TWI414233B - Heat dissipation device and method for assembling the same - Google Patents

Abstract

A heat dissipation device includes a heat sink and a pair of first heat pipes thermally connected with the heat sink. Each of the first heat pipes includes an evaporating section and a condensing section. The heat sink includes a pair of first fin assemblies and a pair of second fin assemblies. The first fin assemblies and the second fin assemblies are assembled together on an alternate manner. Each of the first fin assemblies is located between the second fin assemblies. Each of the second fin assemblies is located between the first fin assemblies. Each of the first and second fin assemblies defines a receiving groove. Each of the second fin assemblies further defines a cutout communicated with the receiving groove thereof. A portion of the condensing section of the first heat pipe is received in the receiving groove of the first fin assembly. The other portion of the condensing section of the first heat pipe is inserted and received in the receiving groove of the second fin assembly through the cutout. The present invention also relates to a method for assembling the heat dissipation device.

Description

Heat sink and assembly method thereof

The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component and an assembling method thereof.

With the rapid development of the electronics industry, the high-speed, high-frequency and integration of electronic components (such as central processing units) has caused a sudden increase in heat generation. In order to efficiently remove the heat generated by electronic components in a limited space, the industry usually A heat sink is attached to the electronic component.

The heat dissipating device generally comprises a heat sink and a heat pipe combined with the heat sink, the heat pipe is arranged in a plurality of stages to increase the contact area between the heat pipe and the heat sink, and improve the heat conduction efficiency of the heat dissipating device. When the heat pipe is set in a plurality of stages, it is difficult to combine with the heat sink, which makes assembly of the heat sink difficult. Therefore, it needs to be improved.

In view of this, it is necessary to provide a heat dissipating device that is easy to assemble and a method of assembling the same.

A heat dissipation device includes a heat sink and a pair of first heat pipes, the heat sink In combination with the pair of first heat pipes, each of the first heat pipes includes an evaporation section and a condensation section, the heat sink includes a pair of first fin sets and a pair of second fin sets, the pair of first fin sets and The pair of second fins are arranged offset from each other, and each of the first and second fin sets is provided with a receiving slot, and each of the second fin sets further has an opening, the opening and the second fin set The receiving slots are connected, and one of the condensation sections of each of the first heat pipes is inserted into the receiving groove of the first fin set, and another part of the condensation section of each first heat pipe is entered by the opening of the second fin set and is received in the first slot Inside the receiving slot of the two fin group.

A method for assembling a heat dissipating device includes the steps of: providing a pair of first fin sets and a pair of second fin sets, each of the first and second fin sets being provided with a receiving slot, each second fin An opening is formed in the group, the opening is in communication with the receiving groove of the second fin set; a pair of first heat pipes are provided, each of the first heat pipes includes an evaporation section and a condensation section; and each first heat pipe is condensed The segments are respectively inserted into the receiving slots of the corresponding first fin group, so that both ends of the condensation section of the first heat pipe protrude out of the first fin group; and the second fin group is inserted in the pair first Between the fin sets, the first and second fin assemblies are enclosed in a ring shape, and the condensation section of the first heat pipe is inserted into the receiving groove of the second fin group from the opening on the second fin group.

In the above heat dissipating device, the heat sink is composed of a pair of first fin sets and a pair of second fin sets. When the heat dissipating device is assembled, the first heat pipe may be first inserted into the first fin set, and then Combining the second fin group with the first heat pipe solves the problem that the curved heat pipe is difficult to assemble, and not only facilitates the assembly of the first heat pipe, but also makes full use of the space.

10‧‧‧Substrate

13‧‧‧ Groove

20‧‧‧heat pipe combination

21‧‧‧First heat pipe

23‧‧‧ second heat pipe

211, 231‧‧Evaporation section

212, 232‧‧ ‧ Condensation section

213, 233‧‧‧ Connection section

30‧‧‧ radiator

31‧‧‧First fin set

311‧‧‧First fin

315‧‧‧First receiving hole

316‧‧‧Second receiving hole

325‧‧‧First storage trough

326‧‧‧Second holding trough

33‧‧‧second fin set

331‧‧‧second fin

312, 332‧‧ ‧ air passage

313, 333‧‧‧ ontology

314, 334‧‧‧ extensions

335‧‧‧ receiving holes

317, 337‧‧‧Add slots

318, 338, 35‧ ‧ steps

319, 339, 37‧‧‧ card slots

320, 340‧‧‧ step folding

321, 341‧‧‧ Pressurized folding

344‧‧‧ gap

345‧‧‧ receiving trough

347‧‧‧ openings

36‧‧‧step surface

38‧‧‧Supercharger

39‧‧‧ accommodating space

40‧‧‧thermal column

50‧‧‧fan

51‧‧‧Fan frame

511‧‧‧ bearing seat

512‧‧‧Fixed frame

513‧‧‧Support frame

514‧‧‧Fixed Arm

515‧‧‧ hook

52‧‧‧ Impeller

1 is a perspective assembled view of a heat sink according to a first preferred embodiment of the present invention.

2 is an exploded view of the heat sink shown in FIG. 1.

3 is a schematic view showing the combination of a heat pipe and a base in the heat sink of FIG. 1.

4 is a perspective enlarged view of the first fin set in the heat sink shown in FIG. 1.

FIG. 5 is a perspective enlarged view of a second fin set in the heat sink of FIG. 1. FIG.

Figure 6 is a perspective enlarged view of the fan in the heat sink of Figure 1.

FIG. 7 is a view showing a state in which the first and second heat pipes and the first and second fin groups are assembled in the heat dissipating device shown in FIG. 1.

Fig. 8 is a view showing a state in which a fan is assembled in the heat sink shown in Fig. 1.

Figure 9 is a perspective assembled view of a heat pipe in a heat sink according to a second preferred embodiment of the present invention.

FIG. 10 is a schematic view showing the heat pipe and the base in the heat dissipation device shown in FIG. 9. FIG.

1 and 2 show a heat dissipating device in a first embodiment of the present invention for dissipating heat from a heat-generating electronic component (not shown) such as a central processing unit. The heat dissipating device comprises a substrate 10, a heat pipe combination 20 combined with the substrate 10, a heat sink 30 combined with the heat pipe assembly 20, a heat conducting column 40 disposed between the heat sink 30, and the heat sink 30 disposed at the heat sink 30. One of the fans 50.

The substrate 10 is a metal plate body having good thermal conductivity, such as a copper plate, an aluminum plate, or the like. The lower surface of the substrate 10 is for thermal contact with the heat-generating electronic component, and the substrate 10 Four grooves 13 are provided on the upper surface, and the grooves 13 are disposed in parallel with each other for accommodating the heat pipe assembly 20.

Referring to FIG. 3 at the same time, the heat pipe assembly 20 includes a pair of first heat pipes 21 located above and a pair of second heat pipes 23 located below. The first heat pipe 21 and the second heat pipe 23 are each bent into a body shape.

Each of the first heat pipes 21 includes an evaporation section 211, a condensation section 212, and a connection section 213 connecting the evaporation section 211 and the condensation section 212. The evaporation section 211 has a flat flat shape and is received in a groove 13 on the outermost side of the substrate 10. The connecting section 213 is formed by one end of the evaporation section 211 being inclined upwardly, that is, extending integrally away from the evaporation section 211. The condensation section 212 is substantially semi-circular in shape and is formed by a free end of the connecting section 213 extending in a counterclockwise direction of the circumference. The plane in which the condensation section 212 is located is parallel to the evaporation section 211.

Each of the second heat pipes 23 has a structure similar to that of the first heat pipes 21. Each of the second heat pipes 23 also includes an evaporation section 231, a condensation section 232, and a connection section 233. The inclination of the connection section 233 is substantially the same as the inclination angle of the connection section 213 of the first heat pipe 21. The second heat pipe 23 is different from the first heat pipe 21 in that the length of the connecting section 233 of the second heat pipe 23 is smaller than the length of the connecting section 213 of the first heat pipe 21, and thus the condensation section 232 of the second heat pipe 23. The vertical distance from the evaporation section 231 is smaller than the vertical distance between the condensation section 212 of the first heat pipe 21 and the evaporation section 211, that is, the condensation section 232 of the second heat pipe 23 is located below the condensation section 212 of the first heat pipe 21. The plane of the condensation section 232 of the second heat pipe 23 is parallel to the plane of the condensation section 212 of the first heat pipe 21. The connecting portion 233 of the second heat pipe 23 is received in a recess 13 on the inner side of the substrate 10.

The heat sink 30 is annular and includes a pair of first fin sets 31 and a pair of second fin sets 33.

Referring to FIG. 4, each of the first fins 31 has a fan shape, and is formed by stacking a plurality of first fins 311. The first fins 311 are each in a sheet shape, and each of the first fins 311 includes a first fin 311. The body 313 and an extension portion 314. The body 313 is substantially square, and has a first receiving hole 315 and a second receiving hole 316 extending through the body 313. The first receiving hole 315 is disposed above the second receiving hole 316. Two additional slots 317 corresponding to the first and second receiving holes 315, 316 are respectively disposed upwardly, and each of the adding slots 317 communicates with the corresponding receiving hole and the outer end of the body 313 to facilitate the first When the second heat pipes 21, 23 are welded to the first fin group 31, solder is added (not shown). The extending portion 314 is integrally formed by the top of the body 313 at the outer end. The inner end of the extending portion 314 is provided with a step portion 318 and a card slot 319. The extending portion 314 is located above the step portion 318. The width of the extension portion 314 is less than the width of the portion of the extension portion 314 below the step portion 318. The card slot 319 is disposed under the step portion 318 and has a substantially triangular shape. The upper side of the card slot 319 is parallel to the step portion 318. The slot 319 and the step portion 318 are used to fix the fan 50. The outer side end of the extending portion 314 and the step portion 318 are respectively disposed to extend vertically forward to form a pressurizing flange 321 and a step flange 320. The pressurizing flange 321 is for increasing the wind pressure of the fan 50 for abutting the fan 50.

When the first fins 311 are stacked and arranged to form the fan-shaped heat dissipation fin group 31, an air flow channel 312 is formed between each adjacent two first fins 311, and each of the first fins 311 is formed. The first receiving hole 315 of the first fin group 311 is formed by the first receiving hole 315 of the first fin group 311, and the second receiving hole 315 of each of the first fins 311 forms the first fin group 31. The second receiving slots 326, the first and second receiving slots 325, 326 are all curved to receive the condensation sections 212, 232 of the first and second heat pipes 21, 23, respectively.

Referring to FIG. 5, each of the second fin sets 33 has a structure similar to that of the first fin set 31. Each of the second fin sets 33 is formed by stacking a plurality of second fins 331 , and an air flow channel 332 is formed between each adjacent two second fins 331 . Each of the second fins 331 includes a body 333 and an extension portion 334 . The extension portion 334 of each of the second fins 331 has the same structure as the extension portion 314 of the first fin 311 , and includes a step portion 338 and a The card slot 339, the outer side end of the extending portion 334 and the position of the step portion 338 are respectively provided with a pressurizing flange 341 and a step flange 340. The body 331 of each of the second fins 331 is different from the body 311 of the first fin 311 in that the body 333 of each of the second fins 331 has a substantially triangular shape, and the two right-angled sides of the triangle are respectively located in the second shape. A receiving hole 335 is formed in the body 333 of the second fin 331 , and the receiving hole 335 is connected to the notch 344 . The receiving portion 335 is connected to the notch 344 . . When the second fins 331 are stacked and arranged to form the second fin set 33, the notches 344 on the body 333 of each of the second fins 331 together form an opening 347 on the body 333 of the second fin set 33, The receiving holes 335 of each of the second fins 331 form a receiving groove 345 of the second fin set 33. The receiving groove 345 is curved, and corresponds to the first receiving groove 325 of the first fin set 31. For accommodating the condensation section 212 of the first heat pipe 21, the receiving The slot 345 is in communication with the opening 347, so that the first heat pipe 31 enters the receiving groove 345 from the opening 347 during assembly.

Referring to FIG. 2, the heat conducting column 40 has a cylindrical shape and is made of a material having good thermal conductivity, such as copper or aluminum, and is disposed between the first and second fin sets 31, 33 of the heat sink 30.

Referring to FIG. 6 , the fan 50 is fixed to the heat sink 30 and includes a frame 51 and an impeller 52 disposed on the frame 51 . The frame 51 includes a carrier 511 in the middle, a fixing frame 512 at the periphery, and a plurality of support frames 513 connecting the fixing frame 512 and the carrier 511. The mounting bracket 511 is configured to carry the impeller 52. The fixing frame 512 is annular, and extends vertically downward to form a plurality of fixed arms 514. The fixed arms 514 are equally spaced on the fixing frame 512, and each fixed arm is disposed. The free end of the 514 is provided with a hook portion 515 protruding from the fixing arm 514 in the radial direction of the fixing frame 512, the hook portion 515 and the first and second fin groups 31, 33 of the heat sink 30. The upper card slots 319, 339 cooperate to fix the fan 50 to the heat sink 30.

Referring to FIG. 7 and FIG. 8 simultaneously, during assembly, the condensation sections 212 of the pair of first heat pipes 21 are respectively inserted in the opposite direction and welded into the first receiving slots 325 of the pair of first fin sets 31, the pair The condensation sections 232 of the two heat pipes 23 are respectively inserted in the opposite direction and welded in the second receiving grooves 326 of the pair of first fin sets 31, wherein the condensation sections 212, 232 of the first and second heat pipes 21, 23 are respectively The ends project out of the first fin set 31. The first fin group 31 and the first and second heat pipes 21 and 23 are placed on the substrate 10, and the evaporation sections 211 and 231 (refer to FIG. 3) of each of the first and second heat pipes 21 and 23 are respectively accommodated. a recess welded to the substrate 10 In the tank 13, wherein the evaporation section 211 of the first heat pipe 21 is located between the evaporation sections 231 of the second heat pipe 23, and the condensation section 212 of each first heat pipe 21 is located in the same horizontal plane as the condensation section 212 of the other first heat pipe 21. The condensation section 232 of each second heat pipe 23 and the condensation section 232 of the other second heat pipe 23 are also located in the same horizontal plane, and the first fin sets 31 are oppositely disposed at a certain distance. The second fin set 33 is inserted into the space formed between the two first fin sets 31 from above and below, and the condensation section 212 of the first heat pipe 21 is opened by the second fin set 33 347 enters the receiving groove 345 of the second fin set 33. At this time, the two ends of the condensation section 232 of the second heat pipe 23 and the connecting sections 213 and 233 of the first and second heat pipes 21 and 22 are located at the The openings 347 of the two fin sets 33 are disposed; the first and second fin sets 31, 33 are staggered, and the annular heat sink 30 is formed to form the first and second fin sets 31, 33. The stepped portions 318, 338 together form an annular step portion 35 of the heat sink 30, and the stepped flanges 320, 340 of the first and second fin sets 31, 33 together form an annular and horizontal portion of the heat sink 30. The step faces 36, the card slots 319, 339 of the first and second fin sets 31, 33 together form an annular card slot 37 of the heat sink 30, and the first and second fin sets 31, 33 are increased. The crimped edges 321, 341 together form an annular plenum 38 of the heat sink 30. The heat conducting column 40 is disposed between the first and second fin groups 31 and 33, and the lower surface thereof is disposed on the evaporation sections 211 and 231 of the first and second heat pipes 21 and 23, and the heat conducting column 40 is The side surfaces are closely attached to and welded to the inner side surfaces of the first and second fin sets 31, 33. The body 313 of the first fin set 31 and the extension 314, the body 333 of the second fin set 33 and the extending portion 334 and the heat conducting column 40 form a receiving space 39 at the top of the heat sink 30. The portion 35, the step surface 36, and the card slot 37 are located in the accommodating space 39. The fan 50 Aligning the accommodating space 39 of the heat sink 30 and pressing the fan 50 downward so that the lower surface of the fixing frame 512 of the fan 50 abuts against the step surface 36 of the step portion 35 of the heat sink 30. The fan 50 The hook portion 515 of the fixed arm 514 is inserted into the slot 37 of the heat sink 30 to fix the fan 50 to the heat sink 30. At this time, the impeller 52 of the fan 50 is received in the receiving space 39. The side surface of the fixing frame 512 of the fan 50 is just attached to the inner surface of the heat sink 30.

When the heat-generating electronic component is in operation, the heat generated by the heat-generating electronic component is transmitted to the substrate 10, and a part of the heat transferred to the substrate 10 is directly transmitted to the heat sink 30, and another heat is transferred to the heat sink through the heat-conducting column 40 in the middle of the heat sink 30. 30, a part of the heat is absorbed by the evaporation sections 211, 231 of the first and second heat pipes 21, 23, and is transmitted to the condensation sections 212, 232 through the connection sections 213, 233, and then transferred to the heat sink 30, and transmitted to The heat of the heat sink 30 is ultimately dissipated by the low temperature air generated by the fan 50 into the surrounding air.

In the heat dissipating device, the heat sink 30 is composed of a pair of first fin sets 31 and a pair of second fin sets 33. When the heat dissipating device is assembled, the first and second heat pipes 21 and 23 can be inserted first. The first fin group 31 is combined with the first and second heat pipes 21 and 23 to solve the problem that the multi-section bending heat pipe is difficult to assemble, and the first and second heat pipes 21 are not only convenient. 23 assembled, but also make full use of space. In addition, the first and second heat pipes 21 and 23 are used in combination with the heat conducting column 40, so that heat can be transmitted from the middle and from the periphery, so that the heat can be evenly distributed on the first and second fins of the heat sink 30. 311, 331, is beneficial to improve the heat dissipation efficiency of the heat sink. The fan 50 is fixed in the receiving space 39 of the heat sink 30, so that the impeller 52 of the fan 50 is provided by the heat sink. By enclosing 30, the low-temperature airflow generated by the fan 50 can be fully utilized to improve the heat dissipation efficiency. At the same time, the heat sink 30 on the periphery of the fan 50 can also function as a side wall of the conventional fan frame, saving the material of the fan 50 while saving the material of the fan 50. The wind pressure of the fan 50 can also be increased, and the heat sink 30 is further provided with a pressurizing portion 38, which can further increase the wind pressure of the fan 50. Next, since the heat sink 30 is provided with a step portion 35 and a card slot 37, the fan 50 has a fixing frame 512 and a fixing arm 514 with a hook portion 515. Therefore, when assembling the heat dissipating device, the fan 50 only needs to be pushed. The fan 50 can be mounted on the heat sink 30 without screw locking, has a simple structure and is convenient to assemble, and the step surface 36 on the step portion 35 of the heat sink 30 can increase the contact area with the fan 50, thereby More uniform force. The first and second fins 311 and 331 of the heat sink 30 are arranged along the radial direction of the heat conducting column 40, so that the low temperature airflow generated by the fan 50 is caused by the airflow between the first and second fins 311 and 331. The channels 312, 332 are blown around the heat sink 30 to remove heat from the heat sink 30 while dissipating heat from other heat-generating electronic components around the heat sink 30.

Of course, in the heat dissipating device, the card slot 37 on the heat sink 30 can be disposed only on one of the first and second fin sets 31, 33, so that only one of the slots 37 is required. Processing the fin set reduces manufacturing processes and reduces costs.

In addition, the first and second heat pipes 21, 23 of the above heat dissipating device may have other forms.

As shown in FIG. 9, the first and second heat pipes 61 and 63 in the heat dissipating device of the second embodiment of the present invention, the first heat pipe 31 is located above the corresponding second heat pipe 63. square. The first and second heat pipes 61, 63 are similar to the first and second heat pipes 21, 23 in the first embodiment, except that the angle of inclination of the connecting portion 613 of each first heat pipe 61 is less than The angle of inclination of the connecting section 633 of a second heat pipe 63.

As shown in FIG. 10, during assembly, the evaporation sections 611, 631 of each of the first and second heat pipes 61, 63 are respectively received and soldered in the grooves 13 on the substrate 10, wherein the evaporation section 611 of the first heat pipe 61 Located between the evaporation sections 631 of the second heat pipe 63, the connection section 633 of the second heat pipe 63 bypasses the outer side of the connection section 613 of the first heat pipe 61, and the condensation section 612 of the first heat pipe 61 and the second heat pipe 63 condense. Segment 632 is parallel.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Substrate

13‧‧‧ Groove

20‧‧‧heat pipe combination

21‧‧‧First heat pipe

23‧‧‧ second heat pipe

31‧‧‧First fin set

311‧‧‧First fin

33‧‧‧second fin set

331‧‧‧second fin

312, 332‧‧ ‧ air passage

321, 341‧‧‧ Pressurized folding

40‧‧‧thermal column

50‧‧‧fan

Claims (21)

A heat dissipating device includes a heat sink and a pair of first heat pipes combined with the pair of first heat pipes, each of the first heat pipes including an evaporation section and a condensation section, wherein the heat sink comprises a pair a first fin set and a pair of second fin sets, the pair of first fin sets and the pair of second fin sets are mutually offset, and each of the first and second fin sets is provided with a receiving slot. Each of the second fin sets is further provided with an opening, and the opening is in communication with the receiving groove of the second fin set, and one of the condensation sections of each of the first heat pipes is partially inserted into the receiving groove of the first fin set, each of each The other part of the condensation section of the first heat pipe enters and is received in the receiving groove of the second fin set, and the heat sink is formed by the first and second fins to form a ring shape. A heat conducting column is disposed in the middle of the device, and the outer surface of the heat conducting column is closely attached to the inner side surface of the first and second fin sets. The heat dissipating device of claim 1, wherein the pair of first heat pipes are respectively disposed on the pair of first fin groups in opposite directions. The heat dissipation device of claim 1, wherein each of the first fin sets is formed by stacking a plurality of first fins, each of the first fins includes a body and the top end of the body is located at an outer end Extending upwardly to form an extension portion, each second fin group is formed by stacking a plurality of second fins, each second fin comprises a body and one of the top portions of the body extending upward at the outer end Extension. The heat dissipating device of claim 3, wherein each of the second fins A notch is formed below the outer side end of the body, and the notches together form an opening of the second fin set. The heat dissipating device of claim 1, further comprising a pair of second heat pipes, each of the second heat pipes comprising an evaporation section and a condensation section, each of the first fin sets further comprising a condenser for accommodating the second heat pipe Another storage slot for the segment. The heat dissipating device of claim 5, wherein the pair of second heat pipes are respectively disposed on the pair of first fin groups in opposite directions. The heat dissipating device of claim 5, wherein the condensation sections of each of the first and second heat pipes are formed to extend in a circumferential direction. The heat dissipating device of claim 5, wherein each of the first heat pipes further comprises a connecting portion connecting one of the evaporation section and the condensation section, and each of the second heat pipes further comprises a connecting section connecting one of the evaporation section and the condensation section. The vertical distance between the evaporation section of the first heat pipe and the condensation section is smaller than the vertical distance of the evaporation section and the condensation section of the second heat pipe. The heat dissipating device of claim 8, wherein the connecting portion of the first heat pipe is formed by extending obliquely upward from one end of the evaporation portion, and the connecting portion of the second heat pipe is also inclined upwardly from one end of the evaporation portion. Forming, the evaporation section of the first heat pipe is disposed between the evaporation sections of the second heat pipe. The heat dissipating device of claim 8, wherein the connecting portion of the first heat pipe is formed by extending obliquely upward from one end of the evaporation portion, and the connecting portion of the second heat pipe is also inclined upwardly from one end of the evaporation portion. Forming, the evaporation section of the second heat pipe is disposed between the evaporation sections of the first heat pipe, and the connection section of the second heat pipe bypasses the outer side of the connection section of the first heat pipe. The heat sink of claim 9 or 10, wherein the second heat The plane in which the condensation section of the tube is located is parallel to the plane in which the condensation section of the first heat pipe is located. The heat dissipating device of claim 5, wherein each of the first fin sets further comprises an adding groove for respectively connecting the receiving groove to the outside, and the adding groove is disposed obliquely upward. The heat dissipating device of claim 1, wherein the first and second fin groups form a receiving space in common on the top of the heat sink, and a fan is installed in the receiving space. The heat dissipating device of claim 13, wherein at least one of the first and second fin sets is provided with a card slot, the fan comprises a fan frame, and the fan frame extends downward to form a plurality of fixed arms The free end of each fixed arm is provided with a hook portion, and the hook portion cooperates with the card slot to fix the fan to the heat sink. The heat dissipating device of claim 14, wherein the fan frame comprises an annular fixing frame, the fixing arm is formed to extend downward from the fixing frame, and the first and second fin groups are provided a step portion that abuts against the step portion. A method for assembling a heat dissipating device includes the steps of: providing a pair of first fin sets and a pair of second fin sets, each of the first and second fin sets being provided with a receiving slot, each second fin An opening is formed in the group, the opening is in communication with the receiving groove of the second fin set; a pair of first heat pipes are provided, each of the first heat pipes includes an evaporation section and a condensation section; and each first heat pipe is condensed The segments are respectively inserted into the receiving slots of the corresponding first fin group, so that the two ends of the condensation section of the first heat pipe protrude outside the first fin group Inserting a second fin set between the pair of first fin sets, so that the first and second fin sets are enclosed in a ring shape, and the condensation section of the first heat pipe is formed by the second fin set The opening enters the receiving groove of the second fin group. The method of assembling a heat dissipating device according to claim 16, wherein each of the first fin sets is formed by stacking a plurality of first fins, each of the first fins comprising a body and being located by a top of the body Extending upwardly at the outer end to form an extension portion, each second fin group is formed by stacking a plurality of second fins, each second fin includes a body and extending upward from an outer end of the body Forming an extension portion, a notch is formed under the outer side end of the body of each of the second fins, and the notches together form an opening of the second fin group. The method of assembling a heat sink according to claim 17, further comprising providing a pair of second heat pipes, each of the second heat pipes including an evaporation section and a condensation section, each of the first fin sets further comprising another The accommodating groove is inserted into the receiving groove of the first fin group while the condensing section of the first heat pipe is inserted into the other receiving groove of the second fin group. The method of assembling a heat dissipating device according to claim 18, wherein the pair of first heat pipes are respectively disposed on the pair of first fin groups in opposite directions, and the pair of second heat pipes are respectively worn in opposite directions Located on the pair of first fin sets. The method for assembling a heat dissipating device according to claim 16, further comprising: providing a heat conducting column, the heat conducting column being disposed in the middle of the first and second fin sets, and affixing the lower surface of the heat conducting column It is disposed on the evaporation section of the first heat pipe, and the side surface thereof is attached to the inner side surface of the first and second fin sets. The method of assembling a heat sink according to claim 16, wherein The first and second fin sets have a receiving space formed in the top of the first fin assembly, and a fan is disposed in the receiving space, and at least one of the first and second fin sets is provided with a card slot. The second fin set is provided with a step portion, and the fan includes a frame, the fan frame includes an annular fixing frame and a plurality of fixing arms extending downward from the fixing frame, and the free ends of each fixing arm are disposed Having a hook portion, the fan is aligned with the accommodating space formed by the first and second fin groups, and the fan is pressed downward, and the hook portion of the fixed arm of the fan is locked in the card slot, and the fixing is fixed. The frame abuts against the step portion, and the fan is fixed to the first and second fin sets.