TW200738121A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200738121A
TW200738121A TW095111397A TW95111397A TW200738121A TW 200738121 A TW200738121 A TW 200738121A TW 095111397 A TW095111397 A TW 095111397A TW 95111397 A TW95111397 A TW 95111397A TW 200738121 A TW200738121 A TW 200738121A
Authority
TW
Taiwan
Prior art keywords
heat
dissipating plates
dissipation device
heat dissipation
circuit board
Prior art date
Application number
TW095111397A
Other languages
Chinese (zh)
Other versions
TWI283161B (en
Inventor
Cheng-Tien Lai
Zhi-Yong Zhou
Qiao-Li Ding
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95111397A priority Critical patent/TWI283161B/en
Application granted granted Critical
Publication of TWI283161B publication Critical patent/TWI283161B/en
Publication of TW200738121A publication Critical patent/TW200738121A/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a pair of heat-dissipating plates and a clip clamping a printed circuit board and the heat-dissipating plates therebetween. The clip includes a connecting portion and a pair of elastic latching portions extending from opposite ends of the connecting portion to be attached on the heat-dissipating plates. Each latching portion includes a pair of claws extending from edges of opposite sides thereof to engage with the heat-dissipating plates and a free end of the latching portion bends to form a positioning piece attached on a front end of each heat-dissipating plate. The heat-dissipating plates are attached on opposite sides of the printed circuit board to enhance efficiency of heat-dissipation of the heat dissipation device. It is convenient for the clip to clamp the heat-dissipating plates and the printed circuit board therebetween and structure of the whole heat dissipation device has advantages of being compact and simple.
TW95111397A 2006-03-31 2006-03-31 Heat dissipation device TWI283161B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95111397A TWI283161B (en) 2006-03-31 2006-03-31 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95111397A TWI283161B (en) 2006-03-31 2006-03-31 Heat dissipation device

Publications (2)

Publication Number Publication Date
TWI283161B TWI283161B (en) 2007-06-21
TW200738121A true TW200738121A (en) 2007-10-01

Family

ID=38829019

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95111397A TWI283161B (en) 2006-03-31 2006-03-31 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI283161B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI514956B (en) * 2014-05-16 2015-12-21 Wistron Neweb Corp Heat dissipating device
CN105307449A (en) * 2014-05-29 2016-02-03 启碁科技股份有限公司 Cooling device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI514956B (en) * 2014-05-16 2015-12-21 Wistron Neweb Corp Heat dissipating device
CN105307449A (en) * 2014-05-29 2016-02-03 启碁科技股份有限公司 Cooling device
CN105307449B (en) * 2014-05-29 2017-12-19 启碁科技股份有限公司 Heat abstractor

Also Published As

Publication number Publication date
TWI283161B (en) 2007-06-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees