200939000 九、發明說明： 【發明所屬之技術領域】 本發明係提供-種排熱模組，尤指-種可清除積塵的排熱模 ，组0 【先前技術】 隨著電子科技麟步，電子產品所驗供的舰越來越複雜及 ❾㉟大’這睛也代表了其⑽的微處㈣之運算速度必須越來越 快使其可應付龐大的純作業I作量，然*當微處理器之運算迷 度不斷的加快之時，其在運作過程巾難生的熱能也會不斷的向 上飆昇，因此散熱問題便成為業者設計電子產品時所必須考慮的 一項重要課題。 " 就筆記型電腦而言，由於本身需滿足輕薄短小且方便攜帶之特 〇 性，所以⑽元件的排列往往非常的緊密，故各個元件（尤其是 中央處理H)所產生的熱能就會快速紐，此時若是散熱問題處 理不佳’；f僅料造成系統當機’尤有甚者，更會出現畴元件 燒壞之情況，也目此散熱魏的優劣對筆記型電齡整體表現著 實有著關鍵性的影響。 般而° ’在筆έ己型電腦内需要散熱的電子元件上，如中央處 理器S會使収额散糾之組合來達職熱的效果 ，請參閱 第1圖’第1圖為習知—排熱模組1G之示顏。排熱模組10包 200939000 含一殼體12、一風扇14以及一散熱件16。殼體12具有一出風口 18。風扇14安裝於殼體12内。散熱件16 _於出風口 18，散熱 件16具有複數個平行排列之導熱鰭片2〇。當電子元件開始發熱、 時，排熱模組10會藉由風扇14之轉動以帶動空氣流動並藉由散 熱件16之複數個導熱韓片2〇的熱傳導而將電子元件運作時所產 生之熱能快速排除至筆記型電腦外部以達到排熱降溫之效果。然 而在散熱過程中所產生的空氣流動亦會帶動内部灰塵之流動，所 ©以只要筆記型電腦經過長時間使用後，往往就會造成散熱件^積 塵_題’意即在散熱件16的導解片2〇上會出現許多的積塵 附著於其上，進而影響排熱模組1〇之散熱功能。雖然可以使用拆 卸政熱件16以直接清軸著於其上之積塵或是裝設酬等方法來 2善’但由於散熱件16本身拆卸不§，在拆卸過財很有可能會 造成扇葉斷裂等情況，而若改換成裝設翻來隔絕灰塵，此一做 去又會出現使空氣流阻升高、影響散熱能力以及增加蜂音等缺點。 ❹ 【發明内容】 因此本發明之目的在於提供一種可清除累積於散熱件上之灰 塵的排熱模組，藉以解決上述之問題。 ^發月係揭路-種可清除積塵之排熱模組’包含有—殼體，具 有一第一風動π以及—第二風動口 ； 一風扇，安裝於該殼體内， Z來引導空氣於該第—風動口與該第二風動口間進出流動；-散 ‘,、、彳於°亥第一風動口，該散熱件包含複數個平行排列之導熱 200939000 鰭片；以及一除塵裝置，設於該第二風動口及該散熱件之間，該 除塵裝置包含一氣窗結構，用來允許該風扇所引導之空氣通過； 以及複數個刮塵件，該些刮塵件係與該些導熱鰭片交錯地安置。 【實施方式】 請參閱第2圖，第2圖為本發明第-實施例-排熱模組50之 示意圖。排熱模組50包含有一殼體52、一風扇54、一散熱件允， © 以及一除塵襄置58。殼體52具有一第一風動口 6〇以及一第二風 動口 62,由第2圖可知，第一風動口⑻係實質上垂直於第二肋 口 62。風扇54係安裝於殼體52内，用來引導空氣於第一風動口 6〇與第二風動口 62間進出流動，舉例來說，當風扇54旋轉時， 風扇54可使用本身之扇葉的旋轉以射氣推出第二風動口62，藉 以使空氣穿過散熱件56 ’進而達到散熱之目的。散熱件兄係位於 第二風動口 62處，散熱件56包含複數個平行排列 、 〇除塵^係、設置於第二風動口晴熱件56之間Γ除塵片裝64置 52包3有乳窗結構65以及複數個到塵件. 來Γ風扇％所败_過，複數靖件^來^ 附者於散熱件56之導熱鰭片64上的積塵。 牙、 以下係針對除塵裝置之結構進行詳細之說明，請表 Π ’第3圖為第2圖除塵細的結構示意圖。 鰭片58與刮塵件66之部分剖面示意圖。如第3圖 不，複數個到塵件66係可為複數個齒釣，也就是說，複數綱 200939000 件66係皆以一角度自除塵裝置％之底部向上彎曲延伸。如第* 圊所示’散熱件56包含複數個平行排列之導熱鰭片％，每一導熱 縛片64上方皆具有一缺口 68，每一片導熱鰭片⑽上之缺口沾、、 係可允許相對應之到塵件66從導熱鰭片64上方往 縛片糾彼此的間隙中，藉以使除塵裝置％組合於散熱件％導上，、， =導_片64與刮塵件66之組合方式係不受上述之限制，也 Ο 除塵裝置58之複數烟塵件66亦可由其他缝插入散 ”、、件56之複數個導熱鰭片64的間隙内。 组人接時著ΓΓ5圖’第5圓為第2圖除塵裝置58輿散熱件 組石時的對應位置示意圖。如第5圖所示，複數個到塵件 ，熱件56中複數個導賴64交錯地安置而插人複數個導熱縛 片64的_内’進而使除塵裝置％組合於散熱件％上、 〇 來’錢數個導熱鯖片64上出現積塵過多的情形而使得排敎胸 之政熱功能受到影響時，使用者僅需將除塵裝置％向取 即可使除縣i 58麟散齡56，在此雜 會因本細—角触上料延狀频雜並頌著Z 向上乂取之動作而連帶地_附著於每_片·則μ 塵’而在將取出之_裝置58清潔完畢之後，使用 積 塵件66向下插入其所各自對應的_: ^8之間隙中，如此即可使除塵裝置58再次與散熱件％相結 200939000 : 紐，請參閱第6圖，第6圖為本發明第二實施例—排執模组 ^之示意圖。排熱模組刚與第一實施例之排熱模組不同之 处在於除塵裝置之設計。排熱模組100包含殼體52、風扇54、散 熱件56，以及—除塵裝置1〇2。殼體％具有第_風動口的以及 第一風動口 62。風扇54係安裝於殼體52内，用來引導空氣於第 風動口 6〇與第二風動口 62間進出流動。散熱件56係位於第二 風動口 6\’散熱件56包含複數個平行排列之導熱趙片64。除塵 ❹裝置1G2係置於第：風動口 62與散熱件56之間，除塵裝置1〇2 包含有氣窗結構65、複數個刮塵件1〇4以及-拉φ 1〇6，複數個 到塵件104係用來刮除附著於散熱件％之導熱铸片科上的積塵， 由第6圖可知，複數個刮塵件1〇4係為垂直且突出於除塵裝置⑽ 氏I5之複數個延伸柱’同第5圖所示，複數個刮塵件刚亦與散 ,、、、件56中複數個導熱縛片Μ交錯地安置且插入其所相對應導熱 續片64的間隙中’而拉帶1〇6係設置於除塵裝置脱上。如此一 ❹來’ §複數個導熱，鰭片64上出現積塵過多的情形而使得排熱模政 :〇〇之散熱魏受到影響時，使用者僅需施力於拉帶1〇6以將除塵 裝置102向上提取，即可使除塵裝置102脫離散熱件56，在此過 程中’複數個刮塵件104就會隨著使用者向上提取之動作而連帶 地刮除附著於每—片導熱鰭片64上的積塵，*在將取出之除塵裝 置102 π潔完畢之後，使用者即可將除塵裝置1〇2之複數個刮塵 件104插入其所各自對應的複數個導熱鰭片64之間隙中，如此即 可使除塵裴置1〇2再次與散熱件56相結合。此外，除塵裝置⑴2 亦可包含有一濾網1〇8，濾網1〇8係安裝於氣窗結構仍内，藉以 200939000 改善散熱鰭片64上的灰塵堆精之悟、、ff 積H而刮塵件1G4的延伸柱結 構設計可不受上述之限制，端視實_用需求而定，舉例來說， 刮塵件1〇4的延伸柱結構與除顧置底部的相對角度亦可為除如 唐以外的其他条疳。 值得注意的是’第-實施例所提及缺口結構的設計以及第二實 施例所提及翻與拉帶的增設均可相互應用於第—實施例及第二 ❹實施例中。此外，上述複數個刮塵件亦可位於除了除塵裝置底部 之外的其他位置，端視實際機構設計需求而定。 本發明係糊_裝置之複數個刮塵件的設計而達到去除散 熱件内部積塵的效果。當排熱模組經長時間使用後出現附著於導 熱.鰭片上之積塵過多的情形而使得排熱模組之散熱功能受到影響 時，使用者僅需藉由拉帶將除塵裝置向上提取，即可將除塵裝置 〇自顺觀巾取出’在此過程巾，除塵裝置上的複數侧塵件就 會因本身的結構紐並且隨著使用者向上提取之動作而連帶地到 除附著於母-片導熱縛片上的積塵，而在將取出之除塵裝置清潔 4畢之後，使用者則是可將除塵裝置沿著複數個刮塵件與複數個 導熱鰭片交錯安置之相對位置（如第5圖所示）插入相對應的間 隙中來與散熱件結合。如此—來，使用者不需使用到王具，亦不 需拆除風扇或是散熱器，即可輕鬆清除附著於導熱鰭片上之積塵。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍 2OO939000 所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖為習知一排熱模組之示意圖。 第2圖為本發明第一實施例一排熱模組之示意圖。 第3圖為第2圖排熱模組之除塵裝置的結構示意圖。 第4圖為第2圖導熱鰭片與刮塵件之部分剖面示意圖。 第5圖為第2 _賴組之除塵裝置與散熱件組合時的相對位 b意圖。 第6圖為本發明第二實施例一排熱模組之示意圖。 【主要元件符號說明】 殼體 12、52 風扇 16、56 出風口 20、64 除塵裝置 60 第二風動口 65 刮塵件 68 拉帶 108 散熱件 導熱鰭片 第一風動口 氣窗結構 缺〇 濾網 lQ ' 50、排熱模組 1〇〇 Q 14、54 18 58、1〇2 62 66、104 1〇6 11200939000 IX. Description of the invention: [Technical field to which the invention pertains] The present invention provides a heat-dissipating module, in particular, a heat-dissipating mold capable of removing dust, group 0 [Prior Art] With the advancement of electronic technology, The ship that the electronic product is inspected is more and more complicated and ❾35 big. This eye also represents the micro-location of its (10). The speed of operation must be faster and faster, so that it can cope with the huge amount of pure work I. As the computing power of the processor continues to accelerate, the heat energy that is difficult to generate in the operation process will continue to soar, so the heat dissipation problem has become an important issue that the industry must consider when designing electronic products. " In the case of notebook computers, because they need to meet the characteristics of being light, thin, and easy to carry, (10) the components are often arranged very tightly, so the heat generated by each component (especially the central processing H) is fast. New, at this time, if the heat dissipation problem is not handled well; f is only expected to cause the system to crash, especially if there is a situation where the domain components burn out, and the overall performance of the heat dissipation Wei is true. Has a critical impact. In general, 'in the electronic components that need to dissipate heat in the pen-type computer, such as the central processor S will make the combination of the amount of income to achieve the effect of the job, please refer to Figure 1 'Figure 1 is the conventional - The appearance of the heat removal module 1G. The heat rejection module 10 package 200939000 includes a housing 12, a fan 14, and a heat sink 16. The housing 12 has an air outlet 18. The fan 14 is mounted within the housing 12. The heat dissipating member 16 is disposed at the air outlet 18, and the heat dissipating member 16 has a plurality of parallel heat conducting fins 2〇. When the electronic component starts to generate heat, the heat-dissipating module 10 drives the air through the rotation of the fan 14 and heats the heat generated by the electronic component when the heat conduction of the heat-dissipating component 16 is performed. Quickly remove it to the outside of the notebook to achieve the effect of cooling and cooling. However, the air flow generated during the heat dissipation process also drives the flow of internal dust. As long as the notebook computer is used for a long time, it often causes the heat sink to accumulate dust. A large amount of dust will adhere to the guide piece 2, which will affect the heat dissipation function of the heat-dissipating module. Although it is possible to use the dismantling of the heating element 16 to directly clear the dust on it or to install it, etc., but because the heat dissipating member 16 itself is not removed, it is very likely that the fan will be disassembled. If the leaf breaks and the like, and if it is changed to install and turn over to isolate the dust, this will cause shortcomings such as increasing the air flow resistance, affecting the heat dissipation capability, and increasing the buzz. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat rejection module that can remove dust accumulated on a heat sink, thereby solving the above problems. ^发月系揭路--A dust-removing heat-dissipating module 'includes a casing, has a first wind π and a second wind port; a fan is installed in the casing, Z To guide the air into and out of the flow between the first air-venting port and the second air-moving port; -scattering,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, And a dust removing device disposed between the second air moving port and the heat dissipating member, the dust removing device comprising a louver structure for allowing air guided by the fan to pass; and a plurality of scraping members, the scraping The dust member is interlaced with the heat transfer fins. [Embodiment] Please refer to Fig. 2, which is a schematic view of a heat removal module 50 according to a first embodiment of the present invention. The heat removal module 50 includes a housing 52, a fan 54, a heat sink, and a dust removing device 58. The housing 52 has a first air port 6 〇 and a second air port 62. As can be seen from Fig. 2, the first air port (8) is substantially perpendicular to the second rib 62. The fan 54 is mounted in the housing 52 for guiding air into and out of the first air moving port 6 〇 and the second air moving port 62. For example, when the fan 54 rotates, the fan 54 can use its own fan. The rotation of the leaf pushes out the second air moving port 62 by ejaculation, so that the air passes through the heat sink 56' to achieve the purpose of heat dissipation. The heat sink member is located at the second air moving port 62. The heat dissipating member 56 includes a plurality of parallel arrays, a dust removing system, and is disposed between the second air moving port and the heat removing member 56. The dust removing piece is mounted on the 64 piece 52 package 3 The nipple structure 65 and a plurality of dust-collecting pieces. The Γ Γ fan% _ over, the plural jing pieces ^ to ^ attached to the heat sink fins on the heat-dissipating fins 64. The following is a detailed description of the structure of the dust removing device. Please refer to Figure 3 for a detailed view of the dust removal structure in Figure 2. A partial cross-sectional view of the fin 58 and the scraper 66. As shown in Fig. 3, a plurality of dust-collecting pieces 66 can be used for a plurality of tooth-picking, that is, a plurality of pieces of 200939000 pieces of 66 series are bent upward from the bottom of the dust removing device at an angle. As shown in FIG. ', the heat sink 56 includes a plurality of parallel heat-dissipating fins, each of which has a notch 68 above each of the heat-conducting fins 64, and the gaps on each of the heat-conducting fins (10) are allowed to pass. Correspondingly, the dust-collecting member 66 is in the gap between the heat-dissipating fins 64 and the binding piece, so that the dust-removing device is combined with the heat-dissipating component %, and the combination of the guiding film 64 and the dust-removing member 66 is Without being limited to the above, the plurality of soot members 66 of the dust removing device 58 may also be inserted into the gaps of the plurality of heat-conducting fins 64 of the member 56 by the other slits. Figure 2 is a schematic view of the corresponding position of the dust removing device 58 舆 heat sink stone. As shown in Fig. 5, a plurality of dust-collecting pieces, a plurality of heat-guides 56 are interleaved and inserted into a plurality of heat-conducting pieces. The _inner of 64 further combines the dust removing device % on the heat dissipating component %, and the excessive amount of dust on the heat-conductive cymbal 64 of the 钱 而 而 而 而 而 而 而 而 而 而 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政Need to take the dust removal device% to make the county i 58 Lin scattered age 56, here Due to the fact that the corner-touching material is mixed and the Z-upward action is taken, it is attached to each _ piece, then the dust is used, and after the device 58 is removed, the product is used. The dust member 66 is inserted downward into the corresponding gap of _: ^8, so that the dust removing device 58 can again be combined with the heat sink member 200939000: New Zealand, please refer to FIG. 6, FIG. The second embodiment is a schematic diagram of the discharge module. The heat removal module is different from the heat removal module of the first embodiment in the design of the dust removal device. The heat rejection module 100 includes a housing 52, a fan 54, and heat dissipation. The piece 56, and the dust removing device 1〇2. The casing % has a first air opening and a first air opening 62. The fan 54 is mounted in the casing 52 for guiding air to the first air port 6〇. The heat transfer member 56 is located at the second air moving port 6'. The heat sink 56 includes a plurality of parallel heat conducting pieces 64. The dust removing device 1G2 is placed at the first: the air opening Between 62 and the heat sink 56, the dust removing device 1〇2 includes a louver structure 65, a plurality of dust scraping members 1〇4, and a pull φ 1〇6 A plurality of dust-receiving members 104 are used to scrape dust accumulated on the heat-conductive cast sheet of the heat sink member. As can be seen from Fig. 6, a plurality of dust-removing members 1〇4 are vertical and protrude from the dust removing device (10). The plurality of extension columns of the I5 are the same as those shown in FIG. 5, and the plurality of dust-removing members are also arranged in a staggered manner with the plurality of heat-conducting pieces in the piece 56 and inserted into the corresponding heat-transfer sheets 64. In the gap, the pull-belt 1〇6 system is set on the dust-removing device. As a result, there are multiple heat-conducting, and there are excessive dust accumulation on the fins 64, which makes the heat-dissipating mode: When affected, the user only needs to apply force to the strap 1〇6 to extract the dust removing device 102 upwards, so that the dust removing device 102 can be disengaged from the heat sink 56. In the process, a plurality of scraping members 104 will follow The user can scrape off the dust attached to each of the heat transfer fins 64 by the upward extraction action. * After the dust removal device 102 is removed, the user can remove the dust removal device 1〇2. The dust scraping members 104 are inserted into the gaps of the respective plurality of heat conducting fins 64 corresponding thereto, Bae 1〇2 dust can be combined with opposite fins 56 again. In addition, the dust removing device (1) 2 may also include a strainer 1〇8, and the filter mesh 1〇8 is installed in the air window structure, thereby improving the dust accumulation on the heat radiating fins 64 by 200939000, and scraping dust by ff product H. The design of the extension column structure of the piece 1G4 is not limited by the above, and the end view depends on the demand. For example, the extension column structure of the dust scraping member 1〇4 and the relative angle of the bottom portion can be Other than the rules. It is to be noted that the design of the notch structure referred to in the first embodiment and the addition of the tuck and the band as mentioned in the second embodiment can be applied to each other in the first embodiment and the second embodiment. In addition, the plurality of the above-mentioned dust scraping members may be located at a position other than the bottom of the dust removing device, depending on the actual mechanism design requirements. The present invention is a design of a plurality of dust-removing members of the paste-device to achieve the effect of removing dust accumulated inside the heat-dissipating member. When the heat-dissipating module is exposed to a large amount of dust on the heat-conducting fin after a long period of use, the heat-dissipating function of the heat-dissipating module is affected, and the user only needs to pull the dust-removing device upward by the pulling belt. The dust removal device can be taken out from the sleek towel. In this process towel, the plurality of side dust members on the dust removal device will be attached to the mother due to the structure of the user and the user's upward extraction action. The dust on the heat-conducting tab is removed, and after the dust-removing device is removed for 4 times, the user can position the dust-removing device along a plurality of scraping members and a plurality of heat-dissipating fins (such as the fifth position). The figure is inserted into the corresponding gap to be combined with the heat sink. In this way, the user can easily remove the dust adhering to the heat-conducting fins without using the kingpiece or removing the fan or the heat sink. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the patent application scope of the present invention should be within the scope of the present invention. [Simple description of the drawing] Fig. 1 is a schematic view of a conventional row of thermal modules. 2 is a schematic view of a row of thermal modules according to a first embodiment of the present invention. Figure 3 is a schematic view showing the structure of the dust removing device of the heat discharging module of Fig. 2. Figure 4 is a partial cross-sectional view of the heat-conducting fin and the dust-removing member of Figure 2. Fig. 5 is a view showing the relative position b of the dust removing device of the second group and the heat dissipating member. Figure 6 is a schematic view of a row of thermal modules in accordance with a second embodiment of the present invention. [Main component symbol description] Housing 12, 52 Fan 16, 56 Air outlet 20, 64 Dust removal device 60 Second air moving port 65 Dust scraping member 68 Pulling belt 108 Heat sink fins First air moving air window structure missing Filter lQ ' 50, heat removal module 1〇〇Q 14, 54 18 58, 1〇2 62 66, 104 1〇6 11