TW200944109A - Heat dissipating device and heat dissipating device assembly and locking device thereof - Google Patents

Heat dissipating device and heat dissipating device assembly and locking device thereof

Info

Publication number
TW200944109A
TW200944109A TW97112218A TW97112218A TW200944109A TW 200944109 A TW200944109 A TW 200944109A TW 97112218 A TW97112218 A TW 97112218A TW 97112218 A TW97112218 A TW 97112218A TW 200944109 A TW200944109 A TW 200944109A
Authority
TW
Taiwan
Prior art keywords
heat dissipating
sides
resilient
dissipating device
heat sink
Prior art date
Application number
TW97112218A
Other languages
Chinese (zh)
Inventor
Jer-Haur Kuo
Xin-Xiang Zha
Ye-Fei Yu
Jun Li
Jun Ding
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW97112218A priority Critical patent/TW200944109A/en
Publication of TW200944109A publication Critical patent/TW200944109A/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating device includes a securing device and a heat sink. The securing device includes a securing frame and two resilient clips. The securing frame is disposed around the heat sink. The securing frame includes two first sides and two second sides which connect with two free ends of the two first sides. The second side is located above and spaces a distance from the first side. The two resilient clips are attached to the two second sides and disposed between the heat sink and the two second sides. The resilient clip includes at least a resilient portion. The resilient portion can generate a resilient force to press the heat sink toward a printed circuit board.
TW97112218A 2008-04-03 2008-04-03 Heat dissipating device and heat dissipating device assembly and locking device thereof TW200944109A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97112218A TW200944109A (en) 2008-04-03 2008-04-03 Heat dissipating device and heat dissipating device assembly and locking device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97112218A TW200944109A (en) 2008-04-03 2008-04-03 Heat dissipating device and heat dissipating device assembly and locking device thereof

Publications (1)

Publication Number Publication Date
TW200944109A true TW200944109A (en) 2009-10-16

Family

ID=44869192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97112218A TW200944109A (en) 2008-04-03 2008-04-03 Heat dissipating device and heat dissipating device assembly and locking device thereof

Country Status (1)

Country Link
TW (1) TW200944109A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401769B (en) * 2009-12-28 2013-07-11 Global Material Science Co Ltd Shadow frame and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401769B (en) * 2009-12-28 2013-07-11 Global Material Science Co Ltd Shadow frame and manufacturing method thereof

Similar Documents

Publication Publication Date Title
JP2015504240A5 (en)
TW200739327A (en) Heat dissipating module
WO2008005591A3 (en) Low-profile board level emi shielding and thermal management apparatus and spring clips for use therewith
TWI411383B (en)
TW200709766A (en) Flexible circuit board with heat sink
NO20084351L (en) Support body for components and circuits
ATE532400T1 (en) HEAT-CONDUCTIVE MOUNTING ELEMENT FOR ATTACHING AN EMBLED CIRCUIT BOARD TO A HEATSINK
SG158005A1 (en) Passive heat radiator and streetlight heat radiating device
JP2012060132A5 (en)
WO2008086027A3 (en) Printed circuit board retaining device
JP2014521224A5 (en)
WO2014078264A3 (en) Fastener member for affixation to a structure in an orthopedic device and method for securing the same
EP2605275A3 (en) Load distributed heat sink system
WO2014132126A3 (en) Light-emitting device and mount therefor
TW200635491A (en) Heat dissipater module and electronic device having the same
JP2014523107A5 (en)
TW200744431A (en) Electronic device
TW200944109A (en) Heat dissipating device and heat dissipating device assembly and locking device thereof
JP2013058663A5 (en)
WO2006102875A3 (en) Printed circuit board assembly
TW200942763A (en) Heat dissipating device and heat dissipating device assembly and securing device thereof
TW200612808A (en) Heat sink fixing device
JP2014212289A (en) Power supply device
TW200736889A (en) Heat dissipation device
TW200738121A (en) Heat dissipation device