TW200911097A - Heat dissipation device with dust removal mechanism - Google Patents

Heat dissipation device with dust removal mechanism Download PDF

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Publication number
TW200911097A
TW200911097A TW96131692A TW96131692A TW200911097A TW 200911097 A TW200911097 A TW 200911097A TW 96131692 A TW96131692 A TW 96131692A TW 96131692 A TW96131692 A TW 96131692A TW 200911097 A TW200911097 A TW 200911097A
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TW
Taiwan
Prior art keywords
heat
dust
dust removing
removing mechanism
metal
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TW96131692A
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Chinese (zh)
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TWI330068B (en
Inventor
Feng-Ku Wang
Chih-Kai Yang
Cheng-Shang Chou
Yu-Chih Cheng
Huang-Cheng Ke
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Inventec Corp
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Priority to TW96131692A priority Critical patent/TWI330068B/en
Publication of TW200911097A publication Critical patent/TW200911097A/en
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Publication of TWI330068B publication Critical patent/TWI330068B/en

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Abstract

A heat dissipation device with a dust removal mechanism including a heat conductive component and a dust removal mechanism is provided. The dust removal mechanism includes a strickle sweep and a transmission element. The strickle sweep which is slidingly disposed on a side of the metal fins is adapted to contact the metal fins along a sliding path orderly. The transmission element is used to drive the strickle sweep sliding along the sliding path such that the dust adhering to the metal fins can be removed. Therefore, for long term usage, the dust has no effect on the dissipation efficiency of the heat dissipation device with the dust removal mechanism.

Description

200911097 ^-r543twf.doc/n 九、發明說明: 【發明所屬之技術領域】 種具 本發明是有關於一種散熱器,且特別是有關於 有除塵機構的散熱器。 ^ 【先前技術】 近年來隨著電腦科技的突猛進,使得電腦之運 度不斷地提高,並且電駐_部之電子元件的發敎功率 亦不斷地攀升。為了預防電腦主機之内部的電子 熱,而導致電子元件發生暫時性或永久性的失效,必須提 供足夠的散熱效能予電腦内部之電子元件。因此,對於高 發熱功率之電子元件’例如中央處理器、㈣⑼、北产 晶片、南橋晶片及暫存記憶雜組等,通#會加裝散熱^ 來降低這些電子元件之溫度。 •、而δ ’散熱為主要由風扇(fan)、散熱縛片組 c=lng fms)及熱官(heat pipe)所組成。散熱縛片組 =在風扇的出風σ,並與熱管連接,㈣吸收由熱管所 “的廢熱。散熱鰭片組由多數個平行排列的金屬片所組 =、、=相鄰之金屬片之間具有—定的間隙,提供廢熱經由 么抓、方式散逸到空氣中。因此,當風扇處於運作狀態下, 冷卻氣流可經由出風口流向散鱗片組,並通過金屬片之 間的間隙,以將廢熱經對流而排出機體之外,進而降低内 部電子元件的工作溫度。 值件注意的是’當散熱器經過長時間使用之後,空氣 200911097 --543twf.doc/n 中的灰塵會漸漸地堆積在散熱鰭片組的金屬片之間。/旦 過多的灰塵累積在金屬片上,傳導至金屬片的廢熱會受到 灰塵的阻隔而無法有效的散出。此外,灰塵亦會阻擋風扇 的氣流,使得對流的效果變差。因此,灰塵將造成廢熱不 易自政熱鰭片組移除的問題,而導致散熱器的散熱能力大 幅地降低。 【發明内容】 本發明提供一種具有除塵機構的散熱器,其藉由除塵 機構清除附著於散熱器上的灰塵。 本發明提出一種具有除塵機構的散熱器,其包括一熱 傳^•組件以及一除塵機構。熱傳導組件包括多數個等向排 列的金屬鰭片。除塵機構包括一刮鈑(strickle sweep)以及 —傳動元件(transmission element)。刮鈑滑設於這些金屬 鰭片之一側,並適於沿一滑動路徑依序地接觸這些金屬鰭 片。傳動元件連接於刮鈑,用以帶動刮鈑沿滑動路徑滑動, 而刮除附著於這些金屬鰭片之灰塵。 在本發明之一實施例中,除塵機構更可包括一復歸元 件。復歸元件連接於刮鈑,使得刮鈑常態位於滑動路徑上 的—第一位置。其中,復歸元件可為一螞線彈簧(spiml sPring)或一螺旋彈簧(helical spring)。 在本發明之一實施例中,傳動元件可包括一線材,其 配置於滑動路徑上,且適於受一外力帶動刮鈑自第一位置 ’月動至滑動路徑上的一第二位置,且復歸元件可藉由線材 200911097 ~ · — - - · · — ·543twf.doc/n 與刮鈑相連接。 在本發明之一實施例中,傳動元件可包括一步進馬 達。 一在本發明之一實施例中,熱傳導組件更可包括至少一 熱官。熱官之-端連接這些金屬鰭片, 源、° ‘、、、BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink, and more particularly to a heat sink having a dust removing mechanism. ^ [Prior Art] In recent years, with the rapid advancement of computer technology, the computer's speed has been continuously improved, and the power of the electronic components of the electric station has been continuously rising. In order to prevent the electronic heat inside the computer mainframe from causing temporary or permanent failure of the electronic components, it is necessary to provide sufficient heat dissipation performance to the electronic components inside the computer. Therefore, for high-heat-power electronic components such as a central processing unit, (4) (9), a north-produced chip, a south-bridge chip, and a temporary memory group, a heat sink can be added to reduce the temperature of these electronic components. • δ ′ heat dissipation is mainly composed of a fan, a heat-dissipating block group c=lng fms, and a heat pipe. The heat dissipation tab group = the air outlet σ of the fan, and is connected with the heat pipe, and (4) absorbs the waste heat of the heat pipe. The heat dissipation fin group is composed of a plurality of metal sheets arranged in parallel =, and = adjacent metal sheets There is a certain gap between the two, so that the waste heat can be dissipated into the air by the way. Therefore, when the fan is in operation, the cooling airflow can flow to the scaly group through the air outlet and pass through the gap between the metal sheets to The waste heat is discharged outside the body by convection, thereby reducing the operating temperature of the internal electronic components. The value note is that the dust in the air 200911097 --543twf.doc/n will gradually accumulate after the radiator has been used for a long time. Between the metal sheets of the heat sink fin group. / If too much dust accumulates on the metal sheet, the waste heat transmitted to the metal sheet will be blocked by the dust and cannot be effectively dissipated. In addition, the dust will also block the airflow of the fan, making convection. The effect is worse. Therefore, the dust will cause the problem that the waste heat is not easily removed from the political fin group, and the heat dissipation capability of the heat sink is greatly reduced. The present invention provides a heat sink having a dust removing mechanism for removing dust attached to a heat sink by a dust removing mechanism. The present invention provides a heat sink having a dust removing mechanism including a heat transfer assembly and a dust removing mechanism. The assembly includes a plurality of isotropically arranged metal fins. The dust removing mechanism includes a scrickle sweep and a transmission element. The scraping slide is disposed on one side of the metal fins and is adapted to slide along one side. The path sequentially contacts the metal fins. The transmission element is coupled to the scraper for driving the scraper to slide along the sliding path to scrape dust attached to the metal fins. In one embodiment of the invention, the dust removing mechanism Furthermore, a resetting element may be included. The resetting element is connected to the scraping so that the scraping normal is located at the first position on the sliding path, wherein the reverting element may be a spiml sPring or a helical spring. In an embodiment of the invention, the transmission element may include a wire disposed on the sliding path and adapted to be driven by an external force The scraping is performed from the first position 'monthly to a second position on the sliding path, and the resetting element can be connected to the scraping by the wire 200911097 ~ · - - - · · · · 543twf.doc / n. In one embodiment, the transmission component can include a stepper motor. In one embodiment of the invention, the heat conduction component can further include at least one thermal officer. The end of the thermal interface connects the metal fins, source, °', ,

^本發明之—實施射,具有除錢構的散熱器,更 % -風扇模組。風扇模組配置於這些金賴片之— 二,且除塵機構位於風扇模組與這些金屬鰭片之間,用以 提供一冷卻氣流通過這些金屬鰭片之間。 在本發明之-實施例巾,刮鈑的㈣可包括銅或橡 梦Κ/νί發Θ由於藉由刮鈑在這些金屬鰭片之間滑動,而r 的灰塵,所以散熱效果在長期使用下不會受“ 办曰’因此散熱效果較為一致。此外,使用者僅 12帶動刮飯,使得刮鈑在這些金屬則間“二 ^ w些金屬則上的灰塵,使用上相當便利。另外 產㈣風壓即可將灰塵吹出機殼之外,二 時頁費時地拆卸機殼與熱傳導組件,因此相當省力且省 舉較明能更明顯易懂,下文特 J亚配合所附圖式,作詳細說明如下。 【實施方式】 200911097 …543twf.doc/n 圖1為本發明一實施例之具有除塵機構的散熱器之立 體不意圖。請參考圖1,具有除塵機構的散熱器1〇〇包括 一熱傳導組件110以及一除塵機構12〇。熱傳導組件11〇 可應用於筆記型電腦等電子裝置中,以提供裝置中高發熱 量的電子元件散熱之用。熱傳導組件110 一般以銅、鋁等 高導熱性金屬材質製成,其可配置在電子元件上或連接到 系統内部的氣冷式散熱模組或水冷式散熱模組,以達到降 溫的目的。在本實施例中,熱傳導組件Π0包括多數個等 向排列的金屬鰭片112,而這些平行排列的金屬鰭片112 彼此相疊並相隔一間隙,以增加熱傳導組件110的散埶 積。 ’、’、 圖2為圖1之A區域的局部放大示意圖,請—併參考 圖1與圖2,除塵機構⑽配置於熱傳導組件11〇的—側, 且除塵機構120主要包括一刮们22以及-傳動元件 124。在本實施例中,傳動元件m可包括-線材124a。 線材124a的-端連接於一復歸元件13〇,其中線材n ^材質可包括尼龍或金屬,而復歸元件π。可為—蜗線 =者是-職彈簧。此外,雜122毅於這些金屬籍 m丨it間’而線材U4a可穿過並纏繞於刮鈑122上的兩 幵1孔122a,使得刮鈑122固定於線材124&上。 担罢在本^例中,線材124a的另—端還可延伸至電子 裝置的機殼(⑽示)之外,並固定於機殼外的一拉環(= :匕=使Γ者可以方便地拉動線材l24a。亦或者是: 、'、、 a連接到筆記型電腦等折疊式電子裝置的樞軸 200911097 -543twf.doc/n (未a示)上,备螢幕相對於底座開啟時,線材124a即可受 到樞轴轉動而被拉動。 一立f 3為圖1之具有除塵機構的散熱器沿1_1,線之剖面 。轉相3 ’ #使用者拉動崎124a或是藉由插 :轉動而帶動線材則,線材124a便受到一作用力 方向dl移動’而帶動刮鈑122沿-滑動路徑S 觸化些金屬鰭片112,使得刮鈑122從一第一位 六而:動至—第二位置P2,且復歸元件13Q對應此作用 ί 反向的回復力。當施予線材咖的作用力釋放 件130產生的回復力便會帶動線材12如朝向一 移動’使得刮飯122從一 3注意的是’藉由傳動元件124的帶動,使得刮飯 2在^動路徑S上滑動並接觸這些金朗片ιΐ2 些金屬韓片112的灰塵刮除或振動下來,所以 因i片112不會受到灰塵包覆而減低散熱的效果。 夠維持相當的政熱$削在長期的使用下’亦能 在另-未繪示的實施例中,傳動元件124可更包括一 馬達’線材124a 1%接於馬達的轉轴上,使得馬達捲 1 一以^^2中受到線材⑽的帶動而滑動。而在又 未繪不的實施例中,傳動元件124可 牛 刮鈑m可直接固定於步進馬達n 124a。使时可藉由㈣錢馬達龄式,使得步進、= 543twf.doc/n 200911097 帶動刮鈑122在這些金屬鰭片112之間滑動。 此外,由於刮鈑122位於熱傳導組件110上下兩側的 凸緣E(見圖2及圖3)之間,使得刮鈑122在滑動時藉由 兩側之凸緣E的限制而不會脫出熱傳導組件110。在另一 未繪示的實施例中’在熱傳導組件110上下兩側的凸緣E 還可分別具有對應刮鈑122的一導槽(未繪示),而可讓 刮鈑122能藉由這兩導槽的導引而更加順暢地滑動。另 外’在本實施例中,線材124a可穿設於熱傳導組件u〇 左右兩側的孔槽118之中’以讓線材i24a的延伸方向平行 於滑動路徑S,而可避免線材124a受力移動時產生不規則 的晃動。 另外,請再參考圖1,在本實施例中,具有除塵機構 的散熱器100更可包括一風扇模組140。風扇模組14〇產 生的冷卻氣流流過這些金屬鰭片112之間的空隙,以藉由 強制對的方式將這些金屬韓片1 1 2上的熱量散出。在另 一未繪示的實施例中,熱傳導組件11()更可包括一熱管。 熱管的一端可與這些金屬鰭片112相接觸,而另一^可與 一熱源相接觸,使得熱源產生的熱量可透過熱管而傳遞至 這些金屬鰭片112。 值得一提的是,除塵機構120位於風扇模組14〇與這 些金屬鰭片112之間,使得除塵機構12〇刮除或振動下來 的灰塵能藉由風扇模組140產生的氣流吹出機殼之外。 綜上所述,本發明之具有除塵機構的散熱器藉由刮飯 在廷些金屬鰭片之間滑動,而能刮除或振下這些金屬妹片 200911097 543twf.doc/n 上的灰塵,因此至少具有下列優點: 一、可減少附著於這些金屬鰭片上 除塵機構的散_在長期的使打具有 響,而能夠維持相當的散熱效果。 胃又至该塵的影 二、 使用者僅需藉由傳動元件來帶 在這些金屬鰭片間滑動,即可,使得刮鈑 塵,使用上相當便利 除足些金屬鰭片上的灰^ The invention - the implementation of the radiation, with a heat sink in addition to the structure, more % - fan module. The fan module is disposed on the two sheets, and the dust removing mechanism is located between the fan module and the metal fins to provide a cooling airflow between the metal fins. In the embodiment of the present invention, the scraped (four) may include copper or rubber velvet / ν Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ Θ It will not be affected by the “doing”, so the heat dissipation effect is more consistent. In addition, the user only drives the scraping rice, so that the dust on the metal is scraped between these metals, which is quite convenient to use. In addition, (4) wind pressure can blow dust out of the casing, and the second page takes time to disassemble the casing and the heat conduction component, so it is quite labor-saving and saves the lighter and more obvious and easy to understand. , as detailed below. [Embodiment] 200911097 ... 543 twf.doc / n Fig. 1 is a schematic view of a radiator having a dust removing mechanism according to an embodiment of the present invention. Referring to Fig. 1, a heat sink 1 having a dust removing mechanism includes a heat conducting component 110 and a dust removing mechanism 12A. The heat conduction component 11 〇 can be applied to an electronic device such as a notebook computer to provide heat dissipation for a high-heat-generating electronic component in the device. The heat conduction component 110 is generally made of a highly thermally conductive metal such as copper or aluminum, and can be disposed on an electronic component or connected to an air-cooled heat dissipation module or a water-cooled heat dissipation module inside the system to achieve the purpose of cooling. In the present embodiment, the heat conducting component Π0 includes a plurality of substantially aligned metal fins 112, and the parallel aligned metal fins 112 are stacked one on another and spaced apart to increase the bulk of the heat conducting component 110. ',', FIG. 2 is a partially enlarged schematic view of the area A of FIG. 1. Please refer to FIG. 1 and FIG. 2, the dust removing mechanism (10) is disposed on the side of the heat conducting component 11A, and the dust removing mechanism 120 mainly includes a scraper 22 And a transmission element 124. In the present embodiment, the transmission element m may include a wire 124a. The end of the wire 124a is connected to a reset element 13A, wherein the wire n^ material may comprise nylon or metal and the component π is reset. Can be - worm line = is the - job spring. Further, the miscellaneous 122 is in the middle of the metal, and the wire U4a can pass through and wrap around the two holes 1122a of the scraper 122, so that the scraper 122 is fixed to the wire 124& In this example, the other end of the wire 124a can also extend beyond the casing of the electronic device (shown in (10)), and is fixed to a pull ring outside the casing (=: 匕 = makes it convenient for the cockroach Pull the wire l24a. Or::, ',, a is connected to the pivot of the folding electronic device such as a notebook computer 200911097 -543twf.doc/n (not shown), when the backup screen is opened relative to the base, the wire 124a can be pivoted and pulled. A vertical f 3 is the profile of the heat sink with the dust removal mechanism of Fig. 1 along the line 1_1. The phase shift 3 ' #user pulls the rally 124a or by inserting: rotating When the wire is driven, the wire 124a is moved by a force direction d1 to drive the scraper 122 to touch the metal fins 112 along the sliding path S, so that the scraper 122 moves from a first position to a second position: Position P2, and the resetting element 13Q corresponds to the reverse responsive force of the action ί. When the force releasing member 130 of the wire coffee is applied, the restoring force generated by the force releasing member 130 causes the wire 12 to move toward a movement, so that the scraping rice 122 is watched from a 3 It is caused by the transmission of the transmission element 124 that the shovel 2 slides on the path S The dust that comes into contact with these golden pieces ιΐ2 some metal pieces 112 is scraped off or vibrated, so the i piece 112 is not covered with dust to reduce the heat dissipation effect. It is enough to maintain a considerable political heat for cutting in long-term use. In another embodiment, the transmission component 124 can further include a motor 'wire 124a 1% connected to the rotating shaft of the motor, so that the motor coil 1 is driven by the wire (10) in the ^2 In the embodiment, which is not depicted, the transmission element 124 can be directly fixed to the stepping motor n 124a. The timing can be made by (4) money motor age, so that stepping, = 543twf.doc /n 200911097 drives the scraper 122 to slide between the metal fins 112. Further, since the scraper 122 is located between the flanges E (see Figs. 2 and 3) on the upper and lower sides of the heat conduction member 110, the scraper 122 is When sliding, the heat conducting component 110 is not released by the limitation of the flanges E on both sides. In another embodiment not shown, the flanges E on the upper and lower sides of the heat conducting component 110 may also have corresponding scrapings respectively. a guide groove (not shown) of 122, which allows the scraper 122 to pass through the two guide grooves Guided to slide more smoothly. In addition, in the present embodiment, the wires 124a may be bored in the holes 118 on the left and right sides of the heat conduction member u' so that the extending direction of the wire i24a is parallel to the sliding path S, In addition, referring to FIG. 1 , in this embodiment, the heat sink 100 having the dust removing mechanism may further include a fan module 140. The fan module 14 〇 The resulting cooling airflow flows through the gaps between the metal fins 112 to dissipate heat from the metal sheets 1 12 by forced pairing. In another embodiment not shown, the heat transfer assembly 11 () may further include a heat pipe. One end of the heat pipe can be in contact with the metal fins 112, and the other can be in contact with a heat source so that heat generated by the heat source can be transmitted to the metal fins 112 through the heat pipe. It is to be noted that the dust removing mechanism 120 is located between the fan module 14 and the metal fins 112, so that the dust scraped or vibrated by the dust removing mechanism 12 can be blown out of the casing by the airflow generated by the fan module 140. outer. In summary, the heat sink with the dust removing mechanism of the present invention can scrape or oscillate the dust on the metal pieces 200911097 543twf.doc/n by sliding the rice between the metal fins. At least the following advantages are as follows: 1. The scattering of the dust removing mechanism attached to the metal fins can be reduced, and the sound can be sustained in the long-term, and the heat dissipation effect can be maintained. The stomach and the shadow of the dust. 2. The user only needs to use the transmission component to slide between the metal fins, so that the dust is scraped and the use is quite convenient. In addition to the gray on the metal fins.

三、 在刮鈑將這些金屬韓片上的灰塵刮除 風扇模組產生的風壓即可將灰塵吹出機殼之外,使^ 機殼與熱傳導組件,因此清理的過程相料 雖然本發明已以較佳實施例揭露如上,然其並非 限定本發明’购所屬技術領域巾具有通常知識者,在 脫離本發明之精神和範圍内,當可作些許之更動與潤飾, 因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。3. After scraping the dust on the metal foil to scrape off the wind pressure generated by the fan module, the dust can be blown out of the casing to make the casing and the heat conduction component, so the cleaning process is compared with the present invention. The preferred embodiments are disclosed above, but are not intended to limit the scope of the present invention. The scope of the present invention is intended to be modified and modified. This is subject to the definition of the scope of the patent application.

【圖式簡單說明】 圖1為本發明一實施例之具有除塵機構的散熱器之立 體示意圖。 圖2為圖1之Α區域的局部放大示意圖 一圖3為圖1之具有除塵機構的散熱器沿,線之剖面 示意圖。 11 200911097 543twf.doc/n 【主要元件符號說明】 100 :具有除塵機構的散熱器 110 :熱傳導組件 112 :金屬鰭片 118 :孔槽 120 :除塵機構 122 :刮鈑 122a :開孔 124 :傳動元件 124a :線材 130 :復歸元件 140 :風扇模組 A :區域 E :邊緣 dl、d2 :方向 PI、P2 :位置 S :滑動路徑 12BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view of a heat sink having a dust removing mechanism according to an embodiment of the present invention. 2 is a partially enlarged schematic view of the region of the ridge of FIG. 1. FIG. 3 is a schematic cross-sectional view of the heat sink along the line of the dust removing mechanism of FIG. 11 200911097 543twf.doc/n [Description of main component symbols] 100: Heat sink 110 with dust removal mechanism: Heat conduction component 112: Metal fin 118: Hole groove 120: Dust removal mechanism 122: Scrape 122a: Opening 124: Transmission element 124a: wire 130: reset element 140: fan module A: area E: edge dl, d2: direction PI, P2: position S: sliding path 12

Claims (1)

200911097 543twf.doc/n 十、申請專利範圍: 1. 一種具有除塵機構的散熱器,包括: 熱傳導組件’包括多數個等向排列的金屬鰭片;以 及 一除塵機構,包括: 到飯’滑设於該些金屬鰭片之一侧,並適於沿 /月動路;^依序地接觸該些金屬則;以及 傳動兀件’用以帶動該刮鈑沿該滑動路徑滑 動’而刮除附著於該些金屬H片之灰塵。 2·如_请專利範目帛丨項所狀具有除塵機構的散 …、咨,其中該除塵機構更包括: 一復歸元件,連接於該刮鈑,使得該刮鈑常態位於該 滑動路徑上的一第一位置。 3,如申請專利範圍第2項所述之具有除塵機構的散 熱為,其中該復歸元件為一蝸線彈簧或一螺旋彈簧。 。。4.如申請專利範圍第2項所述之具有除塵機構的散 熱為,其中該傳動元件包括一線材,適於受一外力帶動該 刮鈑自該第—位置滑動至該滑動路徑上的一第二位置,且 該復歸元件藉由該線材與該刮鈑相連接。 5. 如申請專利範圍第4項所述之具有除塵機構的散 熱器’其中該線材的材質包括尼龍或金屬。 6. 如申請專利範圍第1項所述之具有除塵機構的散 熱杰’其中該傳動元件包括一馬達。 7. 如申請專利範圍第6項所述之具有除塵機構的散 13 200911097 i543twf.doc/n 熱器,其中該馬達為一步進馬達。 8. 如申請專利範圍第1項所述之具有除塵機構的散 熱器,其中該熱傳導組件更包括: 至少一熱管,該熱管之一端連接該些金屬鰭片,而另 一端連接一熱源。 9. 如申請專利範圍第1項所述之具有除塵機構的散 熱器,更包括: 一風扇模組,配置於該些金屬鰭片之一侧,且該除塵 機構位於該風扇模組與該些金屬鰭片之間,用以提供一冷 卻氣流通過該些金屬鰭片之間。 10. 如申請專利範圍第1項所述之具有除塵機構的散 熱器,其中該刮鈑的材質包括銅或橡膠。 14200911097 543twf.doc/n X. Patent application scope: 1. A heat sink with a dust removal mechanism, comprising: a heat conduction component 'including a plurality of isotropically arranged metal fins; and a dust removal mechanism comprising: On one side of the metal fins, and adapted to move along the /month path; to sequentially contact the metal; and the drive member 'to drive the scraper to slide along the sliding path' to scrape the adhesion The dust of the metal H pieces. 2. The method of the patent specification includes a dust removal mechanism, wherein the dust removal mechanism further comprises: a return component coupled to the scraper such that the scraping normal is located on the sliding path a first position. 3. The heat dissipation with a dust removing mechanism according to claim 2, wherein the returning element is a worm spring or a coil spring. . . 4. The heat dissipation of the dust removing mechanism according to claim 2, wherein the transmission component comprises a wire adapted to be driven by an external force to slide the scraper from the first position to the sliding path. Two positions, and the reset element is connected to the scraper by the wire. 5. A heat sink having a dust removing mechanism as claimed in claim 4, wherein the material of the wire comprises nylon or metal. 6. The heat dissipating body having a dust removing mechanism according to claim 1, wherein the transmission element comprises a motor. 7. The scatterer having a dust removal mechanism according to claim 6, wherein the motor is a stepping motor. 8. The heat sink having a dust removing mechanism according to claim 1, wherein the heat conducting component further comprises: at least one heat pipe, one end of the heat pipe connecting the metal fins and the other end being connected to a heat source. 9. The heat sink having the dust removing mechanism according to claim 1, further comprising: a fan module disposed on one side of the metal fins, wherein the dust removing mechanism is located in the fan module and the fan module Between the metal fins, a cooling airflow is provided between the metal fins. 10. The heat sink having a dust removing mechanism according to claim 1, wherein the material of the scraping material comprises copper or rubber. 14
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496531B (en) * 2012-12-12 2015-08-11 Inventec Corp Heat dissipation module and electronic device and duty-removal mothod
TWI568342B (en) * 2014-06-27 2017-01-21 台達電子工業股份有限公司 Heat dissipating fin assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496531B (en) * 2012-12-12 2015-08-11 Inventec Corp Heat dissipation module and electronic device and duty-removal mothod
TWI568342B (en) * 2014-06-27 2017-01-21 台達電子工業股份有限公司 Heat dissipating fin assembly

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