JP2004247574A

JP2004247574A - Substrate cooling device

Info

Publication number: JP2004247574A
Application number: JP2003036711A
Authority: JP
Inventors: Tetsuya Takeuchi; 哲也竹内
Original assignee: Denso Corp
Current assignee: Denso Corp
Priority date: 2003-02-14
Filing date: 2003-02-14
Publication date: 2004-09-02

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate cooling device capable of cooling at least three substrates without providing another heat releasing part at the upper parts of heat releasing cases 1 and 2. <P>SOLUTION: A water cooling unit 3 mounted with substrates 6 and 7 is surrounded by heat radiating cases 1 and 2 mounted with substrates 8 and 9 from the front part and back part, and water cooling fluid is circulated by the internal water cooling unit 3 and a cooling fluid channel 5a formed on the external face of the heat releasing cases so that the heat of the substrates 6 to 9 can be absorbed by the water cooling unit 3 and the heat releasing cases 1 and 2, and that the heat can be released from the external faces of the heat releasing cases 1 and 2 to atmosphere. Thus, the two substrates 6 and 7 can be cooled by the water cooling unit 3, and the two substrates 8 and 9 used to be cooled inside the heat releasing cases 1 and 2 can be cooled by the cooling fluid channel 5a formed on the outer walls of the heat releasing cases 1 and 2. The cooling fluid is circulated by the cooling fluid channel 5a and the water cooling unit 3 so that at least three substrates can be efficiently cooled by a simple structure without providing any heat releasing part at the upper part of the heat releasing cases 1 and 2. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、筐体内で電子機器や電子部品を組み付けた基板を冷却する基板冷却装置に関するものであり、例えば、小型携帯電話基地局内の基板やパーソナルコンピュータ本体内の基板の冷却に用いて有効である。
【０００２】
【従来の技術】
基板に配設したＣＰＵ等は、作動により発熱する。このため、冷却して劣化を防止する必要がある。このような、基板を冷却する技術として、本出願人は先に特願２００１−３３２６１０号に示す技術を出願している。これに示す技術は、アルミニウム製の筐体内で基板を安全作動する温度以下に冷却するため、４枚の基板のうち、２枚は直接筐体内側に取り付け、筐体への熱伝導により基板の熱を吸熱し、筐体外側のフィン加工部から大気中へ自然放熱することにより冷却している。また、他の２枚は、筐体内に沸騰冷却器を設け、この両面に取り付けることにより冷却している。
【０００３】
【発明が解決しようとする課題】
しかしながら、上記出願技術の基板冷却装置では、沸騰冷却器の放熱部を筐体の上部に設ける必要があり、冷却装置が大型化するという問題点がある。本発明は、この出願技術の問題点に鑑みて成されたものであり、その目的は、装置大型化の原因となる筐体上部の放熱部を設けることなく、三枚以上の基板を冷却することのできる基板冷却装置を提供することにある。
【０００４】
【課題を解決するための手段】
本発明は上記目的を達成するために、請求項１ないし請求項７に記載の技術的手段を採用する。すなわち、請求項１に記載の発明では、冷却流体が内部を流通する偏平形状の冷却熱交換器（３）と、冷却熱交換器（３）の一方および他方の面に伝熱良好状態に取り付けられ、作動により発熱する被冷却体（６・７）と、冷却流体が流通する冷却流体通路（５ａ）を外壁に形成した放熱筐体（１・２）とを備え、
被冷却体（６・７）を取り付けた冷却熱交換器（３）を、放熱筐体（１・２）で包囲し、内部の冷却熱交換器（３）と放熱筐体（１・２）に形成した冷却流体通路（５ａ）とで冷却流体を循環させて、被冷却体（６・７）の熱を冷却熱交換器（３）で吸熱し、その熱を放熱筐体（１・２）外面から大気中に放熱することを特徴とする。
【０００５】
これにより、被冷却体（基板６・７）は、冷却熱交換器（３）にて冷却され、筐体（１・２）外壁に冷却流体通路（５ａ）を設け、この冷却流体通路（５ａ）と先の冷却熱交換器（３）とに冷却流体を循環させることにより、出願技術のように筐体上部に放熱部を設けることなく、簡単な構造で被冷却体を効率良く冷却することができる。
【０００６】
請求項２に記載の発明では、冷却流体が内部を流通する偏平形状の冷却熱交換器（３）と、冷却熱交換器（３）の一方および他方の面に伝熱良好状態に取り付けられ、作動により発熱する第１・第２の被冷却体（６・７）と、冷却流体が流通する冷却流体通路（５ａ）を外壁に形成した第１・第２の放熱筐体（１・２）と、これら第１・第２の放熱筐体（１・２）の内側に伝熱良好状態に取り付けられ、作動により発熱する第３・第４の被冷却体（８・９）とを備え、
第１・第２の被冷却体（６・７）を取り付けた冷却熱交換器（３）を、第３・第４の被冷却体（８・９）を取り付けた第１・第２の放熱筐体（１・２）で前後から包囲し、内部の冷却熱交換器（３）と第１・第２の放熱筐体（１・２）に形成した冷却流体通路（５ａ）とで冷却流体を循環させて、第１〜第４の被冷却体（６〜９）の熱を冷却熱交換器（３）および第１・第２の放熱筐体（１・２）で吸熱し、その熱を第１・第２の放熱筐体（１・２）外面から大気中に放熱することを特徴とする。
【０００７】
これにより、上記出願技術では沸騰冷却器で冷却していた２枚の被冷却体（基板６・７）は、冷却熱交換器（３）にて出願技術と同様に冷却するうえ、筐体（１・２）の内側で冷却していた２枚の被冷却体（基板８・９）に対しては、筐体（１・２）外壁に冷却流体通路（５ａ）を設け、この冷却流体通路（５ａ）と先の冷却熱交換器（３）とに冷却流体を循環させることにより、出願技術のように筐体上部に放熱部を設けることなく、簡単な構造で３枚以上の基板を効率良く冷却することができる。
【０００８】
請求項３に記載の発明では、冷却熱交換器（３）の内部を複数の冷却流体流路（３ｂ）に区画したことを特徴とする。これにより、冷却熱交換器（３）内部での伝熱面積を拡大することができるうえ、冷却流体の流れがスムーズとなって冷却熱交換器（３）における冷却効率を良くすることができる。
【０００９】
請求項４に記載の発明では、放熱筐体（１・２）は熱伝導性の良い金属で形成されていることを特徴とする。これにより、放熱筐体（１・２）において高い放熱性能が得られ、冷却効率を良くすることができる。
【００１０】
請求項５に記載の発明では、放熱筐体（１・２）の外面に放熱突起部（５）を形成したことを特徴とする。これにより、放熱筐体（１・２）における放熱性能および冷却効率を更に良くすることができる。
【００１１】
請求項６に記載の発明では、放熱突起部（５）の内部に冷却流体通路（５ａ）を形成したことを特徴とする。これにより、冷却熱交換器（３）における冷却効率、および放熱筐体（１・２）における放熱性能および冷却効率を更に良くすることができる。
【００１２】
請求項７に記載の発明では、被冷却体（６〜９）は、作動により発熱して熱劣化し易い特性を有する電子部品（１０）を組み付けた基板、もしくは電子機器であることを特徴とする。これは、本発明装置が電子部品（１０）を組み付けた基板、もしくは電子機器を冷却するのに好適なことによる。これにより電子部品（１０）や電子機器の熱劣化を防止することができる。
【００１３】
尚、上記各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示す一例である。
【００１４】
【発明の実施の形態】
以下、本発明の実施の形態について図面を用いて説明する。図１は本発明の一実施形態における基板冷却装置Ａの斜視図であり、図２は図１の基板冷却装置Ａの分解図であり、図３はその基板冷却装置Ａの水平断面図である。尚、本実施例１は、携帯電話の小型基地局に本冷却装置を適用した例である。
【００１５】
基板冷却装置Ａは、図２に示す様に、冷却水（冷却流体）が内部を流通する偏平形状の水冷ユニット（冷却熱交換器）３の両面に、作動により発熱する通信用の基板（第１・第２の被冷却体）６・７を伝熱良好な状態で取り付けている。また、冷却水が流通する冷却水通路（冷却流体通路）５ａを外壁に形成した放熱ケース（第１・第２の放熱筐体）１・２の内側に、作動により発熱する通信用の基板（第３・第４の被冷却体）８・９を伝熱良好な状態で取り付けている。
【００１６】
そして、基板６・７を取り付けた水冷ユニット３を、同じく基板８・９を取り付けた放熱ケース１・２で前後から包囲し、その放熱ケース１・２の上下にトップカバー４ａとボトムカバー４ｂとを取り付けている。尚、これら放熱ケース１・２および両カバー４ａ・４ｂは、図示しない防水パッキンを介して図示しないボルト等で水密に組み合わせられている。そして、この基板冷却装置Ａには、車両のエンジン冷却水（ＬＬＣ）のように防錆剤や凍結防止剤を添加した冷却水が充填されで内部を循環するものである。
【００１７】
水冷ユニット３は、偏平形状であり、熱伝導性に優れたアルミニウムのプレートの間に、同じくアルミニウムのインナーフィン３ａ（図３参照）を介在させ、水密に一体ろう付けしたものである。インナーフィン３ａは、伝熱面積を拡大すると共に、内部を複数の冷却水流路３ｂに区画している。
【００１８】
基板６・７は携帯電話と通信を行なう通信回路の一部を構成する基板であり、基板８・９は携帯電話と通信を行なう通信回路の残部を構成する基板である。電子部品１０は、送信モジュール・ＣＰＵ・パワートランジスタ・集積回路等の発熱性電子部品であり、基板６〜９に組み付けられている。これらの発熱性電子部品は、シリコングリースを介して水冷ユニット３の両面もしくは放熱ケース１・２に圧接されている（図３参照）。
【００１９】
放熱ケース１・２は、同じくアルミニウムで形成され、外面の熱を大気中へ放熱するための放熱フィン（放熱突起部）５と共に押し出し成型したコの字の外壁部に、同じくアルミニウムの天板と底板とを接合して作られている。尚、放熱フィン５の中には冷却水が流通する冷却通路５ａが形成されている。トップカバー４ａおよびボトムカバー４ｂも、同じくアルミニウムをダイキャストして作られている。他に、冷却水を循環させるための電動ポンプ１１（図４参照）等から基板冷却装置Ａが構成されている。
【００２０】
次に、基板冷却装置Ａの概略作動を述べる。図４は基板冷却装置Ａ内での冷却水の流れを説明する模式図である。内部の水冷ユニット３と、両カバー４ａ・４ｂの内側と、放熱ケース１・２の外側に形成した冷却流体通路５ａとで連通した冷却水の循環路を形成して、基板６〜９の熱を水冷ユニット３および放熱ケース１・２で吸熱し、その熱を放熱ケース１・２の外面から大気中に放熱している。
【００２１】
より具体的に、電動ポンプ１１で圧送された冷却水は水冷ユニット３の下側から流入し、水冷ユニット３内を流通して両面に取り付けられた基板６・７の熱を吸熱し、上側の出口３ｃよりトップカバー４ａの内側に流出する。そのトップカバー４ａ内に流出した冷却水は、放熱ケース１・２の外側に形成された複数の冷却流体通路５ａを通り、外気で冷却されながら下降してボトムカバー４ｂの内側に流出する。
【００２２】
そして、ボトムカバー４ｂ内に流出した冷却水は、電動ポンプ１１にて入口３ｂより吸入されて上記の循環を行なう。この間、放熱ケース１・２の内側に取り付けられた基板８・９の熱は、放熱ケース１・２へ熱伝導することにより吸熱され、放熱ケース１・２外側の放熱フィン５から外気へ放熱される。
【００２３】
図５は、本発明の第１実施例における基板冷却装置Ａの使用例を示す説明図であり、図に示す様に電柱１２の途中に設置され、自然空冷される。また、図６は、本発明の第２実施例における基板冷却装置の使用例を示す斜視図であり、パーソナルコンピュータの本体部Ｂに本冷却装置を適用した例である。図６中の１３は、パーソナルコンピュータのモニター部である。
【００２４】
図７は、そのパーソナルコンピュータの本体部に用いた基板冷却装置Ｂ内での冷却水の流れを説明する模式図であり、図中の１４はパーソナルコンピュータのマザーボードであり、１５はそのマザーボード１４に搭載されたＣＰＵである。電動ポンプ１１で圧送された冷却水は、ＣＰＵ１５と熱的に接合された水冷ユニット３の下側から流入し、水冷ユニット３内を流通して接合されたＣＰＵ１５の熱を吸熱し、上側の出口３ｃよりトップカバー４ａの内側に流出する。
【００２５】
そのトップカバー４ａ内に流出した冷却水は、放熱ケース１・２の外側に形成された複数の冷却流体通路５ａを通り、外気で冷却されながら下降してボトムカバー４ｂの内側に流出する。そして、ボトムカバー４ｂ内に流出した冷却水は、電動ポンプ１１にて入口３ｂより吸入されて上記の循環を行なう。この間、放熱ケース１・２の内側に取り付けられた図示しない他の基板の熱は、放熱ケース１・２へ熱伝導することにより吸熱され、放熱ケース１・２外側の放熱フィン５から外気へ放熱されるのは実施例１と同様である。
【００２６】
次に、本実施形態での特徴を説明する。冷却水が内部を流通する偏平形状の水冷ユニット３と、水冷ユニット３の一方および他方の面に伝熱良好状態に取り付けられ、作動により発熱する基板６・７と、冷却水が流通する冷却水通路５ａを外壁に形成した放熱ケース１・２と、これら放熱ケース１・２の内側に伝熱良好状態に取り付けられ、作動により発熱する基板８・９とを備え、
基板６・７を取り付けた水冷ユニット３を、基板８・９を取り付けた放熱ケース１・２で前後から包囲し、内部の水冷ユニット３と放熱ケース１・２に形成した冷却水通路５ａとで冷却水を循環させて、基板６〜９の熱を水冷ユニット３および放熱ケース１・２で吸熱し、その熱を放熱ケース１・２外面から大気中に放熱する。
【００２７】
これにより、先に出願した技術では沸騰冷却器で冷却していた２枚の基板６・７は、水冷ユニット３にて先の出願技術と同様に冷却するうえ、放熱ケース１・２の内側で冷却していた２枚の基板８・９に対しては、放熱ケース１・２外壁に冷却水通路５ａを設け、この冷却水通路５ａと先の水冷ユニット３とに冷却流体を循環させることにより、先の出願技術のように放熱ケース上部に放熱部を設けることなく、簡単な構造で３枚以上の基板を効率良く冷却することができる。
【００２８】
また、水冷ユニット３の内部を複数の冷却水流路３ｂに区画している。これにより、冷却熱交換器（３）内部での伝熱面積を拡大することができるうえ、冷却流体の流れがスムーズとなって冷却熱交換器（３）における冷却効率を良くすることができる。また、放熱ケース１・２は熱伝導性の良い金属で形成されている。これにより、放熱ケース１・２において高い放熱性能が得られ、冷却効率を良くすることができる。また、放熱ケース１・２の外面に放熱フィン５を形成している。これにより、放熱ケース１・２における放熱性能および冷却効率を更に良くすることができる。
【００２９】
また、放熱フィン５の内部に冷却水通路５ａを形成している。これにより、水冷ユニット３における冷却効率、および放熱ケース１・２における放熱性能および冷却効率を更に良くすることができる。また、基板６〜９は、作動により発熱して熱劣化し易い特性を有する電子部品１０を組み付けた基板、もしくは電子機器である。これは、本発明装置が電子部品１０を組み付けた基板、もしくは電子機器を冷却するのに好適なことによる。これにより電子部品１０や電子機器の熱劣化を防止することができる。
【００３０】
また、パーソナルコンピュータの本体部Ｂに本冷却装置を適用した例等においては、放熱ケースを密閉化することにより、放熱ケース内部にほこり等の電子機器を誤動作させる物質を導入することがなく、長期に渡って安定した動作が可能である。更に放熱ケースの密閉化により、電動ポンプ１１の作動音等が外部に伝播することを低減でき、低騒音化が可能である。
【００３１】
（その他の実施形態）
上述の実施形態では、放熱ケース１・２内に水冷ユニット３を１枚だけ入れて構成しているが、本発明はこれに限定されるものではなく、水冷ユニット３を複数枚入れ、各水冷ユニット３と放熱ケース１・２の冷却通路５ａとで冷却流体を循環させることにより、冷却できる基板数を６枚、８枚と増やしても良い。また逆に、上述の実施形態においても冷却する基板数を４枚に限るものではなく、１〜３枚であっても良い。
【００３２】
図８は基板冷却装置のその他の実施形態を示す水平断面図である。水冷ユニット３は、図８に示すように複数の冷却水流路３ｂを持った多孔押し出しチューブ等であっても良いし、図示しない単に流路を蛇行させたものであっても良い。
【００３３】
また、放熱ケース１・２の冷却流体通路５ａは、放熱ケース１・２の全外周部でなくとも良く、例えば図８に示すように前後平面部だけでも良いし、発熱が小さい場合は、放熱ケース１・２の外面にフィン形状を設けるまでもなく、同じく図８に示すように放熱ケース１・２の外壁に冷却流体通路５ａを設けて冷却流体を循環させるだけでも良い。また、冷却流体はＬＬＣに限らず、水やフロン等であっても良し、冷却流体の圧送方向についても、上述の実施形態とは逆方向であっても良い。
【図面の簡単な説明】
【図１】本発明の一実施形態における基板冷却装置の斜視図である。
【図２】図１の基板冷却装置の分解図である。
【図３】図１の基板冷却装置の水平断面図である。
【図４】図１の基板冷却装置内での冷却流体の流れを説明する模式図である。
【図５】本発明の第１実施例における基板冷却装置の使用例を示す説明図である。
【図６】本発明の第２実施例における基板冷却装置の使用例を示す斜視図である。
【図７】図６の基板冷却装置内での冷却流体の流れを説明する模式図である。
【図８】基板冷却装置のその他の実施形態を示す水平断面図である。
【符号の説明】
１、２放熱ケース（放熱筐体）
３水冷ユニット（冷却熱交換器）
３ｂ冷却水流路（冷却流体流路）
５放熱フィン（放熱突起部）
５ａ冷却水通路（冷却流体通路）
６〜９基板（被冷却体）
１０ＣＰＵ（電子部品）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate cooling device that cools a substrate on which electronic devices and electronic components are assembled in a housing. For example, the present invention relates to a substrate cooling device that is effective for cooling a substrate in a small mobile phone base station or a substrate in a personal computer main body. is there.
[0002]
[Prior art]
The CPU and the like disposed on the substrate generate heat by operation. For this reason, it is necessary to cool to prevent deterioration. As a technique for cooling the substrate, the present applicant has previously applied for a technique disclosed in Japanese Patent Application No. 2001-332610. In the technology shown in this article, of the four substrates, two of them are mounted directly inside the housing to cool the substrate to a temperature below the safe operation temperature in the aluminum housing, and the heat is transferred to the housing by heat conduction to the housing. It cools by absorbing heat and naturally radiating heat from the fin processing portion outside the housing to the atmosphere. The other two are provided with a boiling cooler in the housing, and are mounted on both sides for cooling.
[0003]
[Problems to be solved by the invention]
However, in the substrate cooling device of the above-mentioned application technology, it is necessary to provide the heat radiating portion of the boiling cooler at the upper part of the housing, and there is a problem that the cooling device becomes large. The present invention has been made in view of the problems of the present application technology, and an object of the present invention is to cool three or more substrates without providing a heat dissipating portion at the upper part of the housing, which causes an increase in the size of the device. It is an object of the present invention to provide a substrate cooling device capable of performing the above.
[0004]
[Means for Solving the Problems]
The present invention employs the technical means described in claims 1 to 7 to achieve the above object. In other words, according to the first aspect of the present invention, the cooling heat exchanger (3) having a flat shape through which the cooling fluid flows and the heat transfer good state is attached to one and the other surfaces of the cooling heat exchanger (3). A cooling target body (6.7) that generates heat by operation, and a heat radiating housing (1.2) having an outer wall formed with a cooling fluid passage (5a) through which a cooling fluid flows,
The cooling heat exchanger (3) to which the object to be cooled (6.7) is attached is surrounded by the heat radiating housing (1.2), and the internal cooling heat exchanger (3) and the heat radiating housing (1.2) are provided. The cooling fluid is circulated through the cooling fluid passage (5a) formed in the cooling water exchanger (3), and the heat of the body to be cooled (6.7) is absorbed by the cooling heat exchanger (3), and the heat is radiated to the heat radiating housing (1.2). ) It is characterized by radiating heat from the outer surface to the atmosphere.
[0005]
As a result, the object to be cooled (the substrates 6 and 7) is cooled by the cooling heat exchanger (3), and a cooling fluid passage (5a) is provided on the outer wall of the housing (1.2). ) And the cooling heat exchanger (3) to circulate the cooling fluid, thereby efficiently cooling the object to be cooled with a simple structure without providing a heat radiating portion at the upper part of the housing unlike the application technology. Can be.
[0006]
According to the second aspect of the present invention, the cooling heat exchanger (3) having a flat shape through which the cooling fluid flows and being attached to one and the other surface of the cooling heat exchanger (3) in a good heat transfer state, First and second heat dissipating casings (1.2) formed on outer walls of first and second cooled bodies (6.7) that generate heat by operation and cooling fluid passages (5a) through which a cooling fluid flows. And third and fourth cooled bodies (8.9) that are attached to the inside of the first and second heat radiating housings (1.2) in a good heat transfer state and generate heat by operation.
The cooling heat exchanger (3) to which the first and second objects to be cooled (6.7) are attached is connected to the first and second heat radiation to which the third and fourth objects to be cooled (8.9) are attached. The cooling fluid is surrounded by the housing (1.2) from the front and rear, and is cooled by the cooling heat exchanger (3) inside and the cooling fluid passage (5a) formed in the first and second heat radiating housings (1.2). And the heat of the first to fourth cooled objects (6 to 9) is absorbed by the cooling heat exchanger (3) and the first and second heat radiating housings (1.2), and the heat is Is radiated to the atmosphere from the outer surfaces of the first and second heat radiating housings (1.2).
[0007]
As a result, the two cooled objects (substrates 6 and 7) cooled by the boiling cooler in the above-mentioned application technology are cooled by the cooling heat exchanger (3) in the same manner as the application technology, and the housing ( A cooling fluid passage (5a) is provided on the outer wall of the housing (1.2) for the two objects to be cooled (substrates 8 and 9) which have been cooled inside of the (1.2). By circulating the cooling fluid between (5a) and the cooling heat exchanger (3), it is possible to efficiently use three or more substrates with a simple structure without providing a heat radiating part at the upper part of the housing unlike the application technology. Can be cooled well.
[0008]
The invention according to claim 3 is characterized in that the inside of the cooling heat exchanger (3) is partitioned into a plurality of cooling fluid flow paths (3b). Thus, the heat transfer area inside the cooling heat exchanger (3) can be increased, and the flow of the cooling fluid can be made smooth, so that the cooling efficiency in the cooling heat exchanger (3) can be improved.
[0009]
According to a fourth aspect of the present invention, the heat radiating housing is formed of a metal having good heat conductivity. Thereby, high heat dissipation performance is obtained in the heat dissipation housings (1 and 2), and cooling efficiency can be improved.
[0010]
The invention according to claim 5 is characterized in that a heat radiating projection (5) is formed on the outer surface of the heat radiating housing (1, 2). Thereby, the heat dissipation performance and cooling efficiency of the heat dissipation housing (1 and 2) can be further improved.
[0011]
The invention according to claim 6 is characterized in that a cooling fluid passage (5a) is formed inside the heat radiation projection (5). Thereby, the cooling efficiency in the cooling heat exchanger (3) and the heat radiation performance and the cooling efficiency in the heat radiating housings (1 and 2) can be further improved.
[0012]
According to a seventh aspect of the present invention, the object to be cooled (6 to 9) is a substrate or an electronic device on which an electronic component (10) having a characteristic of easily generating heat by operation and being easily thermally deteriorated is mounted. I do. This is because the device of the present invention is suitable for cooling a substrate or an electronic device on which the electronic component (10) is assembled. Thereby, thermal deterioration of the electronic component (10) and the electronic device can be prevented.
[0013]
In addition, the code | symbol in the parenthesis of each said means is an example which shows the correspondence with the concrete means described in embodiment mentioned later.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a substrate cooling device A according to an embodiment of the present invention, FIG. 2 is an exploded view of the substrate cooling device A of FIG. 1, and FIG. 3 is a horizontal sectional view of the substrate cooling device A. . The first embodiment is an example in which the present cooling device is applied to a small base station of a mobile phone.
[0015]
As shown in FIG. 2, the substrate cooling device A is provided on both sides of a flat water-cooling unit (cooling heat exchanger) 3 through which cooling water (cooling fluid) flows, and a communication substrate (second heat-generating substrate) that generates heat by operation. The first and second objects to be cooled) 6 and 7 are mounted with good heat transfer. In addition, a communication board (a cooling heat passage) 5a through which cooling water flows (cooling fluid passage) 5a formed on the outer wall of a heat radiation case (first and second heat radiation housings) 1 and 2 which generates heat by operation. (Third and fourth objects to be cooled) 8.9 are attached in a state where heat transfer is good.
[0016]
Then, the water-cooling unit 3 to which the substrates 6 and 7 are attached is surrounded from the front and back by the heat radiation cases 1.2 to which the substrates 8.9 are also attached, and the top cover 4a and the bottom cover 4b are provided above and below the heat radiation cases 1.2. Is installed. The heat radiating cases 1 and 2 and the covers 4a and 4b are combined in a watertight manner with bolts or the like (not shown) via a waterproof packing (not shown). The substrate cooling device A is filled with cooling water to which a rust inhibitor and an antifreezing agent are added, such as vehicle cooling water (LLC), and circulates through the inside.
[0017]
The water-cooling unit 3 has a flat shape and is formed by interposing aluminum inner fins 3a (see FIG. 3) between aluminum plates having excellent heat conductivity, and brazing water-tight integrally. The inner fin 3a enlarges the heat transfer area and partitions the inside into a plurality of cooling water passages 3b.
[0018]
The boards 6 and 7 are boards that form part of a communication circuit that communicates with the mobile phone, and the boards 8 and 9 are boards that make up the rest of the communication circuit that communicates with the mobile phone. The electronic component 10 is a heat-generating electronic component such as a transmission module, a CPU, a power transistor, and an integrated circuit, and is assembled on the substrates 6 to 9. These heat-generating electronic components are pressed against both surfaces of the water cooling unit 3 or the heat radiating cases 1 and 2 via silicon grease (see FIG. 3).
[0019]
The heat radiating cases 1 and 2 are also made of aluminum, and are formed on a U-shaped outer wall portion extruded together with heat radiating fins (heat radiating projections) 5 for radiating heat on the outer surface to the atmosphere. It is made by joining the bottom plate. In addition, a cooling passage 5 a through which cooling water flows is formed in the radiation fin 5. The top cover 4a and the bottom cover 4b are also made by die-casting aluminum. In addition, the substrate cooling device A includes an electric pump 11 (see FIG. 4) for circulating cooling water.
[0020]
Next, a schematic operation of the substrate cooling device A will be described. FIG. 4 is a schematic diagram illustrating the flow of cooling water in the substrate cooling device A. A cooling water circulation path is formed, which communicates with the internal water cooling unit 3, the inside of both covers 4a and 4b, and the cooling fluid passage 5a formed outside the heat radiating cases 1 and 2, so that heat of the substrates 6 to 9 is formed. Is absorbed by the water cooling unit 3 and the heat radiating cases 1 and 2, and the heat is radiated from the outer surfaces of the heat radiating cases 1 and 2 to the atmosphere.
[0021]
More specifically, the cooling water pumped by the electric pump 11 flows in from the lower side of the water-cooling unit 3 and circulates through the water-cooling unit 3 to absorb the heat of the substrates 6 and 7 attached to both sides, and It flows out from the outlet 3c to the inside of the top cover 4a. The cooling water flowing into the top cover 4a passes through a plurality of cooling fluid passages 5a formed outside the heat radiating cases 1 and 2 and descends while being cooled by the outside air, and flows out into the bottom cover 4b.
[0022]
Then, the cooling water flowing into the bottom cover 4b is sucked by the electric pump 11 from the inlet 3b and performs the above-described circulation. During this time, the heat of the substrates 8 and 9 attached inside the heat radiating cases 1 and 2 is absorbed by conducting heat to the heat radiating cases 1 and 2, and is radiated to the outside air from the heat radiating fins 5 outside the heat radiating cases 1 and 2. You.
[0023]
FIG. 5 is an explanatory view showing an example of use of the substrate cooling apparatus A according to the first embodiment of the present invention. As shown in FIG. FIG. 6 is a perspective view showing a usage example of the substrate cooling device according to the second embodiment of the present invention, in which the cooling device is applied to a main body B of a personal computer. Reference numeral 13 in FIG. 6 denotes a monitor of the personal computer.
[0024]
FIG. 7 is a schematic diagram for explaining the flow of cooling water in the substrate cooling device B used for the main body of the personal computer. In FIG. 7, 14 is a motherboard of the personal computer, and 15 is a motherboard of the personal computer. It is a mounted CPU. The cooling water pumped by the electric pump 11 flows in from the lower side of the water cooling unit 3 thermally joined to the CPU 15, flows through the water cooling unit 3, absorbs the heat of the joined CPU 15, and exits on the upper side. 3c flows out inside the top cover 4a.
[0025]
The cooling water flowing into the top cover 4a passes through a plurality of cooling fluid passages 5a formed outside the heat radiating cases 1 and 2 and descends while being cooled by the outside air, and flows out into the bottom cover 4b. Then, the cooling water flowing into the bottom cover 4b is sucked by the electric pump 11 from the inlet 3b and performs the above-described circulation. During this time, the heat of the other substrate (not shown) attached inside the heat radiating cases 1 and 2 is absorbed by conducting heat to the heat radiating cases 1 and 2, and is radiated from the heat radiating fins 5 outside the heat radiating cases 1 and 2 to the outside air. This is the same as in the first embodiment.
[0026]
Next, features of the present embodiment will be described. A flat water cooling unit 3 through which cooling water flows, substrates 6 and 7 mounted on one and the other surface of the water cooling unit 3 in a good heat transfer state and generating heat by operation, and cooling water through which cooling water flows Heat radiating cases 1 and 2 each having a passage 5a formed in an outer wall, and substrates 8 and 9 which are attached inside the heat radiating cases 1 and 2 in a good heat transfer state and generate heat by operation.
The water-cooling unit 3 to which the substrates 6 and 7 are attached is surrounded from the front and back by the heat radiation cases 1.2 to which the substrates 8.9 are attached, and the water cooling unit 3 inside and the cooling water passage 5a formed in the heat radiation cases 1.2 are formed. By circulating cooling water, heat of the substrates 6 to 9 is absorbed by the water cooling unit 3 and the heat radiating cases 1 and 2, and the heat is radiated from the outer surfaces of the heat radiating cases 1 and 2 to the atmosphere.
[0027]
As a result, the two substrates 6 and 7 that have been cooled by the boiling cooler in the previously applied technology are cooled by the water cooling unit 3 in the same manner as in the previously applied technology, and are cooled inside the heat radiation cases 1 and 2. For the two cooled substrates 8 and 9, cooling water passages 5 a are provided on the outer walls of the heat radiation cases 1 and 2, and a cooling fluid is circulated between the cooling water passages 5 a and the water cooling unit 3. Further, it is possible to efficiently cool three or more substrates with a simple structure without providing a heat radiating portion on the heat radiating case as in the prior application.
[0028]
Further, the inside of the water cooling unit 3 is partitioned into a plurality of cooling water channels 3b. Thus, the heat transfer area inside the cooling heat exchanger (3) can be increased, and the flow of the cooling fluid can be made smooth, so that the cooling efficiency in the cooling heat exchanger (3) can be improved. Further, the heat radiating cases 1 and 2 are formed of a metal having good heat conductivity. Thereby, high heat dissipation performance is obtained in the heat dissipation cases 1 and 2, and the cooling efficiency can be improved. Further, the radiation fins 5 are formed on the outer surfaces of the radiation cases 1 and 2. Thereby, the heat radiation performance and cooling efficiency of the heat radiation cases 1 and 2 can be further improved.
[0029]
Further, a cooling water passage 5 a is formed inside the radiation fin 5. Thereby, the cooling efficiency in the water cooling unit 3 and the heat radiation performance and the cooling efficiency in the heat radiation cases 1 and 2 can be further improved. Each of the substrates 6 to 9 is a substrate or an electronic device on which the electronic component 10 having a characteristic of easily generating heat by operation and being easily thermally deteriorated is mounted. This is because the device of the present invention is suitable for cooling a substrate on which the electronic component 10 is assembled or an electronic device. Thereby, thermal deterioration of the electronic component 10 and the electronic device can be prevented.
[0030]
Further, in the case where the present cooling device is applied to the main body B of the personal computer, the heat radiation case is hermetically sealed, so that no substance such as dust or the like that causes electronic devices to malfunction may be introduced into the heat radiation case, and a long-term operation may be achieved. , Stable operation is possible. Further, by closing the heat radiation case, it is possible to reduce the transmission of the operation sound of the electric pump 11 to the outside and to reduce the noise.
[0031]
(Other embodiments)
In the above-described embodiment, only one water-cooling unit 3 is placed in the heat-radiating cases 1 and 2. However, the present invention is not limited to this. By circulating the cooling fluid between the unit 3 and the cooling passages 5a of the heat radiating cases 1 and 2, the number of substrates that can be cooled may be increased to six or eight. Conversely, in the above embodiment, the number of substrates to be cooled is not limited to four, but may be one to three.
[0032]
FIG. 8 is a horizontal sectional view showing another embodiment of the substrate cooling device. The water cooling unit 3 may be a porous extrusion tube or the like having a plurality of cooling water flow paths 3b as shown in FIG. 8, or may simply meander a flow path (not shown).
[0033]
Further, the cooling fluid passage 5a of the heat radiating cases 1 and 2 does not have to be the entire outer peripheral portion of the heat radiating cases 1 and 2, but may be only the front and rear flat portions as shown in FIG. Instead of providing fin shapes on the outer surfaces of the cases 1 and 2, it is also possible to provide a cooling fluid passage 5a on the outer walls of the heat radiating cases 1 and 2 and circulate the cooling fluid as shown in FIG. Further, the cooling fluid is not limited to LLC, but may be water, chlorofluorocarbon, or the like, and the pumping direction of the cooling fluid may be opposite to that in the above-described embodiment.
[Brief description of the drawings]
FIG. 1 is a perspective view of a substrate cooling device according to an embodiment of the present invention.
FIG. 2 is an exploded view of the substrate cooling device of FIG.
FIG. 3 is a horizontal sectional view of the substrate cooling device of FIG. 1;
FIG. 4 is a schematic diagram illustrating a flow of a cooling fluid in the substrate cooling device of FIG. 1;
FIG. 5 is an explanatory diagram showing an example of use of the substrate cooling device in the first embodiment of the present invention.
FIG. 6 is a perspective view showing an example of use of a substrate cooling device according to a second embodiment of the present invention.
FIG. 7 is a schematic diagram illustrating a flow of a cooling fluid in the substrate cooling device of FIG. 6;
FIG. 8 is a horizontal sectional view showing another embodiment of the substrate cooling device.
[Explanation of symbols]
1, 2 heat dissipation case (heat dissipation case)
3 water cooling unit (cooling heat exchanger)
3b Cooling water channel (cooling fluid channel)
5 Heat radiation fins (heat radiation protrusions)
5a Cooling water passage (cooling fluid passage)
6-9 substrate (cooling target)
10 CPU (electronic parts)

Claims

A flat cooling heat exchanger (3) through which a cooling fluid flows,
A cooled body (6.7) that is attached to one and the other surface of the cooling heat exchanger (3) in a good heat transfer state and generates heat by operation;
A heat radiating housing (1.2) having a cooling fluid passage (5a) through which the cooling fluid flows formed on an outer wall;
The cooling heat exchanger (3) to which the object to be cooled (6.7) is attached is surrounded by the heat radiating housing (1.2), and the cooling heat exchanger (3) and the heat radiating housing inside are surrounded. The cooling fluid is circulated through the cooling fluid passage (5a) formed in (1.2) to absorb heat of the object to be cooled (6.7) in the cooling heat exchanger (3). A substrate cooling device, wherein heat is radiated from the outer surface of the heat radiating housing (1, 2) to the atmosphere.

A flat cooling heat exchanger (3) through which a cooling fluid flows,
First and second cooled bodies (6.7) that are attached to one and the other surface of the cooling heat exchanger (3) in a good heat transfer state and generate heat by operation;
First and second heat radiating housings (1.2) each having an outer wall formed with a cooling fluid passage (5a) through which the cooling fluid flows;
A third / fourth cooling object (8.9) which is attached to the inside of the first and second heat radiating housings (1.2) in a good heat transfer state and generates heat by operation;
The cooling heat exchanger (3) to which the first and second objects to be cooled (6.7) are attached is connected to the first and second heat exchangers to which the third and fourth objects to be cooled (8.9) are attached. A cooling fluid passage formed in the cooling heat exchanger (3) and the first and second heat dissipating casings (1.2), which are surrounded by a second heat dissipating casing (1.2) from front and rear. (5a), the cooling fluid is circulated, and the heat of the first to fourth cooled objects (6 to 9) is transferred to the cooling heat exchanger (3) and the first and second heat radiating housings. A substrate cooling device, wherein heat is absorbed at (1.2) and the heat is radiated from the outer surfaces of the first and second heat radiating housings (1.2) to the atmosphere.

The substrate cooling device according to claim 1 or 2, wherein the inside of the cooling heat exchanger (3) is partitioned into a plurality of cooling fluid channels (3b).

4. The substrate cooling device according to claim 1, wherein the heat radiating housing is formed of a metal having good heat conductivity.

The substrate cooling device according to any one of claims 1 to 4, wherein a heat radiation protrusion (5) is formed on an outer surface of the heat radiation housing (1.2).

The substrate cooling device according to claim 5, wherein the cooling fluid passage (5a) is formed inside the heat radiation protrusion (5).

The said 1st-4th to-be-cooled body (6-9) is a board | substrate which mounted the electronic component (10) which has the characteristic which is easy to generate | occur | produce by operation | movement, and is easy to thermally deteriorate, or an electronic device. The substrate cooling device according to any one of claims 1 to 6.