201226830 ± w^^uouGB 36678twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於—種散熱模組與電子裝置，且特別是 有關於-種具有除塵結構的散熱模組與電子裝置。 【先前技術】 近年來隨著電腦科技的突飛猛進，使得電腦之運作 #度不斷地提高，並且電腦主機内部之電子元件的發執功率 亦不斷地攀升。為了預防電腦主機之内部的電子元件過 熱，而導致電子元件發生暫時性或永久性的失效，因而必 須，供足夠的散熱效能予電腦内部之電子元件。據此 於高發熱功率之電子元件，例如中央處理器、緣圖晶片、 北橋晶片、南橋晶片及暫存記憶體模組等，通常會加 熱器來降低這些電子元件之溫度。 θ又月 -般而言’散熱器主要由風扇與散熱鰭片所組成，葬 由接觸的方式將上述這些高發熱的電子元件的熱量傳導^ •散熱籍片，再以風扇所產生的氣流把這些廢哉 方式散逸到空氣中，以進而將廢熱經對流而排出機體二卜的 值得注意的是，當散熱器經過長時間使用之後，空策 中的灰塵會因風扇的對流作用而漸漸地堆積在入風側的散 熱鰭片上，但礙於散熱模組是裝設在機殼内，使用者較^ 以自行清理。久而久之，灰塵的積聚造成風扇的風益^順 利將熱量帶走，因而影響散熱模組整體的散熱效能，進 導致習知電子裝置之使用壽命降低。 201226830 1 36678twf.doc/n 【發明内容】 本發明提供-種散熱模組，其具有除塵機構。 „共一種電子裝置，其具有較佳的耐用性。 私f提&種散熱模組’適於對一發熱元件散熱。 士、，、模，、且包括一散熱鰭片組、一風扇以及至少一除塵元 熱.鰭片組具有—基部與配置在基部上的多個轉片。 接發熱树，則賴發熱林延伸。風扇配置在 I….片、、且上。除塵元件連接於風扇且位在風扇與鰭片之 日。風扇旋轉以帶動除塵元件清除散誠片上的灰塵。 本發％提出1電子裝置’其包括-板件、配置在該 2上的至少—發熱元件以及—散熱模組。散熱模組接觸 X…元件。散熱模組包括一散熱鰭片組、一風扇以及至少 立除，元件。散熱鳍片組具有一入風側、一出風侧、一基 1與多個韓片。基部連接發熱it件。則排列在基部背對 4…元件的一側’且發熱元件位於出風侧，風扇位在入風 ^風扇用以產生一氣流經入風侧流入鰭片，並自出風側 流出，轉片。除塵元件連接於風扇且位在風扇與鰭片之間。 風^，動以帶動除塵元件沿一路徑依序接觸鰭片 ，以使灰 塵k氣流而傳送出鰭片。 在本發明之一實施例中，上述之風扇具有多個主葉 :至少一除塵元件包括分別配置在主葉片上的多個刷除 單元’且這些刷除單元適於接觸上述之鰭片。 在本發明之一實施例中，上述之鰭片呈放射狀地排列 在基部上。 201226830 ^ 36678twf.doc/n 在本發明之一實施例中，上述之鰭片的幾何中心與風 扇的幾何中心彼此重疊。 〃 在本發明之一實施例中，上述之鰭片的幾何中心與風 扇的幾何中心位於同一軸線。 一 在本發明之一實施例中，上述之散熱鰭片組具有一入 風側與多個出風侧，而上述之風扇位於入風側。 、基於上述，在本發明的上述實施例中，散熱模組藉由 • 連接於風扇的除塵元件，以讓風扇轉動的同時一併帶動除 塵元件相對於鰭片旋轉，以使除塵元件得以接觸鰭片以移 除其間隙中的灰塵。此舉藉由風扇制片散熱的同時，讓 除塵元件與鰭片相互接觸而移除其上的灰塵，同時讓風扇 的氣流將灰塵帶出鰭片之外，因此散熱模組藉此而維持其 散熱效能，進而提高電子裝置的使用壽命。 、 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 ®【實施方式】 圖1是依照本發明一實施例的一種電子裝置的示意 圖。圖2是圖1的電子裝置的爆炸圖。圖3是圖2的電子 4置中風扇及除塵元件的示意圖。請同時參考圖1至圖3, 在本實施例中，電子裝置100例如是一顯示卡，其包括一 板件110與配置在板件110上的發熱元件12〇。在本實施 例中，發熱元件為一圖像處理器（GPU)。惟本實施例並 未對電子裝置100的種類予以設限，於其他未繪示的實施 36678twf.doc/n 201226830 例中，電子裝置亦可為主機板上的中央處理器或記憶體模 組等。 〜 在本實施例中，電子裝置100還包括組裝在板件11〇 上的一散熱模組130，其包括一散熱鰭片組132、一風扇 134與一除塵元件136。散熱鰭片組132具有一基部132a、 多個結片132b —入風側S1與一出風侧§2,其中基部132a 連接至發熱元件120，而這些轉片132b排列在基部132a 月對發熱元件120的一側，而發熱元件12〇位在出風側 S2，風扇134位在入風侧S1。風扇134用以產生一氣流以 經由入風側S1流入鰭片132b間的間隙，並且此氣流自出 風侧S2流出鰭片132b。換句話說，發熱元件12〇所產生 的熱畺會經由基部132a而傳送至鰭片132b，而風扇134 所產生的氣流將其熱量帶離鰭片132b。 值得注意的疋，除塵元件136連接於風扇134且位在 風扇134與鰭片132b之間。當風扇134轉動時，除塵元件 136會被風扇134帶動而沿一路徑L1依序接觸上 132b而清潔位在鰭片132b表面上的灰塵。再者’由^風 扇134的氣流會流經鰭片132b間的間隙，因而被除塵元件 136所清除下的灰塵便會隨著氣流而被傳送出鰭片i32b之 外0 基於上述，散熱模組130藉由配置在風扇134上的除 塵元件136，以使風扇134轉動時亦帶動除塵元件136轉 動，藉以讓除塵元件136沿著路徑u依序接觸散埶鰭 組Π2上的每個縛片mb’進而將轉片mb上的灰塵移 201226830 …一GB 36678twf_doc/n t 2重要的是，這些灰塵會隨著風扇134的氣流而傳送 3 132b之外。此舉讓散熱模組13Θ能藉由自身的除塵 而轉其清潔度’進1提高散熱齡130的散熱效率 以及電子裝置100的耐用度。 詳細而言，在本實施例中’散熱模組130還包括組裝 至散熱韓片組132的一支架138,用以裝設上述之風扇 134再者’風扇134具有多個主葉片134a，而除塵元件 _ 136包括配置在各個主葉片134a邊緣的多個刷除單元 136a’足些刷除單元13如的材質為橡膠，其可以雙料射出 方式於製作風扇134之主葉片13如時—併製成軟刷葉 。或者，刷除元件136a也可以是軟刷毛，只要是可以用 =掃除積聚在鰭片132b上的灰塵的物品或材質即可依照 貫際需求選用。 立再者，本實施例的鰭片132b是呈放射狀地排列在基 132a上’而風扇134是藉由支架138而組裝在鰭片132b 上且鰭片132b的幾何中心與風扇134的幾何中心彼此 1 f登’而風们34上的刷除單元1施更可以局部延伸至結 片132b之間的間隙中。換句話說，刷除單元η如實質上 為風扇134朝向鰭片132b的延伸葉片。然鰭片的幾何中心 ^風扇的幾何中心亦可位於同—軸線上，即風扇安裝於韓 的上方，刷除單元局部向下延伸至鰭片間隙中。 此外’風扇134與韓片132b皆為同心圓式的徑向排 列。據此，配置在風扇134上的刷除單元13邰便能在風扇 U4轉動時沿路徑L1依序接觸到每個韓片咖，以讓刷 GB 36678twf.doc/n 除單元136a接觸鰭片132b時藉由刷除或接觸時產生的震 動而將鰭片132b上的灰塵除落。此外，由於鰭片132b的 材質為橡膠，因此刷除單元136a能在接觸鰭片132b以清 除灰塵的同時亦避免對鰭片132b造成損傷。 接著，當鰭片132b上的灰塵因刷除單元136a與鰭片 132b接觸而掉落於鰭片132中的間隙時，風扇134原用以 通過鰭片132b間隙而散熱鰭片組132進行散熱的氣流便會 使掉落的灰塵隨著氣流而被帶出鰭片132b之外。屆此，除 塵元件136便完成對散熱模組130的清潔動作。 綜上所述，在本發明的上述實施例中，散熱模組藉由 配置在風扇上的除塵元件，以讓風扇轉動的同時一併帶動 除塵元件相對於㈣旋轉，以使除塵元件得以移除韓片間 隙中的灰塵。此舉藉由風騎則散熱的同時，讓除塵元 :與：片相互接觸而移除其上的灰塵，以同時讓風扇的氣 流將灰塵帶出_片之外。 再者’由於除塵元件的材質為橡膠，因此藉由其可撓 二f ’，而在其刷_片上灰塵的同時並 傷。故而散熱模組能藉由除塵元件而維 持，、政.、、、效此，並進而提高電子裝置的使用壽命。 木發明已以實施_露如上’然其並非用以限定 本i明之二::斤屬技術領域中具有通常知識者，在不脫離 發明之伴圍内，當可作些許之更動與潤飾，故本 保當視後附之申請專利範_界定者為準。 201226830201226830 ± w^^uouGB 36678twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module and an electronic device, and more particularly to a heat dissipation module having a dust removal structure Group and electronic devices. [Prior Art] In recent years, with the rapid advancement of computer technology, the operation of computers has been continuously improved, and the power of electronic components inside computer mainframes has continuously increased. In order to prevent the electronic components inside the computer from being overheated, the electronic components may be temporarily or permanently disabled. Therefore, it is necessary to provide sufficient heat dissipation performance to the electronic components inside the computer. Accordingly, in high-heat-power electronic components such as a central processing unit, a peripheral chip, a north bridge chip, a south bridge chip, and a temporary memory module, heaters are usually used to lower the temperature of these electronic components. θ又月-Generally speaking, the radiator is mainly composed of a fan and a heat-dissipating fin, and the heat of the above-mentioned high-heating electronic components is radiated by contact, and the heat-dissipating piece is radiated, and then the airflow generated by the fan is used. These decontamination methods are dissipated into the air, so that the waste heat is discharged through the convection and discharged from the body. It is worth noting that after the radiator is used for a long time, the dust in the air strategy gradually accumulates due to the convection of the fan. On the heat sink fins on the air inlet side, but the heat dissipation module is installed in the casing, the user can clean it by himself. Over time, the accumulation of dust causes the fan's wind power to smoothly take away the heat, thus affecting the overall heat dissipation performance of the heat dissipation module, which leads to a decrease in the service life of the conventional electronic device. 201226830 1 36678twf.doc/n SUMMARY OF THE INVENTION The present invention provides a heat dissipation module having a dust removal mechanism. „A total of electronic devices, which have better durability. The private cooling module is suitable for dissipating heat from a heating element. The squirrel, the dies, and the heat sink fins, and a fan At least one dust removing element heat has a base portion and a plurality of rotating pieces disposed on the base portion. The heating tree is connected to the heating forest, and the fan is disposed on the I.. piece, and the dust removing unit is connected to the fan. And the fan is on the day of the fan. The fan rotates to drive the dust removing component to remove the dust on the film. The present invention proposes an electronic device that includes a panel, at least a heating element disposed on the 2, and a heat sink. The heat dissipation module includes a heat sink fin set, a fan, and at least an off-set component. The heat sink fin set has an air inlet side, an air outlet side, and a base 1 and more. A piece of Korean film. The base is connected to the heating element. It is arranged on the side of the base facing away from the 4... component and the heating element is located on the outlet side. The fan is located in the inlet fan. The fan is used to generate a flow of air through the inlet side into the fin. And flow out from the wind side, turn. The component is connected to the fan and is located between the fan and the fin. The air is driven to drive the dust removing component to sequentially contact the fin along a path, so that the dust k flows and the fin is transmitted. In an embodiment of the invention The fan has a plurality of main blades: at least one dust removing member includes a plurality of brushing units respectively disposed on the main blades and the brush removing units are adapted to contact the fins. In an embodiment of the present invention, The above fins are radially arranged on the base. 201226830 ^ 36678twf.doc/n In one embodiment of the invention, the geometric center of the fins and the geometric center of the fan overlap each other. In an embodiment, the geometric center of the fin is located on the same axis as the geometric center of the fan. In one embodiment of the present invention, the heat dissipation fin group has an air inlet side and a plurality of air outlet sides, and the foregoing The fan is located on the air inlet side. Based on the above, in the above embodiment of the present invention, the heat dissipation module is connected to the dust removing component of the fan to rotate the fan while driving the dust removing component relative to each other. The fins are rotated so that the dust removing member can contact the fins to remove dust in the gaps. The heat is removed by the fan, and the dust removing member and the fins are brought into contact with each other to remove the dust thereon, and at the same time The airflow of the fan takes the dust out of the fin, so the heat dissipation module maintains its heat dissipation performance, thereby improving the service life of the electronic device. In order to make the above features and advantages of the present invention more obvious, the following The embodiment will be described in detail below with reference to the accompanying drawings. Fig. 1 is a schematic view of an electronic device according to an embodiment of the invention. Fig. 2 is an exploded view of the electronic device of Fig. 1. The electronic device 100 is a display card, which includes a board member 110 and is disposed on the board member. The heating element 12 on 110 is 〇. In this embodiment, the heat generating component is an image processor (GPU). However, in this embodiment, the type of the electronic device 100 is not limited. In other embodiments, not shown, 36678 twf.doc/n 201226830, the electronic device may also be a central processing unit or a memory module on the motherboard. . In the embodiment, the electronic device 100 further includes a heat dissipation module 130 assembled on the board member 11A, and includes a heat dissipation fin group 132, a fan 134 and a dust removing member 136. The heat dissipating fin group 132 has a base portion 132a, a plurality of fins 132b, an air inlet side S1 and an air outlet side §2, wherein the base portion 132a is connected to the heat generating component 120, and the fins 132b are arranged at the base portion 132a. On one side of 120, the heating element 12 is clamped on the air outlet side S2, and the fan 134 is positioned on the air inlet side S1. The fan 134 is for generating an air flow to flow into the gap between the fins 132b via the air inlet side S1, and the air flow flows out of the fins 132b from the air outlet side S2. In other words, the heat generated by the heat generating component 12 turns to the fins 132b via the base 132a, and the airflow generated by the fan 134 carries its heat away from the fins 132b. Notably, the dusting element 136 is coupled to the fan 134 and is positioned between the fan 134 and the fin 132b. When the fan 134 is rotated, the dust removing member 136 is driven by the fan 134 to sequentially contact the upper portion 132b along a path L1 to clean the dust on the surface of the fin 132b. Furthermore, the airflow from the fan 134 will flow through the gap between the fins 132b, so that the dust removed by the dust removing member 136 will be transmitted out of the fin i32b along with the airflow. The dust removing member 136 is disposed by the dust removing member 136 disposed on the fan 134 to rotate the dust removing member 136 when the fan 134 rotates, so that the dust removing member 136 sequentially contacts each of the binding pieces mb on the stack of fins 2 along the path u. 'In turn, the dust on the rotor mb is moved 201226830 ... one GB 36678twf_doc / nt 2 It is important that the dust will be transmitted 3 132b with the air flow of the fan 134. This allows the heat dissipation module 13 to improve its heat dissipation efficiency of the heat dissipation age 130 and the durability of the electronic device 100 by its own dust removal. In detail, in the present embodiment, the heat dissipation module 130 further includes a bracket 138 assembled to the heat dissipation Korean chip group 132 for mounting the above-mentioned fan 134. Further, the fan 134 has a plurality of main blades 134a, and the dust is removed. The component_136 includes a plurality of brushing units 136a' disposed at the edges of the respective main blades 134a. The brushing unit 13 is made of rubber, which can be made in a double-ejective manner to the main blades 13 of the fan 134. Soft brush leaves. Alternatively, the brushing member 136a may be a soft bristle as long as it is an article or material that can be used to remove dust accumulated on the fins 132b. Further, the fins 132b of the present embodiment are radially arranged on the base 132a' and the fan 134 is assembled on the fins 132b by the brackets 138 and the geometric center of the fins 132b and the geometric center of the fan 134. The brushing unit 1 on the wind 34 can be partially extended into the gap between the tabs 132b. In other words, the brushing unit n is substantially an extending blade of the fan 134 toward the fin 132b. However, the geometric center of the fins ^ the geometric center of the fan can also be located on the same axis, that is, the fan is mounted above the Han, and the brush unit is partially extended downward into the fin gap. Further, both the fan 134 and the Korean piece 132b are concentric circular radial arrays. Accordingly, the brushing unit 13 disposed on the fan 134 can sequentially contact each of the Korean coffee beans along the path L1 when the fan U4 rotates, so that the brush GB 36678twf.doc/n removing unit 136a contacts the fin 132b. The dust on the fins 132b is removed by the vibration generated by the brushing or contact. In addition, since the fin 132b is made of rubber, the brush unit 136a can contact the fins 132b to remove dust while avoiding damage to the fins 132b. Then, when the dust on the fins 132b falls into the gap in the fins 132 due to the contact of the brushing unit 136a with the fins 132b, the fan 134 is used to dissipate the fins 132 through the fins 132b to dissipate heat. The air flow causes the dropped dust to be carried out of the fins 132b with the air flow. At this point, the dust removing member 136 completes the cleaning operation of the heat dissipation module 130. In summary, in the above embodiment of the present invention, the heat dissipating module is disposed on the fan to allow the fan to rotate while rotating the dust removing member relative to (4) to remove the dust removing component. Dust in the gap between Korean and Korean. This action allows the dust-removing element to remove the dust from the surface while the heat is being dissipated by the wind, so that the fan's airflow can bring the dust out of the film. Furthermore, since the material of the dust removing member is rubber, it can be scratched while being dusty on the brush sheet by the flexible second f'. Therefore, the heat dissipation module can be maintained by the dust removing component, and can be used to improve the service life of the electronic device. The invention of the wood has been implemented as described above. However, it is not intended to limit the scope of the present invention:: Those who have the usual knowledge in the technical field of the genus, can make some changes and refinements without departing from the invention. This warranty is subject to the patent application model defined in the attached paragraph. 201226830
jGB 36678twf.doc/n 【圖式簡單說明】 圖1是依照本發明一實施例的一種電子裝置的示意 圖。 圖2是圖1的電子裝置的爆炸圖。 圖3是圖2的電子裝置中風扇及除塵元件的示意圖。 【主要元件符號說明】 100 :電子裝置 110 :板件 120 :發熱元件 130 :散熱模組 132 :散熱鰭片組 132a :基部 132b :鰭片 134 :風扇 134a :主葉片 136 :除塵元件 136a :刷除單元 138 :支架 L1 :路徑 51 :入風侧 52 :出風側JGB 36678twf.doc/n BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an electronic device in accordance with an embodiment of the present invention. 2 is an exploded view of the electronic device of FIG. 1. 3 is a schematic view of a fan and a dust removing component in the electronic device of FIG. 2. [Main component symbol description] 100: electronic device 110: plate member 120: heating element 130: heat dissipation module 132: heat dissipation fin group 132a: base portion 132b: fin 134: fan 134a: main blade 136: dust removing member 136a: brush Except unit 138: bracket L1: path 51: air inlet side 52: air outlet side