TWI610611B - Combined cooling module - Google Patents

Description

Combined cooling module

The invention relates to a heat dissipation module, in particular to a combined heat dissipation module.

A common forced air cooling architecture mainly includes a fan frame and a heat sink. The heat sink is used to be fixed on the heat source to absorb heat from the heat source. The fan frame is used to fix the fan above the heat sink, and the fan is used to forcibly cool the heat sink.

The fan frame and fan settings add extra height to the vertical direction of the heat sink. Therefore, if the volume of the heat sink is to be increased, the width can only be increased from the horizontal direction, and it is not suitable to continue to increase the height in the vertical direction. In addition, the fan frame covers the heatsink largely, and to some extent interferes with the air-cooling effect on the heatsink. This problem can only be solved by increasing the horizontal width of the heatsink, but not directly from the fan frame. Make improvements.

In view of the above problems, the present invention proposes a combined heat dissipation module to solve the problem of the conventional air-cooling heat dissipation architecture.

The invention provides a combined heat dissipation module for removing thermal energy from a heat source. The combined heat dissipation module comprises a first heat sink, at least one fan, a second heat sink, a first heat transfer seat and a second heat transfer seat.

The first heat sink has an upper surface and a lower surface, and the first heat sink has At least one ventilation hole, the ventilation hole penetrates the upper surface and the lower surface.

The fan is fixed to the first heat sink and is located in the vent hole.

The second heat sink has a top surface and a bottom surface; wherein the top surface is disposed at a spaced distance from the lower surface, and at least a portion of the bottom surface is for contacting the heat source.

The first heat transfer seat is disposed on a lower surface of the first heat sink.

The second heat transfer seat is embedded in the second heat sink for contacting the first heat transfer seat to establish a heat transfer path between the first heat sink and the second heat sink. Thereby, the problem that the fan frame interferes with the air cooling effect in the conventional air-cooling heat dissipation module is improved.

In at least one embodiment of the present invention, the first heat sink has a plurality of first heat dissipation fins formed on the upper surface.

In at least one embodiment of the present invention, the combined heat dissipation module further includes at least one first heat pipe embedded in the first heat sink.

In at least one embodiment of the invention, the first heat pipe passes through at least a portion of the first heat transfer seat.

In at least one embodiment of the present invention, the material of the first heat sink is metal.

In at least one embodiment of the present invention, the second heat sink includes a base located on a bottom surface of the second heat sink; at least one second heat pipe partially contacting the base, and the second heat pipe at least passes through the second heat transfer seat Partially, and the second heat pipe has at least one end extending outward; and a plurality of second heat dissipation fins are coupled to the second heat pipe.

In at least one embodiment of the invention, at least a portion of the second heat sink fins are bonded to the outwardly extending portions of the second heat pipe.

In at least one embodiment of the present invention, at least a portion of the second heat sink fins The second heat pipe is coupled to the base portion.

In at least one embodiment of the present invention, the first heat transfer seat has a first contact surface, and the second heat transfer seat has a second contact surface, and the second heat transfer seat contacts the first heat transfer seat with the second contact surface. The first contact surface.

The invention replaces the traditional fan frame by the first heat sink, and establishes a heat transfer path between the upper and lower first heat sinks and the second heat sink through the heat transfer seat, so that the first heat sink can be used to strengthen the second heat dissipation The heat dissipation effect of the device solves the problem that the fan frame itself has an adverse effect on the air cooling effect in the conventional forced air cooling architecture.

1000‧‧‧Combined heat dissipation module

100‧‧‧First radiator

110‧‧‧ upper surface

120‧‧‧lower surface

130‧‧‧ventilation holes

140‧‧‧First heat sink fin

200‧‧‧fan

300‧‧‧second radiator

310‧‧‧ top surface

320‧‧‧ bottom

330‧‧‧Base

340‧‧‧second heat pipe

350‧‧‧Second heat sink fins

400‧‧‧First heat transfer seat

410‧‧‧First contact surface

500‧‧‧Second heat transfer seat

510‧‧‧Second contact surface

600‧‧‧First heat pipe

Figure 1 is a perspective view of an embodiment of the present invention.

Figure 2 is an exploded perspective view of an embodiment of the present invention.

Fig. 3 is another exploded perspective view of the embodiment of the present invention, showing a state in which some components are separated.

Figure 4 is a front elevational view of the embodiment of the present invention showing the state in which the components are separated.

Fig. 5 is another front view of the embodiment of the present invention, showing the state in which all the elements are combined.

Referring to FIG. 1 , FIG. 2 and FIG. 3 , a combined heat dissipation module 1000 for removing heat energy of a heat source is provided. The combined heat dissipation module 1000 includes a first heat sink 100, a plurality of fans 200, a second heat sink 300, a plurality of first heat transfer seats 400, and a plurality of second heat transfer seats 500. The heat source may be a central processing unit, a graphics chip, or a system chip. That is, the heat dissipation module 1000 of the embodiment of the present invention may be installed on a motherboard or Drawing card, but not limited to the above.

As shown in FIGS. 2 and 4, the first heat sink 100 has an upper surface 110 and a lower surface 120. The first heat sink 100 has one or several ventilation holes 130; in the embodiment, the number of the ventilation holes 130 is three, but not limited to the foregoing number. Each of the vent holes 130 penetrates the upper surface 110 and the lower surface 120 such that airflow can pass through the vent holes 130 directly through the first heat sink 100 to flow between the upper surface 110 and the lower surface 120. In addition, the present system of the first heat sink 100 is made of a metal material having a high thermal conductivity, such as copper, aluminum, or an alloy containing the foregoing metal, so that the first heat sink 100 can quickly absorb heat and quickly dissipate heat in the air. the amount.

In addition, as shown in FIG. 1 , FIG. 2 and FIG. 3 , the first heat sink 100 has a plurality of first heat dissipation fins 140 formed on the upper surface 110 for enhancing the air cooling efficiency of the upper surface 110 . In this embodiment, the first heat dissipation fins 140 are integrally formed on the first heat sink 100 (for example, directly fabricated by a die casting process), but it is not excluded that the first heat dissipation fins 140 are separate components and are bonded to the upper surface 110; Other hollow textures or pores may also be formed on the first heat sink 100 to increase the area and further improve the flow of the airflow.

As shown in Figs. 1, 2, and 3, the other function of the first heat sink 100 is to replace the fan frame. The fan 200 is fixed to the first heat sink 100 and located in the vent hole 130 to drive the airflow through the vent hole 130. The number of fans 200 is the same as the number of vent holes 130.

As shown in FIGS. 2, 3, and 4, the second heat sink 300 has a top surface 310 and a bottom surface 320. The top surface 310 is disposed at a spaced distance from the lower surface 120, and at least a portion of the bottom surface 320 is for contacting the heat source.

As shown in FIGS. 2, 3, and 4, the first heat transfer seat 400 is disposed on the lower surface 120 of the first heat sink 100. In addition, the combined heat dissipation module 1000 of the embodiment of the present invention further includes A plurality of first heat pipes 600 are embedded in the first heat sink 100. The first heat transfer seat 400 has a first contact surface 410 that is exposed or even protrudes from the lower surface 120. At the same time, the first heat pipe 600 passes through at least a portion of the first heat transfer seat 400. The heat energy can be more efficiently dispersed in the first heat sink 100 while the heat exchange between the first heat sink 100 and the first heat transfer seat 400 is enhanced by the first heat pipe 600.

As shown in FIG. 2, FIG. 3 and FIG. 4, the second heat transfer seat 500 is embedded in the second heat sink 300, and the second heat transfer seat 500 has a second contact surface 510, and the second contact surface 510 is exposed. On the top surface 310 of the second heat transfer seat 500. In addition, the second heat sink 300 includes a base 330, a plurality of second heat pipes 340, and a plurality of second heat dissipation fins 350. The base 330 is located on the bottom surface 320 of the second heat sink 300 for bonding to the heat source to fix the second heat sink 300 above the heat source. The second heat pipe 340 partially contacts the base 330, and the second heat pipe 340 passes at least a portion of the second heat transfer seat 500 for quickly absorbing heat and heat by the heat source, and the two ends of the second heat pipe 340 extend outward. The second heat dissipation fins 350 are coupled to the second heat pipe 340 to absorb heat from the second heat pipe 340 to perform air cooling. As described above, the fan 200 drives the airflow through the venting holes 130, and the airflow passes through the second heat radiating fins 350 to perform forced air cooling of the second heat radiating fins 350.

As shown in FIGS. 2, 3, and 4, the second heat radiation fins 350 are roughly divided into three groups. One set of second heat dissipation fins 350 is coupled to the second heat pipe 340 to contact the base 330 portion, and the other two sets of second heat dissipation fins 350 are coupled to the outwardly extending portion of the second heat pipe 340 such that the second heat pipe 340 is penetrated and The state of the second heat dissipation fins 350 is connected in series. The aforementioned second heat transfer seat 500 is located substantially between the two sets of second heat dissipation fins 350.

As shown in FIGS. 1 and 5 , the second heat transfer seat 500 contacts the first contact surface 410 of the first heat transfer seat 400 with the second contact surface 510 such that the first heat sink 100 is coupled to the second heat sink 300 . Above, the second heat sink 300 is forcedly air-cooled by the arrangement of the fan 200. At the same time, the first pass The hot seat 400 and the second heat transfer seat 500 also establish a heat transfer path between the first heat sink 100 and the second heat sink 300, so that the heat absorbed by the heat source of the second heat sink 300 is not only passed through the air cooling function. In addition to the dissipation, the second heat transfer seat 500 and the first heat transfer seat 400 may be transmitted to the first heat sink 100 to dissipate heat through the first heat sink 100.

The present invention replaces the conventional fan frame by the first heat sink 100, and establishes a heat transfer path between the upper and lower first heat sinks 100 and the second heat sink 300 through the heat transfer seats 400, 500, so that the first heat sink 100 is available. In order to strengthen the heat dissipation effect of the second heat sink 300, the problem that the fan frame itself has an adverse effect on the air cooling effect in the conventional forced air cooling structure is solved.

1000‧‧‧Combined heat dissipation module

100‧‧‧First radiator

110‧‧‧ upper surface

130‧‧‧ventilation holes

140‧‧‧First heat sink fin

200‧‧‧fan

300‧‧‧second radiator

330‧‧‧Base

340‧‧‧second heat pipe

350‧‧‧Second heat sink fins

400‧‧‧First heat transfer seat

500‧‧‧Second heat transfer seat

600‧‧‧First heat pipe

Claims (9)

A combined heat dissipation module for removing thermal energy of a heat source, comprising: a first heat sink having an upper surface and a lower surface, and the first heat sink has at least one ventilation hole, the ventilation hole penetrating through the An upper surface and the lower surface; at least one fan fixed to the first heat sink and located in the ventilation hole; a second heat sink having a top surface and a bottom surface; wherein the top surface and the lower surface are maintained a spacing distance is provided, and at least a portion of the bottom surface is for contacting the heat source; at least one first heat transfer seat is disposed on a lower surface of the first heat sink; and at least a second heat transfer seat is embedded in the second heat dissipation The device is configured to contact the first heat transfer seat to establish a heat transfer path between the first heat sink and the second heat sink. The combined heat dissipation module of claim 1, wherein the first heat sink has a plurality of first heat dissipation fins formed on the upper surface. The combined heat dissipation module of claim 1, further comprising at least one first heat pipe embedded in the first heat sink. The combined heat dissipation module of claim 3, wherein the first heat pipe passes through at least a portion of the first heat transfer seat. The combined heat dissipation module of claim 1, wherein the material of the first heat sink is metal. The combined heat dissipation module of claim 1, wherein the second heat sink comprises: a base located on a bottom surface of the second heat sink; At least one second heat pipe partially contacting the base, and the second heat pipe passes at least part of the second heat transfer seat, and the second heat pipe has at least one end extending outward; and a plurality of second heat dissipation fins are combined In the second heat pipe. The combined heat dissipation module of claim 6, wherein at least a portion of the second heat dissipation fins are coupled to the outwardly extending portion of the second heat pipe. The combined heat dissipation module of claim 6, wherein at least a portion of the second heat dissipation fins are coupled to the second heat pipe to contact the base portion. The combined heat dissipation structure of claim 1, wherein the first heat transfer seat has a first contact surface, and the second heat transfer seat has a second contact surface, the second heat transfer seat The second contact surface contacts the first contact surface of the first heat transfer seat.