200939001 九、發明說明： 【發明所屬之技術領域】 本發明係提供一種排埶模細，^ . 尤指—種具有拆卸魏的排熱模 【先前技術】 隨著電子科技的進步，電子產品所能提供的功能越來越複雜及 ❹=大’這同時也代表了其内部的微處理器之運算速度必須越來越 ，、使其可應付龐大的系統作業卫作量，然而當微處理器之運算速 f不斷的純之時，其在運作過程中啦生的減也會不斷的向 飆昇’因此散熱問題便成為業者設計電子產品時所必須考慮的 一項重要課題。 就筆記型電腦而言’由於本身需滿足輕薄短小且方便攜帶之特 ❹ 所以内部讀的制往往非常的緊密，故各個元件（尤其是 央處理H)所產生的触就會快速累積，然若散綱題處理不 之不僅4易造成系統當機，尤有甚者，更會出現㈣元件燒壞 —隋况’也因此散触能的優劣對筆記型賴的整體表現著實有 著關鍵性的影響。 王/又而言’在筆記型電腦内需要散熱的電子元件上，如中央處 第^ 1使用風扇與散熱件之組合來達到散熱的效果，請參閱 圖，第1圖為習知一排熱模組1〇之示意圖。排熱模組1〇包 200939001 含一殼體12、一風扇14、一鎖合 ·、一 濾網結構17。殼體12具有―出 Μ ’以及一 内。鎖合如5 來姉__^4 =於殼㈣ Γ^τσ18,散熱件16具有複數個平 。“子元件開始發熱時，賴· 1G會彻 ^鰭片 以帶動S氣流動至出風σ 18處 羽Μ之轉動 子元件所產座夕為社W ± 由政熱件16之熱傳導而將電200939001 IX. Description of the invention: [Technical field to which the invention pertains] The present invention provides a drainage die, which is especially a type of heat-dissipating mold with disassembly Wei [Prior Art] With advances in electronic technology, electronic products The functions that can be provided are more and more complicated and ❹=大', which also means that the internal microprocessor must be more and more computationally fast, so that it can cope with the huge amount of system operation, but when the microprocessor When the speed of operation f is constantly pure, the decrease in the life of the operation will continue to soar. 'Therefore, the heat dissipation problem has become an important issue that the industry must consider when designing electronic products. As far as the notebook computer is concerned, 'because it needs to meet the characteristics of being light, thin, and easy to carry, the internal reading system is often very close, so the touch generated by each component (especially the central processing H) will accumulate quickly, but if Dissipation of the dissertation is not only difficult to cause the system to crash, but especially, there will be (4) component burnout - the situation of the situation, so the quality of the dissipative energy has a crucial impact on the overall performance of the notebook. . Wang/In other words, on the electronic components that need to dissipate heat in the notebook computer, for example, the combination of the fan and the heat sink in the center is used to achieve the heat dissipation effect. Please refer to the figure. Figure 1 shows a row of heat. Schematic diagram of the module 1〇. The heat-dissipating module 1 package 200939001 comprises a casing 12, a fan 14, a lock, and a screen structure 17. The housing 12 has an "outlet" and an inner portion. The lock is like 5 姊 __^4 = in the shell (4) Γ ^τσ18, and the heat sink 16 has a plurality of flats. “When the sub-element starts to heat up, Lai·1G will follow the fins to drive the S gas to flow to the wind σ18. The rotation of the feathers is produced by the sub-components of the body W ± by the heat conduction of the political heat element 16
G ❹ 子疋件所產生之胁_除蝴峨腦外部 ^電 程中所產生的空氣流動亦會帶_部灰塵之流動，所t整、過 型電腦經過長時間使用後，往往就會造成散熱件16穑鹿、要筆記 3散熱㈣的散細2()增财 的^題， 熱件㈣清潔附著於其上之積塵或是如第 t直接拆卸散 15將_結構17向下裝設於殼體12上以減少累綱=片裝= 上的灰塵之方式來改善’但由於散熱件1δ本身拆卸不爯 ^同結構Π亦須經過拆卸鎖合裝置μ之步驟方能將濾網結 本自喊體=上拆除’因此無論是上述何種方式均須㈣麻煩的拆 卸，造成許多維修及清潔上額外的困擾。 t發明内容】 因此，本發明之目的係提供-種可快速拆卸除塵裝置之排 組，藉以解決上述之問題。 …、 殼體 本發明係揭露一種具有拆卸功能之排熱模組，包含有一 200939001 具有一第1動口以及-第二風細；—風扇，安裝於該殼體内， 用來引導空氣於該第一風紗朗第二_叫進歧動；一散 熱件’位於料二風動口；至少-第—卡合敍，位於該第二風 動口且設置於雜體與錄鱗之間；以及-除麵置，具有至 少-側臂，該侧臂設有對應於該第—卡合裝置之—第二卡合裝置。 【實施方式】 〇 請參閱第2圖，第2圖為本發明第一實施例-排熱模組50之 不意圖。排熱模、組50包含有一殼體52、一風扇54、一散軌件％、 至少-第-卡合裝置58，以及一除塵裝置6〇。殼體^具有一第 -風動π 62以及—第二風動σ 64。由第2圖可知，第一風動口 62係實質上垂直於第二風動口 64，風扇％係安裝於殼體％内， 用來引導空氣自第-風動口 62流向第二風動口 64或是自第二風 動口 64流向第-風動口 62。散熱件％係位於第二風動口糾，用 ❾來排除自第二風動口64流出之空氣所吸收之熱能。第一卡合裝置 58係位於第二風動口 64且位於_ 52錄熱件％之間，第一卡 合裝置58係較佳地與殼體52為一體成形。除塵裝置6〇包含一慮 網66以及具有至少-侧臂68，侧臂68係設有對應於第一卡合裝 置58之-第二卡合裝置7〇。由第2圖可知，第二卡合裝置％係 可為- τ字型滑軌，第-卡合裂置58則可為對應此τ字型滑軌之 -滑槽’如此-來’除塵裝置6Q即可齡第—卡合裝置％與第 -卡合裝置70之結合而卡合於殼體52上，而由於第—卡合裝置 58與第二卡合裝置70之間的卡合關係並非為鎖死狀態，因口此當慮 200939001 =，=:::得排熱模組50之散熱功能受到影 脫離第-卡合裝置58之卡人 提取以使第二卡合裝置70 拆知，鮮蚀田土- 此即可輕易完成除塵裝置60的 者就可針對已拆卸出來的除塵裝置6〇 網之動作以去除積塵。此外 潔慮 卞口裝置70之/月軌結構係不受 =之限制，亦可為其他形狀之滑執結構，端視實際應用需求而 疋0 值得-提的是，請參閱第3圖，第3圖為本發明第二實施例一 排熱模組綱之不意圖。第二實施例_所述之元件與第一實施例 中所述之7G件編號綱者，表示其具有_之魏或相對位置， 於此不再贅述。排熱模組卿與第一實施例之排熱模組50不同之 處在於除塵裝置之設計。由第3圖可知，排熱模組膽包含有一 齒鉤除塵裝置102 ’減—來，在依照上叙動作流程拆卸齒釣除 塵裝置1G2時，使用者可同時完成將除塵裝置之拆卸及清潔附著 於複數個導熱.鰭片2〇上的積塵之工作。此外，亦可將上述之滤網 66裝设於齒鈎除塵裝置1〇2上以改善散熱鰭片汾上的灰塵堆積之 情況。 接著，請參閱第4圖，第4圖為本發明第三實施例一排熱模組 150之示意圖。第三實施例中所述之元件與第一實施例中所述之元 件編號相同者，表示其具有相同之功能或相對位置，於此不再贅 述。排熱模組150與第一實施例之排熱模組5〇不同之處在於除塵 8 200939001 裝置以及卡合裝置之設計。排熱模組150包含有一除塵裝置152、 一第一卡合裝置154、殼體52、風扇54以及散熱件56。除塵裝置 152具有至少一把手156、以及至少一側臂158。除塵裝置152另 包含一拉帶160以及遽網66。拉帶160係配置於除塵裝置152之 上方。側臂158係設有相對應第一卡合裝置154之一第二卡合裝 置162。第一卡合裝置154係與殼體52為一體成形且具有一凹陷 部164。把手156設有一突出部166，用來與凹陷部164相扣合， 〇 此外，第一"f·合裝置154係可為一 U字型滑槽且第二卡合裝置162 係為對應於第一卡合裝置154結構形狀之一滑塊，如此一來，除 塵裝置152即可藉由凹陷部164與突出部166之扣合以及第一卡 合裝置154與第二卡合裝置162之卡合而固定於殼體52上。若使 用者欲將除塵裝置152自排熱模組150上拆卸下來，則使用者僅 需壓按把手156以鬆開凹陷部164與突出部166之扣合且利用拉 帶160將除塵裝置152向上提取以使除塵裝置152之第二卡合裝 ❾ 置162自殼體52之第一"合裝置154中脫離’如此即可輕易完成 除塵裝置152之拆卸。 請參閱第5圖，第5圖為本發明第四實施例一排熱模組2〇〇之 示意圖。第四實施例中所述之元件與第三實施例中所述之元件編 破相同者，表示其具有相同之功能或相對位置，於此不再贅述。 排熱模組200與第三實施例之排熱模組15〇不同之處在於卡合裝 置之安農位置。第一卡合裝置154係安裝於散熱件16之—垂直側 邊202。除塵裳置152可藉由第一卡合裝置154上之凹陷部162 200939001 與除塵裝置152之把手156上的突出部166之扣合以及第一卡人 裝置154與第二卡合錢162之結合關定於散熱件％上。如此 -來’當使用者欲將除麵置！52自排賴組上拆卸下來時， 使用者僅需壓按把手156以鬆開凹陷部164與突出部166之扣合 且利用拉帶16G將除塵裝置152向上提取以使除塵裝置152 = 二卡合裝置162自散熱件56之第一卡合裝置154中脫離，如 可輕易完成除塵裝置152之拆卸。 ❹ ❹ 上述實施财所提及之卡合裝置以及把手之健均可不限於 一個，意即可在姆於卡合灯與把手所在位置之另—對應側邊 再多增設用來固定除隸置之—組卡合裝置或—把手。如此一 來’當使用者欲將除塵裝置自排熱模組上拆卸下來時，使用者僅 需驗除塵裝置兩邊把手即可鬆開兩邊凹陷部與突出部之扣合， 接下來使用纽可彻拉帶將除顧置沿著兩邊的卡合裝置:執 道向上提取*輕易完成除塵裝置之拆卸。此外，於實施例中所提 及之突出部與凹陷部之撕位置亦可相互置換，意即把手上可改 為具有1陷部而卡合裝置上則改為具有-突出部。 合二裝置之相互卡合以及凹陷部與突出部之扣 時間使用而在I»件：時如此一來，當聽模組經過長 塵裝置J j拆卩，縣制者就可針對已拆㈣來的除 塵裝置進仃 200939001 可㈣卡合裝置之卡合執道再次將除塵裝置崎轉麵組上。 以上所述僅為本發明之較佳實施例，凡依本發明申咬 圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍广專利範 【圖式簡單說明】 第1圖為習知一排熱模組之示意圖。 0 第2圖為本發明第一實施例一排熱模組之示意圖。 第3圖為本發明第二實施例一排熱模組之示意圖。 第4圖為本發明第三實施例一排熱模組之示意圖。 第5圖為本發明第四實施例一排熱模組之示意圖。 【主要元件符號說明】 10、50、 排熱模組 12 > 52 殼體 100、 150、 200、 14、54 風扇 15 鎖合裝置 16、56 散熱件 17 濾網結構 18 出風口 20 散熱鰭片 58 、 154 第一卡合裝置 60 、 152 除塵裝置 62 第一風動口 64 第二風動〇 66 濾網 68 、 158 側臂 200939001 70 > 162 第二卡合裝置 102 齒鈎除塵裝置 156 把手 160 拉帶 164 凹陷部 166 突出部 202 垂直側邊 Ο ❹ 12G ❹ 所 所 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Heat sink 16 elk, note 3 heat (four) of the fine 2 () increase the wealth of the problem, hot parts (four) clean the dust attached to it or as the t directly disassembled 15 will _ structure 17 down It is provided on the casing 12 to reduce the dust on the scale = chip mount = to improve 'but since the heat sink 1 δ itself is not disassembled, the structure must be removed by the step of disassembling the lock device μ The self-examination of the knot = the removal of the 'therefore, regardless of the above methods must be (four) troublesome disassembly, causing many troubles in maintenance and cleaning. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an arrangement for quickly disassembling a dust removing device to solve the above problems. The present invention discloses a heat removal module having a disassembling function, comprising a 200939001 having a first opening and a second air cooling; a fan mounted in the housing for guiding air to the The first wind yarn lang is the second _ called into the turbulence; a heat sink is located at the second wind moving port; at least the - first snapping is located at the second air moving port and is disposed between the hybrid body and the recorded scale; And - in addition to the face, having at least a side arm provided with a second engaging means corresponding to the first engaging means. [Embodiment] 〇 Please refer to Fig. 2, which is a schematic view of a heat exhaust module 50 according to a first embodiment of the present invention. The exhaust heat module, group 50 includes a housing 52, a fan 54, a loose rail member %, at least a - - engaging device 58, and a dust removing device 6A. The housing ^ has a first air π 62 and a second air σ 64. As can be seen from Fig. 2, the first air moving port 62 is substantially perpendicular to the second air moving port 64, and the fan % is installed in the casing % for guiding air from the first air moving port 62 to the second air moving port. The port 64 flows from the second air port 64 to the first air port 62. The heat sink % is located at the second air port and is corrected by the heat to absorb the heat absorbed by the air flowing out of the second air port 64. The first engaging means 58 is located between the second air moving port 64 and between the _ 52 heat recording members, and the first engaging means 58 is preferably integrally formed with the housing 52. The dust removing device 6A includes a mesh 66 and has at least a side arm 68, and the side arm 68 is provided with a second engaging device 7A corresponding to the first engaging device 58. It can be seen from Fig. 2 that the second engaging device % can be a - τ-shaped sliding rail, and the first engaging cracking 58 can be a - chute corresponding to the τ-shaped sliding rail. 6Q can be engaged with the housing 52 by the combination of the first engagement device % and the first engagement device 70, and the engagement relationship between the first engagement device 58 and the second engagement device 70 is not In order to lock up, the heat dissipation function of the heat-dissipating module 50 is removed from the card-carrying device of the first-engaging device 58 to disassemble the second engaging device 70, as a result of the 200939001 =, =::: Freshly etched soil - the one that can easily complete the dust removal device 60 can remove dust from the action of the detached dust removal device 6 . In addition, the clean/sinking device 70/month rail structure is not limited by the limit, and can also be a sliding structure of other shapes, depending on the actual application requirements. 值得0 worthwhile - please refer to Figure 3, 3 is a schematic view of a row of thermal modules according to a second embodiment of the present invention. The components described in the second embodiment are the same as those in the first embodiment, and indicate that they have a wei or relative position, which will not be described again. The heat removal module is different from the heat removal module 50 of the first embodiment in the design of the dust removal device. It can be seen from Fig. 3 that the heat-dissipating module has a tooth-hook dust-removing device 102' minus--, and the user can simultaneously remove and clean the dust-removing device when the tooth-removing dust removing device 1G2 is removed according to the above-mentioned operation flow. The work of dust accumulation on a plurality of heat-conducting fins. Further, the above-described filter screen 66 may be attached to the tooth hook dust removing device 1〇2 to improve the accumulation of dust on the heat sink fins. Next, please refer to FIG. 4, which is a schematic diagram of a row of thermal modules 150 according to a third embodiment of the present invention. The components described in the third embodiment are identical to the component numbers described in the first embodiment, and have the same functions or relative positions, which will not be described again. The heat removal module 150 differs from the heat removal module 5 of the first embodiment in the design of the dust removal 8 200939001 device and the snap device. The heat rejection module 150 includes a dust removal device 152, a first engagement device 154, a housing 52, a fan 54, and a heat sink 56. The dust removal device 152 has at least one handle 156 and at least one side arm 158. The dust removing device 152 further includes a draw tape 160 and a mesh 66. The draw tape 160 is disposed above the dust removing device 152. The side arm 158 is provided with a second engaging means 162 corresponding to the first engaging means 154. The first engaging means 154 is integrally formed with the housing 52 and has a recess 164. The handle 156 is provided with a protruding portion 166 for engaging with the recessed portion 164. Further, the first "f·closing device 154 can be a U-shaped chute and the second engaging device 162 is corresponding to The first engaging device 154 has a structural shape of a slider. Thus, the dust removing device 152 can be engaged with the protruding portion 166 by the recess portion 164 and the card of the first engaging device 154 and the second engaging device 162. It is fixed to the housing 52. If the user wants to remove the dust removing device 152 from the heat discharging module 150, the user only needs to press the handle 156 to loosen the fastening of the recessed portion 164 and the protruding portion 166 and use the pulling belt 160 to lift the dust removing device 152 upward. The detachment of the dust removing device 152 can be easily accomplished by extracting the second engaging device 162 of the dust removing device 152 from the first "closing device 154 of the housing 52. Please refer to FIG. 5, which is a schematic diagram of a heat-dissipating module 2 according to a fourth embodiment of the present invention. The components described in the fourth embodiment are the same as those described in the third embodiment, and they have the same functions or relative positions, and will not be described again. The heat rejection module 200 differs from the heat rejection module 15 of the third embodiment in the position of the anchoring device. The first engaging means 154 is mounted to the vertical side 202 of the heat sink 16. The dusting skirt 152 can be engaged with the protrusion 166 on the handle 156 of the dust removing device 152 and the combination of the first card device 154 and the second card 162 by the recess 162 200939001 on the first engaging device 154. It is fixed on the heat sink %. So - come 'when the user wants to remove the face! When the user is disassembled from the disengagement group, the user only needs to press the handle 156 to loosen the engagement of the recessed portion 164 with the protruding portion 166 and extract the dust removing device 152 upward by the pulling belt 16G to make the dust removing device 152 = two cards. The detaching device 162 is detached from the first engaging device 154 of the heat sink 56, and the detaching of the dust removing device 152 can be easily accomplished. ❹ 卡 The above-mentioned implementation of the engagement device and the handle of the handle can not be limited to one, so that the other side of the position where the M-card and the handle are located can be added to fix the detachment. - group snap device or - handle. In this way, when the user wants to remove the dust removal device from the heat-dissipating module, the user only needs to check the handles on both sides of the dust-removing device to loosen the fastening between the two-side recessed portion and the protruding portion, and then use Neuktor The pull belt will be placed along the two sides of the engagement device: the upward extraction of the road * easy to complete the removal of the dust removal device. Further, the tearing positions of the protruding portion and the depressed portion mentioned in the embodiment may be replaced with each other, that is, the handle may be changed to have a depressed portion and the engaging device may be replaced with a protruding portion. The mutual engagement of the combined device and the deduction of the recessed portion and the protruding portion are used in the I» piece: when the listening module is removed by the dust collecting device Jj, the county system can be disassembled (4) The dust removal device that came in was put into the 200939001. (4) The card engagement device of the (4) snap device again set the dust removal device on the surface. The above description is only a preferred embodiment of the present invention, and all the equivalent changes and modifications made by the present invention should be broadly covered by the present invention. [Figure is a simple description] Know the schematic diagram of a row of thermal modules. 0 is a schematic view of a row of thermal modules according to the first embodiment of the present invention. 3 is a schematic view of a row of thermal modules according to a second embodiment of the present invention. 4 is a schematic view of a row of thermal modules according to a third embodiment of the present invention. Figure 5 is a schematic view of a row of thermal modules in accordance with a fourth embodiment of the present invention. [Main component symbol description] 10, 50, heat removal module 12 > 52 Housing 100, 150, 200, 14, 54 Fan 15 Locking device 16, 56 Heat sink 17 Filter structure 18 Air outlet 20 Heat sink fin 58 , 154 first engaging device 60 , 152 dust removing device 62 first air moving port 64 second air moving port 66 filter net 68 , 158 side arm 200939001 70 > 162 second engaging device 102 tooth hook dust removing device 156 handle 160 draw tape 164 recess 166 projection 202 vertical side Ο ❹ 12