1378343 六、發明說明： 【發明所屬之技術領域】 一種筆記型電腦，特別有關於一種具有易更換散熱模组之筆 記型電腦。 【先前技術】 隨著科技的快速發展，電子元件的體積逐漸的縮小，使得電 子產品的體積也變的輕薄短小。由於電子元件的製程縮小化，電 子元件在運作的同時，也連帶著產生高溫。一般而言，電子元件 均有一定的工作溫度。當工作溫度過高時，輕者將造成電子裝置 的運行失敗’重者將損害電子元件的壽命。 為能降低電子元件工作時的溫度，所以廠商多會在電子元件 上設置散熱裝置。筆記型電腦的主機板為例。通常主機板具有中 央處理單元、南橋晶Μ、北橋晶#、顯*晶片與記憶體等電子元 件。由於筆記型電腦的内部空間有限’戶斤以為能達到對上述電子 元件進行降溫的目的。•技術多獅整合柄散熱裝置。換+ 之，係將賴裝置料熱板分職接於中央處職、奸曰片^ =二與顯示晶片上，並透過導歸將各電子元件的廢熱傳導 針對_、術只能 一來，物處理__ 絲置。如此 腦的開 !378343 之外’由於習知紐熱裝置的結構’使得散純置無法在不開啟 筆記型電腦的背板的狀況下進行更換。 【發明内容】 雲於以上的問題，本發明的主要目的在於提供—種具有易更 換散熱模組之雜㈣腦，可制於不_軸理⑸的筆記型 電腦。1378343 VI. Description of the invention: [Technical field to which the invention pertains] A notebook computer, in particular, relates to a notebook computer having an easily replaceable heat dissipation module. [Prior Art] With the rapid development of technology, the volume of electronic components has gradually decreased, making the volume of electronic products lighter and shorter. Due to the downsizing of the electronic components, the electronic components are operated together with high temperatures. In general, electronic components have a certain operating temperature. When the operating temperature is too high, the lighter will cause the operation of the electronic device to fail. The heavy one will damage the life of the electronic component. In order to reduce the temperature during operation of electronic components, manufacturers often place heat sinks on electronic components. Take the motherboard of the notebook as an example. Usually, the motherboard has electronic components such as a central processing unit, a south bridge, a north bridge, a display wafer, and a memory. Due to the limited internal space of the notebook computer, it is thought that the purpose of cooling the above electronic components can be achieved. • Technical multi-lion integrated handle heat sink. For the change of +, the Lai equipment hot plate is divided into the central office, the smuggling film ^ = two and the display wafer, and through the lead to the electronic heat conduction of the electronic components for _, surgery can only come, Material processing __ silk set. In this case, the opening of the brain! 378343 is not able to be replaced without opening the back panel of the notebook computer due to the structure of the conventional heater. SUMMARY OF THE INVENTION In view of the above problems, the main object of the present invention is to provide a notebook computer having a miscellaneous (four) brain with an easy-to-change heat-dissipating module and a non-axis (5).
為達上述目的’本發明所揭露之具有易更換散熱模組之筆記 型電腦包括第-殼體、主機板、第—散熱模組、第二散熱模組與 第二殼體。主機板配置於第—殼體並具有第—晶片及第二晶片. •第-散熱模組包含第-導熱板、第—熱管及散熱則；第一導敎 板係接觸第’並將第—晶片之熱量藉第—熱管傳導至散熱 韓片；第二散麵組包含第二導熱板、第二熱管及散熱板 導熱板係接觸第二晶片，並將第二晶片之熱量藉第二熱管傳導至 散熱板’散熱板係接觸散蘭片；在第二殼體上具有—開口；第 二殼體覆蓋於主機板與第—殼體；開口係對應第二散熱模組，開 口面積大於第二散熱模組，使得第二散熱模組可以通過開口，將 第二散熱模組設置於主機板上。 本發明的嫩化散熱裝置可以朗在砰處理晶片的筆記型 電肠中開發廠商可以根據不同的中央處理單元與處理晶片分別 替換相應的散紐構。如此—來，可崎低畴符合中央處理單 元與處理晶片崎錄置的製造成本。 有關本發明㈣徵與實作，兹配合圖示作最佳實施例詳細說 1378343 明如下。 【實施方式】 請參考「第1圖」所示，其係為本發明之散熱裝置爆炸圖示 意圖。本發明的筆記型電腦具有顯示單元(未繪示)與本體·。筆 記型電腦可以是小型移動個人電腦(ultmM〇biie pc，腦^)、平 板電腦(τ_、電子書閱讀器等等，但本發明不僅限於此。 本體200包括第-殼體210、主機板22〇、第一散熱模組 230、第一散熱模組24〇、第二殼體25〇與背板勘。主機板no 配置於第-殼體训，主機板22〇具有第一晶片奶及第二晶片 222。第-晶片221可以是中央處理單元與顯示晶片。第二晶片 222是北橋晶片。隨著電子元件的製程微小化，使得電子元件在運 作時會產生高溫。由於電子元件有工作溫度的限制，若是持續處 於兩溫狀態下將使得電子元件毀損，進而影響筆記型電腦的運作。 第一散熱模組230包含第一導熱板23卜第一熱管232及散熱 鰭片233。第一熱管232的；端設置第一導熱板231，另一端設置 政熱鳍片233。第一導熱板231係接觸第一晶片221，並將第一晶 片221之熱量藉第一熱管232傳導至散熱鰭片233。第一熱管232 與透過導熱膠固合散熱鰭片233。第一熱管232可藉由熱傳導、液 汽態變化及毛細管現象，而將熱量從第一導熱板231端傳導至另 一端(即散熱鰭片233)。由於散熱鰭片233具有較大面積，所以可 以進行快速的散熱。 第二散熱模組240包含第二導熱板24卜第二熱管242'及一散 1378343 熱板243。第二熱管242的一端設置第二導熱板241，第二熱管242 的另一端設置散熱板243。第二導熱板241係接觸第二晶片222， 並將第二晶片222之熱量藉第二熱管242傳導至散熱板243。而散 熱板243係接觸散熱鰭片233，其中，散熱板243可以透過扣接、 黏合或疊合的方式與散熱鰭片233接觸。 在第二殼體250中設置一開口 251。開口 251的開口範圍至少 擴及第一晶片221的位置與第二晶片222的位置之間。換言之， 鲁 開口之面積大於該第二散熱模組之大小。開口 251係對應第二散 熱模組240以供第二散熱模組240藉開口 251置入第一殼體21〇。 主機板220被第二殼體250覆蓋與第一殼體21〇之間。 請配合「第1圖」並同時參考「第2圖」至「第6圖」所示， 其係分別為本發明之散熱裝置組合示意圖。首先，將第二散熱模 、、且240的第一熱管242係沿著開口 251邊緣設置，而散熱板243 被設置於第一殼體210的一側邊，請參考「第2圖」所示。 鲁 首先請參考「第2圖」，將第二散熱模組24G設置於第二晶片 222上。接著，當第二殼體25〇覆蓋於主機板22〇與第一殼體21〇 時，「第二散熱模組240係被第二殼體250所覆蓋(第二散熱模組24〇 在第3圖」巾的虛線係為局部剖面表示）。由於開α⑸的開口 面積大於第-散減組23G，所以可以將第—散_組23〇置入於 開口 251中，並與第二散熱模組240進行結合。 請參考「第4圖」所示，「第4圖」上方係為第-散熱模組23〇, 其組裝方式請參考「第4圖」中的虛線80、82、84。首先第一散 熱模組230從上方置入。當第一散熱模組 230置入開口 251時， 需要將散熱則说沿纽Μ財向與雜板243接合。最後， 將第一散熱模、组230沿著虛線84黏合於第-晶片211上，如「第 5圖」所示。 丑与錢上述的散錄置產生更佳的功效，可以在散熱板^ 與，熱鰭片233的-侧邊設置—風扇27()，風扇，的出風口則琴 鄰散熱板243與散熱鰭片233(請配合「第】圖」與「第㈣」戶, 厂、使得風扇270所吹出的風可以有效率的帶走散熱板如與崩 ^片233的廢熱。而散熱板243的表面除了可以是平面外，亦 2為波浪狀，散熱板243與風經過的面積大大的增加，藉以提 向散熱的效率。最後，在第二殼體25〇上再覆蓋上一層背板細， 則可完成筆記型電腦的本體細的組裝。 “本發㈣模組化散絲置可以顧在不同處理晶片的筆記型 ^腦中。開發薇商可以雜不_巾央處理單元與處理晶片而不 *修改散_組結構。如此—來，可崎低_符合中央處理單 凡與處理晶片的散熱裝置的製造成本。 雖然本發明以前述讀佳實施例揭露如上，離並非用以限 ^本發明，任何熟習相像技藝者，在不脫離本發曰月之精神和範圍 太’當可作铸之更動制飾，本發明之專梅護範圍須視 本3兒明書_之申請專利賴所界定者為準。 【圖式簡單說明】 意圖 第1圖係為本發明之散熱裝置爆炸示 第2圖係為本發明之散埶 與第二殼體之組合動作咅^第二散熱模組置人第一殼體 *处圖。 第3圖係林糾之散聽置 盘笛—奶躺 第—散熱模組置入第一 ，、第―成體之組合動作二示意圖。 殼體 之第一散熱模組與第一殼體之 第4圖係為本發明之散熱裝置 組合示意圖。 第5圖係為本發明之_裝置之第-散熱模組、第-殼體與 第二殼體之組合示意圖。 第6圖係為本發明之散熱裝置之風扇置入第一般體與第二殼 體之示意圖。 【主要元件符號說明】 散熱裝置100 導熱板110 導熱管120 散熱鰭片130 本體200 . 第一殼體210 主機板220 第一晶片221 第二晶片222 第一散熱模組230 第一導熱板231 1378343 第一熱管232 散熱鰭片233 第二散熱模組240 第二導熱板241 第二熱管242 散熱板243 第二殼體250 開口 251 背板260 風扇270 虛線 80、82、84In order to achieve the above object, the notebook computer with the easy-to-replace heat dissipation module disclosed in the present invention includes a first housing, a main board, a first heat dissipation module, a second heat dissipation module and a second housing. The motherboard is disposed on the first housing and has a first wafer and a second wafer. The first heat dissipation module includes a first heat conduction plate, a first heat pipe and a heat dissipation; the first guide plate contacts the first and the first The heat of the wafer is conducted to the heat dissipation Korean piece by the first heat pipe; the second heat dissipation plate, the second heat pipe and the heat dissipation plate of the heat dissipation plate are in contact with the second wafer, and the heat of the second wafer is conducted by the second heat pipe. The heat sink plate is in contact with the loose plate; the second casing has an opening; the second casing covers the main plate and the first casing; the opening corresponds to the second heat dissipation module, and the opening area is larger than the second The heat dissipation module enables the second heat dissipation module to pass through the opening to set the second heat dissipation module on the motherboard. The tenderizing heat dissipating device of the present invention can be used in a notebook type electrophoresis in which a wafer is processed by a developer, and the corresponding bulk structure can be replaced by a different central processing unit and a processing wafer, respectively. In this way, the low-domain conforms to the manufacturing cost of the central processing unit and the processing chip. With regard to the invention (4), the exemplification and implementation of the present invention will be described in detail with reference to the drawings. [Embodiment] Please refer to the "Fig. 1", which is an illustration of the explosion of the heat sink of the present invention. The notebook computer of the present invention has a display unit (not shown) and a body. The notebook computer may be a small mobile personal computer (ultmM〇biie pc, brain), a tablet computer (τ_, an e-book reader, etc., but the present invention is not limited thereto. The body 200 includes the first housing 210 and the motherboard 22 〇, the first heat dissipation module 230, the first heat dissipation module 24〇, the second housing 25〇 and the backplane. The motherboard is disposed in the first-shell training, and the motherboard 22 has the first wafer milk and the first The second wafer 222. The first wafer 221 may be a central processing unit and a display wafer. The second wafer 222 is a north bridge wafer. As the electronic component is miniaturized, the electronic component generates a high temperature during operation. The limitation of the first heat pipe 23 includes the first heat pipe 23 and the first heat pipe 232 and the heat dissipation fins 233. If the temperature is constant, the electronic components will be damaged and the electronic components will be damaged. The first heat conducting plate 231 is disposed at the other end, and the first heat conducting plate 231 is in contact with the first wafer 221, and the heat of the first wafer 221 is conducted to the heat radiating fin by the first heat pipe 232. 233. A heat pipe 232 and a heat-dissipating heat-dissipating fin 233 are fixed. The first heat pipe 232 can conduct heat from the first heat-conducting plate 231 end to the other end by heat conduction, liquid vapor state change and capillary phenomenon (ie, heat-dissipating fins) 233). Since the heat dissipation fins 233 have a large area, rapid heat dissipation can be performed. The second heat dissipation module 240 includes a second heat conduction plate 24, a second heat pipe 242', and a dispersion 1373343 heat plate 243. The second heat pipe 242 The second heat conducting plate 241 is disposed at one end of the second heat pipe 242. The second heat conducting plate 241 contacts the second wafer 222, and the heat of the second wafer 222 is conducted to the heat sink through the second heat pipe 242. 243. The heat dissipation plate 243 is in contact with the heat dissipation fins 233, wherein the heat dissipation plate 243 can be in contact with the heat dissipation fins 233 by fastening, bonding or overlapping. An opening 251 is disposed in the second housing 250. The opening 251 The opening range extends at least between the position of the first wafer 221 and the position of the second wafer 222. In other words, the area of the Lu opening is larger than the size of the second heat dissipation module. The opening 251 corresponds to the second heat dissipation module 240. First The heat dissipation module 240 is placed in the first casing 21 by the opening 251. The motherboard 220 is covered by the second casing 250 and the first casing 21A. Please cooperate with "Fig. 1" and refer to "Fig. 2" As shown in Fig. 6, it is a schematic diagram of the heat sink assembly of the present invention. First, the first heat pipe 242 of the second heat sink, 240 is disposed along the edge of the opening 251, and the heat sink 243 It is provided on one side of the first casing 210, please refer to "Fig. 2". First, please refer to "Fig. 2", and the second heat dissipation module 24G is placed on the second wafer 222. Then, when the second housing 25 is covered by the motherboard 22 and the first housing 21, the second heat dissipation module 240 is covered by the second housing 250 (the second heat dissipation module 24 is in the The dotted line of the figure 3 is a partial cross section. Since the opening area of the opening α(5) is larger than the first-scattering group 23G, the first-scattering group 23〇 can be placed in the opening 251 and combined with the second heat dissipation module 240. Please refer to "Figure 4". The top of Figure 4 is the first heat dissipation module 23〇. For the assembly method, please refer to the dotted lines 80, 82 and 84 in Figure 4 . First, the first heat dissipation module 230 is placed from above. When the first heat dissipation module 230 is placed in the opening 251, the heat dissipation is required to be joined to the miscellaneous plate 243 along the button. Finally, the first heat dissipation mold and the group 230 are bonded to the first wafer 211 along the broken line 84, as shown in Fig. 5. The ugly and the above-mentioned scatter recordings have better effects. They can be placed on the heat sink and the side of the heat fin 233 - the fan 27 (), the fan, the air outlet is adjacent to the heat sink 243 and the heat sink fin Piece 233 (please cooperate with the "figure" and "fourth" households, so that the wind blown by the fan 270 can efficiently take away the waste heat of the heat sink such as the chip 233. The surface of the heat sink 243 is It can be out-of-plane and also wavy. The area of the heat-dissipating plate 243 and the wind passing through is greatly increased, so as to improve the efficiency of heat dissipation. Finally, the second casing 25 is covered with a layer of the back plate. Complete the assembly of the body of the notebook computer. "This hair (4) modularized filament placement can be considered in the notebook type of different processing wafers. The development of Weishang can be mixed with the processing unit and the processing wafer without * Modifying the scatter-group structure. As such, it can be reduced to meet the manufacturing cost of the central processing unit and the heat sink for processing the wafer. Although the present invention has been disclosed above in the foregoing preferred embodiment, it is not intended to limit the invention. Anyone who is familiar with the art, is not out of this hairpin The spirit and scope of the moon is too 'when it can be used for casting, the scope of the special beauty protection of the invention shall be determined according to the definition of the patent application of this book. [Simplified illustration] Intention first Figure 2 is a diagram showing the explosion of the heat dissipating device of the present invention. Fig. 2 is a combination of the dilation frame and the second casing of the present invention, and the second heat dissipating module is placed on the first casing *. Correction of the flute flute - milk lying - the thermal module is placed in the first, the first - adult combination action diagram 2. The first heat sink module and the first shell of the fourth figure is FIG. 5 is a schematic diagram of a combination of a first heat dissipation module, a first housing and a second housing of the present invention. FIG. 6 is a fan of the heat dissipation device of the present invention. Schematic diagram of placing the first body and the second casing. [Description of main components] Heat sink 100 Heat conduction plate 110 Heat pipe 120 Heat sink fin 130 Body 200. First casing 210 Motherboard 220 First wafer 221 Second wafer 222 first heat dissipation module 230 first heat conduction plate 231 1378343 first heat pipe 232 heat dissipation The second housing 233 of the second sheet 243 heat dissipation module 240 of the second heat conducting plate 241 of the second heat pipe radiator plate 242 back plate 250 opening 251 fan 270 broken lines 80, 82, 260
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