CN217985804U - Heat dissipation system and electronic device with same - Google Patents

Abstract

The utility model provides a cooling system and have this cooling system's electron device for solve current liquid cooling heat radiation module and lead to the not good problem of radiating efficiency because of the mounted position changes. The method comprises the following steps: the liquid cooling radiator is used for being thermally connected with a heating source and internally provided with a working fluid; the first heat dissipation module is communicated with the liquid cooling radiator; the second heat dissipation module is communicated with the liquid cooling radiator and the first heat dissipation module, and the second heat dissipation module and the first heat dissipation module are positioned at different horizontal heights; and a pipe group, which is connected in series with the liquid cooling radiator, the first heat dissipation module and the second heat dissipation module, wherein the working fluid circularly flows among the liquid cooling radiator, the first heat dissipation module and the second heat dissipation module.

Description

Heat dissipation system and electronic device with same

Technical Field

The present invention relates to a heat dissipation device and an electronic device, and more particularly to a heat dissipation system and an electronic device having the same.

Background

In order to avoid local overheating of an electronic device, the current heat dissipation modes of electronic devices such as desktop computers, notebook computers and the like mainly include that a liquid cooling heat dissipation module is arranged in the electronic device, the liquid cooling heat dissipation module can be attached to a heat generation area of the electronic device, the existing liquid cooling heat dissipation module can be provided with a working chamber, and the working chamber can be filled with a working fluid; therefore, heat energy generated by the heating area can be diffused to the liquid cooling heat dissipation module, so that the heat energy is effectively prevented from being gathered in the heating area, and the heat dissipation effect can be realized.

However, when the conventional liquid cooling module is applied to a projector, the projector often needs to be set differently in accordance with the use environment, for example, the projector can be horizontally placed on a desktop or hung from a ceiling, so that the liquid cooling module disposed in the projector can change the form of the liquid cooling module disposed in the projector after being turned over, which results in a limited heat dissipation effect of the liquid cooling module on the heating area and poor heat dissipation performance.

Accordingly, there is a need for an improved liquid-cooled heat dissipation module.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present invention provides a heat dissipation system, which can provide a good heat dissipation effect regardless of the use status of the heat dissipation system when the heat dissipation system is turned over due to the external environment.

The present invention provides a heat dissipation system, which has the advantages of simple structure and easy assembly.

It is still another object of the present invention to provide a heat dissipation system, which can reduce the manufacturing cost.

It is still another object of the present invention to provide a heat dissipation system, which has better heat dissipation effect.

In the present invention, the directions or the similar terms thereof, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., refer to the directions of the drawings, and the directions or the similar terms thereof are only used to assist the explanation and understanding of the embodiments of the present invention, but not to limit the present invention.

The components and members described throughout the present invention use the term "a" or "an" only for convenience and to provide a general meaning of the scope of the present invention; in the present invention, the term "comprising" should be interpreted as including one or at least one, and the singular includes the plural unless it is obvious that it means otherwise.

The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.

The utility model discloses a heat dissipation system, include: the liquid cooling radiator is used for being thermally connected with a heating source and internally provided with a working fluid; the first heat dissipation module is communicated with the liquid cooling radiator; the second heat dissipation module is communicated with the liquid cooling radiator and the first heat dissipation module, and the second heat dissipation module and the first heat dissipation module are positioned at different horizontal heights; and a pipe group, which is connected in series with the liquid cooling radiator, the first heat dissipation module and the second heat dissipation module, wherein the working fluid circularly flows along the liquid cooling radiator, the first heat dissipation module and the second heat dissipation module.

The utility model discloses an electronic device, include: a housing; an electronic module, which is arranged in the casing, and the heating source is positioned in the electronic module; and the heat dissipation system is arranged in the shell, and a heat source connecting surface of the liquid cooling radiator is thermally connected with the heating source.

Therefore, the utility model discloses a cooling system and have this cooling system's electronic device, utilize this cooling system to have this first heat dissipation module and this second heat dissipation module, and this second heat dissipation module is located different level with this first heat dissipation module, therefore, the phase change of usable this working fluid is up during the evaporation, and utilize the difference in height of this first heat dissipation module and this second heat dissipation module to make this working fluid flow backward down during the condensation, this electronic device receives external environment's demand and overturns its user state, this working fluid can all fully absorb the heat energy of this source that generates heat, and then help this electronic module heat dissipation in order to maintain appropriate operating temperature, can avoid this electronic module's operating temperature too high, can reach the effect that provides good heat dissipation efficiency. In addition, because this second thermal module and this first thermal module are located different level, can make this working fluid natural circulation flow through the difference in height of this second thermal module and this first thermal module, consequently, the utility model discloses cooling system does not need to set up a pumping in addition, has the effect that can reduce manufacturing cost and save space.

The liquid cooling radiator can be provided with a body which can be thermally connected with the heating source. Therefore, the structure is simple and convenient to manufacture, and the manufacturing cost is reduced.

The liquid cooling radiator can be provided with a first sealing cover and a second sealing cover, and the first sealing cover and the second sealing cover can be respectively combined at two ends of the body. Therefore, the structure is simple and convenient to assemble.

The first cover can have a first containing groove therein, the second cover can have a second containing groove therein, and the first containing groove and the second containing groove can be communicated. Therefore, the working fluid in the second container at the lower position can absorb heat energy from liquid state to evaporate into gaseous state and upwards enter the first container at the higher position, so that the liquid cooling radiator has enough space for the working fluid to evaporate, and has better radiating effect.

The liquid cooling radiator is provided with a radiating fin group which is positioned in the body. Therefore, the heat energy in the body and the radiating fin group have more contact areas, and the radiating fin group has better radiating effect.

Wherein, the liquid cooling radiator can be L-shaped. Therefore, the liquid cooling radiator can be easily matched with the position of the heating source, and has the effect of convenient use.

The first heat dissipation module can be provided with a first box body and a first heat dissipation pipe body, and two ends of the first heat dissipation pipe body can be communicated with the first box body. Therefore, the working fluid can be condensed from gas state to liquid state in the first radiating pipe, so that the temperature of the working fluid in the first radiating pipe is reduced, and the effect of better radiating effect is achieved.

The first heat dissipation module can have a first fin unit, and the first heat dissipation tube can contact the first fin unit. Therefore, the first fin unit can take away the heat energy transferred to the first heat radiation pipe body by the working fluid, and the heat radiation pipe has the effect of good heat exchange efficiency.

The second heat dissipation module can be provided with a second box body and a second heat dissipation pipe body, and two ends of the second heat dissipation pipe body can be communicated with the second box body. Therefore, the working fluid can be condensed from gas state to liquid state in the second radiating pipe, so that the temperature of the working fluid in the second radiating pipe is reduced, and the effect of better radiating effect is achieved.

The second heat dissipation module is provided with a second fin unit, and the second heat dissipation tube body can contact with the second fin unit. Therefore, the second fin unit can take away the heat energy transferred to the second heat radiation pipe body by the working fluid, and the heat radiation pipe has the effect of good heat exchange efficiency.

The first pipe can be communicated with the liquid cooling radiator and the first heat dissipation module, the second pipe can be communicated with the first heat dissipation module and the second heat dissipation module, and the third pipe can be communicated with the second heat dissipation module and the liquid cooling radiator. Therefore, the structure is simple and convenient to manufacture, and the effect of reducing the manufacturing cost is achieved.

The liquid cooling radiator can be provided with a base and an upper cover, the upper cover can be combined with the base to form a working chamber together, and the working chamber is filled with working fluid. Therefore, the structure is simple and convenient to assemble.

The liquid cooling radiator can be provided with a radiating fin group which is positioned in the working chamber. Therefore, the heat energy in the working chamber and the radiating fin group have more contact areas, and the radiating fin group has better radiating effect.

The working fluid may be a low boiling point phase change fluid. Therefore, the circulation speed of the gas-liquid phase of the working fluid can be increased, and the effect of better heat dissipation is provided.

Wherein the working fluid may be a non-conductive liquid. Therefore, even if the working liquid leaks, the short circuit of the system circuit can not be generated.

The working fluid which forms liquid state and is positioned in the liquid cooling radiator can cover the local part of the heating source. Therefore, the heat dissipation structure has the effect of better heat dissipation effect.

Wherein, the working fluid which forms liquid state and is positioned in the liquid cooling radiator can cover the whole heating source. Therefore, the heat dissipation structure has the effect of better heat dissipation effect.

The first heat dissipation module can be higher than the second heat dissipation module. Therefore, the working fluid is evaporated from a liquid state to a gas state and upwards enters the first containing groove, the working fluid can be condensed from the gas state to the liquid state in the first radiating module and naturally drops to the second radiating module at a lower position, the liquid working fluid is formed and then flows into the liquid cooling radiator, the working fluid can naturally and circularly flow through the height difference between the second radiating module and the first radiating module, and the manufacturing cost can be reduced.

The second heat dissipation module can be higher than the first heat dissipation module. Therefore, the working fluid is evaporated from a liquid state to a gas state and enters the second containing groove upwards, the working fluid can be condensed from the gas state to the liquid state in the second heat dissipation module and naturally drops to the first heat dissipation module at a lower position, the liquid working fluid is formed and then flows into the liquid cooling radiator, the working fluid can naturally and circularly flow through the height difference between the second heat dissipation module and the first heat dissipation module, and the manufacturing cost can be reduced.

The utility model discloses a cooling system can wrap a fan unit in addition, and this fan unit can be located between this first heat dissipation module and this second heat dissipation module. Therefore, the fan component can guide airflow so as to take away heat energy transferred to the first heat dissipation module or the second heat dissipation module from the liquid cooling radiator, and has the effect of good heat dissipation efficiency.

Wherein, the electronic device is a projector. Thus, the utility model has the effect of convenient use.

Drawings

FIG. 1: the utility model discloses a perspective view of a preferred embodiment of the electronic device;

FIG. 2: the utility model discloses an exploded perspective view of a first embodiment of a heat dissipation system;

FIG. 3: the utility model discloses a top view of a first embodiment of a heat dissipation system;

FIG. 4: base:Sub>A cross-sectional view taken along line A-A of FIG. 3;

FIG. 5: the utility model discloses a use situation diagram of an electronic device hung at a fixed position;

FIG. 6: the utility model discloses a usage situation diagram of the electronic device placed on the desktop;

FIG. 7: the utility model discloses the decomposition perspective of cooling system second embodiment.

Description of the reference numerals

[ utility model ] to solve the problems

Liquid cooling radiator

11: main body

11a heat source connection surface

12 first cover

13 second cover

14 radiating fin group

15 first circulation port

16: second circulation opening

17, a base

171 bottom surface

18, an upper cover

2: first heat radiation module

21 the first box body

21a first communication port

21b second communication port

22 the first heat-dissipating tube

First fin unit

3: second heat radiation module

31 second case

31a first inlet/outlet

31b second inlet/outlet

32: second heat dissipation tube body

33 second Fin Unit

4: pipe fitting set

41 first pipe fitting

42 second pipe fitting

43 third pipe fitting

5: fan assembly

6: casing

7 electronic module

E electronic device

L working fluid

H heating source

J heat dissipation system

S1, first containing groove

S2, a second containing groove

T is a working chamber.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below; in addition, the same reference numerals are used in different drawings to designate the same elements, and the description thereof will be omitted.

Please refer to fig. 2, which is a first embodiment of the heat dissipation system J of the present invention, including a liquid cooling radiator 1, a first heat dissipation module 2, a second heat dissipation module 3 and a pipe assembly 4, wherein the first heat dissipation module 2 communicates with the liquid cooling radiator 1, the second heat dissipation module 3 communicates with the liquid cooling radiator 1 and the first heat dissipation module 2, and the pipe assembly 4 connects the liquid cooling radiator 1, the first heat dissipation module 2 and the second heat dissipation module 3 in series.

Referring to fig. 2 and fig. 4, the liquid-cooled heat sink 1 is filled with a working fluid L, and the liquid-cooled heat sink 1 can be thermally connected to at least one heat generating source H. The utility model discloses do not restrict the form of this liquid cooling radiator 1, for example, the liquid cooling radiator 1 of this embodiment can cooperate this at least one position of generating heat source H and generally become the L type, this liquid cooling radiator 1 can have a body 11, this body 11 can become the cavity form, this body 11 has a heat source and connects face 11a, this heat source is connected face 11a hot junction in this generating heat source H, and this working fluid L's liquid level preferred can be located this body 11 department, this generating heat source H can be local to being located this working fluid L, make this working fluid L that is arranged in this liquid cooling radiator 1 liquid form can cover this generating heat source H's part, better, can make this working fluid L's liquid level of this working fluid L be higher than this generating heat source H, make this working fluid L that is arranged in this liquid cooling radiator 1 liquid form can cover whole this generating heat source H, make this generating heat source H's heat energy can transmit to the working fluid L in this liquid cooling radiator 1.

Referring to fig. 4, the working fluid L may be water or other liquid, and preferably, the working fluid L may be alcohol, fluorinated liquid or other low-boiling point phase change liquid, so that the working fluid L can absorb heat energy from a liquid state and evaporate into a gaseous state, thereby utilizing a gas-liquid phase change mechanism to realize heat energy transfer. The working fluid L may be a non-conductive liquid, so that even if the working fluid L leaks, the electric line is not short-circuited, and the working fluid L can be safely used.

Referring to fig. 2 and fig. 3, in addition, the liquid-cooled heat sink 1 may have a first cover 12 and a second cover 13, the first cover 12 and the second cover 13 are respectively combined to two ends of the main body 11, the first cover 12 has a first receiving cavity S1 therein, the second cover 13 has a second receiving cavity S2 therein, the first receiving cavity S1 is communicated with one end of the main body 11, and the second receiving cavity S2 is communicated with the other end of the main body 11, so that the first receiving cavity S1 is communicated with the second receiving cavity S2.

Moreover, the liquid cooling radiator 1 preferably further has a heat dissipating fin set 14, the heat dissipating fin set 14 is located in the body 11, the heat dissipating fin set 14 can be formed by bending a single-sheet fin or by stacking and fastening multiple fins, so that the present invention is not limited, and thus, the heat energy in the body 11 and the heat dissipating fin set 14 can have more contact area, and the heat dissipating effect can be improved.

Referring to fig. 4, the liquid-cooled heat sink 1 may further include a first vent 15 and a second vent 16, the first vent 15 may be located on the second cover 13, the second vent 16 may be located on the first cover 12, the first vent 15 and the second vent 16 may allow the working fluid L to flow in or out, in this embodiment, the first vent 15 may allow the working fluid L to flow in a direction toward the inside of the liquid-cooled heat sink 1, and the second vent 16 may allow the working fluid L to flow out in a direction away from the liquid-cooled heat sink 1.

Referring to fig. 2 and 4, the first heat dissipation module 2 may have a first box 21 and a first heat dissipation pipe 22, the first box 21 may be used to store liquid, the first box 21 may be circular, rectangular or polygonal, the present invention is not limited thereto, the first box 21 may have a first communication port 21a and a second communication port 21b, the first communication port 21a and the second communication port 21b may be disposed at the same side of the first box 21, the first communication port 21a and the second communication port 21b may be used to allow the working fluid L to flow in or out, in this embodiment, the first communication port 21a may be used to allow the working fluid L to flow in a direction in the first box 21, and the second communication port 21b may be used to allow the working fluid L to flow out in a direction away from the first box 21.

In this embodiment, the first heat dissipating pipe 22 is described as a curved shape, and the first heat dissipating pipe 22 may be formed into a plurality of U-shaped structures, so that the first heat dissipating pipe 22 can have a larger contact area with the surrounding cold air, and a better heat dissipating effect can be achieved.

Moreover, the first heat dissipation module 2 can have a first fin unit 23, the first fin unit 23 can be located at one side of the first box 21, the first fin unit 23 can be formed by bending a single-sheet fin or by stacking, buckling and combining multiple fins, without limitation, the first fin unit 23 can be made of a metal material with a high thermal conductivity to improve the thermal conductivity, the first heat dissipation tube 22 can be combined with the first fin unit 23, so that the first heat dissipation tube 22 can contact the first fin unit 23, in this embodiment, the first heat dissipation tube 22 is illustrated by penetrating through the first fin unit 23; thus, the heat energy transferred to the first heat dissipating tube 22 by the working fluid L can be taken away by the first fin unit 23, so that the temperature of the working fluid L can be lowered.

The second heat dissipation module 3 and the first heat dissipation module 2 are located at different horizontal heights, and the axial projections of the second heat dissipation module 3 and the first heat dissipation module 2 may be overlapped or staggered, in this embodiment, the axial projections of the second heat dissipation module 3 and the first heat dissipation module 2 are overlapped, so that the second heat dissipation module 3 and the first heat dissipation module 2 may be arranged in an up-down symmetrical manner, and the first heat dissipation module 2 may be higher than the second heat dissipation module 3.

In detail, the second heat dissipation module 3 may have a second box 31 and a second heat dissipation pipe 32, the second box 31 may be used to store liquid, the second box 31 may be circular, rectangular or polygonal, the present invention is not limited thereto, the second box 31 may have a first port 31a and a second port 31b, the first port 31a and the second port 31b may be disposed on the same side of the second box 31, the first port 31a and the second port 31b may be used to allow the working fluid L to flow in or out, in this embodiment, the first port 31a may be used to allow the working fluid L to flow in a direction in the second box 31, and the second port 31b may be used to allow the working fluid L to flow out in a direction away from the second box 31.

In this embodiment, the second heat pipe 32 is described as a curved shape, and the second heat pipe 32 may be formed into a plurality of U-shaped structures, so that the second heat pipe 32 can have a large contact area with surrounding cold air, and a good heat dissipation effect can be achieved.

Moreover, the second heat dissipation module 3 may have a second fin unit 33, the second fin unit 33 may be located at one side of the second box 31, the second fin unit 33 may be formed by bending a single-sheet fin or by stacking multiple fins in a buckling manner, the present invention is not limited thereto, the second fin unit 33 may be made of a metal material with a high thermal conductivity to improve the thermal conductivity, the second heat dissipation tube 32 may be combined with the second fin unit 33 to make the second heat dissipation tube 32 contact the second fin unit 33, in this embodiment, the second heat dissipation tube 32 is illustrated as penetrating through the second fin unit 33; thus, the heat energy transferred to the second heat dissipating tube 32 by the working fluid L can be taken away by the second fin unit 33, so that the temperature of the working fluid L can be lowered.

The tube assembly 4 may have a first tube 41, a second tube 42 and a third tube 43, the first tube 41 may communicate with the second opening 16 of the liquid-cooled heat sink 1 and the first opening 21a of the first heat sink module 2, the second tube 42 may communicate with the second opening 21b of the first heat sink module 2 and the first inlet/outlet 31a of the second heat sink module 3, the third tube 43 may communicate with the second inlet/outlet 31b of the second heat sink module 3 and the first opening 15 of the liquid-cooled heat sink 1, the tube assembly 4 has the working fluid L, and the working fluid L circulates along the liquid-cooled heat sink 1, the first heat sink module 2 and the second heat sink module 3.

Referring to fig. 2, 3 and 4, when the heat dissipation system J operates, the heat source connection surface 11a of the liquid-cooled heat sink 1 can be thermally connected to the heat source H, the working fluid L in the liquid-cooled heat sink 1 is concentrated in the second receiving chamber S2, and the liquid level of the working fluid L can be located at the main body 11, and the working fluid L in the liquid-cooled heat sink 1 can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the working fluid L in the liquid-cooled heat sink 1 can absorb heat energy from the heat source H; then, the working fluid L in the gas state can enter the first receiving chamber S1 upward, the working fluid L entering the first receiving chamber S1 upward can flow into the first heat dissipation module 2 through the first pipe 41, and is rapidly condensed from the gas state into the liquid state in the first heat dissipation pipe 22, so that the temperature of the working fluid L in the first heat dissipation pipe 22 is lowered, and the cooled working fluid L can flow into the second tank 31 of the second heat dissipation module 3 through the second pipe 42.

At this time, when a sufficient amount of the working fluid L is accumulated in the second tank 31, the working fluid L can flow into the liquid-cooled radiator 1 through the third pipe 43; the working fluid L can fully absorb the heat energy of the heating source H by continuous circulation, so that the effect of providing good heat dissipation efficiency can be achieved; by arranging the first fin units 23, the heat energy in the first heat dissipating tube 22 and the first fin units 23 can have a larger contact area, thereby improving the heat dissipating effect. It is particularly noted that, in this embodiment, the first heat dissipation module 2 is higher than the second heat dissipation module 3, so that the first heat dissipation module 2 serves as a condenser, that is, the working fluid L evaporates from a liquid state into a gas state and naturally rises to the first container S1 located at a higher position, and the working fluid L naturally drops down to the second heat dissipation module 3 located at a lower position by condensing from the gas state into a liquid state in the first heat dissipation module 2, so as to form the liquid working fluid L and then flows into the liquid cooling radiator 1.

It is stated otherwise that the heat dissipation system J of the present invention may further include a fan assembly 5, the fan assembly 5 may be located between the first heat dissipation module 2 and the second heat dissipation module 3, the fan assembly 5 may guide the air flow, so as to take away the heat energy transferred from the liquid cooling heat sink 1 to the first heat dissipation module 2 or the second heat dissipation module 3, and further have the function of good heat dissipation performance. The fan assembly 5 may be a centrifugal fan, a cross flow fan, an axial flow fan, or the like, and in the present embodiment, the axial flow fan is taken as an example for description, but not limited thereto.

Please refer to fig. 1, which shows a preferred embodiment of the electronic device E of the present invention, including a housing 6, an electronic module 7 and the aforementioned heat dissipation system J, wherein the electronic module 7 and the heat dissipation system J are disposed in the housing 6.

In detail, the electronic device E can be, for example, a notebook Computer, a projector or an Industrial Computer (IPC), the electronic module 7 can be a device that generates heat energy, such as a power supply, a hard disk, a fan, a motherboard, a cpu, a memory, a display adapter, etc., wherein the electronic module 7 that generates high temperature during operation, such as the motherboard, the cpu, the memory, the display adapter, etc., the heat source H is located in the electronic module 7, and the heat source contact surface 11a of the liquid cooling heat sink 1 is thermally connected to the heat source H.

Referring to fig. 2, 4 and 5, in the present embodiment, the electronic device E is described by taking a projector as an example, and the projector can be hung on a fixed place such as a ceiling as shown in fig. 5. In the operation process of the electronic device E (projector), when the temperature of the electronic module 7 rises, the working fluid L in the liquid-cooled heat sink 1 can rapidly absorb the heat energy at the heat source H, the working fluid L can absorb the heat energy from a liquid state and evaporate into a gaseous state, the working fluid L in the gaseous state can enter the first receiving chamber S1 upwards, flow into the first heat dissipation module 2 through the first pipe 41 to cool, flow into the second tank 31 of the second heat dissipation module 3 through the second pipe 42, and finally flow into the liquid-cooled heat sink 1 through the third pipe 43; the continuous circulation can effectively take away the heat energy of the electronic module 7, and further help the electronic module 7 to dissipate heat to maintain a proper working temperature, thereby avoiding the working temperature of the electronic module 7 from being too high and achieving the effect of providing good heat dissipation efficiency.

Referring to fig. 2, 4 and 6, in addition, the electronic device E (projector) may also be placed on a desktop as shown in fig. 6, that is, the electronic device E (projector) is turned over 180 degrees from the mode shown in fig. 5, so that the second cover 13 is located above the first cover 12, and the second heat dissipation module 3 is located above the first heat dissipation module 2. In the operation process of the electronic device E (projector), when the temperature of the electronic module 7 rises, the working fluid L in the liquid-cooled heat sink 1 can rapidly absorb the heat energy at the heat source H, the working fluid L can absorb the heat energy from a liquid state and evaporate into a gaseous state, the working fluid L in the gaseous state can enter the second receiving chamber S2 upwards, the working fluid L entering the second receiving chamber S2 upwards can flow into the second heat dissipation module 3 through the third pipe 43, and is rapidly condensed into a liquid state from the gaseous state in the second heat dissipation pipe 32, so that the temperature of the working fluid L in the second heat dissipation pipe 32 is reduced, and the cooled working fluid L can flow into the first box 21 of the first heat dissipation module 2 through the second pipe 42, and finally, the working fluid L can flow into the liquid-cooled heat sink 1 through the first pipe 41; thus, the heat energy can be effectively taken away from the electronic module 7.

Therefore, the phase change of the working fluid L can be utilized to rise during evaporation, the working fluid L flows back downwards during condensation by utilizing the height difference between the first heat dissipation module 2 and the second heat dissipation module 3, the electronic device E can turn over the use state thereof no matter how the electronic device E is required by the external environment, the working fluid L can fully absorb the heat energy of the heating source H, and further the electronic module 7 is helped to dissipate heat so as to maintain proper working temperature, the working temperature of the electronic module 7 can be prevented from being too high, and the effect of providing good heat dissipation efficiency can be achieved. It is particularly noted that, in the present embodiment, the second heat dissipation module 3 is higher than the first heat dissipation module 2, so that the second heat dissipation module 3 serves as a condenser, i.e., the working fluid L evaporates from a liquid state to a gas state and naturally rises to the second receiving chamber S2 located at a higher position, and the working fluid L naturally drops to the first heat dissipation module 2 located at a lower position after condensing from the gas state to the liquid state in the second heat dissipation module 3, so as to form the liquid working fluid L and then flows into the liquid cooling radiator 1.

Please refer to fig. 7, which shows a second embodiment of the heat dissipation system J of the present invention, the second embodiment of the present invention is substantially the same as the first embodiment described above, in the second embodiment, the liquid cooling heat sink 1 can cooperate with the position of the heat source H to form a lying state, the liquid cooling heat sink 1 can have a base 17 and an upper cover 18, the upper cover 18 can be combined with the base 17, so that a working chamber T can be formed between the upper cover 18 and the base 17, the working fluid L is filled in the working chamber T, the heat source connecting surface 11a can be located on the bottom surface 171 of the base 17, the heat source connecting surface 11a directly or indirectly contacts the heat source H, the first circulation port 15 can be located on the base 17, the second circulation port 16 can be located on the upper cover 18, and the first circulation port 15 and the second circulation port 16 are located at two ends of the liquid cooling heat sink 1, respectively.

When the heat dissipation system J is in operation, the bottom surface 171 of the liquid cooling radiator 1 can be thermally connected to the heat source H, and the working fluid L in the working chamber T can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the working fluid L in the working chamber T can absorb heat energy from the heat source H; then, the working fluid L forming the gas state can flow upward and flow into the first heat dissipation module 2 through the first pipe 41, the working fluid L can be rapidly condensed from the gas state into the liquid state in the first heat dissipation pipe 22, so that the temperature of the working fluid L in the first heat dissipation pipe 22 is reduced, and after the working fluid L after being cooled can flow into the second box 31 of the second heat dissipation module 3 through the second pipe 42, the working fluid L can flow into the working chamber T through the third pipe 43; the working fluid L can fully absorb the heat energy of the heating source H by continuously circulating in this way, and the effect of providing good heat dissipation efficiency can be achieved.

In addition, in this embodiment, the number of the fan assemblies 5 may be two, two fan assemblies 5 are respectively disposed above the first heat dissipation module 2 and below the second heat dissipation module 3, and the two fan assemblies 5 respectively guide the air flows of the first heat dissipation module 2 and the second heat dissipation module 3, so as to take away the heat energy transferred from the liquid-cooled heat sink 1 to the first heat dissipation module 2 and the second heat dissipation module 3, thereby further having a good heat dissipation effect.

To sum up, the utility model discloses a cooling system and have this cooling system's electronic device, utilize this cooling system to have this first heat radiation module and this second heat radiation module, and this second heat radiation module is located different level with this first heat radiation module, therefore, the phase change of usable this working fluid is up during the evaporation, and utilize the difference in height of this first heat radiation module and this second heat radiation module to make this working fluid flow backward down when the condensation, this electronic device is whatever receives external environment's demand and overturns its user state, this working fluid can all fully absorb the heat energy of this source that generates heat, and then help this electronic module heat dissipation in order to maintain appropriate operating temperature, can avoid this electronic module's operating temperature too high, can reach the effect that provides good radiating efficiency. In addition, because this second heat dissipation module is located different level with this first heat dissipation module, can make this working fluid natural circulation flow through this second heat dissipation module and this first heat dissipation module's difference in height, consequently, the utility model discloses cooling system need not set up a pumping in addition, has the effect that can reduce manufacturing cost and save space.

Claims (22)

1. A heat dissipation system, comprising:

a liquid-cooled radiator for thermally connecting a heating source, the liquid-cooled radiator having a working fluid therein;

the first heat dissipation module is communicated with the liquid cooling radiator;

the second heat dissipation module is communicated with the liquid cooling radiator and the first heat dissipation module, and the second heat dissipation module and the first heat dissipation module are positioned at different horizontal heights; and

and the pipe group is connected in series with the liquid cooling radiator, the first radiating module and the second radiating module, and the working fluid circularly flows along the liquid cooling radiator, the first radiating module and the second radiating module.

2. The heat dissipating system of claim 1, wherein the liquid-cooled heat sink has a body thermally coupled to the heat generating source.

3. The heat dissipating system of claim 2, wherein the liquid-cooled heat sink has a first cover and a second cover, the first cover and the second cover being attached to the two ends of the body, respectively.

4. The heat dissipating system of claim 3, wherein the first cover has a first receiving slot therein, the second cover has a second receiving slot therein, and the first receiving slot is in communication with the second receiving slot.

5. The heat dissipating system of claim 2, wherein the liquid-cooled heat sink has a set of heat dissipating fins located within the body.

6. The heat dissipating system of claim 1, wherein the liquid-cooled heat sink is L-shaped.

7. The heat dissipation system of claim 1, wherein the first heat dissipation module has a first housing and a first heat dissipation tube, and two ends of the first heat dissipation tube are connected to the first housing.

8. The heat dissipating system of claim 7, wherein the first heat dissipating module has a first fin unit, the first heat dissipating tube contacting the first fin unit.

9. The heat dissipation system of claim 1, wherein the second heat dissipation module has a second housing and a second heat dissipation tube, and two ends of the second heat dissipation tube are connected to the second housing.

10. The heat dissipating system of claim 9, wherein the second heat dissipating module has a second fin unit, and the second heat dissipating tube contacts the second fin unit.

11. The heat dissipation system of claim 1, wherein the set of pipes includes a first pipe, a second pipe, and a third pipe, the first pipe communicates the liquid-cooled heat sink with the first heat dissipation module, the second pipe communicates the first heat dissipation module with the second heat dissipation module, and the third pipe communicates the second heat dissipation module with the liquid-cooled heat sink.

12. The heat dissipating system of claim 1, wherein the liquid-cooled heat sink has a base and a top cover that combines with the base to form a working chamber, the working chamber being filled with the working fluid.

13. The heat dissipating system of claim 12, wherein the liquid-cooled heat sink has a set of heat dissipating fins located in the working chamber.

14. The heat dissipating system of claim 1, wherein the working fluid is a low boiling point phase change fluid.

15. The heat dissipating system of claim 1, wherein the working fluid is a non-conductive liquid.

16. The heat dissipating system of claim 1, wherein the working fluid in the liquid-cooled heat sink forming a liquid state covers a portion of the heat generating source.

17. The heat dissipating system of claim 1, wherein the working fluid in the liquid-cooled heat sink forming a liquid state covers the entire heat generating source.

18. The heat dissipation system of claim 1, wherein the first heat dissipation module is higher than the second heat dissipation module.

19. The heat dissipation system of claim 1, wherein the second heat dissipation module is higher than the first heat dissipation module.

20. The heat dissipation system of any one of claims 1-19, further comprising a fan assembly positioned between the first heat dissipation module and the second heat dissipation module.

21. An electronic device, comprising:

a housing;

an electronic module, which is arranged in the casing, wherein the heating source is positioned in the electronic module; and

a heat dissipation system as recited in any one of claims 1-20 disposed in the enclosure, a heat source connection surface of the liquid-cooled heat sink being thermally coupled to the heat generating source.

22. The electronic device of claim 21, wherein the electronic device is a projector.

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