M426987 五、新型說明： 【新型所屬之技術領域】 本新型係關於-種電子裝置’特暇_種具散鱗構之電子 裝置。 【先前技術】 近年來，隨著科技與資_日新月異，電子產品的製造技術 亦日漸進步。電子產品除了追求輕、薄'短、小的特性外，更朝 著優越的性能邁進。 以電腦為例，隨著半導體技術的進步，電腦内的一積體電路 的體積亦逐漸縮小。為了使積體電路能處理更多的資料，就相同 體積下的频f路而言，現今的频電路已經可以賴比以往積 體電路多上數倍以上的—電子元件。t賴電路_元電子件數 讀來越多時’電子元件運科所產生的—触亦越來越大。 口此用以麟電子i件所敍之熱能的散減組便佔有重 要的席之地轉圖顯示卡上的散熱模組為例，其散熱模組大 户為A熱鰭片，且散熱鰭片係透過高導熱係數的金屬材質來譽 造。散熱^綠置於顯示卡上的運算^，以吸收運算晶⑽ 產生y’、、％ ϋ且為了提高散熱模組對運算晶片的散熱效果，更 可於散，…曰片上加裝一風扇，使風扇產生強制對流而對散熱鰭片 進行排熱。 」_ θ圖”肩示卡〜般係設置於電腦機殼内，而風扇係疊設 f、’會圖顯=卡^的散熱則。當風扇運轉時，風扇係抽取電腦機 成内的工孔亚將空氣直接吹送於繪圖顯示卡上而進行散熱。並 3 ΐνΐ^ΖΟ^δ / =’已，行過敎織的熱空氣，又再度被風扇抽取而進 父換。更近—步來說’上述的風扇配置方法僅能產生局部 _不==溫微得風流循環的溫度越來越高，而風 =繪圖顯示相賴效率無法後提升，造錄熱效果不彰2 【新型内容】 本新型提供-種具散熱結構之電子裝置，藉以解決習知 =電=裝置騎賴時，風散所魅的風錄往僅於局部範圍内 進㈣環，造成散触:果不彰的問題。 本新型所揭露之具散熱結構之電子似，其包含—基板、一 —/、、源帛散熱鰭片組、一第一軸流扇及-渦流扇。主熱源 j於基板ϋ熱則级熱接觸於主熱源，第—散熱鰭片級 二土板保持-距離以形成—通道。第—滅扇設置於第一散熱韓 組上’第-軸流扇之旋雜心延線係穿過基板。騎扇設置於 一轴流扇旁’渦流扇之旋轉細延線係穿過基板。其卜第一 軸二扇產生-第i流，第—風流通過第—散熱則組，並沿著 通道：朝渦流扇之方向流動。渦流扇吸引第一風流 ，並將第一風 &沿著渦流粒徑向而朝遠離第—散_片組之方向排出。 本新型所揭露之具散熱結構之電子裝置，其包含一基板、一 T源、-第二散熱⑼組、—第二軸流扇及—敲扇。主熱源 1於基板n細片組熱接觸於主熱源。第二軸流扇設置 於第-政顏>!組上’第二贿扇之旋轉如延線係穿過基板。 4 M426987 軸向的空氣，並將空氣朝渦流扇16〇的徑向方向排出。意即，渦 ' 流扇160所產生的風流方向係概略平行於基板100。 ' 此外，在本實施例或是其它實施例當中，電子裝置10更包含 —第二散熱鰭片組130,第二散熱鰭片組130置於主熱源n〇上並 熱接觸於主熱源110 ’第二散熱鰭片組13〇概略位於基板1〇〇的第 '二端1〇2。並且，第二散熱鰭片組13〇更可連接位於主熱源11〇 上的熱管140,使得第二散熱鰭片組13〇與第一散熱鰭片組12〇 傷透過熱管140而互相連接，以使第二散熱鰭片組13〇與第一散熱 .鳍片組120之間能夠達成熱傳遞的效果。 並且，在本實施例或是其它實施例當中，第二散熱鰭片組13〇 係可包含多個並排的鰭片131’且每一鰭片131之長邊的延伸方向 係概略平行於基板100的第一端101至第二端102的延伸方向。 並且’相鄰兩縛片131夾有一氣流道132。由於每一鰭片131之長 邊的延伸方向係概略平行於基板100的第一端1〇1至第二端1〇2 的延伸方向，因此氣流道132的一流道方向係與第一轴流扇15〇 至渦流扇160的延伸方向為同一方向。 此外’在本實施例或是其它實施例當中，電子裝置1〇更可包 含一第二軸流扇17〇’第二軸流扇170設置於渦流扇160旁並位於 第二散熱鰭片組130上。並且，第二轴流扇17〇之旋轉軸心延線c 係穿過基板1〇〇’且渦流扇16〇介於第一轴流扇15〇與第二軸流扇 Π0之間。換言之’第二軸流扇17〇概略位於於基板1〇〇的第二端 102上。當第一軸流扇]5〇運轉時，第一軸流扇15〇所產生的風流 係正向吹送至第二散熱鰭片組130及基板100。 M426987 值得一提的是，就本實施例而言，由於 係位於主熱源no上，而第一散_片組no no，此’可將第二散細組13。視為一主散熱=组主= 第一散熱鰭片組130視為一副散熱鰭片紐。並且，可將 : 扇Π0視為-主排熱風扇，而將第一轴流扇15〇視為一畐 扇。至於介於第二轴流扇170與第一抽流扇15〇之；^ 160,則可視為一導流風扇。 啊机屬 此外，在本實施例或是其它實施例當中，電子裝置1〇更勺八 -罩體勘，罩體180設置於基板1〇〇上且覆蓋住第1流扇^含 第二軸流扇Π0與渦流扇。罩體⑽具有三個通風口收對應 於第-軸流扇150、第二做扇17G與顺扇16G，此三個通風口、 182分別暴露出第-轴流扇15〇、第二軸流扇m與渴流扇咖。 此外，罩體180上具有-稽踏184 ’撞牆184介於第—轴流扇⑼ 與渦流扇160之間，以阻擋風流由渦流扇16〇吹送至第—軸流屬 150。換句話說’擋牆184令渦流扇16〇所排出的徑向風流只能夠 吹送至第二軸流扇170而無法吹送至第一軸流扇15〇β並且，通風 口 182處更可延伸有固定部188,罩體18〇透過固定部188而鎖固 於第一散熱鰭片組120及第二散熱鰭片組丨3〇上。 此外，在本貫施例或是其它實施例當中，播牆184更可為一 具有一開口 186的環型結構’擋牆184環繞於渦流扇16〇，且開口 186係面對第二軸流扇no。如此的環型結構之擋牆184，可加強 阻擋渦流扇160所排出的徑向風流吹送至第一軸流扇15〇，且開口 186的設計也可提升引導風流流量與流向之功效。M426987 V. New description: [New technical field] This new type is about the electronic device 'special 暇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ [Prior Art] In recent years, with the rapid development of technology and capital, the manufacturing technology of electronic products has gradually improved. In addition to the pursuit of light and thin 'short and small features, electronic products are advancing toward superior performance. Taking computers as an example, with the advancement of semiconductor technology, the volume of an integrated circuit in a computer has gradually decreased. In order to enable the integrated circuit to process more data, today's frequency circuits can rely on electronic components that are several times more than conventional integrated circuits in terms of frequency f paths in the same volume. The number of electronic components is the number of electronic components. The more the readings are made, the more the electronic components are produced. The ventilating group of the thermal energy described by the cymbal electronic i-pieces occupies an important place for the heat-dissipating module on the graphic display card. The heat-dissipating module is a hot fin and a heat-dissipating fin. It is made of metal with high thermal conductivity. The heat dissipation ^ green is placed on the display card ^, to absorb the operation crystal (10) to produce y', % ϋ and in order to improve the heat dissipation effect of the heat dissipation module on the operation chip, it is also possible to add a fan to the 曰 film. The fan is forced to convect and the heat sink fins are exhausted. "_ θ map" shoulder card ~ general system is set in the computer case, and the fan is stacked f, 'will display = card ^ heat dissipation. When the fan is running, the fan is extracted from the computer machine Kong Ya blows the air directly onto the drawing display card to dissipate heat. And 3 ΐνΐ^ΖΟ^δ / = 'has already passed through the hot air of the weaving, and is again pumped by the fan and replaced by the father. More recent - step Said that the above fan configuration method can only produce partial _ no == warm micro-circulation loop temperature is getting higher and higher, and wind = drawing display depends on the efficiency can not be improved, the recording heat effect is not good 2 [new content] The present invention provides an electronic device with a heat dissipating structure, so as to solve the problem of the conventional = electric=device riding, the wind of the wind is only recorded in the local area (four) ring, causing the touch: the problem is not obvious The electrons of the heat dissipation structure disclosed in the present invention comprise a substrate, a —/, a source fin fin group, a first axial fan and an eddy current fan. The main heat source j is on the substrate. The heat is in contact with the main heat source, and the first heat sink fin level two earth plates are maintained at a distance to form a channel. - The fan is set on the first heat dissipation group. The 'pin-axis extension line of the first-axis fan passes through the substrate. The ride fan is placed next to an axial fan. The rotary extension of the vortex fan passes through the substrate. The first axis and the second fan generate the ith stream, the first airflow passes through the first heat dissipation group, and flows along the channel: in the direction of the vortex fan. The vortex fan attracts the first airflow, and the first wind & The eddy current particle diameter is discharged away from the first-scattering sheet group. The electronic device with heat dissipation structure disclosed in the present invention comprises a substrate, a T source, a second heat dissipation (9) group, and a second axis. The flow fan and the knocking fan. The main heat source 1 is in thermal contact with the main heat source on the substrate n thin film group. The second axial flow fan is disposed on the first - Zhengyan>! group 'the second bribe fan rotates as the extension line wears 4 M426987 Axial air, and the air is discharged in the radial direction of the vortex fan 16〇. That is, the direction of the wind generated by the vortex fan 160 is roughly parallel to the substrate 100. In addition, in this embodiment In an embodiment or other embodiments, the electronic device 10 further includes a second heat dissipation fin set 130 and a second heat dissipation fin 130 is placed on the main heat source n〇 and is in thermal contact with the main heat source 110. The second heat-dissipating fin group 13 is roughly located at the second end 1〇2 of the substrate 1〇〇. And, the second heat-dissipating fin group 13〇 The heat pipe 140 located on the main heat source 11〇 can be connected, so that the second heat dissipation fin group 13〇 and the first heat dissipation fin group 12 are connected to each other through the heat pipe 140, so that the second heat dissipation fin group 13〇 A heat dissipation effect can be achieved between the fin sets 120. Moreover, in this embodiment or other embodiments, the second heat dissipation fin set 13 can include a plurality of side-by-side fins 131' and each The extending direction of the long side of one fin 131 is substantially parallel to the extending direction of the first end 101 to the second end 102 of the substrate 100. And the adjacent two tabs 131 have an air passage 132 interposed therebetween. Since the extending direction of the long side of each of the fins 131 is substantially parallel to the extending direction of the first end 1〇1 to the second end 1〇2 of the substrate 100, the direction of the flow path 132 and the first axial flow are The direction in which the fan 15 turns to the vortex fan 160 is the same direction. In addition, in the embodiment or other embodiments, the electronic device 1 further includes a second axial fan 17 . The second axial fan 170 is disposed adjacent to the vortex fan 160 and located at the second heat dissipation fin set 130 . on. Further, the rotation axis extension c of the second axial fan 17 is passed through the substrate 1' and the eddy fan 16 is interposed between the first axial fan 15'' and the second axial fan Π0. In other words, the second axial fan 17 is located substantially on the second end 102 of the substrate 1A. When the first axial fan is operated at 5 〇, the air flow generated by the first axial fan 15 is forwardly blown to the second heat radiation fin group 130 and the substrate 100. M426987 It is worth mentioning that, in the present embodiment, since the system is located on the main heat source no and the first scattered film group no no, this may be the second scatter group 13. It is regarded as a main heat dissipation = group master = the first heat dissipation fin group 130 is regarded as a pair of heat dissipation fins. Also, the fan Π 0 can be regarded as a main exhaust fan, and the first axial fan 15 〇 can be regarded as a fan. As for the second axial fan 170 and the first exhaust fan 15; ^ 160, it can be regarded as a flow guiding fan. In addition, in this embodiment or other embodiments, the electronic device 1 is further provided with a scooping body, and the cover 180 is disposed on the substrate 1 and covers the first flow fan and includes the second axis. Flow fan Π0 and eddy current fan. The cover body (10) has three vents corresponding to the first-axis fan 150, the second fan 17G and the sash 16G, and the three vents 182 respectively expose the first-axis fan 15 〇 and the second axial flow Fan m and thirsty fan. In addition, the cover body 180 has a -step 184' collision wall 184 between the first axial fan (9) and the vortex fan 160 to block the flow of wind from the vortex fan 16 to the first axial flow 150. In other words, the retaining wall 184 allows the radial wind flow discharged from the vortex fan 16 to be blown only to the second axial fan 170 and cannot be blown to the first axial fan 15 〇 β, and the vent 182 is more extendable. The fixing portion 188 and the cover 18 锁 are fixed to the first heat radiation fin group 120 and the second heat radiation fin group 丨 3 〇 through the fixing portion 188 . In addition, in the present embodiment or other embodiments, the broadcast wall 184 may be a ring-shaped structure having an opening 186. The retaining wall 184 surrounds the vortex fan 16 〇, and the opening 186 faces the second axial flow. Fan no. The retaining wall 184 of the annular structure can enhance the radial wind flow discharged from the blocking vortex fan 160 to the first axial fan 15〇, and the design of the opening 186 can also improve the effect of guiding the flow and flow direction of the wind flow.