CN205755249U - All-in-one radiating subassembly - Google Patents
All-in-one radiating subassembly Download PDFInfo
- Publication number
- CN205755249U CN205755249U CN201620700967.5U CN201620700967U CN205755249U CN 205755249 U CN205755249 U CN 205755249U CN 201620700967 U CN201620700967 U CN 201620700967U CN 205755249 U CN205755249 U CN 205755249U
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- Prior art keywords
- heat
- conducting
- elements
- heat dissipation
- radiating
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Abstract
All-in-one radiating subassembly, including: conducting-heat elements, its one end is for contacting with integration machine mainboard；Thermal component, thermal component includes heat-radiating substrate and heat dissipation grid, and heat-radiating substrate contacts with the other end of conducting-heat elements, and heat dissipation grid is arranged on heat-radiating substrate, has cooling air channel between two adjacent heat dissipation grids；Air-cooler, it is oppositely arranged with thermal component.This all-in-one radiating subassembly is provided with conducting-heat elements and thermal component especially, utilizes conducting-heat elements outwards to be derived by the heat produced on mainboard rapidly, can be diffused in air by the heat that conducting-heat elements is derived rapidly.
Description
Technical field
This utility model relates to Intelligent treatment equipment technical field, more specifically, particularly to a kind of all-in-one with dissipating
Hot assembly.
Background technology
All-in-one is that it has by the computer apparatus of display, cpu motherboard, hard disk and other integration of equipments to one
The advantages such as degree of integration is high, volume is little.
Understanding as general knowledge, in computer running, display, cpu motherboard even hard disk all can distribute heat,
In traditional computer architecture, all can be positioned on the position of CPU at mainboard and radiator is set, and also one and radiator can be set
Relative radiator fan.Fan is utilized to realize the heat radiation of cpu motherboard.
But, in all-in-one, owing to the degree of integration of all-in-one is higher, compact conformation, the speed that its heat distributes is just
Have and obviously reduce.If used for a long time, heat constantly accumulates, and will result in all-in-one serious the asking of heating
Topic.
Utility model content
(1) technical problem
In sum, how to solve the problem that all-in-one heating is serious, become those skilled in the art urgently to be resolved hurrily
Problem.
(2) technical scheme
This utility model provides a kind of all-in-one radiating subassembly, for integration machine mainboard is dispelled the heat, including:
Conducting-heat elements, described conducting-heat elements is metal list structure, and one end of described conducting-heat elements is used for and all-in-one
Mainboard contacts；
Thermal component, described thermal component includes heat-radiating substrate and heat dissipation grid, and described heat-radiating substrate is metal system
Heat-radiating substrate, described heat-radiating substrate is plank frame, and described heat-radiating substrate contacts with the other end of described conducting-heat elements, described scattered
Heat grate is metal heat dissipation grid, and described heat dissipation grid is provided with multiple, and whole described heat dissipation grids is arranged at described dissipating
On hot substrate, have for cooling down the cooling air channel that air-flow passes through between two adjacent described heat dissipation grids；
Air-cooler, described air-cooler includes air outlet, and described air outlet is oppositely arranged with described thermal component.
Preferably, whole described heat dissipation grids is arranged in the same direction, arranges at equal intervals between described heat dissipation grid.
Preferably, described conducting-heat elements is copper conducting-heat elements；Described conducting-heat elements includes three, three described heat conduction
Between parts, interval is arranged；Whole described conducting-heat elements is arranged in parallel.
Preferably, described heat-radiating substrate is copper heat-radiating substrate, and described heat dissipation grid is copper heat dissipation grid；Described heat radiation
Substrate is connected with described heat dissipation grid and is formed with the thermal component of integral structure.
Preferably, this utility model also includes link, and described link is arranged at the upside of described conducting-heat elements also
Offset with described conducting-heat elements.
Preferably, described link is metal link；Described link is X-shaped structure, opens on described link
It is provided with the installing hole passed for screw.
Preferably, described link is aluminum link.
(3) beneficial effect
Designed by said structure:
The all-in-one radiating subassembly that this utility model provides, it is provided with conducting-heat elements and thermal component especially, sharp
Can outwards be derived by the heat that produce on mainboard rapidly with conducting-heat elements, thermal component is connected with conducting-heat elements, radiating part
Part is made up of heat-radiating substrate and heat dissipation grid, and thermal component is relatively big, as such, it is possible to will lead rapidly with the contact area of air
The heat that thermal part is derived diffuses in air.Further, this utility model is also provided with air-cooler, accelerates gas by air-cooler
Circulation, can increase gas and take away the speed of thermal component surface heat.
Accompanying drawing explanation
Fig. 1 is the structural representation of all-in-one radiating subassembly in this utility model embodiment；
In FIG, component names with the corresponding relation of reference is:
Conducting-heat elements 1, heat-radiating substrate 2, heat dissipation grid 3, air-cooler 4, link 5.
Detailed description of the invention
With embodiment, embodiment of the present utility model is described in further detail below in conjunction with the accompanying drawings.Following example
For this utility model is described, but can not be used for limiting scope of the present utility model.
In description of the present utility model, except as otherwise noted, " multiple " are meant that two or more；Term
On " ", D score, "left", "right", " interior ", " outward ", " front end ", " rear end ", " head ", the orientation of the instruction such as " afterbody " or position close
System for based on orientation shown in the drawings or position relationship, be for only for ease of description this utility model and simplifying describe rather than
Instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, therefore can not
It is interpreted as restriction of the present utility model.Additionally, term " first ", " second ", " the 3rd " etc. are only used for describing purpose, and can not
It is interpreted as instruction or hint relative importance.
In description of the present utility model, it should be noted that unless otherwise clearly defined and limited, term " phase
Even ", " connection " should be interpreted broadly, for example, it may be fixing connection, it is also possible to be to removably connect, or be integrally connected；Can
To be mechanical connection, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary.For this
For the those of ordinary skill in field, above-mentioned term concrete meaning in this utility model can be understood with concrete condition.
Refer to Fig. 1, Fig. 1 is the structural representation of all-in-one radiating subassembly in this utility model embodiment.
This utility model provides a kind of all-in-one radiating subassembly, for dispelling the heat integration machine mainboard.In this reality
With in a novel embodiment, this radiating subassembly includes:
1, conducting-heat elements, conducting-heat elements 1 is metal list structure, and one end of conducting-heat elements 1 is used for and integration machine mainboard
Contact.Conducting-heat elements 1 act as the main heat sink area contact with all-in-one, by heat transfer process, all-in-one is (main
Integration machine mainboard) on heat conduction on conducting-heat elements 1.Conducting-heat elements 1 has preferably employed heat-transfer rate metal faster
Structure, in an embodiment of the present utility model, conducting-heat elements 1 uses fine copper to make, and it is solid bar-like member.In order to
Accelerating the heat absorption speed of conducting-heat elements 1, conducting-heat elements 1 is processed according to shaped tiles for the one end contacted with mainboard,
Conducting-heat elements 1 can be properly fit onto on mainboard, by the way of this increase contact area, improve the conduction of heat
Speed.
2, thermal component, thermal component includes heat-radiating substrate 2 and heat dissipation grid 3, and heat-radiating substrate 2 dispels the heat for metal system
Substrate, heat-radiating substrate 2 is plank frame, and heat-radiating substrate 2 contacts with the other end of conducting-heat elements 1, and heat dissipation grid 3 dissipates for metal system
Heat grate, heat dissipation grid 3 is provided with multiple, and whole heat dissipation grids 3 is arranged on heat-radiating substrate 2, two adjacent heat radiation lattice
Have between grid for cooling down the cooling air channel that air-flow passes through.Thermal component is connected with conducting-heat elements 1, and conducting-heat elements 1 absorbs
Heat be transferred on thermal component, thermal component includes heat-radiating substrate 2 and heat dissipation grid 3, and heat dissipation grid 3 can increase
Heat-radiating substrate 2 and the contact area of air, so can more be diffused into heat in air in express delivery.
3, air-cooler, air-cooler 4 includes air outlet, and air outlet is oppositely arranged with thermal component.Acting as of air-cooler 4
Accelerate gas velocity of liquid assets, as such, it is possible to heat dissipation grid 3 and the heat of heat-radiating substrate 2 row are taken away in more express delivery.
Being designed by said structure, the all-in-one radiating subassembly that this utility model provides, it is provided with heat-conducting part especially
Part 1 and thermal component, utilize conducting-heat elements 1 outwards to be derived by the heat produced on mainboard rapidly, thermal component with
Conducting-heat elements 1 connects, and thermal component is made up of heat-radiating substrate 2 and heat dissipation grid 3, and the contact area of thermal component and air is relatively
Greatly, as such, it is possible to rapidly the heat that conducting-heat elements 1 is derived is diffused in air.Further, this utility model is also provided with cold
Blower fan 4, accelerates gas by air-cooler 4 and circulates, can increase gas and take away the speed of thermal component surface heat.
In this utility model, whole heat dissipation grids 3 is arranged in the same direction, arranges at equal intervals between heat dissipation grid 3.
Specifically, conducting-heat elements 1 is copper conducting-heat elements；Conducting-heat elements 1 includes three, between three conducting-heat elements between
Every setting；Whole conducting-heat elements is arranged in parallel.
Specifically, heat-radiating substrate 2 is copper heat-radiating substrate 2, and heat dissipation grid 3 is copper heat dissipation grid 3；Heat-radiating substrate 2 with
Heat dissipation grid 3 connects and is formed with the thermal component of integral structure.
Understand in said structure designs: conducting-heat elements 1, so can be by generation on mainboard for contacting with mainboard
Heat is quickly transferred on conducting-heat elements 1.In order to improve the reliability being connected between conducting-heat elements 1 and mainboard, it is to avoid heat-conducting part
The situation that part 1 comes off from mainboard occurs, additionally providing link 5 in the present embodiment, link 5 is arranged at conducting-heat elements 1
Upside also offsets with conducting-heat elements 1.
Specifically, link 5 is metal link；Link 5 is X-shaped structure, offers for spiral shell on link 5
Follow closely through installing hole.
In a preferred embodiment of the present invention, link 5 is aluminum link.
Offer installing hole in four ends of link 5, utilize bolt to pass installing hole and link 5 is fastened on mainboard
On, conducting-heat elements 1 is then compressed between mainboard and installing rack.
The all-in-one arranged by above-mentioned all-in-one radiating subassembly, is mounted with above-mentioned radiating subassembly, so, on mainboard
The heat produced can quickly move through radiating subassembly and be dispersed in air, and radiating efficiency is high, good heat dissipation effect.
Embodiment of the present utility model is given for the sake of example and description, and is not exhaustively or to incite somebody to action
This utility model is limited to disclosed form.Many modifications and variations are aobvious and easy for the ordinary skill in the art
See.Selecting and describing embodiment is in order to principle of the present utility model and actual application are more preferably described, and makes this area
Those of ordinary skill it will be appreciated that this utility model thus design is suitable to the various embodiments with various amendments of special-purpose.
Claims (7)
1. an all-in-one radiating subassembly, for integration machine mainboard is dispelled the heat, it is characterised in that including:
Conducting-heat elements (1), described conducting-heat elements is metal list structure, and one end of described conducting-heat elements is used for and one owner
Plate contacts；
Thermal component, described thermal component includes heat-radiating substrate (2) and heat dissipation grid (3), and described heat-radiating substrate is metal
Heat-radiating substrate processed, described heat-radiating substrate is plank frame, and described heat-radiating substrate contacts with the other end of described conducting-heat elements, described
Heat dissipation grid is metal heat dissipation grid, and described heat dissipation grid is provided with multiple, and whole described heat dissipation grids is arranged at described
On heat-radiating substrate, have for cooling down the cooling air channel that air-flow passes through between two adjacent described heat dissipation grids；
Air-cooler (4), described air-cooler includes air outlet, and described air outlet is oppositely arranged with described thermal component.
All-in-one radiating subassembly the most according to claim 1, it is characterised in that
Whole described heat dissipation grids is arranged in the same direction, arranges at equal intervals between described heat dissipation grid.
All-in-one radiating subassembly the most according to claim 2, it is characterised in that
Described conducting-heat elements is copper conducting-heat elements；
Described conducting-heat elements includes three, and between three described conducting-heat elements, interval is arranged；
Whole described conducting-heat elements is arranged in parallel.
All-in-one radiating subassembly the most according to claim 3, it is characterised in that
Described heat-radiating substrate is copper heat-radiating substrate, and described heat dissipation grid is copper heat dissipation grid；
Described heat-radiating substrate is connected with described heat dissipation grid and is formed with the thermal component of integral structure.
All-in-one radiating subassembly the most according to claim 4, it is characterised in that
Also including link (5), described link is arranged at the upside of described conducting-heat elements and offsets with described conducting-heat elements.
All-in-one radiating subassembly the most according to claim 5, it is characterised in that
Described link is metal link；
Described link is X-shaped structure, offers the installing hole passed for screw on described link.
All-in-one radiating subassembly the most according to claim 6, it is characterised in that
Described link is aluminum link.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620700967.5U CN205755249U (en) | 2016-07-05 | 2016-07-05 | All-in-one radiating subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620700967.5U CN205755249U (en) | 2016-07-05 | 2016-07-05 | All-in-one radiating subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755249U true CN205755249U (en) | 2016-11-30 |
Family
ID=57381005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620700967.5U Active CN205755249U (en) | 2016-07-05 | 2016-07-05 | All-in-one radiating subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755249U (en) |
-
2016
- 2016-07-05 CN CN201620700967.5U patent/CN205755249U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |