KR200180349Y1 - Copper cooling plate with vanes for cpu cooling device - Google Patents
Copper cooling plate with vanes for cpu cooling device Download PDFInfo
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- KR200180349Y1 KR200180349Y1 KR2019960041042U KR19960041042U KR200180349Y1 KR 200180349 Y1 KR200180349 Y1 KR 200180349Y1 KR 2019960041042 U KR2019960041042 U KR 2019960041042U KR 19960041042 U KR19960041042 U KR 19960041042U KR 200180349 Y1 KR200180349 Y1 KR 200180349Y1
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- copper
- cooling
- heat sink
- benefits
- cpu
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Abstract
본 고안은 앞서 출원한 본 출원인의 특허출원 제96-32948호 “씨피유(CPU) 냉각장치”의 개량에 관한 것으로, 상세하게는 방열판을 일정간격으로 슬릿포밍(slit forming)하여 수직 또는 상향 경사지는 냉각편익을 복수 개 형성하여 냉각효율(방열능력)이 더욱 향상시킨 것이다.The present invention relates to an improvement of the applicant's patent application No. 96-32948 "CPU cooling device" filed previously, in detail, by slit forming the heat sink at regular intervals, The cooling efficiency (heat dissipation ability) was further improved by forming a plurality of cooling benefits.
Description
본 고안은 본 출원인의 선 특허출원 제96-32948호 “씨피유(CPU) 냉각장치”의 개량에 관한 것으로, 상세하게는 구리 방열판을 일정간격으로 슬릿포밍(slit forming)하여 수직 또는 상향 경사지는 구리냉각 편익을 복수 개 형성함으로써 냉각효율(방열능력)을 더욱 향상시킨 것이다.The present invention relates to an improvement of the applicant's prior patent application No. 96-32948 "CPU cooling device", in particular, copper slit forming a copper heat sink at a predetermined interval vertically or upwardly inclined copper By providing a plurality of cooling benefits, the cooling efficiency (heat dissipation capacity) is further improved.
상기 특허출원 제96-32948호는 제1도와 같이 열전도율은 다소 낮지만 대량 주조가 용이한 알루미늄 블록(2)의 상.하부면에 알루미늄 블록(2)보다 열전도율이 우수한 구리 흡열판(4)과 구리 방열판(6)을 각각 접촉시킨다음 구리 리벳(8)으로 접합시켜 3중 구조화 함으로써 CPU로부터 발생된 열이 구리 흡열판(4)과 구리리벳(8) 및 구리 방열판(6)을 통하여 우수한 열전도가 이루어지고 또한, 알루미늄 블록(2)을 통하여 방열이 이루어지게 함으로서 열용량(또는 열전도율)을 증가시켜 냉각효율이 매우 향상되기는 하나 구리 방열판(6)이 제5도와 같이 평판구조이므로 냉각팬(10)으로 강제냉각시키더라도 냉풍 접촉시간과 접촉압력이 짧아 냉각효율이 다소 낮은 편이다.The patent application No. 96-32948 is a copper heat absorbing plate (4) having a higher thermal conductivity than the aluminum block (2) on the upper and lower surfaces of the aluminum block (2), which is somewhat low in thermal conductivity but easy to mass cast, as shown in FIG. The copper heat sink 6 is brought into contact with each other, and then bonded to the copper rivets 8 to form a triple structure so that heat generated from the CPU is excellent in heat conduction through the copper heat absorbing plate 4, the copper rivets 8, and the copper heat sink 6. In addition, the heat dissipation is made through the aluminum block (2) to increase the heat capacity (or thermal conductivity) to improve the cooling efficiency, but the copper heat sink 6 is a flat plate structure as shown in the fifth cooling fan 10 Even though forced cooling, the cooling efficiency is slightly lower due to the shorter contact time and contact pressure.
따라서, 본 고안은 열전도율이 우수한 구리판으로 형성된 방열판을 슬릿포밍하여 수직 또는 상향 경사지는 구리냉각 편익을 복수 개 형성하여 냉풍 정체시간과 풍압을 증가시킴으로써 냉각효율이 보다 향상되게 한 것으로, 이하 본 고안의 바람직한 실시예를 첨부한 도면에 따라 상세히 설명하면 다음과 같다.Therefore, the present invention is to improve the cooling efficiency by increasing the cold wind stagnation time and wind pressure by forming a plurality of vertical or upward inclined copper cooling benefits by slit forming a heat sink formed of a copper plate with excellent thermal conductivity, the following Preferred embodiments will be described in detail with reference to the accompanying drawings.
제1도는 씨피유(CPU) 냉각장치의 단면구성도.1 is a cross-sectional view of a CPU cooling device.
제2도는 본 고안의 외관사시도.2 is an external perspective view of the present invention.
제3도는 본 고안의 평면도.3 is a plan view of the present invention.
제4도는 본 고안의 부분단면도.4 is a partial cross-sectional view of the present invention.
제5도는 종래 고안의 외관사시도.5 is an external perspective view of a conventional design.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
A : 구리방열판 θ1,θ2 : 구리냉각편익의 각도A: copper heat sink θ1, θ2: angle of copper cooling benefit
2 : 알루미늄 블록 4 : 구리흡열판2: aluminum block 4: copper heat absorbing plate
6 : 구리방열판 8 : 구리리벳6: copper heat sink 8: copper rivet
10 : 냉각팬 12 : 가장자리부10 cooling fan 12 edge portion
14 : 구리냉각편익 16 : 중심선14: copper cooling benefits 16: centerline
18 : 중심공18: center hole
제2, 3, 4도는 본 고안 방열판(A)의 구성도로, 복수 개의 방열핀이 적당한 간격으로 형성된 알루미늄 블록(2)의 상,하부 면에 상기 알루미늄 블록(2)보다 열전도율이 우수한 구리흡열판(4)과 구리방열판(6)을 접촉시킨 다음 역시 알루미늄 블록(2)보다 열전도율이 우수한 구리리벳(8)으로 접합시켜 방열효율을 향상시킨 씨피유(CPU) 냉각장치에 있어서, 구리방열판(6)의 가장자리 부(12)를 적당한 간격으로 슬릿포밍(slit forming)하여 제2도와 같이 수직 또는 상향 경사지는 구리냉각편익(14)을 복수 개 형성함으로서 냉각팬(16)에 의한 냉풍이 구리냉각편익(14)에 부딪쳐 순환되게 함으로서 냉각효율을 더욱 향상시킨 것이다.2, 3, 4 is a configuration of the heat sink (A) of the present invention, a copper heat absorbing plate having better thermal conductivity than the aluminum block (2) on the upper and lower surfaces of the aluminum block (2) formed with a plurality of heat radiation fins at appropriate intervals ( 4) the copper heat sink (6) in contact with the copper heat sink (6) and then bonded with a copper rivet (8), which is also better thermal conductivity than the aluminum block (2) to improve the heat dissipation efficiency, By slit forming the edge portion 12 at appropriate intervals to form a plurality of copper cooling benefits 14 which are vertically or upwardly inclined as shown in FIG. 2, the cold air by the cooling fan 16 is reduced by the copper cooling benefits 14. ) To improve circulation efficiency.
상기에서 구리냉각편익(14)의 높이(H)는 구리냉각편익(14)의 직상부에 위치하는 냉각팬(10)과 접촉되지 않으면서 냉풍이 충분히 부딪칠수 있는 높이로 하고, 구리냉각편익(14)의 형성각도(θ1)는 제3도와 같이 중심선(16)으로부터 45도 전후의 기울기를 갖게 하므로서 구리냉각편익(14)의 직상부에 위치하는 냉각팬(10)으로부터 공급되는 냉풍이 구리냉각편익(14)으로 공급되어 냉각되게 하고, 구리냉각편익(14)의 개수는 냉각팬(10)의 풍량이나 방열량을 감안하여 적당한 개수로 가감하도록 한다.In the above, the height H of the copper cooling benefit 14 is a height at which cold air can be sufficiently hit without being in contact with the cooling fan 10 located directly above the copper cooling benefit 14, and the copper cooling benefit ( The forming angle θ1 of 14) gives the inclination of about 45 degrees from the center line 16 as shown in FIG. 3, while the cold air supplied from the cooling fan 10 located directly above the copper cooling benefit 14 is cooled by copper. It is supplied to the convenience 14 to be cooled, and the number of the copper cooling benefits 14 to be added or subtracted to an appropriate number in consideration of the air flow rate and heat dissipation amount of the cooling fan 10.
또한, 구리냉각편익(14)의 수직기울기(θ2)는 제4도와 같이 직각으로 하거나 직각을 전후 한 ±15도 전후 기울기의 예각이나 둔각으로 형성하여 충돌풍량을 적당히 조절할 수도 있으며, 슬릿포밍 지점은 중심공(18)으로부터 다소 이격된 지점으로부터 시작하므로서 복수 개의 구리냉각편익(14) 및 가장자리부(12)가 전체적으로 일체화되게 한다.In addition, the vertical slope θ2 of the copper cooling benefit 14 may be formed at a right angle as shown in FIG. 4 or at an acute angle or an obtuse angle at an angle of ± 15 degrees before and after the right angle, to appropriately adjust the amount of impact air. Starting from a point slightly spaced from the central hole 18, the plurality of copper cooling benefits 14 and the edge 12 are integrated as a whole.
본 고안에서 구리냉각편익(14)의 형성방향은 냉각팬(10)의 냉풍방향에 따라 왼쪽 또는 오른쪽으로 형성할 수 있다. 미 설명 부호 (CPU)는 중앙처리장치, (20)은 프린트기판, (22)는 CPU의 핀, (24)는 모서리부 이다.In the present invention, the forming direction of the copper cooling benefit 14 may be formed to the left or the right side according to the cooling wind direction of the cooling fan 10. CPU is a central processing unit, 20 is a printed board, 22 is a CPU pin, and 24 is a corner.
이와 같이 구성하여서 된 본 고안은 냉각팬(10)의 직하부에 위치하는 구리방열판(6)에 복수 개의 구리냉각편익(14)이 빙둘러 형성되어 있으므로 본 출원인의 선 특허출원 제96-32948호보다 냉각효율이 더욱 향상된다.The present invention constituted as described above has a plurality of copper cooling benefits 14 formed on the copper heat dissipation plate 6 located directly below the cooling fan 10, and thus, the applicant's prior patent application No. 96-32948 The cooling efficiency is further improved.
즉, 냉각팬(10)에 의해 발생된 냉풍의 일부는 구리방열판(6)의 가장자리부(12)와 접촉하면서 가장자리부(12)의 열이나 그 주변의 열을 흡수하면서 가장자리부로 이동되며, 특히 구리냉각편익(14)의 저항에 의해 가장자리부(12)와 구리냉각편익(14)이 교차하는 모서리부(24)에 많은 량의 풍량이 충돌 및 접촉되므로 구리방열판(6)이 더욱 효과적으로 냉각된다.That is, a part of the cold air generated by the cooling fan 10 is moved to the edge while absorbing the heat of the edge portion 12 or the heat of the surrounding portion 12 in contact with the edge portion 12 of the copper heat sink 6, and in particular Due to the resistance of the copper cooling benefit 14, a large amount of airflow collides with and contacts the edge portion 24 where the edge portion 12 and the copper cooling benefit 14 cross each other, and thus the copper heat sink 6 is cooled more effectively. .
또한, 구리냉각편익(14)이 제2도, 제3도와 같이 중심선(16)으로부터 45도 전후로 각각 기울어져 있으므로 제2도와 같이 구리냉각편익(14)과 접촉하므로 전체적인 접촉저항이 증가되어 냉각효율이 향상된다.In addition, since the copper cooling benefits 14 are inclined about 45 degrees from the center line 16 as shown in FIGS. 2 and 3, respectively, the copper cooling benefits 14 come into contact with the copper cooling benefits 14 as shown in FIG. This is improved.
또한, 구리냉각편익(14)이 구리방열판(6)과 일체로 된 구리이므로 구리흡열판(6)과 구리리벳(8)으로 우수하게 전도되는 열량을 효과적으로 방열시킬 수 있다.In addition, since the copper cooling benefits 14 are copper integrated with the copper heat dissipation plate 6, it is possible to effectively dissipate the amount of heat excellently conducted by the copper heat sink 6 and the copper rivets 8.
이상과 같이 본 고안은 열전도율이 우수한 구리판으로 구성된 방열판을 슬릿포밍하여 수직 또는 상향 경사지는 구리냉각 편익을 복수 개 형성함으로써 냉풍 정체시간(접촉시간)과 풍압이 증가되어 CPU의 냉각효율이 보다 향상되는 효과가 있다.As described above, the present invention slit-forms a heat sink made of a copper plate having excellent thermal conductivity, thereby forming a plurality of vertical or upwardly inclined copper cooling benefits, thereby increasing cold air stagnation time (contact time) and wind pressure, thereby improving CPU cooling efficiency. It works.
본 고안에서 냉각팬(10)에 의해 발생된 냉풍의 일부는 구리방열판(6)의 가장자리부(12)와 접촉하면서 가장자리부(12)의 열이나 그 주변의 열을 흡수하면서 가장자리부로 이동되며, 특히 구리냉각편익(14)의 저항에 의해 가장자리부(12)와 구리냉각편익(14)이 교차하는 모서리부(24)에 많은 량의 풍량이 충돌 및 접촉되므로 구리방열판(6)이 더욱 효과적으로 냉각되며, 구리냉각편익(14)이 제2도, 제3도와 같이 중심선(16)으로부터 45도 전후로 각각 기울어져 있으므로 제2도와 같이 구리냉각편익(14)과 접촉하므로 전체적인 접촉저항이 증가되어 냉각효율이 향상되는 효과가 있다.Part of the cold air generated by the cooling fan 10 in the present invention is moved to the edge while absorbing the heat of the edge portion 12 or the heat of the peripheral portion 12 in contact with the edge portion 12 of the copper heat sink (6), In particular, a large amount of airflow collides and contacts the edge portion 24 where the edge portion 12 and the copper cooling benefit portion 14 intersect due to the resistance of the copper cooling benefit 14, so that the copper heat sink 6 is cooled more effectively. Since the copper cooling benefits 14 are inclined about 45 degrees from the center line 16 as shown in FIGS. 2 and 3, respectively, the copper cooling benefits 14 come into contact with the copper cooling benefits 14 as shown in FIG. This has the effect of being improved.
또한, 구리냉각편익(14)이 구리방열판(6)과 일체로 된 구리이므로 구리흡열판(6)과 구리리벳(8)으로 우수하게 전도되는 열량을 효과적으로 방열시킬 수 있는 효과가 있다.In addition, since the copper cooling benefit 14 is copper integrated with the copper heat dissipation plate 6, there is an effect of effectively dissipating the amount of heat excellently conducted by the copper heat sink 6 and the copper rivets 8.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960041042U KR200180349Y1 (en) | 1996-11-19 | 1996-11-19 | Copper cooling plate with vanes for cpu cooling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960041042U KR200180349Y1 (en) | 1996-11-19 | 1996-11-19 | Copper cooling plate with vanes for cpu cooling device |
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| Publication Number | Publication Date |
|---|---|
| KR19980028057U KR19980028057U (en) | 1998-08-05 |
| KR200180349Y1 true KR200180349Y1 (en) | 2000-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960041042U KR200180349Y1 (en) | 1996-11-19 | 1996-11-19 | Copper cooling plate with vanes for cpu cooling device |
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| KR100429456B1 (en) * | 2000-12-20 | 2004-05-03 | 위니아만도 주식회사 | Protection against heat element of solenoid valve for food storing apparatus |
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