TWI400424B - Heat dissipation module and electronic device using the same - Google Patents

Description

Thermal module and electronic device with heat dissipation module

The present invention relates to a heat dissipation module and an electronic device, and more particularly to a heat dissipation module and an electronic device having a dust removal structure.

In recent years, with the rapid advancement of computer technology, the operation speed of computers has been continuously improved, and the heating power of electronic components inside computer mainframes has continuously increased. In order to prevent the electronic components inside the computer mainframe from overheating, the electronic components are temporarily or permanently disabled, so it is necessary to provide sufficient heat dissipation performance to the electronic components inside the computer. Accordingly, for electronic components with high heating power, such as a central processing unit, a graphics chip, a north bridge chip, a south bridge chip, and a temporary memory module, a heat sink is usually added to reduce the temperature of these electronic components.

Generally speaking, the heat sink is mainly composed of a fan and a heat dissipation fin, and the heat of the above-mentioned high heat-generating electronic components is transmitted to the heat dissipation fins by contact, and the waste heat is convected by the airflow generated by the fan. The method is dissipated into the air to further discharge the waste heat out of the body by convection.

It is worth noting that when the heat sink is used for a long time, the dust in the air will gradually accumulate on the heat sink fins on the wind side due to the convection of the fan, but the heat dissipation module is installed in the casing. It is more difficult for users to clean themselves. Over time, the accumulation of dust causes the wind of the fan to not carry away the heat smoothly, thus affecting the overall heat dissipation performance of the heat dissipation module, which in turn leads to a decrease in the service life of the conventional electronic device.

The invention provides a heat dissipation module having a dust removal mechanism.

The present invention provides an electronic device that has better durability.

The invention provides a heat dissipation module suitable for dissipating heat from a heat generating component. The heat dissipation module includes a heat dissipation fin set, a fan, and at least one dust removing component. The heat sink fin set has a base and a plurality of fins disposed on the base. The base is connected to the heating element, and the fins extend away from the heating element. The fan is configured on the heat sink fin set. The dust removing element is connected to the fan and is located between the fan and the fin. The fan rotates to drive the dust removing component to remove dust from the heat sink fins.

The invention provides an electronic device comprising a plate member, at least one heating element disposed on the plate member, and a heat dissipation module. The heat dissipation module contacts the heating element. The heat dissipation module includes a heat dissipation fin set, a fan, and at least one dust removing component. The heat sink fin set has an air inlet side, an air outlet side, a base portion and a plurality of fins. The base is connected to the heating element. The fins are arranged on one side of the base opposite the heating element, and the heating element is located on the wind outlet side, and the fan is located on the air inlet side. The fan is used to generate a flow of air into the fin through the wind side, and the fin exits from the wind side. The dust removing element is connected to the fan and is located between the fan and the fin. The fan rotates to drive the dust removing component to sequentially contact the fin along a path, so that the dust transmits the fin along with the airflow.

In an embodiment of the invention, the fan has a plurality of main blades. The at least one dust removing member includes a plurality of brush removing units respectively disposed on the main blades, and the brush removing units are adapted to contact the fins described above.

In an embodiment of the invention, the fins are radially arranged on the base.

In an embodiment of the invention, the geometric center of the fins and the geometric center of the fan overlap each other.

In an embodiment of the invention, the geometric center of the fin is located on the same axis as the geometric center of the fan.

In an embodiment of the invention, the heat dissipation fin set has an air inlet side and a plurality of air outlet sides, and the fan is located on the air inlet side.

Based on the above, in the above embodiment of the present invention, the heat dissipating module is connected to the dust removing component of the fan to rotate the fan together to rotate the dust removing component relative to the fin, so that the dust removing component can contact the fin. Remove dust from its gaps. By dissipating the fins and the fins, the dust removes the dust on the fins while the fans are in contact with each other, and the airflow of the fan brings the dust out of the fins. Its heat dissipation performance further increases the service life of the electronic device.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic diagram of an electronic device in accordance with an embodiment of the invention. 2 is an exploded view of the electronic device of FIG. 1. 3 is a schematic view of a fan and a dust removing component in the electronic device of FIG. 2. Referring to FIG. 1 to FIG. 3 simultaneously, in the embodiment, the electronic device 100 is, for example, a display card, and includes a board member 110 and a heating element 120 disposed on the board member 110. In this embodiment, the heat generating component is an image processor (GPU). However, in this embodiment, the type of the electronic device 100 is not limited. In other embodiments not shown, the electronic device may also be a central processing unit or a memory module on the motherboard.

In the embodiment, the electronic device 100 further includes a heat dissipation module 130 assembled on the panel 110, and includes a heat dissipation fin set 132, a fan 134 and a dust removing component 136. The heat dissipation fin group 132 has a base portion 132a, a plurality of fins 132b, a wind inlet side S1 and an air outlet side S2, wherein the base portion 132a is connected to the heat generating component 120, and the fins 132b are arranged at the base portion 132a opposite to the heat generating component 120. On one side, the heating element 120 is on the air outlet side S2, and the fan 134 is on the air inlet side S1. The fan 134 is configured to generate an air flow to flow into the gap between the fins 132b via the wind inlet side S1, and the air flow flows out of the fins 132b from the wind exit side S2. In other words, the heat generated by the heating element 120 is transferred to the fins 132b via the base 132a, and the airflow generated by the fan 134 carries its heat away from the fins 132b.

It is noted that the dusting element 136 is coupled to the fan 134 and is located between the fan 134 and the fin 132b. When the fan 134 is rotated, the dust removing member 136 is driven by the fan 134 to sequentially contact the fins 132b along a path L1 to clean the dust on the surface of the fins 132b. Moreover, since the airflow of the fan 134 flows through the gap between the fins 132b, the dust removed by the dust removing member 136 is transmitted out of the fins 132b with the airflow.

Based on the above, the heat dissipating module 130 is disposed on the fan 134 to prevent the dust removing member 136 from rotating when the fan 134 rotates, so that the dust removing member 136 sequentially contacts the heat dissipating fin group 132 along the path L1. Each fin 132b, in turn, removes dust from the fins 132b. More importantly, the dust will travel out of the fins 132b as the airflow of the fan 134. This allows the heat dissipation module 130 to maintain its cleanliness by its own dust removal structure, thereby improving the heat dissipation efficiency of the heat dissipation module 130 and the durability of the electronic device 100.

In detail, in the embodiment, the heat dissipation module 130 further includes a bracket 138 assembled to the heat dissipation fin set 132 for mounting the fan 134 described above. Furthermore, the fan 134 has a plurality of main blades 134a, and the dust removing member 136 includes a plurality of brush removing units 136a disposed at the edges of the respective main blades 134a. The brush removing units 136a are made of rubber, which can be produced by double injection. The main blades 134a of the fan 134 are collectively formed into soft brush blades. Alternatively, the brushing member 136a may be a soft bristles, as long as it is an article or material that can be used to remove dust accumulated on the fins 132b.

Moreover, the fins 132b of the present embodiment are radially arranged on the base 132a, and the fan 134 is assembled over the fins 132b by the brackets 138, and the geometric center of the fins 132b and the geometric center of the fan 134 The overlapping portions 136a on the fan 134 may extend partially into the gap between the fins 132b. In other words, the brush unit 136a is substantially the extended blade of the fan 134 toward the fin 132b. However, the geometric center of the fin and the geometric center of the fan may also be on the same axis, that is, the fan is mounted above the fin, and the brush unit partially extends downward into the fin gap.

In addition, both the fan 134 and the fins 132b are concentric circular radial arrangements. Accordingly, the brushing unit 136b disposed on the fan 134 can sequentially contact each of the fins 132b along the path L1 when the fan 134 rotates, so that the brushing unit 136a contacts or removes the fins 132b by touching or contacting the fins 132b. The vibration generated at the time removes the dust on the fins 132b. In addition, since the material of the fins 132b is rubber, the brushing unit 136a can contact the fins 132b to remove dust while avoiding damage to the fins 132b.

Then, when the dust on the fins 132b falls into the gap in the fins 132 due to the contact of the brushing unit 136a with the fins 132b, the fan 134 is used to dissipate the fins 132 through the fins 132b to dissipate heat. The air flow causes the dropped dust to be carried out of the fins 132b with the air flow. At this time, the dust removing member 136 completes the cleaning operation of the heat dissipation module 130.

In summary, in the above embodiment of the present invention, the heat dissipating module is disposed on the fan to prevent the fan from rotating while rotating the dust removing member relative to the fin to move the dust removing member. In addition to dust in the fin gap. The heat is removed from the fins by the fan, and the dust removing member and the fins are brought into contact with each other to remove the dust on the fins, so that the airflow of the fan brings the dust out of the fins.

Moreover, since the material of the dust removing member is rubber, since it is flexible and smaller than the hardness of the fin, it does not cause damage to the fin while brushing off the dust on the fin. Therefore, the heat dissipation module can maintain the heat dissipation performance by the dust removing component, and further improve the service life of the electronic device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Electronic devices

110‧‧‧plate

120‧‧‧heating components

130‧‧‧ Thermal Module

132‧‧‧Fixing fin group

132a‧‧‧ base

132b‧‧‧Fins

134‧‧‧fan

134a‧‧‧Main blade

136‧‧‧Dust removal components

136a‧‧‧Brushing unit

138‧‧‧ bracket

L1‧‧‧ path

S1‧‧‧wind side

S2‧‧‧ wind side

1 is a schematic diagram of an electronic device in accordance with an embodiment of the invention.

2 is an exploded view of the electronic device of FIG. 1.

3 is a schematic view of a fan and a dust removing component in the electronic device of FIG. 2.

110. . . Plate

120. . . Heating element

132. . . Heat sink fin set

132a. . . Base

132b. . . Fin

134. . . fan

L1. . . path

S1. . . Wind side

S2. . . Ventilation side

Claims (8)

A heat dissipation module is configured to dissipate heat from a heat generating component. The heat dissipation module includes: a heat sink fin set having a base and a plurality of fins disposed on the base, the base connecting the heat generating component, the fins The back of the sheet extends to the heat generating component; a fan is disposed on the heat sink fin set; and at least one dust removing component is coupled to the fan and located between the fan and the fins, and the dust removing component is partially downward Extending into the gap of the fins, the fan rotates to drive the dust removing component to remove dust on the heat dissipation fins, and the dust is transmitted along the gap between the fins to the airflow generated by the rotation of the fan to Outside the fins. The heat dissipation module of claim 1, wherein the fan has a plurality of main blades, and the at least one dust removing component comprises a plurality of cleaning units respectively disposed on the main blades, and the cleaning units are adapted to Contact the fins. The heat dissipation module of claim 1, wherein the fins are radially arranged on the base. The heat dissipation module of claim 3, wherein the geometric centers of the fins are on the same axis as the geometric center of the fan. The heat dissipation module of claim 3, wherein the heat dissipation fin set has an air inlet side and an air outlet side, and the fan is located on the air inlet side. An electronic device comprising: a board member; At least one heating element is disposed on the board; a heat dissipating module is assembled to the board and contacts the heating element, and the heat dissipating module comprises: a heat dissipating fin set having an air inlet side and an air outlet side a base portion and a plurality of fins, the base portion is connected to the heat generating component, the fins are arranged on a side of the base portion facing the heat generating component, and the heat generating component is located on the air outlet side; a fan is disposed in the heat dissipation a fin group is located on the air inlet side, the fan generates an airflow flowing into the fins through the air inlet side, the airflow flows out of the fins from the air outlet side; and at least one dust removing component is connected to the fan And between the fan and the fins, a portion of the dust removing member extends downward into the gap of the fins, and the fan rotates to drive the dust removing member to sequentially contact the fins along a path to The dust is caused to pass the fins from the gaps of the fins with the air flow. The electronic device of claim 6, wherein the fan has a plurality of main blades, and the at least one dust removing member comprises a plurality of brushing units respectively disposed on the main blades, and the brush removing units are suitable Contact the fins. The electronic device of claim 6, wherein the fins are radially arranged on the base, and the fan is located on the fin.