JPH118485A - Cooling structure of electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure of electronic equipment which is inexpensive and simple and is capable of efficiently cooling portable electronic equipment with a small space, such as a notebook-type personal computer. SOLUTION: The cooling structure of an electronic equipment contains a body 1 housing electronic components 2 therein, and a chimney-like cylinder 4 which is formed in such a manner that the cylinder 4 is protruded from the body 1 and has a suction port 4a at one end of the cylinder 4 and a discharge port 4b at the other end. The suction port 4a of the cylinder 4 is positioned above a CPU chip 2a, an electronic component which produces high heat, placed inside the body 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure of a natural air cooling system for cooling the inside of an electronic device by natural convection, and more particularly to a cooling structure suitable for a portable electronic device such as a notebook personal computer.

[0002]

2. Description of the Related Art Generally, in electronic equipment, in order to guarantee the normal operation of an electronic circuit and the long-term reliability of a device,
It is necessary to keep the temperature of electronic components such as LSI below a predetermined value. Therefore, various cooling methods have been conventionally proposed in order to radiate heat generated in the electronic components.

For example, Japanese Patent Application Laid-Open No. 64-72597 discloses a unit in which a plurality of packages in which a large number of semiconductor components and the like are mounted in a bookshelf format are stacked in a multistage manner in a cabinet via a convection induction plate. A cooling structure of an electronic device in which an exhaust duct is provided above a unit disposed in an upper stage is disclosed. According to this cooling structure, the ambient temperature of the electronic components of the package mounted on the uppermost unit can be reduced by utilizing the chimney effect of the exhaust duct provided above the uppermost unit.

Japanese Utility Model Laid-Open Publication No. 59-103496 discloses that a cylindrical heat radiator having good thermal conductivity is attached to a heat generating element mounted in a housing of an electric device, and both ends of the heat radiator are opened at both ends of the housing. A heat radiator communicating with ventilation holes formed on upper and lower surfaces is disclosed.

Japanese Utility Model Application Laid-Open No. 55-40554 discloses a convection guide plate provided vertically adjacent to a plurality of heat generating modules, and a convection guide in a vertical direction on one side surface of the heat generating module and the convection guide plate. There is disclosed a natural air cooling duct structure having a duct through which warm air is blown out, and a heater provided at a lower bottom portion of the duct to increase a convection effect. According to this structure, by the convection guide plate and the duct,
Facilitates natural air cooling of heat generated from multiple heat generating modules, and a heater provided at the bottom bottom of the duct,
Forces natural convection.

A conventional notebook personal computer employs a system in which a heat spreader is attached to CPU-based electronic components, which generate a large amount of heat, to cool naturally. However, recent CPU electronic components are
Higher-speed electronic components, such as 5 W and 10 W, have increased in speed. Therefore, a fan is installed in the heat spreader to further enhance the cooling effect.

Further, some recent notebook personal computers include, for example, "FMV-B" manufactured by Fujitsu Limited.
Some systems employ a method of spreading the heat of the heat-generating electronic components to the entire personal computer by using a heat pipe or the like, such as IBLO NC (trade name). In this method, the temperature of the electronic components that are concentrated on heat is reduced by diffusing the heat of the electronic components that are concentrated on heat to the entire housing.

[0008]

SUMMARY OF THE INVENTION Japanese Patent Application Laid-Open No. 64-7259
The cooling structure for an electronic device disclosed in Japanese Patent Publication No. 7 can be adopted when a sufficient space can be secured, but in a portable electronic device represented by a notebook personal computer, the space in the main body is small. It is difficult to adopt because there are few.

The heat dissipation device disclosed in Japanese Utility Model Laid-Open Publication No. Sho 59-103496 has a case where a sufficient space can be secured.
Suitable for components such as power ICs with a small number of connection terminals, but in CPU-based LSIs, an IC such as a CPU is mounted on a high-density wiring board and placed on a tubular heat-radiator with good thermal conductivity. It is difficult to do.

The natural air cooling duct structure disclosed in Japanese Utility Model Laid-Open Publication No. 55-40554 has a structure in which a convection guide plate and a duct are provided on the side surface of a heat generating module. In many cases, components are also mounted on the side surface, and it is difficult to provide a duct on the side surface of the heat generating module.

In a system in which a heat spreader is used for natural air cooling, a metal having a high thermal conductivity is usually used. Therefore, in order to further enhance the heat radiation effect, it is necessary to increase the heat radiation area of the metal. As a result, the overall weight increases and the occupied volume increases, so that cooling using only the heat spreader is not very suitable for portable electronic devices whose weight and occupied volume are limited.

In the cooling method using a heat spreader with a fan, power consumption is required for rotation of the fan, so that the use time of the electronic device is shortened accordingly.

In a system in which the heat of electronic components is spread by using a heat pipe or the like to spread the heat to the entire personal computer, if the amount of heat generated by the electronic components increases, the entire device becomes too hot accordingly. In addition, in order to spread the heat throughout the device, it is necessary to insert a wide aluminum plate used as a heat spreader, which increases the weight of the device. Furthermore, even when a heat pipe is used, the heat pipe is expensive, and the manufacturing cost of the device is high.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has a cooling structure for an electronic device capable of efficiently cooling a portable electronic device having a small space, such as a notebook personal computer, with an inexpensive and simple structure. The purpose is to provide.

[0015]

According to the present invention, there is provided a cooling structure for an electronic device, wherein a main body having an electronic component therein, a protruding portion provided on the main body, a suction port formed at one end, and the other end formed. A chimney-shaped cylinder having a discharge port formed at an end thereof, wherein a suction port of the cylinder is disposed at a position above an electronic component provided inside the main body. It is.

According to the present invention, the "chimney effect" by the cylindrical body
Increases the air flow, and the heat generated by the electronic components
Since heat is efficiently radiated to the outside through the inside of the cylindrical body, the cooling effect by natural air cooling can be enhanced.

According to another aspect of the present invention, there is provided a cooling structure for an electronic device having a main body provided with an electronic component therein, and a lid attached to the main body so as to be openable and closable. An opening for heat radiation is formed at an upper position, and a chimney-shaped cylinder is provided inside the lid to communicate the opening of the main body with the outside of the lid.

If the cylinder is extendable, the chimney effect can be further enhanced by extending the cylinder.

When the suction port of the cylindrical body is formed wider toward the electronic component side, a large amount of air that is heated by the electronic component and is going to rise can be captured, and the cooling effect by natural air cooling is further enhanced. be able to.

Preferably, a heat spreader made of a material having good heat conductivity is provided between the electronic component and the cylinder. The heat spreader may have fins extending radially from the center line of the cylinder, and may have a fan.

In order to conduct heat to the cylinder itself, the cylinder may be made of a material having good heat conductivity, and the heat spreader may contact the cylinder.

In order to improve the intake of air from the outside, it is preferable that an external air intake port is formed in the main body near the electronic component.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view schematically showing a cooling structure of an electronic device according to the first embodiment.

As shown in FIG. 1, a wiring board 3 on which various electronic components 2 are mounted is installed in a main body 1 of the electronic device. In addition, a chimney-shaped cylindrical body 4 is provided at an upper portion of the main body 1 so as to protrude in a vertical direction in order to radiate heat generated in the main body 1 to the outside. Both ends of the cylindrical body 4 are open, and a suction port 4a is formed at a lower end and a discharge port 4b is formed at an upper end. The suction port 4 a of the cylindrical body 4 is arranged at a position above the CPU chip 2 a which is a high heat-generating electronic component in the electronic component 2.

According to the first embodiment, the warmed air above the CPU chip 2a, which is the high heat-generating electronic component 2, is sucked from the suction port 4a of the cylinder 4 as shown by the arrow. . The inhaled air rises inside the cylinder 4. The pressure of the raised air decreases and the volume expands. As a result, the rising speed of the air increases, and the outlet 4 of the cylinder 4
b. At the suction port of the cylinder 4, the amount of air suction increases, and the speed of natural convection of air around the CPU chip 2a increases.

As described above, the flow of air is enhanced by the “chimney effect” by the cylindrical body 4, and the heat generated from the electronic components 2 installed on the wiring board 3 efficiently passes through the inside of the cylindrical body 4 to the outside. Since the heat is radiated, the cooling effect by natural air cooling can be enhanced.

FIG. 2 is a side sectional view schematically showing a cooling structure of an electronic device according to a second embodiment of the present invention. As shown in FIG. 2, in the second embodiment, the suction port 4a of the cylinder 4 is formed wider toward the CPU chip 2a. According to the second embodiment, since the suction port 4a of the cylinder 4 is formed wider toward the CPU chip 2a, it is possible to capture a lot of air that is heated by the electronic component 2 and is going to rise. The cooling effect by natural air cooling can be further enhanced.

FIG. 3 is a side sectional view schematically showing a cooling structure of an electronic device according to a third embodiment of the present invention. As shown in FIG. 3, in the third embodiment, a heat spreader 5 made of aluminum or the like having good thermal conductivity is provided between the CPU chip 2a and the lower end of the cylindrical body 4.
According to the third embodiment, the heat spreader 5 can spread the heat of the CPU chip 2a and improve the cooling performance.

4 to 6 schematically show a cooling structure of an electronic apparatus according to a fourth embodiment of the present invention, FIG. 4 is a side sectional view, FIG. 5 is a plan sectional view, and FIG. FIG. FIG.
As shown in FIG. 5, in the fourth embodiment, the CPU chip 2
A fin-type heat spreader 5 is provided between the first heat sink a and the suction port 4a of the cylindrical body 4. Fins 5 of heat spreader 5
a are arranged radially around the center axis of the cylindrical body 4 as shown in FIGS.
The inflow of air from the side surface is improved. Further, the cylinder 4 is made of a material such as aluminum having good thermal conductivity, and the upper portion of the fin 5a is brought into contact with the lower end of the cylinder 4 so that the fin 5
If it is configured to conduct heat directly to the cylinder 4 itself from a, the heat dissipation can be improved.

A heat sink with a fan is used as the heat spreader 5, and the cylinder 4 is forcibly forced by a fan.
The cooling effect may be enhanced by discharging the air from the upper end of the housing. In this case, when the temperature of the electronic component 2 is low, the cooling is performed only by natural air cooling, and when the temperature increases, the fan is rotated to improve the cooling capacity, thereby suppressing power consumption.

FIG. 7 is a side sectional view schematically showing a cooling structure of an electronic apparatus according to a fifth embodiment of the present invention applied to a notebook personal computer, and FIG. 8 is a front sectional view thereof.

As shown in FIGS. 7 and 8, the notebook personal computer includes a main body 1 having an electronic component 2 therein, and a lid 6 attached to the main body 1 so as to be openable and closable.

A keyboard 1a, operation switches (not shown) and the like are arranged on the upper surface of the main body 1, and a wiring board 3 on which various electronic components 2 are mounted is installed inside the main body 1. Also, CP which is a high heat generation electronic component among the electronic components 2 is used.
An opening 7 for heat dissipation is formed at a position above the U chip 2a, and a fin type heat spreader 5 is provided between the opening 7 and the CPU chip 2a. Furthermore, CP
An external air inlet 8 is formed on the outer wall of the main body 1 near the U chip 2a in order to make air intake from the outside favorable.

On the surface of the cover 6, a liquid crystal display 6a for displaying data and the like input by the keyboard 1a is provided. In addition, a chimney-shaped cylinder 4 is provided inside the lid 6 to communicate the opening 7 of the main body 1 with the outside of the lid 6 when the lid 6 is opened. As shown in FIG. 8, the cylinder 4 is arranged along the vertical direction on the side of the liquid crystal display 6a.

As shown by a dotted line in FIG. 7, the upper part of the cylindrical body 4 may be drawn out so that the cylindrical body 4 can be protruded from the upper part of the lid part 6. In this case, since the protruding cylindrical body 4 becomes longer, the chimney effect is further enhanced, and the cooling effect can be further enhanced. As a structure for pulling out the cylindrical body 4, for example, a structure similar to that of the pull-out antenna is adopted.

According to the fifth embodiment, the air circulation is enhanced by the chimney effect of the cylinder 4 provided inside the lid 6, and the CPU chip 2 a
Since the heat generated from the electronic component 2 is efficiently radiated to the outside through the inside of the cylindrical body 4, the cooling effect by natural air cooling can be enhanced.

The suction port 4a of the cylinder 4 may be formed wider toward the heat spreader 5, and the lower end of the cylinder 4 may contact the fin 5a of the heat spreader 5. Further, the heat spreader 5 may have an exhaust fan. Furthermore, the main body near the CPU is
In order to easily take in air from the outside, a mesh structure may be used.

The present invention is not limited to the above embodiment, and various changes can be made within the scope of the technical matters described in the claims. For example, in the above-described embodiment, the suction port 4a of the cylinder 4 is disposed at a position above the CPU chip 2a. However, the invention is not limited thereto. The suction port 4a may be arranged. Further, a plurality of cylinders 4 may be provided instead of one. Further, in the fifth embodiment, an example in which the present invention is applied to a notebook personal computer is shown. However, the present invention is not limited to this, and is applied to other portable electronic devices such as a dedicated word processor, an electronic notebook, and an electronic dictionary. Is also good.

[0039]

EXAMPLES The inventor of the present application actually manufactured the first embodiment and conducted an experiment on the cooling effect. In this experiment, 1
00 mm × 100 mm × 1.6 mm glass epoxy wiring board 3, 120 mm × 120 mm × 30 mm resin body 1, 8 mm × 13 mm rectangular inner diameter and 1 m thickness
A resin cylinder 4 having a length of 100 mm and a length of 100 mm was used.

The size of the CPU chip 2a is 10
mm × 10 mm, and is mounted on the wiring board 3 by a flip chip method. A suction port 4a of the cylindrical body 4 is provided at a position 5 mm above the upper surface of the CPU chip 2a, and an outside air suction port 8 is provided at a side of the electronic device body 1 with a window of 5 mm × 20 mm.

In an electronic device manufactured with the above dimensions,
The thermal resistance of the CPU chip 2a was compared between the case where the cylinder 4 was installed and the case where the cylinder 4 was not installed. In the comparison, generally, a flow thermometer (manufactured by Flow Merrick Co., Ltd.), which is a simulation software for analyzing the heat radiation of this kind of electronic device, was used.

As a result of the experiment, when the cylinder 4 was not installed, the thermal resistance of the chip 2a was 50 ° C./W.
When the cylinder 4 was installed, it was found that the thermal resistance was reduced to 44 ° C./W.

The inventor of the present application conducted an experiment on the cooling effect using a general notebook personal computer which is commercially available. In this experiment, a pipe-shaped cylinder 4 having a rectangular cross section of 5 mm × 10 mm and a length of 250 mm is provided beside the liquid crystal display 6a. The suction port 4a of the cylinder 4 is arranged at a position 3 mm above the heat spreader 5 arranged on the upper surface of the CPU chip 2a. CP
In the vicinity of the U chip 2a, the outside air suction port 8 is
Is formed.

The cylinder 4 is made of aluminum and has a CPU
Fin type heat spreader 5 adhered to the upper surface of chip 2a (in this case, fin 5a
Is arranged above the center of the heat spreader), and the lower end of the cylindrical body 4 is brought into contact with the fins 5 a of the fin-type heat spreader 5.

Also in this experiment, the thermal resistance of the CPU chip 2a was compared between the case where the cylinder 4 was installed and the case where the cylinder 4 was not installed, as in the above-described experiment.
Was obtained, the result that the thermal resistance of the chip 2a was significantly reduced was obtained.

When the cylindrical body 4 is brought into contact with the fins 5a, the thermal resistance can be reduced by bonding with the silver-containing silicone resin.

[0047]

The present invention has the following excellent effects. (1) Since the chimney-shaped cylinder is provided at a position above the electronic component provided in the main body of the electronic device, the cooling structure is simple and the size and weight of the electronic device can be reduced. Further, the manufacturing cost of the electronic device can be reduced. (2) Since the electronic device is cooled by the chimney effect of the chimney-shaped cylinder, it is not necessary to rotate the fan to cool it, and power consumption can be reduced. Further, even when a heat spreader with a fan is used, the operating time of the fan can be shortened, so that power consumption can be suppressed. (3) In a portable electronic device such as a notebook personal computer having a main body and a lid openably and closably attached to the main body, since a cylinder is provided inside the lid, the cooling performance is provided by the chimney effect of the cylinder. Can be increased.

[Brief description of the drawings]

FIG. 1 is a side sectional view schematically showing a cooling structure of an electronic device according to a first embodiment of the present invention.

FIG. 2 is a side sectional view schematically showing a cooling structure of an electronic device according to a second embodiment of the present invention.

FIG. 3 is a side sectional view schematically showing a cooling structure of an electronic device according to a third embodiment of the present invention.

FIG. 4 is a side sectional view schematically showing a cooling structure of an electronic device according to a fourth embodiment of the present invention.

FIG. 5 is a plan sectional view schematically showing a cooling structure of an electronic device according to a fourth embodiment of the present invention.

FIG. 6 is a perspective view schematically showing a cooling structure of an electronic device according to a fourth embodiment of the present invention.

FIG. 7 is a side sectional view schematically showing a cooling structure of an electronic apparatus according to a fifth embodiment of the present invention applied to a notebook personal computer.

FIG. 8 is a front sectional view schematically showing a cooling structure of an electronic apparatus according to a fifth embodiment of the present invention applied to a notebook personal computer.

[Explanation of symbols]

 1: Body 2: Electronic components 2a: CPU chip 3: Wiring board 4: Cylindrical body 4a: Inlet 4b: Outlet 5: Heat spreader 5a: Fin 6: Lid 7: Opening 8: Outside air intake

Claims (9)

[Claims] 1. A main body having an electronic component therein, a main body protruding from the main body, and a suction port formed at one end,
A chimney-shaped cylinder having a discharge port formed at the other end, wherein the suction port of the cylinder is disposed at a position above an electronic component provided inside the main body. Characteristic electronic equipment cooling structure. 2. An electronic apparatus comprising: a main body having an electronic component therein; and a lid attached to the main body so as to be openable and closable, wherein the main body has an opening for heat radiation at a position above the electronic component. A cooling structure for an electronic device, wherein a chimney-shaped cylinder is formed inside the lid, and communicates between the opening of the main body and the outside of the lid. 3. The cooling structure for an electronic device according to claim 1, wherein said tubular body is extendable and contractible. 4. The cooling structure for an electronic device according to claim 1, wherein the suction port of the cylindrical body is formed wider toward the electronic component. 5. The heat spreader according to claim 1, wherein a heat spreader made of a material having good heat conductivity is provided between the electronic component and the cylindrical body. Electronic equipment cooling structure. 6. The cooling device for an electronic device according to claim 5, wherein said heat spreader has fins extending radially from a center line of said cylindrical body. 7. The cooling device for an electronic device according to claim 5, wherein the cylinder is made of a material having good thermal conductivity, and the heat spreader is in contact with the cylinder. . 8. The cooling device for an electronic device according to claim 5, wherein the heat spreader has a fan. 9. The electronic device according to claim 1, wherein an outside air intake port is formed in a main body near the electronic component.
Electronic equipment cooling structure