201035728 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子設備的散熱結構。 [先前技術] [0002] 現今的電子設備，尤其是電腦，正呈現小型化趨勢。但 這也帶來了散熱方面的困擾。例如，在為筆記型電腦及 迷你型電腦的主要發熱元件（如中央處理器）散熱時， ' 有兩種常見的方式。一種是使用傳統的風扇散熱器進行 散熱。該方式成本低，但越來越難以滿足不斷變小的電 Ο 子設備的散熱需求。另一種是利用熱導管將主要發熱元 件產生的熱量傳遞至機箱散熱孔處而散出。熱導管能夠 滿足小型電子設備的散熱需求，但價格卻非常昂貴。 【發明内容】 [0003] 鑒於以上内容，有必要提供一種成本較低而散熱效果較 佳的散熱方案。 [0004]201035728 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat dissipation structure of an electronic device. [Prior Art] [0002] Today's electronic devices, especially computers, are showing a trend toward miniaturization. But this also brings about the problem of heat dissipation. For example, there are two common ways to dissipate heat from the main heating elements of a notebook or minicomputer, such as a central processing unit. One is to use a traditional fan heatsink for heat dissipation. This approach is costly, but it is increasingly difficult to meet the cooling needs of ever-decreasing electrical devices. The other is to use a heat pipe to transfer the heat generated by the main heating element to the heat dissipation hole of the chassis to dissipate. Heat pipes can meet the cooling needs of small electronic devices, but they are very expensive. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a heat dissipation scheme with lower cost and better heat dissipation effect. [0004]
一種散熱結構，包括電子設備以專裝襄於該電子設備的 散熱裝置，該電子設備包括機殼以及裝設在該機殼内的 電路板，該電路板上設有一發熱元件，該散熱裝置用於 為該發熱元件散熱，該散熱裝置包括一貼合於該發熱元 件的基座、由該基座延伸出的複數散熱鰭片以及一風扇 ，該機殼開設有與該散熱裝置匹配的開口，該散熱裝置 的基座透過該開口貼合於該發熱元件的基座，該散熱裝 置具有入風口及出風口，該入風口及該出風口位於該機 殼外。 [0005] ΛΑΟ 1 ηο»7〇ο υίίοΐυοίώο 本發明散熱結構採用熱直通技術，其熱交換率高且成本 士 sS /.a λ A1 η 1 ο ττ / ιΐ 1 ο -χτ λ〇 αγ»αι Ληηη η Αυιυι 第 ο 只/六丄ο 只 ubo^ul4〇o〇-u 201035728 低廉。 【實施方式】 [0006] 請參閱圖1及圖2，本發明散熱結構的第一較佳實施方式 包括一電子設備以及一為該電子設備散熱的散熱裝置10 〇 [0007] 該電子設備包括一機殼50以及一裝設在機殼50内的電路 板60。機殼50上開設一與散熱裝置10相匹配的開口（未 標號），用於裝設散熱裝置10。機殼50在其開口所在區 域向内形成一凹陷部51，且該凹陷部51的侧壁53採用傾 斜設計。電路板60上設有一發熱元件61以及複數其他電 子元件63。在本實施方式中，該電子設備為一桌上型電 腦主機，電路板60為一主機板，發熱元件61為一中央處 理器。 [0008] 散熱裝置10包括一大體呈扁圓柱形的殼體20。殼體20由 一頂部（未標號）、一底部（未標號）以及一連接於該 頂部與該底部之間的側部（未標號）所圍成。殼體20的 頂部中央開設圓形開口，形成入風口 21。殼體20的侧部 環繞地開設間隔排列的複數開口，形成出風口 23。殼體 20底部為一散熱器的基座30。基座30的内表面垂直延伸 出複數散熱鰭片31。該等散熱鰭片31依次間隔設置並形 成為一環狀鰭片組。每一散熱鰭片31的位於該環狀鰭片 組外侧的一端位於出風口 23處。散熱裝置10在其入風口 21内設置一渦流式風扇40，且風扇40被該環狀鰭片組的 散熱鰭片31所環繞。 [0009] 組裝時，將散熱裝置10透過機殼50的開口安裝至該電子 098108723 表單編號 A0101 第 4 頁/共 16 頁 0982014363-0 201035728 [0010] 〇 [ooii] [0012] [0013] Ο [0014] 設備。散熱裝置10位於凹陷部51内，散熱裝置10的基座 30貼合於發熱元件61。散熱裝置10的入風口 21及出風口 23均位於該電子設備的機殼50外。 使用時，啟動風扇40。散熱裝置10的基座30將發熱元件 61所產生的熱量傳遞至散熱鰭片31。風扇40使得機殼50 外部的冷空氣由散熱裝置10的入風口 21進入散熱裝置10 ，並在攜帶了散熱鰭片31的熱量後直接透過散熱裝置10 的出風口 23被排出至該電子設備的機殼50外。 其中，機殼50的凹陷部51是為了使熱裝置10安裝至該電 子設備後不致使整體厚度增加太多，並保證整體美觀。 凹陷部51的侧壁53的傾斜設計，對於排出的熱空氣具有 一定的導引作用，以利散熱。 另外，在其他實施方式中，可利用一葉片式風扇來替換 渦流式風扇40的作用。 請參閱圖3及圖4，本發明散熱結構的第二較佳實施方式 包括一電子設備以及一為該電子設備散熱的散熱裝置10Α 〇 該電子設備包括一機殼50Α以及一裝設在機殼50Α内的電 路板60Α。機殼50Α上開設一與散熱裝置10Α相匹配的開 口，用於裝設散熱裝置10Α。電路板60Α上設有一發熱元 件61Α以及複數其他電子元件63Α。 散熱裝置10Α包括一大體呈斗笠狀的殼體20Α。殼體20Α 由一頂部（未標號）、一底部（未標號）以及一連接於 該頂部與該底部之間的側部（未標號）所圍成。殼體20Α 098108723 表單編號A01G1 0982014363-0 [0015] 201035728 的頂部一側開設圓形開口 ’形成入風口 21A。殼體20A的 頂部的另一側開設扇形開口 ’形成出風口 。殼體20A 底部為一散熱器的基座30A。基座30A的内表面的位於出 風口 23A下方的區域垂直延伸出複數散熱鰭片31A並延伸 至出風口23A處。該等散熱鰭片31A沿散熱裝置10A的徑 向設置並依次間隔排列以形成一扇狀鰭片組。散熱裝置 1〇八在其入風口21人内設置一葉片式風扇40八。 [0016] 組裝時，將散熱裝置10A透過機殼50A的開口安裝至該電 子設備。散熱裝置10A的基座30A貼合於發熱元件61A ° 散熱裝置10A的入風嫌21A藏出風口 2 3 A均位於該電子設 備的機殼50A外。 美 [0017] 使用時，啟動風扇40A。散熱裝置10A的基座30A將發熱 元件61A所產生的熱量傳遞至散熱鰭片31A。風扇40A使 得機殼50A外部的冷空氣由散熱裝置10A的入風口 21A進 入散熱裝置10A，並在攜帶了散熱鳟片31A的熱量後直接 透過散熱裝置10A的出風口 2 3A修排出至該電子設備的機 殼50A外。 [0018] 另外，在其他實施方式中，可利用一渦流式風扇來替換 葉片式風扇40A的作用。 [0019] 由上述兩較佳實施方式可看出，本發明散熱結構採用了 熱直通設計，即冷空氣不經過機殼5〇、50A内部而直接進 入散熱裝置10、10A並直接由散熱裝置10、10A流出機殼 50、50A外。本發明散熱結構的散熱裝置1〇、10A的入風 口 21、21A及出風口 23、23A均位於機殼50、50A外，避 098108723 表單編號A0101 第6頁/共16頁 0982014363-0 201035728 [0020] Ο [0021] [0022] G [0023] [0024] [0025] [0026] 免了熱風駐留於電子設備内的問題’提高了散熱效率。 請參閱圖5及圖6，為本發明散熱結構的第三較佳實施方 式。第三較佳實施方式與第二較佳實施方式的區別在於 :在第三較佳實施方式中’散熱裝置10B的殼體20B的側 部設置了複數閥門25B。閥門25B位於機殼506内。閥門 25B的開啟、關閉以及閥開啟程度可以被控制’例如閥門 25B可以透過扭簧鉸鏈、结構固定於殼體’閥門的開啟程度 由風扇的風力直接控制4這樣便可利用進入散熱裝置10B 的多餘冷空氣為電子設備内的其他電子元件63B散熱’且 該多餘冷空氣由閥門25B流出的大小及方向皆可被控制。 本發明散熱結構採用熱直通技術;，其熱交換專在50%以上 ，且成本低廉。本發明散熱結構除適用於桌上型電腦散 熱外，尤其還適用於筆記型電腦、精巧型電腦、液晶顯 示器等薄小型的電子設備。 综上所述，本發明符合發明專利要件，爰教法提出專利 申請。惟，以上所述者僅為本發明乏輪佳實施例，舉凡 熟悉本案技藝之人士，在爱依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明散熱結構的第一較佳實施方式的剖視圖。 圖2為圖1中散熱裝置的立體圖。 圖3為本發明散熱結構的第二較佳實施方式的剖視圖。 圖4為圖3中散熱裝置的立體圖。 098108723 表單編號A0101 第7頁/共16頁 0982014363-0 201035728 [0027] 圖5為本發明散熱結構的第三較佳實施方式的剖視圖。 [0028] 圖6為圖5中散熱裝置的立體圖。 【主要元件符號說明】A heat dissipating structure includes an electronic device for disassembling a heat dissipating device mounted on the electronic device, the electronic device comprising a casing and a circuit board mounted in the casing, wherein the circuit board is provided with a heating element, and the heat dissipating device is used For dissipating heat from the heat generating component, the heat dissipating device includes a base attached to the heat generating component, a plurality of heat radiating fins extending from the base, and a fan, and the casing is provided with an opening matching the heat dissipating device. The pedestal of the heat dissipating device is attached to the pedestal of the heating element through the opening, and the heat dissipating device has an air inlet and an air outlet, and the air inlet and the air outlet are located outside the casing. [0005] 散热 1 ηο»7〇ο υίίοΐυοίώο The heat dissipation structure of the invention adopts a hot through technique, and the heat exchange rate thereof is high and the cost is sS /.a λ A1 η 1 ο ττ / ιΐ 1 ο -χτ λ〇αγ»αι Ληηη η Αυιυι The first ο only / six 丄 ο only ubo^ul4〇o〇-u 201035728 Low. [0006] Referring to FIG. 1 and FIG. 2, a first preferred embodiment of the heat dissipation structure of the present invention includes an electronic device and a heat dissipation device 10 for dissipating heat from the electronic device. [0007] The electronic device includes a The casing 50 and a circuit board 60 mounted in the casing 50. An opening (not labeled) matching the heat sink 10 is disposed on the casing 50 for mounting the heat sink 10. The casing 50 is formed with a recess 51 inwardly in the region where the opening is located, and the side wall 53 of the recess 51 is designed to be inclined. The circuit board 60 is provided with a heat generating component 61 and a plurality of other electronic components 63. In this embodiment, the electronic device is a desktop computer host, the circuit board 60 is a motherboard, and the heating element 61 is a central processor. The heat sink 10 includes a housing 20 having a generally flat cylindrical shape. The housing 20 is surrounded by a top portion (not labeled), a bottom portion (not labeled), and a side portion (not labeled) connected between the top portion and the bottom portion. A circular opening is formed in the center of the top of the casing 20 to form an air inlet 21. The side portions of the casing 20 are circumferentially provided with a plurality of spaced-apart openings to form an air outlet 23. The bottom of the housing 20 is a base 30 of a heat sink. The inner surface of the susceptor 30 extends perpendicularly from the plurality of fins 31. The heat dissipating fins 31 are sequentially spaced apart and formed into an annular fin group. One end of each of the heat dissipation fins 31 located outside the annular fin group is located at the air outlet 23. The heat sink 10 is provided with a vortex fan 40 in its air inlet 21, and the fan 40 is surrounded by the heat radiating fins 31 of the annular fin group. [0009] When assembling, the heat sink 10 is mounted to the electronic 098108723 through the opening of the casing 50. Form No. A0101 Page 4 of 16 0982014363-0 201035728 [0010] 〇[ooii] [0012] [0013] Ο [ 0014] Equipment. The heat sink 10 is located in the recess 51, and the base 30 of the heat sink 10 is attached to the heat generating component 61. The air inlet 21 and the air outlet 23 of the heat sink 10 are located outside the casing 50 of the electronic device. When in use, the fan 40 is activated. The susceptor 30 of the heat sink 10 transfers the heat generated by the heat generating component 61 to the heat radiating fins 31. The fan 40 allows the cold air outside the casing 50 to enter the heat dissipating device 10 from the air inlet 21 of the heat dissipating device 10, and is directly discharged to the electronic device through the air outlet 23 of the heat dissipating device 10 after carrying the heat of the heat dissipating fin 31. Outside the casing 50. Wherein, the recessed portion 51 of the casing 50 is such that the thermal device 10 is not attached to the electronic device to increase the overall thickness too much, and the overall appearance is ensured. The inclined design of the side wall 53 of the recessed portion 51 has a certain guiding effect on the discharged hot air for heat dissipation. Additionally, in other embodiments, a vane fan can be utilized to replace the effect of the vortex fan 40. Referring to FIG. 3 and FIG. 4, a second preferred embodiment of the heat dissipation structure of the present invention includes an electronic device and a heat sink 10 for dissipating heat from the electronic device. The electronic device includes a casing 50 and a casing. The board inside the 50 Α 60 Α. An opening corresponding to the heat sink 10A is disposed on the casing 50 for mounting the heat sink 10Α. The circuit board 60 is provided with a heat generating element 61 and a plurality of other electronic components 63. The heat sink 10 includes a body 20 that is generally in the shape of a bucket. The housing 20 is surrounded by a top (not labeled), a bottom (not labeled), and a side (not labeled) connected between the top and the bottom. Housing 20Α 098108723 Form No. A01G1 0982014363-0 [0015] The top side of 201035728 has a circular opening ‘to form the air inlet 21A. The other side of the top of the casing 20A is provided with a fan-shaped opening 'to form an air outlet. The bottom of the housing 20A is a base 30A of a heat sink. The area of the inner surface of the base 30A below the air outlet 23A extends perpendicularly from the plurality of heat radiating fins 31A and extends to the air outlet 23A. The heat dissipating fins 31A are disposed along the radial direction of the heat dissipating device 10A and are sequentially spaced to form a fan fin group. Heat Dissipating Device 1A set of a vane fan 40 eight in the air inlet 21 of the person. [0016] At the time of assembly, the heat sink 10A is attached to the electronic device through the opening of the casing 50A. The base 30A of the heat sink 10A is attached to the heat generating element 61A. The air inlet 21A of the heat sink 10A is located outside the casing 50A of the electronic device. [0017] When in use, the fan 40A is activated. The susceptor 30A of the heat sink 10A transfers the heat generated by the heat generating element 61A to the heat radiating fins 31A. The fan 40A allows the cold air outside the casing 50A to enter the heat dissipating device 10A from the air inlet 21A of the heat dissipating device 10A, and is directly discharged to the electronic device through the air outlet 2 3A of the heat dissipating device 10A after carrying the heat of the heat dissipating fin 31A. The outside of the casing 50A. In addition, in other embodiments, a vortex fan can be utilized to replace the function of the vane fan 40A. [0019] As can be seen from the above two preferred embodiments, the heat dissipation structure of the present invention adopts a hot through design, that is, the cold air directly enters the heat dissipation device 10, 10A without passing through the inside of the casing 5, 50A and directly from the heat dissipation device 10 10A flows out of the casing 50, 50A. The air inlets 21, 21A and the air outlets 23, 23A of the heat dissipating device 1A, 10A of the heat dissipating structure of the present invention are all located outside the casing 50, 50A, avoiding 098108723 Form No. A0101 Page 6 / 16 pages 0982014363-0 201035728 [0020 [0022] [0024] [0025] [0026] The problem of avoiding the presence of hot air in the electronic device 'increased heat dissipation efficiency. Referring to Figures 5 and 6, a third preferred embodiment of the heat dissipation structure of the present invention is shown. The third preferred embodiment differs from the second preferred embodiment in that a plurality of valves 25B are provided on the side of the casing 20B of the heat sink 10B in the third preferred embodiment. Valve 25B is located within housing 506. The opening, closing and valve opening degree of the valve 25B can be controlled. For example, the valve 25B can be fixed to the housing through the torsion spring hinge, and the degree of opening of the valve is directly controlled by the wind of the fan 4 so that the excess heat entering the heat sink 10B can be utilized. The cold air dissipates heat to the other electronic components 63B in the electronic device and the size and direction of the excess cold air flowing out of the valve 25B can be controlled. The heat dissipation structure of the invention adopts a hot through technology; the heat exchange is exclusively 50% or more, and the cost is low. In addition to being suitable for desktop computer heat dissipation, the heat dissipation structure of the present invention is particularly suitable for thin and small electronic devices such as a notebook computer, a compact computer, and a liquid crystal display. In summary, the present invention complies with the requirements of the invention patent, and the patent application is filed by the martyrdom. However, the above-mentioned embodiments are only the preferred embodiments of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a first preferred embodiment of a heat dissipation structure of the present invention. 2 is a perspective view of the heat sink of FIG. 1. 3 is a cross-sectional view showing a second preferred embodiment of the heat dissipation structure of the present invention. 4 is a perspective view of the heat sink of FIG. 3. 098108723 Form No. A0101 Page 7 of 16 0982014363-0 201035728 [0027] FIG. 5 is a cross-sectional view showing a third preferred embodiment of the heat dissipation structure of the present invention. 6 is a perspective view of the heat sink of FIG. 5. [Main component symbol description]
散熱裝置 10、10A、 10B 殼體 20 、 20A 、 20B 入風口 21 、 21A 出風口 23、23A 閥門 25B 基座 30、30A 散熱鰭片 31 、 31A 風扇 40 ' 40A 機殼 50 、 50A 、 50B 回陷部 51 側壁 53 電路板 60 、 60A 發熱元件 61 ' 61A 電子元件 63 、 63A 、 63B 098108723 表單編號A0101 第8頁/共16頁 0982014363-0Heat sink 10, 10A, 10B Housing 20, 20A, 20B Air inlet 21, 21A Air outlet 23, 23A Valve 25B Base 30, 30A Heat sink fins 31, 31A Fan 40 ' 40A Housing 50, 50A, 50B Back Port 51 Sidewall 53 Circuit board 60, 60A Heating element 61 ' 61A Electronic component 63, 63A, 63B 098108723 Form number A0101 Page 8 of 16 0982014363-0