GB201208816D0 - Printed circuit board heatsink mounting - Google Patents

Printed circuit board heatsink mounting

Info

Publication number
GB201208816D0
GB201208816D0 GB201208816A GB201208816A GB201208816D0 GB 201208816 D0 GB201208816 D0 GB 201208816D0 GB 201208816 A GB201208816 A GB 201208816A GB 201208816 A GB201208816 A GB 201208816A GB 201208816 D0 GB201208816 D0 GB 201208816D0
Authority
GB
United Kingdom
Prior art keywords
pcb
face
heatsink
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB201208816A
Other versions
GB2502148A (en
GB2502148B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Control Techniques Ltd
Original Assignee
Nidec Control Techniques Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Control Techniques Ltd filed Critical Nidec Control Techniques Ltd
Priority to GB201208816A priority Critical patent/GB2502148B/en
Publication of GB201208816D0 publication Critical patent/GB201208816D0/en
Priority to CN 201320275975 priority patent/CN203279444U/en
Publication of GB2502148A publication Critical patent/GB2502148A/en
Application granted granted Critical
Publication of GB2502148B publication Critical patent/GB2502148B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Abstract

A heatsink for mounting on a printed circuit board (PCB) has a first face for mounting electronic components and a second face opposite the first face for heat dissipation via fins etc. The heatsink has at least one channel, but preferably more, for receiving parts of the PCB such a finger 409 and edges (405 fig 4). When assembled, the component mounting surface faces in substantially the same direction as a first face of the PCB that may carry components, such a s package 501, and the heat dissipating surface faces in substantially the same direction as the second opposite face of the PCB. Preferably the heatsink is positioned at least partially within a cutout of the PCB (see figure 4), and most preferably a fastener 507 can connect the component (via hole 503) and the PCB (via hole 411 in the finger) together. Figures 6 and 7 show top and bottom depictions of the assembly of component heatsink and PCB.
GB201208816A 2012-05-18 2012-05-18 Printed circuit board heatsink mounting Expired - Fee Related GB2502148B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB201208816A GB2502148B (en) 2012-05-18 2012-05-18 Printed circuit board heatsink mounting
CN 201320275975 CN203279444U (en) 2012-05-18 2013-05-20 Radiating fin and radiating assembly arranged on printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB201208816A GB2502148B (en) 2012-05-18 2012-05-18 Printed circuit board heatsink mounting

Publications (3)

Publication Number Publication Date
GB201208816D0 true GB201208816D0 (en) 2012-07-04
GB2502148A GB2502148A (en) 2013-11-20
GB2502148B GB2502148B (en) 2015-04-29

Family

ID=46546325

Family Applications (1)

Application Number Title Priority Date Filing Date
GB201208816A Expired - Fee Related GB2502148B (en) 2012-05-18 2012-05-18 Printed circuit board heatsink mounting

Country Status (2)

Country Link
CN (1) CN203279444U (en)
GB (1) GB2502148B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3376837A1 (en) 2017-03-17 2018-09-19 Valeo Iluminacion Lighting module with heat dissipation means on pcb and method for producing thereof
CN107318198A (en) * 2017-08-22 2017-11-03 张吉光 A kind of LED drive control devices
CN107983803A (en) * 2017-11-27 2018-05-04 苏州惠琪特电子科技有限公司 A kind of preparation method of pcb board radiating piece
EP4068923A1 (en) * 2021-03-31 2022-10-05 Siemens Aktiengesellschaft Cooling device for cooling a semiconductor module and converter with the cooling device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4853828A (en) * 1985-08-22 1989-08-01 Dart Controls, Inc. Solid state device package mounting apparatus
SE460008B (en) * 1987-11-04 1989-08-28 Saab Scania Ab REFRIGERATOR CONTAINS AN ELECTRIC CIRCUIT CARD AND USE THEREOF
US6304451B1 (en) * 1999-12-01 2001-10-16 Tyco Electronics Logistics Ag Reverse mount heat sink assembly
TW201144987A (en) * 2010-06-01 2011-12-16 Hon Hai Prec Ind Co Ltd Heat sink and electronic device

Also Published As

Publication number Publication date
GB2502148A (en) 2013-11-20
GB2502148B (en) 2015-04-29
CN203279444U (en) 2013-11-06

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20200518