissipating fin unit 6, the heat energy of the heat absorbing section 31 and the phase change liquid L can have a larger contact area, and the heat dissipating effect can be improved.
Referring to fig. 7, it is a fourth embodiment of the liquid cooling heat dissipating device of the present invention, the liquid inlet section 32 and the liquid outlet section 33 can be selectively disposed on the same side of the housing 2, or in other embodiments, the liquid inlet section 32 and the liquid outlet section 33 can also be disposed on two adjacent sides of the housing 2; therefore, the circulating pipe 3 can be easily assembled, aligned, adjusted in height difference or evaded other components, so that the circulating pipe 3 can be matched with various installation spaces, and the use convenience can be improved.
Referring to fig. 8, a preferred embodiment of the liquid cooling heat dissipating system of the present invention includes at least one of the liquid cooling heat dissipating device J, a pump P, a cooling unit Q, and a pipe unit U, wherein the pipe unit U is connected in series to the circulating pipe 3 of the liquid cooling heat dissipating device J, the pump P, and the cooling unit Q.
Referring to fig. 3 and 8, the liquid-cooled heat sink J may directly or indirectly contact a heat source H of an electronic device (not shown) from the bottom surface 1b of the base 1, the electronic device may be an industrial computer or a server, and the heat source H may be a motherboard, a central processing unit, a memory, a display processor, and the like. In this embodiment, two liquid-cooled heat dissipating devices J of the liquid-cooled heat dissipating system are illustrated.
In detail, the pump P may be located outside the liquid-cooled heat sink J, and the pipe set U may communicate the liquid inlet section 32 of one of the liquid-cooled heat sinks J with the pump P through a pipe U1; the tube set U may further include a tube U2 communicating the pump P with the cooling unit Q, a tube U3 communicating the liquid outlet section 33 of the other liquid-cooled heat sink J with the cooling unit Q, and a tube U4 communicating the liquid outlet section 33 of the one liquid-cooled heat sink J with the liquid inlet section 32 of the other liquid-cooled heat sink J; the pipe set U has the circulating liquid R therein, and the pump P is operated to drive the circulating liquid R to circulate in the pipe set U and the circulating pipe 3.
It should be noted that the pump P is based on the principle of driving the circulating liquid R to flow circularly, and the shape and position of the pump P can be adjusted as required, so that, in other embodiments, the pump P can also be located in the phase change chamber S as shown in fig. 9, which is not limited by the present invention.
Referring to fig. 2 and fig. 3, when the liquid-cooled heat dissipating system having the liquid-cooled heat dissipating apparatus J of the present embodiment operates, the working liquid W in the working chamber T can rapidly absorb the heat energy from the heat source H and then transfer the heat energy to the phase change liquid L, and the phase change liquid L in the phase change chamber S can absorb the heat energy from a liquid state and evaporate into a gaseous state, so that the phase change liquid L can absorb the heat energy converted from the working liquid W.
Referring to fig. 3 and 8, next, the circulating liquid R in the circulating pipe 3 can rapidly absorb the heat energy in the phase change chamber S, so that the phase change liquid L in the phase change chamber S can be rapidly condensed from a gaseous state to a liquid state to absorb heat, the circulating liquid R in the circulating pipe 3 can further cool the phase change liquid L in the phase change chamber S, and through the operation of the pump P, the circulating liquid R can carry the heat energy away from the heat source H and cool the liquid L while passing through the cooling unit Q, and is guided to the liquid-cooled heat sink J again after cooling; the continuous circulation can effectively cool the heat source H received by the liquid cooling heat dissipation device J, and the effect of providing good heat dissipation efficiency can be achieved.
It should be noted that the cooling unit Q may have a fan assembly Q1 and a fin assembly Q2, and the airflow of the fan assembly Q1 may be blown toward the fin assembly Q2, so as to dissipate the heat energy transferred from the liquid-cooled heat sink to the fin assembly Q2, which may further have a good heat dissipation effect.
To sum up, the utility model discloses a liquid cooling heat abstractor and liquid cooling system who has this liquid cooling heat abstractor, can absorb the heat energy of this heat source department by the phase change liquid in this phase change cavity, phase change liquid in this phase change cavity can be followed liquid and absorbed heat energy and evaporate into the gaseous state, make this phase change liquid can utilize the change mechanism of gas-liquid phase to reach the heat transfer, and can absorb the heat energy in this phase change cavity rapidly through the circulating fluid in this circulating pipe, make the phase change liquid in this phase change cavity can be become liquid heat absorption by the gaseous state condensation rapidly, make the circulating fluid in this circulating pipe can further cool down to the phase change liquid in this phase change cavity, can realize providing good radiating efficiency's efficiency. And through the operation of the pump, the heat energy at the heat source can be taken away and cooled when passing through the cooling unit, and is guided to the liquid cooling heat dissipation device again after being cooled, so that the circulation is continuous, the heat source can be effectively cooled, and the heat dissipation efficiency is improved.
Claims (10)
1. A liquid-cooled heat sink, comprising:
a base;
the shell is combined with the base, a phase change chamber is formed between the shell and the base, and the phase change chamber is filled with phase change liquid; and
a circulating tube for circulating a circulating liquid, the circulating tube having a heat sink section located in the phase change chamber and contacting the phase change liquid.
2. The liquid cooled heat sink of claim 1, further comprising a cover enclosing a recess in the base, the recess and the cover defining a working chamber therebetween, the working chamber not communicating with the phase change chamber, the working chamber filled with a working fluid.
3. The liquid cooled heat sink of claim 2, further comprising a porous structure layer on the cover, the porous structure layer contacting the phase change liquid.
4. The liquid-cooled heat sink of claim 1, further comprising a heat fin unit located in the phase change chamber and in contact with the phase change liquid and the heat sink section.
5. The liquid cooled heat sink of claim 1, further comprising a porous structure layer on the base, the porous structure layer contacting the phase change liquid.
6. The liquid cooled heat sink of claim 5, wherein the porous structure layer is formed by sintering copper powder.
7. The liquid-cooled heat sink of claim 1, wherein the circulation tube has an inlet section and an outlet section connected to respective ends of the heat absorbing section.
8. The liquid-cooled heat sink of claim 7, wherein the liquid inlet section and the liquid outlet section are disposed on a same side of the housing.
9. The liquid-cooled heat sink of any one of claims 1-8, wherein the heat sink section has a plurality of bends.
10. A liquid-cooled heat dissipation system, comprising:
at least one liquid-cooled heat sink as recited in any one of claims 1 to 9, the base adapted to contact a heat source;
a pump;
a cooling unit; and
and the pipe piece set is connected with the circulating pipe of the liquid cooling heat dissipation device, the pump and the cooling unit in series, and the circulating liquid flows circularly when the pump operates.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109214560U TWM609021U (en) | 2020-11-04 | 2020-11-04 | Liquid cooling heat dissipation device and liquid cooling heat dissipation system with the same |
| TW109214560 | 2020-11-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213991458U true CN213991458U (en) | 2021-08-17 |
Family
ID=76037103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022632442.1U Active CN213991458U (en) | 2020-11-04 | 2020-11-13 | Liquid cooling heat abstractor and have this liquid cooling heat abstractor's liquid cooling system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN213991458U (en) |
| TW (1) | TWM609021U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158243A (en) * | 2021-12-30 | 2022-03-08 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN114501931A (en) * | 2021-12-31 | 2022-05-13 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
-
2020
- 2020-11-04 TW TW109214560U patent/TWM609021U/en unknown
- 2020-11-13 CN CN202022632442.1U patent/CN213991458U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158243A (en) * | 2021-12-30 | 2022-03-08 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN114501931A (en) * | 2021-12-31 | 2022-05-13 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN114501931B (en) * | 2021-12-31 | 2024-03-22 | 联想(北京)有限公司 | Heat abstractor and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM609021U (en) | 2021-03-11 |
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