201225823 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱系統，尤指一種能有效降低電腦機 箱内之電源溫度之電腦機箱散熱系統。 【先前技術】 [0002] 隨著電腦技術之快速發展，目前之台式機中小機箱系統 之使用越來越普遍。由於機箱之體積越來越小，冷空氣 從機箱前面板之進風口進入機箱，流經電源、硬碟機和 主機板構成之風道，再進入中央處理器之散熱器後藉由 ^ 電源風扇排出。由於吸收了發熱元件熱量之較高溫度之 空氣絕大多數經由電源排出機箱，導致電源溫度上升。 【發明内容】 [0003] 鑒於以上内容，有必要提供一種能有效降低電腦機箱内 之電源溫度之電腦機箱散熱系統。 [0004] —種電腦機箱散熱系統，包括一機箱，該機箱包括一底 板、一垂直於該底板之後板及一裝設於該底板上之電腦 Q 主機板，該電腦主機板上裝有一第一發熱元件及位於該 第一發熱元件上之散熱器，該底板上鄰近電腦主機板裝 設一第二發熱元件，該第二發熱元件靠近後板設置並與 該電腦主機板分別靠近後板之不同側，該後板上相應於 該散熱器和第二發熱元件分別開設第一出風開口和第二 出風開口，該第二發熱元件與該電腦主機板之間裝設一 擋風隔板，使得由外界進入機箱之氣流流經散熱器和第 二發熱元件後分別經由該第一出風開口和第二出風開口 排出機箱。 099142900 表單編號A0101 第5頁/共16頁 0992074373-0 201225823 [0005] 與習知技術相比，上述電腦機箱散熱“藉由該撞風隔 板將該第-發熱元件和第二發熱元件分隔成兩個各自獨 立之散熱祕，並將該第-發熱元件和第二發熱元件產 生之熱量分別經由該第一出風開口和第二出風開口排出 機箱，大大降低了該第二發熱元件之溫度，有效防止了 5玄第一發熱元件因溫度過高造成之損壞。 【實施方式】 [0006] [0007] [0008] 請參閱圖1和圖3，本發明電腦機箱散熱系統包括一機箱 10 ’該機箱10包括一底板n、兩側板12、13、一前板14 及一後板15。該兩側板12、13、前板14和後板15均垂直 於該底板11設置。 該底板11上平行裝設了―電駐機板2{)，該電腦主機板 20上安裝有一第一發熱元件28和一安裝於該第—發熱元 件28上之散熱器21。該散熱器21靠近該前板14 一側可裝 設一導風罩23、—風扇24及—進風罩25。料風罩23包 括一進風開口 231和一出風開口 232，該出風開口 232用 以連接S亥散熱器21。該風扇24包括一第一侧面241和一第 二側面242。該導風罩23之進風開口 231用以連接該風扇 24之第一側面241，該進風罩25可裝設於該風扇％之第 一衝面242上。该風扇24藉由該進風罩25與機箱1〇之外 部連通’用以將外部之冷空氣導入機箱〗〇。 該底板11上鄰近電腦主機板2〇用以裝設一第二發熱元件 22和一光碟驅動器27 ,該第二發熱元件22靠近該後板15 設置並與該電腦主機板20分別靠近後板15之不同側，該 光碟驅動為2 7靠近該前板1 4設置。該前板〗4上開設複數 099142900 表單編號A010】 0992074373-0 201225823 開孔1 41。忒後板1 5上相應於該散熱器2 1開設複數第 -出風開孔15卜該第二發熱元件22之後板上開設複數第 -出風開孔221。該第二發熱元件22與該電蹈主機板2〇之 間可裝設一擋風隔板26，使得由外界進入機箱ι〇之氣流 政熱器21和第二發熱元件22後分別經由該第一出風 開孔151和第二出風開孔221排出機箱1〇。 [0009] Ο ο [0010] 請—併參閱圖2，該擋風隔板26包括一第—擋風部261、 一平行於該第一擋風部261之第二擋風部262、及一連接 於該第一擋風部261和第二擋風部262之間之彎折部263 。邊第一擋風部261包括相互連接之一第一部2611和一第 一部2612。該第一部2611之底部凸設複數用以卡固於該 底板11上之卡扣部263。該第二部2612、彎折部263和第 二擋風部262可裝設於該電腦主機板2〇上。於本發明較佳 實施方式中，該第一部2611之高度大於該第二部2612、 骜折4263和第一擋風部262之高度。該第一發熱元件28 和散熱器21鄰近該第一擋風部261設置，該第二發熱元件 22鄰近該第二擋風部262設置。其中，該第一發熱元件28 為中央處理器，該第二發熱元件22為電源供應器。該第 二發熱元件22内可裝設一電源風扇（圖未示）。 當電腦主機運行時，裝設於該導風罩23上之風扇24和該 第二發熱元件22内之電源風扇開始工作。該機箱1〇外一 部分較低溫度之空氣可由前板14上之進風開孔1 41和底板 上之進風罩25進入機箱1〇，並可於該風扇24之作用下 加速流經導風罩23和散熱器21。一部分較低溫度之空氣 吸收了該散熱器21之熱量可由該後板15上之第一出風開 099142900 表單編號Α0101 第7頁/共16頁 0992074373-0 201225823 孔1 5 1排出機箱1 0。另外一部分較低溫度之空氣可由前板 14上之進風開孔141進入機箱1〇，並可於該電源風扇之作 用下加速流經第二發熱元件22。另外一部分較低溫度之 空氣吸收了該第二發熱元件22之熱量可由該後板15上之 第一出風開孔15 2排出機箱1 〇。由於機箱1 〇内之磨強低於 外部壓強，機箱10内產生之負壓作用使得機箱1〇外較低 溫度之空氣可由前板14上之進風開孔丨41源源不斷之進入 機箱10内，並可帶走該散熱器21和第二發熱元件22之熱 量後藉由該第一出風開孔1 51和第二出風開孔丨5 2迅速被 排出。 [0011] 099142900 藉由業界熟知之電子產品熱分析軟體lcepak對該電腦 機箱散熱系統之效能進行仿真。模擬條件設定為：初始 %境溫度為35度’該第—發熱元件28之散熱效率為咖， 。玄第一發熱凡件22之散熱效率為24〇w，該散熱器21之尺 寸為85. 3mmx81_x87· 7mm，該風扇24之尺寸為92mmx 92mmx25mm，轉速為2〇〇〇rpm，最大風流量為35 32以爪 ，最大靜壓為0.084 inch-H20。根據上述之類比條件， 應用本電腦機箱散熱系統後，得出之結果為：該第二發 熱，件22前面進風處之最高溫度為50.2度，側面進風處 之最高溫度為51. 〇度。而沒有應用本電腦機箱散熱系統 時’該第二發熱元件22前面進風處之最高溫度為58.0度 ’側面進風處之最高溫度為59. 7度。由此看出，改進後 ，该第二發熱元件22之溫度顯著降低。 本發明電職箱散熱线藉由_風隔板26將該第—發 熱元件28和第二發熱元件22分隔成兩個各自獨立之散熱 表單編號A0I01 第8頁/共16頁 0992074373-0 [0012] 201225823 系統，並將該第一發熱元件28和第二發熱元件22產生之 熱量分別經由該第一出風開口 151和第二出風開口 152排 出機箱10，大大降低了該第二發熱元件22之溫度，有效 防止了該第二發熱元件22因溫度過高造成之損壞。 [0013] 综上所述，本發明確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0014] 圖1係本發明電腦機箱散熱系統一較佳實施方式之分解圖 〇 .201225823 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat dissipation system, and more particularly to a computer chassis heat dissipation system capable of effectively reducing the power supply temperature in a computer case. [Prior Art] [0002] With the rapid development of computer technology, the use of small and medium-sized chassis systems is becoming more and more popular. As the size of the chassis is getting smaller and smaller, cold air enters the chassis from the air inlet of the front panel of the chassis, flows through the air passage formed by the power supply, the hard disk drive, and the motherboard, and then enters the heat sink of the central processor and then passes the power supply fan. discharge. Since most of the air that absorbs the heat of the heat of the heat generating element is discharged from the chassis via the power source, the temperature of the power source rises. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a computer chassis heat dissipation system that can effectively reduce the power supply temperature in a computer case. [0004] A computer chassis cooling system includes a chassis, the chassis includes a bottom plate, a rear plate perpendicular to the bottom plate, and a computer Q motherboard mounted on the bottom plate, the computer motherboard is equipped with a first a heat generating component and a heat sink on the first heat generating component, wherein the second heat generating component is disposed adjacent to the computer motherboard on the bottom plate, and the second heat generating component is disposed adjacent to the rear panel and is different from the rear panel of the computer motherboard a first air outlet opening and a second air outlet opening respectively disposed on the rear panel corresponding to the heat sink and the second heat generating component, and a windshield partition is disposed between the second heat generating component and the computer motherboard The airflow entering the chassis from the outside passes through the heat sink and the second heat generating component, and then exits the chassis through the first air outlet opening and the second air outlet opening, respectively. 099142900 Form No. A0101 Page 5 / Total 16 Page 0992074373-0 201225823 [0005] Compared with the prior art, the above-mentioned computer case heat dissipation "separates the first heating element and the second heating element by the collision baffle The two separate heat dissipation secrets, and the heat generated by the first heating element and the second heating element are respectively discharged out of the chassis through the first air outlet opening and the second air outlet opening, thereby greatly reducing the temperature of the second heating element. The utility model effectively prevents the damage of the fifth heat generating component due to excessive temperature. [Embodiment] [0007] [0008] Referring to FIG. 1 and FIG. 3, the computer chassis heat dissipation system of the present invention includes a chassis 10' The chassis 10 includes a bottom plate n, two side plates 12, 13, a front plate 14, and a rear plate 15. The two side plates 12, 13, the front plate 14, and the rear plate 15 are disposed perpendicular to the bottom plate 11. The bottom plate 11 is disposed on the bottom plate 11. The electro-mechanical board 2{) is mounted in parallel with a first heating element 28 and a heat sink 21 mounted on the first heating element 28. The heat sink 21 is adjacent to the front board. 14 one side can be equipped with a windshield 23, fan 24 An air inlet cover 25. The air hood 23 includes an air inlet opening 231 and an air outlet opening 232 for connecting the S Hai radiator 21. The fan 24 includes a first side surface 241 and a second side. The air inlet 231 of the air hood 23 is connected to the first side surface 241 of the fan 24. The air inlet cover 25 can be mounted on the first punching surface 242 of the fan. The air inlet cover 25 communicates with the external portion of the chassis 1 to introduce external cold air into the chassis. The bottom plate 11 is adjacent to the computer motherboard 2 for mounting a second heating element 22 and a disk drive 27 The second heating element 22 is disposed adjacent to the rear panel 15 and adjacent to the computer motherboard 20 on a different side of the rear panel 15, and the optical disc drive is disposed adjacent to the front panel 14. The front panel is opened. Plural 099142900 Form No. A010] 0992074373-0 201225823 Opening 1 41. The rear plate 1 5 has a plurality of first-out air opening 15 corresponding to the heat sink 2 1 , and the second heating element 22 is opened on the board. - an air outlet 221. The second heating element 22 and the electric circuit board 2 can be installed A windshield partition 26 is configured to allow the airflow politicizer 21 and the second heat generating component 22 that enter the chassis ι from the outside to exit the chassis 1 through the first air outlet opening 151 and the second air outlet opening 221, respectively. [0009] Please refer to FIG. 2, the windshield partition 26 includes a first windshield portion 261, a second wind shield portion 262 parallel to the first windshield portion 261, and a A bent portion 263 connected between the first wind shield portion 261 and the second wind shield portion 262. The first first windshield portion 261 includes a first portion 2611 and a first portion 2612 that are connected to each other. A latching portion 263 is formed on the bottom portion of the first portion 2611 for fastening to the bottom plate 11. The second portion 2612, the bent portion 263, and the second wind shield portion 262 may be mounted on the computer motherboard 2A. In the preferred embodiment of the present invention, the height of the first portion 2611 is greater than the height of the second portion 2612, the folding portion 4263, and the first wind shield portion 262. The first heating element 28 and the heat sink 21 are disposed adjacent to the first wind shield 261, and the second heat generating component 22 is disposed adjacent to the second wind shield 262. The first heating element 28 is a central processing unit, and the second heating element 22 is a power supply. A power supply fan (not shown) may be disposed in the second heating element 22. When the mainframe is running, the fan 24 mounted on the air duct 23 and the power supply fan in the second heating element 22 start to operate. A portion of the lower temperature air of the chassis 1 can enter the chassis 1 through the air inlet opening 41 on the front panel 14 and the air inlet cover 25 on the bottom plate, and can accelerate through the air guiding device under the action of the fan 24. Cover 23 and heat sink 21. A portion of the lower temperature air absorbs the heat of the heat sink 21 and can be opened by the first air outlet on the rear plate 15. 099142900 Form No. 1010101 Page 7 of 16 0992074373-0 201225823 Hole 1 5 1 Discharge the chassis 1 0. An additional portion of the lower temperature air can enter the chassis 1 through the air inlet opening 141 in the front panel 14 and can be accelerated through the second heating element 22 by the power supply fan. Another portion of the lower temperature air absorbing the heat of the second heat generating component 22 can be discharged from the chassis 1 through the first air outlet opening 15 2 of the rear panel 15. Since the grinding force in the casing 1 is lower than the external pressure, the negative pressure generated in the casing 10 allows the air of the lower temperature of the casing 1 to continuously enter the casing 10 through the air inlet opening 41 of the front plate 14. The heat of the heat sink 21 and the second heat generating component 22 can be taken away and then quickly discharged by the first air outlet opening 51 and the second air outlet opening 252. [0011] 099142900 The performance of the computer chassis cooling system is simulated by the well-known electronic product thermal analysis software lcepak. The simulation condition is set such that the initial % ambient temperature is 35 degrees'. The heat dissipation efficiency of the first heating element 28 is coffee. The heat dissipation efficiency of the first heating element 22 is 24〇w, the size of the heat sink 21 is 85. 3mmx81_x87·7mm, the size of the fan 24 is 92mmx 92mmx25mm, the rotation speed is 2〇〇〇rpm, and the maximum wind flow is 35 32 with claws, the maximum static pressure is 0.084 inch-H20. According to the above analogy conditions, after applying the heat dissipation system of the computer case, the result is: the second heat, the maximum temperature of the air inlet at the front of the piece 22 is 50.2 degrees, and the maximum temperature of the side air inlet is 51. . The maximum temperature of the air inlet at the front of the second heating element 22 is 58.0 degrees. The maximum temperature at the side air inlet is 59.7 degrees. It can be seen from this that after the improvement, the temperature of the second heating element 22 is significantly lowered. The electric box heat-dissipating wire of the present invention divides the first heat-generating component 28 and the second heat-generating component 22 into two separate heat-dissipating form numbers A0I01 by the air baffle 26, page 8 / total 16 pages 0992074373-0 [0012 ] 201225823 system, and the heat generated by the first heating element 28 and the second heating element 22 is discharged out of the chassis 10 through the first air outlet opening 151 and the second air outlet opening 152, respectively, thereby greatly reducing the second heating element 22 The temperature effectively prevents the second heating element 22 from being damaged due to excessive temperature. [0013] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0014] FIG. 1 is an exploded view of a preferred embodiment of a computer chassis heat dissipation system of the present invention.
[0015] 圖2係圖1中擋風隔板之示意圖。 [0016] 圖3係圖1中電腦機箱散熱系統之組裝圖。 【主要元件符號說明】 [0017] 機箱：10 〇 [0018] 底板：11 [0019] 側板：12、13 [0020] 前板：14 [0021] 後板：15 [0022] 電腦主機板：20 [0023] 散熱器：21 099142900 表單編號A0101 第9頁/共16頁 0992074373-0 201225823 [0024] 第二發熱元件： 22 [0025] 導風罩： 23 [0026] 風扇：2 4 [0027] 進風罩： 25 [0028] 擋風隔板 ：26 [0029] 光碟驅動器：27 [0030] 第一發熱元件： 28 [0031] 進風開孔 ：141 [0032] 第一出風開孔： 151 [0033] 第二出風開孔： 221 [0034] 進風開口 ：231 [0035] 出風開口 ：232 [0036] 第一側面 ：241 [0037] 第二側面 ：242 [0038] 第一擋風部：261 [0039] 第二擋風部：262 [0040] 彎折部： 263 [0041] 第一部： 2611 [0042] 第二部： 2612 099142900 表單編號AO]01 第10頁/共16頁 0992074373-0 201225823 2613 [0043] 卡扣部2 is a schematic view of the windshield spacer of FIG. 1. 3 is an assembled view of the computer chassis heat dissipation system of FIG. 1. [Main component symbol description] [0017] Chassis: 10 〇 [0018] Base plate: 11 [0019] Side plate: 12, 13 [0020] Front plate: 14 [0021] Rear plate: 15 [0022] Computer motherboard: 20 [ 0023] Radiator: 21 099142900 Form No. A0101 Page 9 / Total 16 Page 0992074373-0 201225823 [0024] Second heating element: 22 [0025] Air hood: 23 [0026] Fan: 2 4 [0027] Intake air Cover: 25 [0028] Windshield: 26 [0029] Disc drive: 27 [0030] First heating element: 28 [0031] Air inlet: 141 [0032] First air outlet: 151 [0033 ] Second outlet opening: 221 [0034] Inlet opening: 231 [0035] Outlet opening: 232 [0036] First side: 241 [0037] Second side: 242 [0038] First windshield: 261 [0039] Second windshield: 262 [0040] Bending: 263 [0041] Part 1: 2611 [0042] Part 2: 2612 099142900 Form No. AO] 01 Page 10 / Total 16 Page 0992074373- 0 201225823 2613 [0043] Buckle
099142900 表單編號A0101 第Π頁/共16頁 0992074373-0099142900 Form No. A0101 Page/Total 16 Pages 0992074373-0