TWI404494B - Heat dissipation module - Google Patents
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- TWI404494B TWI404494B TW99119575A TW99119575A TWI404494B TW I404494 B TWI404494 B TW I404494B TW 99119575 A TW99119575 A TW 99119575A TW 99119575 A TW99119575 A TW 99119575A TW I404494 B TWI404494 B TW I404494B
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Abstract
Description
本發明是有關於一種散熱模組，且特別是有關於一種具有除塵功能的散熱模組。The invention relates to a heat dissipation module, and in particular to a heat dissipation module with a dust removal function.
近年來隨著電腦科技的突飛猛進，使得電腦之運作速度不斷地提高，並且電腦內部之電子元件的發熱功率亦不斷地攀升，為了預防電腦內部的電子元件過熱，而導致電子元件發生暫時性或永久性的失效，必須提供足夠的散熱效能予電腦內部的電子元件。In recent years, with the rapid advancement of computer technology, the operation speed of computers has been continuously improved, and the heating power of electronic components inside the computer has been continuously increased. In order to prevent the electronic components inside the computer from overheating, the electronic components are temporarily or permanently. Sexual failure must provide sufficient heat dissipation to the electronic components inside the computer.
一般而言，散熱模組主要由風扇(fan)、散熱鰭片組(cooling fins)及熱管(heat pipe)所組成。散熱鰭片組配置在風罩的出風口，並與熱管連接，用以吸收由熱管所傳導的廢熱。散熱鰭片組由多數個平行排列的金屬片所組成，而相鄰之金屬片之間具有一定的間隙，提供廢熱經由對流的方式散逸到空氣中。因此，當風扇處於運作狀態下，冷卻氣流可經由風罩的出風口流向散熱鰭片組，並通過金屬片之間的間隙，以將廢熱經對流而排出機體之外，進而降低內部電子元件的工作溫度。Generally speaking, the heat dissipation module is mainly composed of a fan, a cooling fins and a heat pipe. The heat dissipation fin group is disposed at an air outlet of the wind hood and is connected to the heat pipe to absorb waste heat conducted by the heat pipe. The heat-dissipating fin group is composed of a plurality of parallel-arranged metal sheets, and a certain gap is provided between the adjacent metal sheets, so that waste heat is dissipated into the air via convection. Therefore, when the fan is in operation, the cooling airflow can flow to the heat dissipation fin group through the air outlet of the wind hood, and pass through the gap between the metal sheets to discharge the waste heat out of the body by convection, thereby reducing the internal electronic components. Operating temperature.
值得注意的是，當散熱器經過長時間使用之後，空氣中的灰塵會漸漸地堆積在散熱鰭片組及風罩內。若不清理的話，一旦過多的灰塵累積在散熱鰭片組或風罩內，容易造成氣流不易將廢熱自散熱鰭片組移除，導致散熱模組的散熱能力大幅地降低。It is worth noting that when the heat sink is used for a long time, the dust in the air will gradually accumulate in the heat sink fin group and the wind hood. If it is not cleaned, if too much dust accumulates in the heat sink fin group or the hood, it is easy to cause the airflow to remove the waste heat from the heat sink fin group, and the heat dissipation capability of the heat dissipation module is greatly reduced.
本發明提供一種散熱模組，以避免灰塵累積在散熱鰭片組上或風罩內。The invention provides a heat dissipation module to prevent dust from accumulating on the heat dissipation fin set or in the wind cover.
本發明提出一種散熱模組，組裝於一殼體內，散熱模組包括一風罩、一風扇、一散熱鰭片組以及一除塵裝置。風罩內具有一入風區、一出風區以及位於入風區與出風區之間的一導流區，導流區具有一主通道以及一位於風罩與殼體之間的次通道。風扇配置於入風區。散熱鰭片組配置於出風區。除塵裝置配置於次通道。The invention provides a heat dissipation module assembled in a casing. The heat dissipation module comprises a wind cover, a fan, a heat dissipation fin set and a dust removing device. The windshield has an air inlet zone, an air outlet zone and a flow guiding zone between the air inlet zone and the air outlet zone. The flow guiding zone has a main channel and a secondary channel between the windshield and the casing. . The fan is placed in the air inlet area. The heat sink fin group is disposed in the air outlet area. The dust removal device is disposed in the secondary channel.
在本發明之一實施例中，上述風罩的底面具有一開口以及一導流板，位於導流區的下方，而次通道的一端連接開口，且導流板沿著風罩的底面延伸且位於風罩與殼體之間，以形成次通道。In an embodiment of the present invention, the bottom surface of the hood has an opening and a deflector located below the flow guiding area, and one end of the secondary passage is connected to the opening, and the deflector extends along the bottom surface of the hood and Located between the hood and the housing to form a secondary passage.
在本發明之一實施例中，上述導流板於開口的下方對應具有一斜面以及連接斜面的一水平面。In an embodiment of the invention, the baffle has a slope below the opening and a horizontal plane connecting the slopes.
在本發明之一實施例中，上述導流板一體成形或組裝於風罩的底面。In an embodiment of the invention, the baffle is integrally formed or assembled to the bottom surface of the hood.
在本發明之一實施例中，上述除塵裝置包括靜電產生裝置，以供電給導流板，並使導流板上帶有靜電。In an embodiment of the invention, the dust removing device includes an electrostatic generating device for supplying power to the deflector and causing static electricity on the deflector.
在本發明之一實施例中，上述除塵裝置包括電壓可調式靜電產生裝置。In an embodiment of the invention, the dust removing device comprises a voltage adjustable electrostatic generating device.
在本發明之一實施例中，上述除塵裝置包括除塵濾網。In an embodiment of the invention, the dust removing device comprises a dust filter.
在本發明之一實施例中，上述除塵裝置包括除塵袋。In an embodiment of the invention, the dust removing device includes a dust bag.
在本發明之一實施例中，上述除塵裝置包括靜電除塵刷。In an embodiment of the invention, the dust removing device comprises an electrostatic precipitator brush.
在本發明之一實施例中，上述散熱模組更包括一熱管以及一散熱片，熱管的一端連接散熱鰭片組，而另一端連接散熱片。In one embodiment of the present invention, the heat dissipation module further includes a heat pipe and a heat sink. One end of the heat pipe is connected to the heat dissipation fin set, and the other end is connected to the heat sink.
基於上述，本發明的散熱模組於風罩的導流區設有次通道，可將未到達散熱鰭片組的冷卻氣流中夾帶的灰塵經由次通道排出於風罩之外。因此，可減少灰塵累積於散熱鰭片組或風罩內，以提高散熱模組的散熱效能。Based on the above, the heat dissipation module of the present invention is provided with a secondary passage in the flow guiding area of the hood, and the dust entrained in the cooling airflow that does not reach the heat dissipation fin group can be discharged outside the hood through the secondary passage. Therefore, dust can be accumulated in the heat dissipation fin group or the wind hood to improve the heat dissipation performance of the heat dissipation module.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1為本發明一實施例之散熱模組的示意圖。圖2A及圖2B為本發明二實施例之散熱模組沿著圖1之A-A線的剖面示意圖。FIG. 1 is a schematic diagram of a heat dissipation module according to an embodiment of the invention. 2A and 2B are cross-sectional views of the heat dissipation module of the second embodiment of the present invention taken along line A-A of FIG. 1.
請參考圖1、圖2A及圖2B，散熱模組10包括一風罩100、一風扇110、一散熱鰭片組120以及一除塵裝置130。風罩100內具有一入風區102、一出風區104以及位於入風區102與出風區104之間的一導流區106。風扇110配置於入風區102，而散熱鰭片組120配置於出風區104。此外，散熱模組10還可包括一熱管140以及一散熱片150，其中熱管140的一端連接散熱鰭片組120，而另一端連接散熱片150。散熱片150可直接貼附在一電子元件(未繪示)上，例如是中央處理器或高功率晶片，並且散熱片150可將電子元件內的廢熱經由熱管140傳導至散熱鰭片組120。當風扇110被驅動而處於運作狀態時，冷卻氣流F可經由風罩100的入風區102流向位於出風區104的散熱鰭片組120，並通過散熱鰭片組120之間的間隙，以將廢熱經對流而排出殼體20的出風口22之外，進而降低殼體20內部的電子元件的工作溫度。Referring to FIG. 1 , FIG. 2A and FIG. 2B , the heat dissipation module 10 includes a wind hood 100 , a fan 110 , a heat dissipation fin set 120 , and a dust removal device 130 . The windshield 100 has an air inlet area 102, an air outlet area 104, and a flow guiding area 106 between the air inlet area 102 and the air outlet area 104. The fan 110 is disposed in the air inlet region 102 , and the heat dissipation fin group 120 is disposed in the air outlet region 104 . In addition, the heat dissipation module 10 further includes a heat pipe 140 and a heat sink 150. One end of the heat pipe 140 is connected to the heat dissipation fin set 120, and the other end is connected to the heat sink 150. The heat sink 150 can be directly attached to an electronic component (not shown), such as a central processing unit or a high power chip, and the heat sink 150 can conduct waste heat in the electronic component to the heat dissipation fin set 120 via the heat pipe 140. When the fan 110 is driven to be in an operating state, the cooling airflow F may flow to the heat dissipation fin set 120 located in the air outlet area 104 via the air inlet area 102 of the air hood 100, and pass through the gap between the heat dissipation fin sets 120 to The waste heat is discharged outside the air outlet 22 of the casing 20 by convection, thereby lowering the operating temperature of the electronic components inside the casing 20.
值得注意的是，導流區106位於入風區102與出風區104之間，且導流區106具有一主通道106a，用以引導大部分的冷卻氣流F1由入風區102流向出風區104。此外，導流區106還具有一次通道106b，位於風罩100與殼體20(下殼體)之間，可將另一冷卻氣流F2中夾帶的灰塵D排出於風罩100之外，因此次通道106b亦可稱為除塵通道。It should be noted that the diversion zone 106 is located between the inflow zone 102 and the outlet zone 104, and the diversion zone 106 has a main channel 106a for guiding most of the cooling airflow F1 from the inflow zone 102 to the outlet. Area 104. In addition, the flow guiding area 106 further has a primary passage 106b between the hood 100 and the casing 20 (lower casing), and the dust D entrained in the other cooling airflow F2 can be discharged outside the hood 100, and thus Channel 106b may also be referred to as a dust removal channel.
請參考圖2A及圖2B，在本實施例中，風罩100的底面108可具有一開口112以及一導流板114，位於導流區106的下方。次通道106b的一端連接開口112，且導流板114沿著風罩100的底面108延伸且位於風罩100與殼體20之間，以形成次通道106b。導流板114的材質可為絕緣塑膠、金屬或其組合，且導流板114可一體成形於風罩100的底面108或以鎖固或焊接的方式固定於風罩100的底面108。舉例而言，導流板114於開口112的下方對應具有一斜面114a以及連接斜面114a的一水平面114b。對此，本發明不加以限制。導流板114的功能除了引導氣流移動的方向之外，還能帶電荷，以吸引帶電荷的灰塵D往導流板114移動。Referring to FIG. 2A and FIG. 2B , in the embodiment, the bottom surface 108 of the hood 100 may have an opening 112 and a baffle 114 located below the flow guiding area 106 . One end of the secondary passage 106b is connected to the opening 112, and the deflector 114 extends along the bottom surface 108 of the hood 100 and is located between the hood 100 and the housing 20 to form a secondary passage 106b. The baffle 114 may be made of insulating plastic, metal or a combination thereof, and the baffle 114 may be integrally formed on the bottom surface 108 of the hood 100 or fixed to the bottom surface 108 of the hood 100 by locking or welding. For example, the baffle 114 has a slope 114a and a horizontal surface 114b connecting the slopes 114a below the opening 112. In this regard, the invention is not limited. The function of the deflector 114, in addition to directing the direction of airflow movement, can also be charged to attract charged dust D to the deflector 114.
請參考圖2A，除塵裝置130a可配置於導流板114的外側，例如是靜電產生裝置或電壓可調式靜電產生裝置，其可供電給導流板114，以使導流板114上帶有靜電，並可視環境中灰塵量的多寡，調整供電的電壓，以決定導流板114上的靜電量。此外，請參考圖2B，除塵裝置130b也可直接配置於次通道106b內，以吸附的方式來清除灰塵D。除塵裝置130b例如是除塵濾網、除塵袋或是靜電除塵刷等。對此，本發明不加以限制。Referring to FIG. 2A, the dust removing device 130a may be disposed outside the deflector 114, such as an electrostatic generating device or a voltage-adjustable static generating device, which can supply power to the deflector 114 to cause static electricity on the deflector 114. And depending on the amount of dust in the environment, the voltage of the power supply is adjusted to determine the amount of static electricity on the deflector 114. In addition, referring to FIG. 2B, the dust removing device 130b can also be directly disposed in the secondary channel 106b to remove the dust D by adsorption. The dust removing device 130b is, for example, a dust removing filter, a dust removing bag, or an electrostatic dust removing brush. In this regard, the invention is not limited.
承上所述，當冷卻氣流F通過導流區106時，夾帶的灰塵D受到重力的牽引會逐漸往下墜落，以使部分的灰塵D經由次通道106b而吸附在除塵濾網、除塵袋或是靜電除塵刷，而除塵濾網、除塵袋或是靜電除塵刷可以手動的方式定期移除，以保持清潔。或是，讓夾帶的灰塵D帶有負電荷，並於通過導流區106時受到導流板114上的正電荷(靜電)的吸引而往下墜落，以吸附在導流板114上。當靜電產生裝置關閉電源，以使導流板114上的靜電消失時，導流板114上的灰塵不再附著而可經由氣流F2帶走而排出於風罩100之外。因此，本發明可減少灰塵D累積在散熱鰭片組120上或風罩100內，以提高散熱模組10的散熱效能。As described above, when the cooling airflow F passes through the flow guiding area 106, the entrained dust D is gradually pulled down by the gravity pulling, so that part of the dust D is adsorbed on the dust removing filter, the dust removing bag or the secondary passage 106b. It is an electrostatic dust-removing brush, and the dust filter, dust bag or electrostatic dust-cleaning brush can be manually removed periodically to keep it clean. Alternatively, the entrained dust D is negatively charged and falls downward by the positive charge (electrostatic) on the deflector 114 when passing through the flow guiding region 106 to be adsorbed on the deflector 114. When the static electricity generating device turns off the power supply so that the static electricity on the deflector 114 disappears, the dust on the deflector 114 is no longer attached and can be taken away from the hood 100 via the airflow F2. Therefore, the present invention can reduce the accumulation of dust D on the heat dissipation fin set 120 or the hood 100 to improve the heat dissipation performance of the heat dissipation module 10.
綜上所述，本發明的散熱模組於風罩的導流區設有次通道，可將未到達散熱鰭片組的冷卻氣流中夾帶的灰塵經由次通道排出於風罩之外。因此，可減少灰塵累積於散熱鰭片組或風罩內，以提高散熱模組的散熱效能。In summary, the heat dissipation module of the present invention is provided with a secondary passage in the flow guiding area of the hood, and the dust entrained in the cooling airflow that does not reach the heat dissipation fin group can be discharged outside the hood through the secondary passage. Therefore, dust can be accumulated in the heat dissipation fin group or the wind hood to improve the heat dissipation performance of the heat dissipation module.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
10．．．散熱模組10. . . Thermal module
20．．．殼體20. . . case
22．．．出風口twenty two. . . Air outlet
100．．．風罩100. . . wind cover
102．．．入風區102. . . Wind inlet area
104．．．出風區104. . . Outlet area
106．．．導流區106. . . Diversion area
106a．．．主通道106a. . . main road
106b．．．次通道106b. . . Secondary channel
108．．．底面108. . . Bottom
110．．．風扇110. . . fan
112．．．開口112. . . Opening
114．．．導流板114. . . Deflector
114a．．．斜面114a. . . Bevel
114b．．．水平面114b. . . level
120．．．散熱鰭片組120. . . Heat sink fin set
130．．．除塵裝置130. . . Dust removal device
130a．．．除塵裝置130a. . . Dust removal device
130b．．．除塵裝置130b. . . Dust removal device
140．．．熱管140. . . Heat pipe
150．．．散熱片150. . . heat sink
F．．．冷卻氣流F. . . Cooling airflow
F1．．．冷卻氣流F1. . . Cooling airflow
F2．．．冷卻氣流F2. . . Cooling airflow
D．．．灰塵D. . . dust
圖1為本發明一實施例之散熱模組的示意圖。FIG. 1 is a schematic diagram of a heat dissipation module according to an embodiment of the invention.
圖2A及圖2B為本發明二實施例之散熱模組沿著圖1之A-A線的剖面示意圖。2A and 2B are cross-sectional views of the heat dissipation module of the second embodiment of the present invention taken along line A-A of FIG. 1.
10．．．散熱模組10. . . Thermal module
20．．．殼體20. . . case
100．．．風罩100. . . wind cover
102．．．入風區102. . . Wind inlet area
104．．．出風區104. . . Outlet area
106．．．導流區106. . . Diversion area
106a．．．主通道106a. . . main road
106b．．．次通道106b. . . Secondary channel
108．．．底面108. . . Bottom
110．．．風扇110. . . fan
112．．．開口112. . . Opening
114．．．導流板114. . . Deflector
114a．．．斜面114a. . . Bevel
114b．．．水平面114b. . . level
120．．．散熱鰭片組120. . . Heat sink fin set
130a．．．除塵裝置130a. . . Dust removal device
F．．．冷卻氣流F. . . Cooling airflow
F1．．．冷卻氣流F1. . . Cooling airflow
F2．．．冷卻氣流F2. . . Cooling airflow
D．．．灰塵D. . . dust
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99119575A TWI404494B (en) | 2010-06-15 | 2010-06-15 | Heat dissipation module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99119575A TWI404494B (en) | 2010-06-15 | 2010-06-15 | Heat dissipation module |
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| Publication Number | Publication Date |
|---|---|
| TW201146155A TW201146155A (en) | 2011-12-16 |
| TWI404494B true TWI404494B (en) | 2013-08-01 |
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| TW99119575A TWI404494B (en) | 2010-06-15 | 2010-06-15 | Heat dissipation module |
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| TW (1) | TWI404494B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI651039B (en) * | 2017-08-17 | 2019-02-11 | 仁寶電腦工業股份有限公司 | Heat dissipation module and electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5919568B2 (en) * | 2011-07-25 | 2016-05-18 | パナソニックＩｐマネジメント株式会社 | Electronics |
| TWI776662B (en) * | 2021-09-01 | 2022-09-01 | 奇鋐科技股份有限公司 | Centrifugal fan noise-lowering structure |
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2010
- 2010-06-15 TW TW99119575A patent/TWI404494B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM244718U (en) * | 2003-08-22 | 2004-09-21 | Hon Hai Prec Ind Co Ltd | Heat dissipating device employing air duct |
| TW200823637A (en) * | 2006-11-23 | 2008-06-01 | Inventec Corp | Heat-dissipation device having dust-disposal mechanism |
| TWM322012U (en) * | 2007-04-11 | 2007-11-11 | Aopen Inc | Personal computer with clapboard |
| TW200931231A (en) * | 2008-01-11 | 2009-07-16 | Wistron Corp | Heat-dissipating module having a dust-removing mechanism and assembly of an electronic device and the heat-dissipating module |
| TWM350977U (en) * | 2008-10-01 | 2009-02-11 | Inventec Corp | Fan device capable of electrostatic dust removal |
| TWM360552U (en) * | 2009-03-13 | 2009-07-01 | Giga Byte Tech Co Ltd | Heat sink with circumlocutory air channel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI651039B (en) * | 2017-08-17 | 2019-02-11 | 仁寶電腦工業股份有限公司 | Heat dissipation module and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201146155A (en) | 2011-12-16 |
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