TW200736889A - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
- Publication number
- TW200736889A TW200736889A TW095109229A TW95109229A TW200736889A TW 200736889 A TW200736889 A TW 200736889A TW 095109229 A TW095109229 A TW 095109229A TW 95109229 A TW95109229 A TW 95109229A TW 200736889 A TW200736889 A TW 200736889A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipating plate
- dissipating
- circuit board
- printed circuit
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device includes a first heat-dissipating plate and a second heat-dissipating plate respectively attached on opposite sides of a printed circuit board. The first heat-dissipating plate has a first clasp extending from a side edge thereof and the first clasp includes a resisting portion for resisting ends of the printed circuit board and the second heat-dissipating plate and a latching portion extending from an end of the resisting portion to engage with the second heat-dissipating plate. The second heat-dissipating plate defines a depressed portion in a side thereof to engage with the latching portion of the first clasp. Other sides of two heat-dissipating plates engage with each other to clip the printed circuit board between the first and second heat-dissipating plates.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95109229A TWI326023B (en) | 2006-03-17 | 2006-03-17 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95109229A TWI326023B (en) | 2006-03-17 | 2006-03-17 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200736889A true TW200736889A (en) | 2007-10-01 |
TWI326023B TWI326023B (en) | 2010-06-11 |
Family
ID=45074305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95109229A TWI326023B (en) | 2006-03-17 | 2006-03-17 | Heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI326023B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015167528A1 (en) | 2014-04-30 | 2015-11-05 | Hewlett-Packard Development Company, L.P. | Thermal management assembly |
-
2006
- 2006-03-17 TW TW95109229A patent/TWI326023B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI326023B (en) | 2010-06-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |