200805038 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種熱管散熱裝置，特別涉及一種可以有 效冷卻電子元件之熱管散熱裝置。 【先前技術】 …隨著電子産業之迅速發展，巾央處理料電子元件之 運算速度大幅提高’其産生之熱量亦隨之劇增，嚴重威脅 著電子元件運行時之性能。如何將電子元件之熱量散發出 =以保證其正常運行係至㈣要。爲有效散發中央處理 器在運行過程中産生之熱量，業界通常在中央處理器表面 ::-二熱器辅助其散熱，從而使中央處理 持在正常運行範圍内。 又堆 傳統散熱裝置，均包括一今勒辨 M 座奸心… 已括放熱體，該散熱體包括-底 /、又“上之放熱鰭片，該底座多係實體金屬。麸 φ =著m;體積越來越小’性能提升越來越快，轉出= 中，因爲局限於金屬之傳熱性能，底座中心 而且傳熱速度慢，影響整體散m =、裝置之四周， 定，無法有效運算。體放…效果’使传CPU運行不穩 :發熱量CPU多數採用帶熱管散 =與其相接之基座上，同時借助熱管二 遞到延端之散埶鍵Η μ ^ …、里、逑傳 熱裝置四周，達到^ ^ 散熱韓片將熱量散發到散 達到冷部CPU之目的。熱管因傳熱速度快而 200805038 使散熱裝置性能得以大幅度提升，如何進一步提高熱管在 散熱裝置中之使用效率，係業界一直在努力改進之目標。 【發明内容】 有鑒於此，有必要提供一種重量較輕且散熱性能佳之 熱管散熱裝置。 一種熱管散熱裝置，包括一基板、設於基板上之第一 散熱鰭片組及至少一熱管，該熱管連接第一散熱鰭片組與 _基板，該第一散熱鰭片組至少一侧設有第二散熱鰭片組， 該第二散熱鰭片組延伸至基板一侧，並套設于熱管上。 該熱管散熱裝置與習知技術相比，基板之兩側分佈有 第二散熱鰭片組之延伸部分，使得熱管之熱量可以在吸熱 段附近就及時得到散發，縮短了傳熱路徑，使得散熱胜能 更佳，且可省去部分基板材料，減輕了基板之重量。 【實施方式】 _ 請參閱圖1至圖4,本發明熱管散熱裝置用以對發熱電 子元件散熱，包括一基板40、設於基板40上之第一散熱鰭 片組80與分佈在第一散熱鰭片組80及基板40兩侧之兩個 第二散熱鰭片組90，該裝置還包括複數連接基板40與第 一、二散熱鰭片組80、90之熱管20。 該基板40包括用於導熱之本體部48與該本體部相對 兩侧延伸而出之兩固定部44、46，其中固定部44與本體部 48寬度相同，固定部46比本體部48寬，從而形成T型結 構。該兩固定部44、46上均設有用於固定之孔。該基板40 200805038 之本體部48之一表而田从奴 於緊貼電子元件（圖未示），另— 相對表面開設有複數另一 硬數與熱官20相結合之半圓形容样42, 0 該表面上分佈有複數散埶餘 日且 片組80。 ，、、一曰片向上延伸，形成第一散熱鰭 成，且這此f片、::、】組8〇由複數第-散熱鰭片間隔排列而 二熱連接到一。該第 基板扣之第二散之第一散熱部84與遠離 ^ …邛82。該弟一散熱部84延伸超出美始 4〇之本體部48與基板4〇之固 出土板 劫品牲μ U疋邛44相貼合以增加鰭片傳 ”、、面積。弟二散熱部82較第一散熱 ， 第一散熱部84平齊，另—相針制、喜、 見-則邊與 , 另相對側邊延伸超出基板40,從而 二ΐΓΓ、差，片組呈“L，、。該第二散熱部82上 第一散熱部下84端緣開設容槽88。該容槽 與美曰二D於t® ’以利於與熱管2°過盈配合。該容槽88 接人$〜槽42相對應兩者之間之容槽在兩者連 4〇 ;成—通孔。熱管2〇貫穿插入該通孔中並分別與基板 40、弟一散熱鰭片組80接觸。 該第二散熱籍片組90平行設於第一散熱簿片組⑼及 :— 反:〇之兩侧，其由複數第二散熱鰭片間隔排列而成。該 雜:散熱‘鳍片組90包括靠近基板4〇之第一散熱部％與遠 離^反40之第二散熱部92。該第一散熱部％與基板4〇 ^等寬，第二散熱部92較第-散熱部94寬，其一侧 散熱部94平齊，另一相對側邊延伸超出基板4〇 ” 散熱鰭片組80之第二散熱部82之一側邊相平齊， 200805038 從而形成一階梯落差使鰭片組呈“L”型。該第二散熱部92 與第一散熱部94分別開設有與熱管20相結合之通孔96之 98 〇 該熱管20呈“U”型，包括相互平行之第一傳熱段 22、第二傳熱段24及將第一傳熱段22與第二傳熱段24聯 成一體之第三傳熱段26。該熱管20之第一傳熱段22之大 部分周面與第一散熱鰭片組80之容槽88過盈配合，其餘 部分周面與基板40上之容槽42錫焊或借助導熱膠連接。 _ 熱管20之第一傳熱段22於基板40兩側橫向伸出並以過盈 配合之方式穿設於第二散熱鰭片組90之第一散熱部94之 通孔46，而第二傳熱段24穿設於第一、第二散熱鰭片組 80、90之第二散熱部82、92之通孔86、96並通過過盈配 合方式與鰭片緊密結合。 電子元件工作時，其産生之熱量傳遞到基板40，部分 熱量通過第一散熱鰭片組80迅速發散，同時一部分熱量傳 _遞至熱管20之第一傳熱段22上，熱管20内之工作介質通 過相變化循環使熱量迅速傳遞到套設於其上之各散熱鰭片 組80、90，從而有效地將熱量散發出去。因爲在靠近基板 40附近之熱管部分套設有第二散熱鰭片組90之第一散熱 部94，使其傳熱路徑縮短，熱量得到及時之散發，故其散 熱性能更佳，且第二散熱鰭片組90分佈在基板40之兩侧， 不需要設置在基板40上，從而省去了基板材料，減輕了基 板之重量。 【圖式簡單說明】 200805038 圖i係本發明熱管散熱裝置之立體組裝圖。 圖2係本發明熱管散熱裝置之倒置立體組裝圖 圖3係本發明熱管散熱裝置之部分立體組裝圖 圖4係本發明熱管散熱裝置之立體分解圖。 【主要元件符號說明】 数管 第二傳熱段 _ 基板 固定部 第一散熱鰭片組 第一散熱部 容槽 第二散熱部 通孔 20 第一傳熱段 22 24 第三傳熱段 26 40 容槽 42 44 > 46本體部 48 80 第二散熱部 82 84 通孔 86 88 第二散熱鰭片組 90 92 第一散熱部 94 96 ^ 98200805038 IX. Description of the Invention: [Technical Field] The present invention relates to a heat pipe heat sink, and more particularly to a heat pipe heat sink capable of effectively cooling electronic components. [Prior Art] ... With the rapid development of the electronics industry, the computing speed of the electronic components of the towel processing material has increased dramatically. The heat generated by it has also increased dramatically, seriously threatening the performance of electronic components during operation. How to dissipate the heat of the electronic components = to ensure that its normal operation is to (4). In order to effectively dissipate the heat generated by the central processor during operation, the industry usually assists in heat dissipation on the surface of the central processor's surface ::- two heaters, so that the central processing is within normal operating range. The traditional heat sinks are also included, including the ones that have been identified. The heat sink consists of a bottom and a heat radiating fin. The base is mostly solid metal. The bran is φ = m The volume is getting smaller and smaller 'the performance is getting faster and faster, and the transfer out = medium, because it is limited to the heat transfer performance of the metal, the center of the base and the heat transfer rate is slow, affecting the overall dispersion m =, the circumference of the device, fixed, can not be effective Operation. The effect of the body...the effect makes the CPU run unstable: the heat generating CPU mostly uses the heat pipe to disperse the pedestal on the pedestal, and at the same time, the heat pipe is used to transfer the 埶 key to the end Η μ ^ ..., Around the heat transfer device, the heat dissipation of the Korean film is dissipated to the CPU of the cold part. The heat pipe has a high heat transfer rate and 200805038, which greatly improves the performance of the heat sink. How to further improve the heat pipe in the heat sink The efficiency of use is the goal that the industry has been striving to improve. [Invention] In view of the above, it is necessary to provide a heat pipe heat dissipation device with light weight and good heat dissipation performance. A heat pipe heat dissipation device includes a substrate, a first heat dissipation fin set and a heat pipe connected to the first heat dissipation fin set and the _ substrate, wherein the first heat dissipation fin set is provided with a second heat dissipation fin set on at least one side, the second The heat sink fin group extends to one side of the substrate and is sleeved on the heat pipe. Compared with the prior art, the heat pipe heat dissipation device has an extension portion of the second heat dissipation fin group distributed on both sides of the substrate, so that the heat of the heat pipe can be The heat absorption section is dissipated in time, the heat transfer path is shortened, the heat dissipation is better, and part of the substrate material can be omitted, and the weight of the substrate can be reduced. [Embodiment] _ Please refer to FIG. 1 to FIG. 4, the present invention The heat pipe heat dissipating device is configured to dissipate heat from the heat-generating electronic component, and includes a substrate 40, a first heat-dissipating fin group 80 disposed on the substrate 40, and two second heat-dissipating heats distributed on the first heat-dissipating fin group 80 and the substrate 40 The fin assembly 90 further includes a plurality of heat pipes 20 connecting the substrate 40 and the first and second heat dissipation fin sets 80, 90. The substrate 40 includes a body portion 48 for heat conduction and an opposite side of the body portion. The two fixing portions 44, 46, The middle fixing portion 44 is the same width as the main body portion 48, and the fixing portion 46 is wider than the main body portion 48 to form a T-shaped structure. The two fixing portions 44, 46 are provided with holes for fixing. The main body portion 48 of the substrate 40 200805038 One of them is from the slave to the electronic component (not shown), and the other surface is provided with a plurality of semi-circular capacitances combined with a plurality of hard numbers and a thermal officer 20, 0 which is distributed on the surface. For the rest of the day, the wafer group 80., and a sheet extend upward to form a first heat sink fin, and the f sheet, the ::, group 8 is arranged by the plurality of heat sink fins and the two heat connections are connected. 1. The second heat dissipating portion 84 of the second substrate is separated from the 邛 82. The heat dissipating portion 84 extends beyond the body portion 48 of the first substrate and the substrate 4 μ U疋邛44 is attached to increase the fin transfer, area. The second heat dissipating portion 82 is lower than the first heat dissipating portion, and the first heat dissipating portion 84 is flush, and the other side is made up, the other side is seen, and the other side is extended beyond the substrate 40, so that the two sides are different from each other. "L,. The second heat dissipating portion 82 has a groove 88 at the end edge of the lower portion of the first heat dissipating portion. The groove and the M2D are at t' to facilitate interference fit with the heat pipe. The receiving slot is connected to the slot 40. The second heat-dissipating film group 90 is disposed in parallel on the first heat-dissipating film set (9) and: - the opposite sides of the cymbal, which are arranged by a plurality of second heat-dissipating fins. 90 includes a first heat dissipating portion % near the substrate 4 and a second heat dissipating portion 92 away from the counter 40. The first heat dissipating portion % is equal to the substrate 4 , and the second heat dissipating portion 92 is wider than the first heat dissipating portion 94 . One side of the heat dissipating portion 94 is flush, and the other opposite side extends beyond the substrate 4"". One side of the second heat dissipating portion 82 of the heat dissipating fin group 80 is flush, 200805038 A step that the gap was fins "L" shaped. The second heat dissipating portion 92 and the first heat dissipating portion 94 respectively open a through hole 96 of the heat pipe 20. The heat pipe 20 has a "U" shape, and includes a first heat transfer portion 22 and a second pass parallel to each other. The hot section 24 and the third heat transfer section 26 that integrates the first heat transfer section 22 with the second heat transfer section 24 are integrated. The majority of the circumferential surface of the first heat transfer section 22 of the heat pipe 20 is in interference fit with the cavity 88 of the first heat dissipation fin set 80, and the remaining peripheral surface is soldered to the cavity 42 of the substrate 40 or connected by a thermal conductive adhesive. . The first heat transfer section 22 of the heat pipe 20 extends laterally on both sides of the substrate 40 and penetrates through the through hole 46 of the first heat dissipation portion 94 of the second heat dissipation fin set 90 in an interference fit manner, and the second pass The heat segment 24 is disposed through the through holes 86, 96 of the second heat dissipating portions 82, 92 of the first and second heat dissipating fin sets 80, 90 and is tightly coupled to the fin by an interference fit. When the electronic component is in operation, the generated heat is transferred to the substrate 40, and part of the heat is rapidly dissipated through the first heat dissipation fin group 80, and a part of the heat is transferred to the first heat transfer section 22 of the heat pipe 20, and the heat pipe 20 works. The medium is rapidly transferred to the heat-dissipating fin sets 80, 90 disposed thereon by a phase change cycle, thereby effectively dissipating heat. Because the first heat dissipation portion 94 of the second heat dissipation fin group 90 is disposed on the heat pipe portion near the substrate 40, the heat transfer path is shortened, and the heat is dissipated in time, so that the heat dissipation performance is better, and the second heat dissipation is performed. The fin sets 90 are distributed on both sides of the substrate 40 and need not be disposed on the substrate 40, thereby eliminating the substrate material and reducing the weight of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. i is a perspective assembled view of a heat pipe heat dissipating device of the present invention. 2 is an inverted perspective assembly view of the heat pipe heat dissipating device of the present invention. FIG. 3 is a partially assembled view of the heat pipe heat dissipating device of the present invention. FIG. 4 is an exploded perspective view of the heat pipe heat dissipating device of the present invention. [Main component symbol description] The second heat transfer section of the tube _ the substrate fixing portion the first heat radiation fin group the first heat dissipation portion the second heat dissipation portion through hole 20 the first heat transfer portion 22 24 the third heat transfer portion 26 40 The cavity 42 44 > 46 body portion 48 80 the second heat dissipation portion 82 84 the through hole 86 88 the second heat dissipation fin group 90 92 the first heat dissipation portion 94 96 ^ 98