TW200736889A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200736889A
TW200736889A TW095109229A TW95109229A TW200736889A TW 200736889 A TW200736889 A TW 200736889A TW 095109229 A TW095109229 A TW 095109229A TW 95109229 A TW95109229 A TW 95109229A TW 200736889 A TW200736889 A TW 200736889A
Authority
TW
Taiwan
Prior art keywords
heat
dissipating plate
dissipating
circuit board
printed circuit
Prior art date
Application number
TW095109229A
Other languages
Chinese (zh)
Other versions
TWI326023B (en
Inventor
Cheng-Tien Lai
Zhi-Yong Zhou
Qiao-Li Ding
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95109229A priority Critical patent/TWI326023B/en
Publication of TW200736889A publication Critical patent/TW200736889A/en
Application granted granted Critical
Publication of TWI326023B publication Critical patent/TWI326023B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device includes a first heat-dissipating plate and a second heat-dissipating plate respectively attached on opposite sides of a printed circuit board. The first heat-dissipating plate has a first clasp extending from a side edge thereof and the first clasp includes a resisting portion for resisting ends of the printed circuit board and the second heat-dissipating plate and a latching portion extending from an end of the resisting portion to engage with the second heat-dissipating plate. The second heat-dissipating plate defines a depressed portion in a side thereof to engage with the latching portion of the first clasp. Other sides of two heat-dissipating plates engage with each other to clip the printed circuit board between the first and second heat-dissipating plates.
TW95109229A 2006-03-17 2006-03-17 Heat dissipation device TWI326023B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95109229A TWI326023B (en) 2006-03-17 2006-03-17 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95109229A TWI326023B (en) 2006-03-17 2006-03-17 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200736889A true TW200736889A (en) 2007-10-01
TWI326023B TWI326023B (en) 2010-06-11

Family

ID=45074305

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95109229A TWI326023B (en) 2006-03-17 2006-03-17 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI326023B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015167528A1 (en) 2014-04-30 2015-11-05 Hewlett-Packard Development Company, L.P. Thermal management assembly

Also Published As

Publication number Publication date
TWI326023B (en) 2010-06-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees