M309314 八、新型說明： 【新型所屬之技術領域】 " 本創作係關於一種散熱機殼，更詳而言之，係有關一 •種應用於具發熱元件之電子系統，使該電子系統兼具^ 熱、防塵及防水效果之散熱機殼。 【先前技術】M309314 VIII. New description: [New technology field] " This creation is about a heat-dissipating case, more specifically, an electronic system applied to a heating element, so that the electronic system has both ^ Heat, dust and water resistant heat sink. [Prior Art]
Ik著電腦技術的不斷發展，電腦中之中央處理器、顯 :卡、記憶體的主頻不斷上升，以及硬碟轉速的不^提^ 高，致使它們工作時產生的熱量也逐漸加大，著實會造成 電腦本身之零件故障或損壞，進而導致電腦盔法正曰^ 作。 吊 因此，目前電子設備大多會加裝散熱裝置以進行散熱 處理，以電腦為例，其係會在外殼部分加裝散熱風扇以進 仃抽風，相應地可降低外殼内之發熱元件或裝置之溫度， 俾達散熱之目的，然，現以此種方式進行散熱之電;ς 籲備，無疑地係使整個電子設備處於開放式的空間，因而又容 易使侍開放式的空間中之灰塵，藉由該散熱風扇之抽風口 進入該電子設備之内部，日積月累之下，該些灰塵係會造 成該電子設備之内部元件或裝置電性接觸不良之情事，此 外，該電子設備所處之環境大多有使用者在旁，無可避免 地，使用者偶會不小心的把水或飲料翻倒，而造成水等液 體藉由該散熱風扇之抽風口進入該電子設備之内部，此 打’則更容易因水氣之影響，造成該電子設備之内部的元 件或裝置之電氣特性受影響，甚而發生該電子設備損毁之 19683 M309314 情事。 因此，如何提供-種可解決上述習知技術之缺失的技 -術方案，乃當今業界亟待解決之問題。 ，【新型内容】 鑒於白知技術之缺陷，本創作之主要目的在於提供一 種政熱機设，以對電子系統之發熱元件進行散熱。 本創作之另一目的在於提供一種散熱機殼，以對電子 系統之發熱元件進行防塵。 本創作之再一目的在於提供一種散熱機殼，以對電子 系統之發熱元件進行防水。 為達成上述主要及其他目的，本創作提供一種應用於 具1¾熱元件之電子糸統之散熱機殼，其包括··機箱，係具 一導熱側，用以容置並遮蔽該發熱元件；冷卻流體導熱模 組，係設置於該機箱内並形成冷卻流體導熱路徑，該冷卻 流體導熱路徑係行經該發熱元件以及該機箱之導熱侧，用 鲁以透過運行於該冷卻流體導熱路徑上之冷卻流體與該發 熱元件進行熱交換後，經該冷卻流體之運行，再透過該冷 卻流體與該機箱之導熱側進行熱交換，俾將該發熱元件之 熱能傳導至该機箱之導熱側；殼體，係用以容置該機箱， 並設置有入風口以及出風口，俾於與該機箱之間形成氣流 通道；以及散熱模組，係設置於該氣流通道以及該機箱之 導熱側上’用以吸收該機箱之導熱側之熱能，並將所吸收 之熱能傳導至各區域，俾透過各區域與由該入風口流入至 該氣流通道且由該出風口流出之空氣進行熱交換。 6 19683 M3 09314 相較於習知技術，本創作係先透過冷卻流體導熱模組 .與，熱元件進行熱交換後，再透過機箱、以及散熱模纪之 -熱交換方式，將熱能傳導至該散熱模組之各區域，最後藉 •由該散熱模組之各區域與由該人風口流人至該氣流通道0 且由該出風口流出之空氣進行熱交換後，達到上述主要之 、此外本創作更透過可遮蔽該發熱元件之機箱，達 述另以及再一之目的，相應地，本創作係可解決習 ·:技術中，僅能提供電子系統之發熱元件單一散熱效果而 …、法同時兼具防塵以及防水效果之問題。 【實施方式】 、以下係藉由特定的具體實例說明本創作之實施方 式，熟悉此技藝之人士可由本說明書所揭示之内容輕易地 瞭解本創作之其他優點與功效。本創作亦可藉由其他不同 的具體實例加以施行或應用，本說明書中的各項細節亦可 基於不同觀點與應用，在不悖離本創作之精神下進行各種 鲁修飾與變更。 請參閲第1及2圖，係為本創作之散熱機殼之第一實 施例之分解以及第i圖之A_A剖面示意圖，如圖所示，該 政熱機=1係應用於具發熱元件之電子系統。於本實施例 X电子系統係貝施為資料處理系統，例如伺服器電腦 ^server)’而為簡化圖示以更清楚表現出本創作之散熱機 4 1的各組成構件之結構，該電子系統僅以設置於主機板 ⑽20上之中央處理單元（CP1021以及北橋晶片（NorthIk is constantly developing computer technology. The main frequency of the central processing unit, the display card, and the memory in the computer are constantly rising, and the speed of the hard disk is not raised, so that the heat generated during their operation is gradually increased. It will cause malfunction or damage to the parts of the computer itself, which will lead to the computer helmet method. Therefore, most electronic devices are currently equipped with a heat sink for heat dissipation. In the case of a computer, a heat sink fan is added to the outer casing to extract air, and the temperature of the heat generating component or device in the outer casing can be reduced accordingly. The purpose of heat dissipation is, however, the heat dissipation in this way; 吁 吁 , , , , , , , , , , , , , 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑 无疑The air outlet of the cooling fan enters the inside of the electronic device, and over time, the dust may cause electrical contact between the internal components or devices of the electronic device. In addition, the environment of the electronic device is mostly The user is in the side, inevitably, the user accidentally dumps the water or the beverage, and the liquid such as water enters the inside of the electronic device through the air outlet of the cooling fan, which is easier. Due to the influence of moisture, the electrical characteristics of the components or devices inside the electronic device are affected, and even the damage of the electronic device is 19683 M309314. thing. Therefore, how to provide a technical solution that can solve the above-mentioned lack of the prior art is an urgent problem to be solved in the industry today. [New content] In view of the defects of Baizhi technology, the main purpose of this creation is to provide a political thermal device to dissipate heat from the heating elements of the electronic system. Another object of the present invention is to provide a heat dissipation housing for dustproofing of heating elements of an electronic system. A further object of the present invention is to provide a heat dissipation housing for waterproofing the heating elements of the electronic system. In order to achieve the above main and other purposes, the present invention provides a heat dissipating casing for an electronic system having a 13⁄4 thermal component, comprising: a chassis having a heat conducting side for receiving and shielding the heating element; cooling The fluid heat conduction module is disposed in the chassis and forms a heat transfer path of the cooling fluid. The heat transfer path of the cooling fluid passes through the heat generating component and the heat conducting side of the chassis, and passes through the cooling fluid running on the heat conduction path of the cooling fluid. After heat exchange with the heating element, the cooling fluid is operated to exchange heat with the heat conducting side of the chassis through the cooling fluid, and the heat energy of the heating element is transmitted to the heat conducting side of the chassis; The air intake channel is disposed between the air inlet and the air outlet, and the air cooling channel is disposed on the air flow channel and the heat conduction side of the chassis to absorb the air The thermal energy of the heat conducting side of the chassis, and the absorbed heat energy is transmitted to the respective regions, and through the respective regions and from the air inlet to the airflow passage The air flows out from the outlet of the heat exchanger. 6 19683 M3 09314 Compared with the prior art, this creation firstly transmits heat energy to the heat through the cooling fluid heat conduction module, after heat exchange with the heat element, and then through the chassis and the heat dissipation mode-heat exchange method. The main areas of the heat dissipation module are finally exchanged by the heat exchange between the area of the heat dissipation module and the air flowing from the air outlet to the air flow passage 0 and flowing out of the air outlet. The creation is made through the chassis that can shield the heating element, and the purpose of the other is to solve the problem. Accordingly, the creation system can solve the problem: in the technology, only the heating element of the electronic system can be provided with a single heat dissipation effect. It has both dustproof and waterproof effects. [Embodiment] The following describes the implementation of the present invention by a specific specific example, and those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification. The creations may also be carried out or applied by other specific examples. The details of the present specification may also be based on different opinions and applications, and various modifications and changes may be made without departing from the spirit of the present invention. Please refer to Figures 1 and 2 for the decomposition of the first embodiment of the heat-dissipating case of the present invention and the cross-sectional view of the A_A of the i-th figure. As shown in the figure, the government machine is used for heating elements. electronic system. In the present embodiment, the X electronic system is a data processing system, such as a server computer (server), and the structure of each component of the heat sink 41 of the present invention is more clearly shown to simplify the illustration. Only the central processing unit (CP1021 and Northbridge (North) on the motherboard (10) 20
Bridge chip)22 與電源供應器（p〇wer supply)23 作為該 19683 M3 09314 :::統之構件’亦即，該些電子系統之構件並非為該電 ，“ ” j之所有組成構件，其僅用以作為本實施例所應用之 電子系、、先中之發熱几件，此外，該些電子系 ‘限制實際實施時可庫用之私敎分杜與於一 非 了」應用之發熱兀件，貫際實施時可應用之 务熱70件係可依實際情況作調整。 •本f作之散熱機殼α本實施例中之組成構件係包 .括機相10、冷部流體no、導熱模組、殼體12、散熱 • = 13以及風扇模組14。…分別針對本創作之散熱 钱成1之上揭各組成構件進行詳細說明： 一該機相10’係具一導熱侧100，用以容置並遮蔽該發 熱元件（亦即為本實施例之中央處理單元21、北橋晶片22 以及電源供應器23)。於本實施例中，該機箱1〇係如同 圖中所示，其係容置並遮蔽該電子系統中之主機板上以及 電源供應器等發熱元件，以隔絕外來物，例如灰塵或水氣 等會對該電子系統產生電氣影響者，而該機箱1〇之導熱 侧100之材質之較佳實施方式係為鋁合金。 ‘、，該冷卻流體110導熱模組u,係設置於該機箱10内 並形成冷卻流體110導熱路徑，該冷卻流體11〇導熱路徑 係行經該發熱元件（亦即為本實施例之中央處理單元 21、北橋晶片22以及電源供應器23)以及該機箱1〇之導 熱側100，用以透過運行於該冷卻流體丨丨〇導熱路徑上之 冷卻流體110與該發熱元件進行熱交換後，經該冷卻流體 110之運行，再透過該冷卻流體110與該機箱1〇之導熱 側100進行熱交換’俾將該發熱元件之熱能傳導至該機箱 19683 8 M309314 10之導熱侧100。 於本實施例中，該冷卻流體110導熱模組U係包括： 冷卻流體110、熱交換管U1以及驅動單元112，其中， 該冷部流體11 〇係為液體，例如水，但並非以此為限，亦 可實施為氣體，例如空氣；該熱交換管1 1 i係用以形成該 冷卻流體110導熱路徑，其係以緊靠該發熱元件（亦即為 本實施例之中央處理單元21、北橋晶片22以及電源供應Bridge chip) 22 and a power supply (p〇wer supply) 23 as a component of the 19683 M3 09314::, that is, the components of the electronic system are not the components of the electrical, "j" It is only used as the electronic system used in this embodiment, and the first part of the heat generation. In addition, these electronic systems are limited to the use of the private use of the library. The 70 pieces of heat that can be applied during the implementation can be adjusted according to the actual situation. • The heat-dissipating case α of the present embodiment includes the machine component 10, the cold fluid no, the heat-conducting module, the housing 12, the heat dissipation •=13, and the fan module 14. The detailed description of each component is performed on the heat-dissipating component 1 of the present invention: a phase 10' of the machine has a heat-conducting side 100 for accommodating and shielding the heat-generating component (that is, the embodiment) The central processing unit 21, the north bridge wafer 22, and the power supply 23). In this embodiment, the chassis 1 is as shown in the figure, which accommodates and shields the heating elements on the motherboard and the power supply in the electronic system to isolate foreign objects such as dust or moisture. A preferred embodiment of the material of the thermally conductive side 100 of the chassis is an aluminum alloy. The heat-dissipating module u of the cooling fluid 110 is disposed in the casing 10 and forms a heat-conducting path of the cooling fluid 110, and the heat-dissipating path of the cooling fluid 11 passes through the heating element (that is, the central processing unit of the embodiment) 21. The north bridge chip 22 and the power supply 23) and the heat conducting side 100 of the chassis 1 are configured to exchange heat with the heat generating component through the cooling fluid 110 running on the heat transfer path of the cooling fluid. The operation of the cooling fluid 110 is further exchanged with the heat conducting side 100 of the chassis through the cooling fluid 110. The thermal energy of the heating element is conducted to the heat conducting side 100 of the chassis 19683 8 M309314 10 . In this embodiment, the cooling fluid 110 heat conduction module U includes: a cooling fluid 110, a heat exchange tube U1, and a driving unit 112, wherein the cold portion fluid 11 is a liquid, such as water, but not The heat exchange tube 1 1 i is used to form a heat conduction path of the cooling fluid 110, which is in close proximity to the heat generating component (that is, the central processing unit 21 of the embodiment). Northbridge chip 22 and power supply
器23)以及該機箱10之導熱側1〇〇之方式且透過運行於 該冷卻流體110導熱路徑上（即該熱交換管U1中）之冷卻 流體110進行熱交換，其中，該熱交換管u丨之材質之較 佳實施方式係為鋁，需予以附加說明的是，該熱交換管 111之尺寸以及形狀之設置並非以圖中所示者予以限 制，其係可依照實際實施時，欲進行散熱之發熱元件之尺 寸以及位置進行設置；該驅動單元112係用以使該冷卻流 體110運行於該冷卻流體11〇導熱路徑上，亦即，使該冷 籲卻流體110運行於該熱交換管U1中，因此，其必需和該 冷卻流體110之形式相對應，而於本實施例中，該冷卻流 體110係為液體，故該驅動單元112之較佳實施方式係為 幫浦（pump)，此外，若該冷卻流體丨丨〇係為氣體，則該驅 動單元112之較佳實施方式係為風扇。 該殼體12，係用以容置該機箱丨〇，並設置有入風口 120以及出風口 121，俾於與該機箱1〇之間形成氣流通 道。於本實施例中，該殼體12係包括··側蓋122以及設 置有該入風口 120以及該出風口 121之外殼主體123，而 19683 9 M309314 該侧蓋12 2以及該外殼主體i 2 3係可以螺絲鎖固或結構私 合等結合方式進行組裝，需附加說明的是，因該結合方^ -係有多種實施方式且經上述文字說明，對於此領域中具^ 通常知識者應可據以實施，故圖中並未顯示本實施例之結 合方式；該殼體12係以一般電子系統（例如伺服器電腦） 之外殼的材質構成即可，且其可實施之形狀並非以圖中所 不者予以限制，此外，該入風口 ！ 2〇以及出風口 i 2丨之位 置以及尺寸亦非以圖中所示者予以限制，只要能在該殼體 12與該機箱1 〇之間形成氣流通道皆為本創作之入風口 120以及出風口 121可實施之方式。 該散熱模組13，係設置於該氣流通道以及該機箱1〇 之導熱側100上，用以吸收該機箱1〇之導熱側1〇〇之熱 能，並將所吸收之熱能傳導至各區域，俾透過各區域與由 該入風口 12 0流入至該氣流通道且由該出風口 121流出之 空氣進行熱交換。於本實施例中，該散熱模組係包括·· _設置於該機箱10之導熱側100上之底板130以及複數設 置於该底板130上之散熱片131，其中，該底板ι3〇係用 以吸收該機箱10之導熱側1〇〇之熱能，並將該熱能傳導 至該各區域（包括該底板130本身以及該複數散熱片 131)，藉此，透過該底板130以及該複數散熱片131與在 該氣流通道上運行之空氣進行熱交換（大散熱面積），俾達 快速散熱之目的，其中，該散熱片131之材質之較佳實施 方式係為鋁。 遠風扇模組14，係設置於該氣流通道上，用以加速 19683 10 M309314 由該=風口 120流入至該氣流通道且由該出風口 i2i流出 ，之空氣之流動速度，俾相應加速該散熱模組13之各區域 -與由該入風口 120流入至該氣流通道且由該出風口 ΐ2ι .流出之空氣進行熱交換之速度。於本實施例中，該風扇模 組14所設置之位置係以圖中所示者為最 之一側），但並非心限制其可設置之位置，且該風扇^ 組14可貫施之組數亦可依實際之散熱需求作調整。 #請參閱第3及4圖，係為本創作之散熱機殼之第二 •實施例之分解以及第3圖之A—A剖面示意圖，如圖所示， 該第二實施例與第-實施例之不同處在於，該第二實施例 之散熱模組13係僅僅包括複數設置於該機箱1〇之導熱側 100上之散熱片131，而透過該散熱模組13之設置亦可經 由與空氣之熱交換達到良好的散熱效果。 綜上所述，本創作之散熱模組係主要包括該機箱、該 冷卻流體導熱模組、該殼體以及該散熱模組，其運作方式 ，❿係先透過該冷卻流體導熱模組與該發熱元件進行熱交換 後，再透過該機箱、以及該散熱模組之熱交換方式，將熱 能傳導至該散熱模組之各區域，最後藉由該散熱模組之各 區域與由該殼體入風口流入至該氣流通道且由該殼體出 風口流出之空氣進行熱交換後，不僅可達到對該電子系統 之發熱元件進行散熱之目的，更透過可遮蔽該發熱元件之 機相’達到對電子系統之發熱元件進行防塵、防水之目 的，相應地，本創作係可解決習知技術中，僅能提供電子 系統之發熱元件單一散熱效果而無法同時兼具防塵以及 19683 11 M3 09314 t ^ fit 之散熱效果。運仃子系統之散熱元件得到更佳 【圖式簡單説明】The heat exchange side of the chassis 10 and the heat transfer side of the chassis 10 are heat exchanged through a cooling fluid 110 running on the heat transfer path of the cooling fluid 110 (ie, in the heat exchange tube U1), wherein the heat exchange tube u The preferred embodiment of the material of the crucible is aluminum. It should be noted that the size and shape of the heat exchange tube 111 are not limited as shown in the drawings, and may be performed according to actual implementation. The size and position of the heat-dissipating heat-dissipating component are set; the driving unit 112 is configured to operate the cooling fluid 110 on the heat-dissipating path of the cooling fluid 11 , that is, to operate the cold-calling fluid 110 on the heat-exchange tube In U1, therefore, it must correspond to the form of the cooling fluid 110. In the present embodiment, the cooling fluid 110 is a liquid, so the preferred embodiment of the driving unit 112 is a pump. Further, if the cooling fluid is a gas, the preferred embodiment of the driving unit 112 is a fan. The housing 12 is configured to receive the chassis and is provided with an air inlet 120 and an air outlet 121 to form an air flow passage with the chassis 1 . In this embodiment, the housing 12 includes a side cover 122 and a housing body 123 provided with the air inlet 120 and the air outlet 121, and the 19683 9 M309314 the side cover 12 2 and the housing body i 2 3 It can be assembled by a combination of screw locking or structural congruence. It should be additionally noted that since the binding system has various embodiments and is described by the above text, it should be possible for those who have the usual knowledge in this field. The embodiment of the present invention is not shown in the drawings; the housing 12 is constructed of a material of a casing of a general electronic system (for example, a server computer), and the shape that can be implemented is not in the drawings. No restrictions, in addition, the air inlet! 2位置 and the position and size of the air outlet i 2丨 are not limited as shown in the figure, as long as the air passage can be formed between the casing 12 and the casing 1 皆 is the inlet vent 120 of the creation The tuyere 121 can be implemented in a manner. The heat dissipation module 13 is disposed on the air flow channel and the heat conduction side 100 of the chassis 1 to absorb the heat energy of the heat conduction side of the chassis 1 and transmit the absorbed heat energy to each area. The heat is exchanged between the air flowing through the air inlet 12 to the air flow passage and flowing out of the air outlet 121 through the respective regions. In this embodiment, the heat dissipation module includes a bottom plate 130 disposed on the heat conducting side 100 of the chassis 10 and a plurality of heat sinks 131 disposed on the bottom plate 130. Absorbing thermal energy of the heat conducting side of the chassis 10 and conducting the thermal energy to the respective regions (including the bottom plate 130 itself and the plurality of heat sinks 131), thereby passing through the bottom plate 130 and the plurality of heat sinks 131 The air running on the air passage is subjected to heat exchange (large heat dissipation area) for the purpose of rapid heat dissipation, and a preferred embodiment of the material of the heat sink 131 is aluminum. The remote fan module 14 is disposed on the airflow passage for accelerating the flow rate of the air flowing into the airflow passage from the air outlet 120 and flowing out of the air outlet i2i, and the speed of the air is accelerated accordingly. Each zone of the group 13 - the rate of heat exchange with the air flowing from the air inlet 120 to the air flow path and flowing out of the air outlet ΐ2ι. In this embodiment, the position of the fan module 14 is the one shown in the figure, but the position of the fan module 14 is not limited, and the fan group 14 can be disposed. The number can also be adjusted according to the actual heat dissipation requirements. #Please refer to Figures 3 and 4 for the second embodiment of the heat dissipation case of the present invention and the A-A cross-sectional view of Fig. 3, as shown in the figure, the second embodiment and the first implementation The difference is that the heat dissipation module 13 of the second embodiment includes only a plurality of heat dissipation fins 131 disposed on the heat conduction side 100 of the chassis 1 , and the heat dissipation module 13 can also be disposed through the air through the heat dissipation module 13 . The heat exchange achieves a good heat dissipation effect. In summary, the heat dissipation module of the present invention mainly includes the chassis, the cooling fluid heat conduction module, the housing and the heat dissipation module, and the operation mode thereof, the first through the cooling fluid heat conduction module and the heat generation After the components are subjected to heat exchange, heat is transmitted to the regions of the heat dissipation module through the heat exchange mode of the chassis and the heat dissipation module, and finally, the regions of the heat dissipation module and the air inlets of the heat dissipation module are The heat flowing into the air passage and flowing out of the air outlet of the casing can not only achieve the purpose of dissipating heat of the heating element of the electronic system, but also reach the electronic system through the machine phase that can shield the heating element. The heating element is used for dustproof and waterproof purposes. Accordingly, the present invention can solve the conventional technology, and can only provide a single heat dissipation effect of the heating element of the electronic system, and cannot simultaneously have dustproof and heat dissipation of 19683 11 M3 09314 t ^ fit. effect. The heat dissipation component of the operation subsystem is better [Simplified illustration]
土第1圖係為本創作之散熱機殼之第〜A 思圖； 貫施例分解示 第/圖係為第1圖之A-A剖面示意圖； 施例分解开 土弟3圖係為本創作之散熱機殼之第一〜 恩圖；以及 布〜貫 【主要 1 10 1〇0 11 *110 111 112 12 12〇 121 122 123 13 4圖係為第3圖之a-A剖面示意圖 元件符號說明】 散熱機殼 機箱 導熱側 冷部流體導熱模組 冷卻流體 熱交換管 驅動單元 殼體 入風口 出風口 側蓋 外殼主體 散熱模組 19683 12 M309314 130 底板 131 散熱片 -14 風扇模組 .20 主機板 21 中央處理單元 22 北橋晶片 23 電源供應器The first picture of the soil is the first ~A thinking of the heat-dissipating case of the creation; the example of the decomposition of the example is the AA cross-section of the first picture; The first part of the heat-dissipating case is ~ 恩图; and the cloth ~ 【 [main 1 10 1 〇 0 11 * 110 111 112 12 12 〇 121 122 123 13 4 Figure 4 is a diagram of the aA cross-section of the figure 3 symbol description] Chassis case heat conduction side cold part fluid heat conduction module cooling fluid heat exchange tube drive unit housing air inlet air outlet side cover housing main body heat dissipation module 19683 12 M309314 130 bottom plate 131 heat sink-14 fan module .20 main board 21 central Processing unit 22 north bridge chip 23 power supply