201225820 六、發明說明： " 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱系統，尤指一種能有效降低一體式 電腦内之溫度之一體式電腦散熱系統。 【先前技術】 [0002] 隨著電腦技術之發展，電腦廠商開始把主機集成到顯示 器中，從而形成一體式電腦（aU-in-one)，縮寫為 ' AI0。AI0相較習知台式機有著連線少、體積小之優勢， 集成度更高，價格亦並無明顯變化，可塑性則更強，廠 〇 商可以設計出極具個性之產品。習知之一體式電腦散熱 系統中於驅動器設備（例如硬碟機驅動器、光碟驅動器 等）上方安裝一風扇，專門用以為驅動器設備散熱，增 加了生產成本。 【發明内容】 [0003] 鑒於以上内容，有必要提供一種能有效降低一體式電腦 内之驅動器設備溫度之一體式電腦散熱系統。 ^ [0004] 一種一體式電腦散熱系統，包括一顯示模組及一裝設於 〇 該顯示模組背部之主機模組，該主機模組包括一承載板 ，該承載板上裝設一電腦主機板，該電腦主機板一面裝 設一第一散熱風扇，該承載板上裝設一驅動器設備，該 驅動器設備周圍裝設一導風板，該導風板將來自散熱系 統外部之冷空氣沿一平行於該驅動器設備之第一方向導 向驅動器設備，冷空氣吸收了該驅動器設備之熱量後經 由該第一散熱風扇沿一垂直於該第一方向之第二方向排 出散熱系統。 099142727 表單編號A0101 第3頁/共12頁 0992074080-0 201225820 [0005] 與習知技術相比，上述一體式電腦散熱系統藉由該導風 板將來自散熱系統外部之冷空氣沿該第一方向導向驅動 器設備，使得來自散熱系統外部之冷空氣盡可能多之流 向該驅動器設備，降低了該驅動器設備之溫度。 【實施方式】 [0006] 請一併參閱圖1和圖2，本發明一體式電腦散熱系統包括 一外殼10、一主機模組20、一邊框30及一固定於該邊框 30上之顯示模組40，該主機模組20裝設於該顯示模組40 背部。 [0007] 該主機模組20包括一承載板22及一安裝於該承載板22上 之電腦主機板24。該電腦主機板24—面裝設一第一發熱 元件（圖未示）及一位於該第一發熱元件上之第一散熱 風扇21。該承載板22上裝設一第二散熱風扇23及一驅動 器設備25。該驅動器設備25周圍裝設一導風板26，該導 風板26將來自散熱系統外部之冷空氣沿一平行於該驅動 器設備25之第一方向導向驅動器設備25。冷空氣吸收了 該驅動器設備25之熱量後經由該第一散熱風扇21沿一垂 直於該第一方向之第二方向排出散熱系統。該電腦主機 板24另一面裝設一第二發熱元件（圖未示）。該電腦主 機板24上鄰近該第一散熱風扇21裝設一第三發熱元件29 。該第一散熱風扇21和第二散熱風扇23分別為裝設於該 承載板22上之一第一散熱器27和一第二散熱器28散熱。 [0008] 該導風板26包括一擋風部261及自該擋風部261兩側垂直 延伸出之兩導風部262、263。來自散熱系統外部之冷空 氣經由該檔風部261和驅動器設備25之間之縫隙進入該導 099142727 表單編號A0101 第4頁/共12頁 0992074080-0 201225820 ❹ 風板26，並沿該導風部262、263之延伸方向流經該驅動 器設備25為其散熱。其中，該第一發熱元件為中央處理 器，該第二發熱元件為顯卡，該第三發熱元件29為記憶 體，該驅動器設備25為硬碟機驅動器或光碟驅動器。該 外殼10上相應於該第一散熱風扇21和第二散熱風扇23位 置處開設複數第一進風開孔11。該外殼10上相應於該驅 動器設備25位置處開設複數第二進風開孔12。該外殼10 上相應於該第三發熱元件29位置處開設複數第三進風開 孔13。該外殼10上相應於該第一散熱器27和第二散熱器 28位置處開設複數出風開孔14。該第一散熱器27和第二 散熱器28分別經由複數熱管50與該第二發熱元件和第一 發熱元件熱接觸，分別用以為該第二發熱元件和第一發 熱元件散熱。 [0009] Ο 當電腦主機運行時，該第一散熱風扇21和第二散熱風扇 23開始工作。該散熱系統外一部分較低溫度之空氣由外 殼10上之第二進風開孔12進入主機模組20，並沿該導風 部262、263之延伸方向流經該驅動器設備25。一部分較 低溫度之空氣吸收了該驅動器設備25之熱量，並於該第 一散熱風扇21和第二散熱風扇23之作用下加速流經該第 一散熱器27和第二散熱器28經由該外殼10上出風開孔14 排出。一部分較低溫度之空氣由外殼10上之第一進風開 孔11進入主機模組20，並於該第一散熱風扇21和第二散 熱風扇23之作用下加速流經該第一散熱器27和第二散熱 器28經由該外殼10上出風開孔14排出。另外一部分較低 溫度之空氣由外殼10上之第三進風開孔13進入主機模組 099142727 表單編號Α0101 第5頁/共12頁 0992074080-0 201225820 20，另外一部分較低溫度之空氣吸收了該第三發熱元件 29之熱量，並於該第一散熱風扇21和第二散熱風扇23之 作用下加速流經該第一散熱器2 7和第二散熱器2 8經由該 外殼10上出風開孔14排出。由於散熱系統内之壓強低於 外部壓強，因而於散熱系統内產生之負壓作用使得主機 模組20外較低溫度之空氣可經由外殼10上之第一進風開 孔11、第二進風開孔12和第三進風開孔13源源不斷之進 入散熱系統内，並帶走該第一發熱元件、第二發熱元件 和第三發熱元件29之熱量後藉由該出風開孔14迅速被排 出。 [0010] 藉由一業界熟知之電子產品熱分析軟體Icepak對該一體 式電腦散熱系統之效能進行仿真。模擬條件設定為：初 始環境溫度為35度，該第一發熱元件之散熱效率為65W， 該第二發熱元件22之散熱效率為85W，該第三發熱元件29 之散熱效率為22 W，該硬碟機驅動器25之散熱效率為25 W，該第一散熱器27和第二散熱器28之尺寸為85. 3mmx 81mmx87. 7mm，該第一散熱風扇21和第二散熱風扇23之 尺寸為92n]mx92mmx25min，轉速為2000rpm，最大風流量 為35. 32cfm，最大靜壓為0. 0 84 inch-H20。根據上述 之類比條件，應用本一體式電腦散熱系統後，得出之結 果為：該硬碟機驅動器25表面之最高溫度為47. 5047度 。而沒有應用本一體式電腦散熱系統時，該硬碟機驅動 器25表面之最高溫度為47.8345度。由此看出，改進後 ，該硬碟機驅動器25之溫度與改進前大致相等，甚至有 所降低。而且使用本一體式電腦散熱系統後，節省了習 099142727 表單編號A0101 第6頁/共12頁 0992074080-0 201225820 知之一體式電腦散熱系統中安裝於該硬碟機驅動器25上 方之散熱風扇，降低了生產成本。 [0011] 本發明一體式電腦散熱系統藉由該導風板2 6將來自散熱 系統外部之冷空氣沿該第一方向導向驅動器設備25，使 得來自散熱系統外部之冷空氣盡可能多之流向該驅動器 設備25，降低了該驅動器設備25之溫度。 [0012] 綜上所述，本發明確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0013] 圖1係本發明一體式電腦散熱系統一較佳實施方式之分解 圖。 [0014] 圖2係圖1中一體式電腦散熱系統之組裝圖。 【主要元件符號說明】 [0015] 外殼：10 [0016] 第一進風開孔：11 [0017] 第二進風開孔：12 [0018] 第三進風開孔：13 [0019] 出風開孔：14 [0020] 主機模組：20 099142727 表單編號A0101 第7頁/共12頁 0992074080-0 201225820 [0021] 第一散熱風扇：21 [0022] 承載板：22 [0023] 第二散熱風扇：23 [0024] 電腦主機板：24 [0025] 驅動器設備：25 [0026] 導風板.2 6 [0027] 第一散熱器：27 [0028] 第二散熱器：28 [0029] 第三發熱元件：29 [0030] 邊框：30 [0031] 顯示模組：40 [0032] 熱管：50 [0033] 擋風部：261 [0034] 導風部：262、263 099142727 表單編號A0101 第8頁/共12頁 0992074080-0201225820 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation system, and more particularly to a computerized heat dissipation system capable of effectively reducing the temperature in an integrated computer. [Prior Art] [0002] With the development of computer technology, computer manufacturers began to integrate the host into the display to form an integrated computer (aU-in-one), abbreviated as 'AI0. Compared with the conventional desktop, AI0 has the advantages of less connection and smaller size, higher integration, no significant change in price, and greater plasticity. The manufacturer can design a product with great personality. In a conventional computer cooling system, a fan is installed above a driver device (such as a hard disk drive, a disk drive, etc.) to specifically dissipate heat for the drive device, thereby increasing production costs. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a computerized cooling system that can effectively reduce the temperature of a driver device in an integrated computer. [0004] An integrated computer cooling system includes a display module and a host module mounted on the back of the display module, the host module includes a carrier board, and a host computer is mounted on the carrier board a first cooling fan is disposed on one side of the computer motherboard, and a driver device is disposed on the carrier board, and an air guiding plate is disposed around the driving device, and the air guiding plate carries a cold air from the outside of the heat dissipation system Parallel to the first direction of the driver device to the driver device, the cold air absorbs the heat of the driver device and then discharges the heat dissipation system through the first heat dissipation fan in a second direction perpendicular to the first direction. 099142727 Form No. A0101 Page 3 of 12 0992074080-0 201225820 [0005] Compared with the prior art, the integrated computer cooling system uses the air deflector to bring cold air from the outside of the heat dissipation system along the first direction. The drive device is directed such that cold air from outside the heat dissipation system flows as much as possible to the drive device, reducing the temperature of the drive device. [0006] Referring to FIG. 1 and FIG. 2 together, the integrated computer cooling system of the present invention includes a casing 10, a host module 20, a frame 30, and a display module fixed to the frame 30. 40. The host module 20 is mounted on the back of the display module 40. The mainframe module 20 includes a carrier board 22 and a computer motherboard 24 mounted on the carrier board 22. The computer motherboard 24 is provided with a first heat generating component (not shown) and a first heat radiating fan 21 on the first heat generating component. A second cooling fan 23 and a driver device 25 are mounted on the carrier board 22. An air deflector 26 is disposed around the driver device 25, and the air deflector 26 directs cold air from the outside of the heat dissipation system to the driver device 25 in a first direction parallel to the driver device 25. The cold air absorbs the heat of the driver device 25 and then discharges the heat dissipation system through the first heat dissipation fan 21 in a second direction perpendicular to the first direction. The other side of the main computer board 24 is provided with a second heating element (not shown). A third heating element 29 is mounted on the computer main board 24 adjacent to the first cooling fan 21. The first heat dissipating fan 21 and the second heat dissipating fan 23 respectively dissipate heat from the first heat sink 27 and the second heat sink 28 mounted on the carrying board 22. The air deflector 26 includes a wind shield portion 261 and two air guiding portions 262 and 263 extending perpendicularly from both sides of the wind shield portion 261. The cold air from the outside of the heat dissipation system enters the guide 099142727 via the gap between the windshield portion 261 and the driver device 25, Form No. A0101, Page 4/12, 0992074080-0 201225820, Windshield 26, and along the air guiding portion The extending direction of 262, 263 flows through the driver device 25 for heat dissipation. The first heating element is a central processing unit, the second heating element is a graphics card, the third heating element 29 is a memory, and the driver device 25 is a hard disk drive or a compact disk drive. A plurality of first air inlet openings 11 are defined in the outer casing 10 at positions corresponding to the first heat dissipation fan 21 and the second heat dissipation fan 23. A plurality of second air inlet openings 12 are defined in the outer casing 10 at positions corresponding to the drive device 25. A plurality of third air inlet openings 13 are formed in the outer casing 10 at positions corresponding to the third heat generating component 29. A plurality of air outlet openings 14 are defined in the outer casing 10 at positions corresponding to the first heat sink 27 and the second heat sink 28. The first heat sink 27 and the second heat sink 28 are in thermal contact with the second heat generating component and the first heat generating component via the plurality of heat pipes 50, respectively, for respectively dissipating heat from the second heat generating component and the first heat generating component. [0009] The first cooling fan 21 and the second cooling fan 23 start to operate when the mainframe is running. A portion of the lower temperature air outside the heat dissipation system enters the main module 20 from the second air inlet opening 12 in the outer casing 10 and flows through the driver device 25 in the direction in which the air guiding portions 262, 263 extend. a portion of the lower temperature air absorbs the heat of the driver device 25 and accelerates through the first heat sink 27 and the second heat sink 28 via the outer casing by the first heat radiating fan 21 and the second heat radiating fan 23 10 upper air outlet 14 is discharged. A portion of the lower temperature air enters the main module 20 from the first air inlet opening 11 of the outer casing 10, and accelerates through the first heat sink 27 under the action of the first cooling fan 21 and the second cooling fan 23. And the second heat sink 28 is discharged through the air outlet 14 on the outer casing 10. Another portion of the lower temperature air enters the main module 099142727 from the third air inlet opening 13 in the outer casing 10. Form No. Α0101 Page 5 of 12 0992074080-0 201225820 20, another part of the lower temperature air absorbs the The heat of the third heat generating component 29 is accelerated by the first heat radiating fan 21 and the second heat radiating fan 23 to flow through the first heat sink 27 and the second heat sink 28 through the outer casing 10 The hole 14 is discharged. Since the pressure in the heat dissipation system is lower than the external pressure, the negative pressure generated in the heat dissipation system allows the air of the lower temperature outside the main unit module 20 to pass through the first air inlet opening 11 and the second air inlet on the outer casing 10. The opening 12 and the third inlet opening 13 continuously enter the heat dissipation system, and take away the heat of the first heating element, the second heating element and the third heating element 29, and then quickly pass through the outlet opening 14 It is discharged. [0010] The performance of the integrated computer cooling system is simulated by a well-known electronic product thermal analysis software Icepak. The simulation condition is set such that the initial ambient temperature is 35 degrees, the heat dissipation efficiency of the first heating element is 65 W, the heat dissipation efficiency of the second heating element 22 is 85 W, and the heat dissipation efficiency of the third heating element 29 is 22 W. The heat dissipation efficiency of the disk drive 25 is 25 W, and the size of the first heat sink 27 and the second heat sink 28 is 85. 3 mm x 81 mm x 87. 7 mm, and the size of the first heat dissipation fan 21 and the second heat dissipation fan 23 is 92 n] 0 84 inch-H20。 The maximum static air pressure is 0. 0 84 inch-H20. According to the above-mentioned analogy conditions, after the application of the integrated computer cooling system, the result is that the maximum temperature of the surface of the hard disk drive 25 is 47.5047 degrees. When the integrated computer cooling system is not applied, the maximum temperature of the surface of the hard disk drive 25 is 47.8345 degrees. It can be seen from this that after the improvement, the temperature of the hard disk drive 25 is substantially equal to or even reduced before the improvement. Moreover, after using the integrated computer cooling system, the saving 099142727 Form No. A0101 Page 6 / Total 12 Page 0992074080-0 201225820 Knowing that the cooling fan mounted on the hard disk drive 25 in one of the computer cooling systems is reduced Cost of production. [0011] The integrated computer heat dissipation system of the present invention guides the cold air from the outside of the heat dissipation system to the driver device 25 in the first direction by the air guide plate 26, so that the cold air from the outside of the heat dissipation system flows as much as possible to the The driver device 25 reduces the temperature of the driver device 25. [0012] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0013] FIG. 1 is an exploded view of a preferred embodiment of an integrated computer cooling system of the present invention. 2 is an assembled view of the integrated computer heat dissipation system of FIG. 1. [Main component symbol description] [0015] Housing: 10 [0016] First air inlet opening: 11 [0017] Second air inlet opening: 12 [0018] Third air inlet opening: 13 [0019] Opening: 14 [0020] Main unit: 20 099142727 Form No. A0101 Page 7 / Total 12 Page 0992074080-0 201225820 [0021] First cooling fan: 21 [0022] Carrier board: 22 [0023] Second cooling fan :23 [0024] Computer motherboard: 24 [0025] Drive device: 25 [0026] Air deflector. 2 6 [0027] First heat sink: 27 [0028] Second heat sink: 28 [0029] Third heat Component: 29 [0030] Frame: 30 [0031] Display Module: 40 [0032] Heat Pipe: 50 [0033] Windshield: 261 [0034] Air Guide: 262, 263 099142727 Form No. A0101 Page 8 / Total 12 pages 0992074080-0