US20060185821A1 - Thermal dissipation device - Google Patents

Thermal dissipation device Download PDF

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Publication number
US20060185821A1
US20060185821A1 US11/189,339 US18933905A US2006185821A1 US 20060185821 A1 US20060185821 A1 US 20060185821A1 US 18933905 A US18933905 A US 18933905A US 2006185821 A1 US2006185821 A1 US 2006185821A1
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US
United States
Prior art keywords
thermal dissipation
heat sink
dissipation device
thermal
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/189,339
Inventor
Ryan Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Comp Take Tech Co Ltd
Original Assignee
Comp Take Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Comp Take Tech Co Ltd filed Critical Comp Take Tech Co Ltd
Assigned to COMP TAKE TECHNOLOGY CO., LTD. reassignment COMP TAKE TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, RYAN
Publication of US20060185821A1 publication Critical patent/US20060185821A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a thermal dissipation device, especially to a thermal dissipation device used on the heating electrical components for thermal dissipation performance.
  • FIG. 1 is the block diagram of the traditional thermal dissipation device.
  • the upper side 11 of the thermal dissipation device usually connects with one fan, and the down side 12 usually connects with the heating electronic components (such as a CPU).
  • the heat of the thermal dissipation device will be conducted outside when the fan runs.
  • the kernel part of this thermal dissipation device is solid, the surface of this thermal dissipation device is implemented by several heat sink fins; when the fan runs, the thermal dissipation performance of these heat sink fins will be better, but the thermal of this thermal dissipation device is distributed from the solid kernel to the surface. At this situation, this solid kernel connects with the electronic components with most heat, but the thermal dissipated by the fan is the least. That is, the fan cannot conduct the thermal effectively for this design of heat sink fins.
  • FIG. 2 is a block diagram of another conventional thermal dissipation device.
  • This thermal dissipation device is assembled with several heat sink fins 22 , several heat pipe 21 and base site 23 . It is not easy to implement this thermal dissipation device because heat pipe 21 has to be passed through every heat sink fin 22 with high cost; and takes larger space and inefficient thermal conduction.
  • An objective of the present invention is to provide a new thermal dissipation device able to conduct thermal efficiently, increase thermal dissipation area, enhance the thermal dissipation performance, decrease space and optimize the heat sink performance of the fan.
  • a thermal dissipation device includes a heat sink; and at least a heat pipe that pastes on the surface of the heat sink to conduct the thermal to the heat sink efficiently for thermal dissipation.
  • the thermal dissipation device also includes a base site to be connected with a heating electronic component.
  • the heat sink of the thermal dissipation device is used to connect with a fan.
  • the heat sink of the thermal dissipation device is cylindrical that is implemented by several heat sink fins.
  • the heat pipe of the thermal dissipation device is soldered up the surface of the heat sink.
  • FIG. 1 shows the traditional thermal dissipation device
  • FIG. 2 shows another traditional thermal dissipation device
  • FIG. 3 shows the thermal dissipation device according to the present invention.
  • FIG. 4 shows the detailed of the thermal dissipation device according to the present invention.
  • FIG. 3 shows the thermal dissipation device according to the present invention.
  • the thermal dissipation device of the present invention includes a heat sink 31 , a heat pipe 32 , and a base site 33 .
  • Base site 33 can be connected with one heating electronic component (which is not shown in the diagram), the heat pipe 32 is able to conduct the thermal of the electronic component to the heat sink 31 .
  • Heat sink 31 can be cylindrical or any other shape, which is implemented by several heat sink fins. Due to the heat of electronic component is conducted from the base site to the heat sink fins of the heat sink by the heat pipe, the thermal distribution of the heat sink is from external to internal with more efficiently and easy to be fan out by the fan. Further more, this design is able to generate the largest thermal surface but with the smallest space to enhance the thermal performance.
  • FIG. 4 shows the detailed component diagram of the thermal dissipation device according to the present invention.
  • the thermal dissipation device of the present invention is a newly advantaged design to conduct thermal efficiently, increase thermal surface area, minimize the space, and enhance thermal performance of the heat sink and the fan.
  • Any outlook modification, such as the number of heat pipe or the shape of the heat sink, is included in the present invention if the heat pipe pasted on the external surface of the heat sink.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A thermal dissipation device includes a heat sink; and at least a heat pipe that pastes on the surface of the heat sink to conduct the thermal to the heat sink efficiently for thermal dissipation.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a thermal dissipation device, especially to a thermal dissipation device used on the heating electrical components for thermal dissipation performance.
    • BACKGROUND OF THE INVENTION
  • Thermal dissipation devices are very popular in the electrical devices, such as a computer, which CPU has one thermal dissipation device (i.e. cooler) with a fan for increasing the heat conduction performance. If the performance of the thermal dissipation device is not good, CPU will be over heating and the processing speed of CPU will also be affected, or even forces this CPU burning out. Therefore, a good thermal dissipation device is a very important component for high efficiency electronic devices (such as a computer). FIG. 1 is the block diagram of the traditional thermal dissipation device. The upper side 11 of the thermal dissipation device usually connects with one fan, and the down side 12 usually connects with the heating electronic components (such as a CPU). The heat of the thermal dissipation device will be conducted outside when the fan runs. The kernel part of this thermal dissipation device is solid, the surface of this thermal dissipation device is implemented by several heat sink fins; when the fan runs, the thermal dissipation performance of these heat sink fins will be better, but the thermal of this thermal dissipation device is distributed from the solid kernel to the surface. At this situation, this solid kernel connects with the electronic components with most heat, but the thermal dissipated by the fan is the least. That is, the fan cannot conduct the thermal effectively for this design of heat sink fins.
  • FIG. 2 is a block diagram of another conventional thermal dissipation device. This thermal dissipation device is assembled with several heat sink fins 22, several heat pipe 21 and base site 23. It is not easy to implement this thermal dissipation device because heat pipe 21 has to be passed through every heat sink fin 22 with high cost; and takes larger space and inefficient thermal conduction.
    • SUMMARY OF THE INVENTION
  • An objective of the present invention is to provide a new thermal dissipation device able to conduct thermal efficiently, increase thermal dissipation area, enhance the thermal dissipation performance, decrease space and optimize the heat sink performance of the fan.
    • BRIEF DESCRIPTION OF THE INVENTION
  • According to the present invention, a thermal dissipation device includes a heat sink; and at least a heat pipe that pastes on the surface of the heat sink to conduct the thermal to the heat sink efficiently for thermal dissipation.
  • In accordance with one aspect of the present invention, the thermal dissipation device also includes a base site to be connected with a heating electronic component.
  • In accordance with one aspect of the present invention, the heat sink of the thermal dissipation device is used to connect with a fan.
  • In accordance with one aspect of the present invention, the heat sink of the thermal dissipation device is cylindrical that is implemented by several heat sink fins.
  • In accordance with one aspect of the present invention, the heat pipe of the thermal dissipation device is soldered up the surface of the heat sink.
  • The present invention may best be understood through the following description with reference to the accompanying drawings, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 shows the traditional thermal dissipation device;
  • FIG. 2 shows another traditional thermal dissipation device;
  • FIG. 3 shows the thermal dissipation device according to the present invention; and
  • FIG. 4 shows the detailed of the thermal dissipation device according to the present invention.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • FIG. 3 shows the thermal dissipation device according to the present invention. The thermal dissipation device of the present invention includes a heat sink 31, a heat pipe 32, and a base site 33. Base site 33 can be connected with one heating electronic component (which is not shown in the diagram), the heat pipe 32 is able to conduct the thermal of the electronic component to the heat sink 31. Heat sink 31 can be cylindrical or any other shape, which is implemented by several heat sink fins. Due to the heat of electronic component is conducted from the base site to the heat sink fins of the heat sink by the heat pipe, the thermal distribution of the heat sink is from external to internal with more efficiently and easy to be fan out by the fan. Further more, this design is able to generate the largest thermal surface but with the smallest space to enhance the thermal performance. FIG. 4 shows the detailed component diagram of the thermal dissipation device according to the present invention.
  • To sum up, the thermal dissipation device of the present invention is a newly advantaged design to conduct thermal efficiently, increase thermal surface area, minimize the space, and enhance thermal performance of the heat sink and the fan. Any outlook modification, such as the number of heat pipe or the shape of the heat sink, is included in the present invention if the heat pipe pasted on the external surface of the heat sink.
  • While the invention has been described in terms of what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention need not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.

Claims (5)

1. A thermal dissipation device including:
a heat sink; and
at least a heat pipe that pastes on the surface of said heat sink to conduct the thermal to said heat sink efficiently for thermal dissipation.
2. The device according to claim 1 wherein said thermal dissipation device further includes a base site to be connected with a heating electronic component.
3. The device according to claim 1 wherein said heat sink of said thermal dissipation device is used to connect with a fan.
4. The device according to claim 1 wherein said heat sink of said thermal dissipation device is cylindrical that is implemented by several heat sink fins.
5. The device according to claim 1 wherein said heat pipe of said thermal dissipation device is soldered up the surface of said heat sink.
US11/189,339 2005-02-24 2005-07-26 Thermal dissipation device Abandoned US20060185821A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW094202913 2005-02-24
TW094202913U TWM278213U (en) 2005-02-24 2005-02-24 Heat dissipation device

Publications (1)

Publication Number Publication Date
US20060185821A1 true US20060185821A1 (en) 2006-08-24

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US11/189,339 Abandoned US20060185821A1 (en) 2005-02-24 2005-07-26 Thermal dissipation device

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US (1) US20060185821A1 (en)
TW (1) TWM278213U (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070151712A1 (en) * 2006-01-05 2007-07-05 Foster Jimmy G Sr Heat sink for distributing a thermal load
US20080094798A1 (en) * 2005-04-11 2008-04-24 Lee Sang C Apparatus for cooling computer parts and method of manufacturing the same
US20080210404A1 (en) * 2007-03-01 2008-09-04 Peng Ji-Ping Cooling device with ringed fins
US20090056928A1 (en) * 2007-09-01 2009-03-05 Shih-Jie Jiang Heat dissipation assembly
US20100147496A1 (en) * 2008-12-11 2010-06-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20100155023A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having heat pipes inserted therein
US20100212865A1 (en) * 2007-10-08 2010-08-26 Lee Sangcheol Heat dissipating device using heat pipe
CN108352369A (en) * 2016-02-16 2018-07-31 西门子公司 Radiator and electrical equipment
US11024558B2 (en) * 2010-03-26 2021-06-01 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US6315033B1 (en) * 2000-05-22 2001-11-13 Jia Hao Li Heat dissipating conduit
US6422303B1 (en) * 2000-03-14 2002-07-23 Intel Corporation Silent heat exchanger and fan assembly
US6439298B1 (en) * 2001-04-17 2002-08-27 Jia Hao Li Cylindrical heat radiator
US20030000683A1 (en) * 2001-06-29 2003-01-02 Mast Brian E. Heat pipe system for cooling flywheel energy storage systems
US6702002B2 (en) * 2002-06-03 2004-03-09 Chin-Wen Wang Hydronic pump type heat radiator
US20040226690A1 (en) * 2003-04-23 2004-11-18 Lee Hsieh Kun Tubular heat dissipation device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
US6422303B1 (en) * 2000-03-14 2002-07-23 Intel Corporation Silent heat exchanger and fan assembly
US6315033B1 (en) * 2000-05-22 2001-11-13 Jia Hao Li Heat dissipating conduit
US6439298B1 (en) * 2001-04-17 2002-08-27 Jia Hao Li Cylindrical heat radiator
US20030000683A1 (en) * 2001-06-29 2003-01-02 Mast Brian E. Heat pipe system for cooling flywheel energy storage systems
US6702002B2 (en) * 2002-06-03 2004-03-09 Chin-Wen Wang Hydronic pump type heat radiator
US20040226690A1 (en) * 2003-04-23 2004-11-18 Lee Hsieh Kun Tubular heat dissipation device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080094798A1 (en) * 2005-04-11 2008-04-24 Lee Sang C Apparatus for cooling computer parts and method of manufacturing the same
US7515417B2 (en) * 2005-04-11 2009-04-07 Zalman Tech Co., Ltd. Apparatus for cooling computer parts and method of manufacturing the same
US20070151712A1 (en) * 2006-01-05 2007-07-05 Foster Jimmy G Sr Heat sink for distributing a thermal load
US20080210404A1 (en) * 2007-03-01 2008-09-04 Peng Ji-Ping Cooling device with ringed fins
US20090056928A1 (en) * 2007-09-01 2009-03-05 Shih-Jie Jiang Heat dissipation assembly
US20100212865A1 (en) * 2007-10-08 2010-08-26 Lee Sangcheol Heat dissipating device using heat pipe
US20100147496A1 (en) * 2008-12-11 2010-06-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20100155023A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having heat pipes inserted therein
US11024558B2 (en) * 2010-03-26 2021-06-01 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
CN108352369A (en) * 2016-02-16 2018-07-31 西门子公司 Radiator and electrical equipment
US20180343769A1 (en) * 2016-02-16 2018-11-29 Siemens Aktiengesellschaft Radiator and electric device
EP3365915A4 (en) * 2016-02-16 2019-05-29 Siemens Aktiengesellschaft Radiator and electric device
US10856433B2 (en) * 2016-02-16 2020-12-01 Siemens Aktiengesellschaft Radiator and electric device

Also Published As

Publication number Publication date
TWM278213U (en) 2005-10-11

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Legal Events

Date Code Title Description
AS Assignment

Owner name: COMP TAKE TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, RYAN;REEL/FRAME:016860/0822

Effective date: 20050601

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION