TW200942763A - Heat dissipating device and heat dissipating device assembly and securing device thereof - Google Patents

Heat dissipating device and heat dissipating device assembly and securing device thereof

Info

Publication number
TW200942763A
TW200942763A TW97112208A TW97112208A TW200942763A TW 200942763 A TW200942763 A TW 200942763A TW 97112208 A TW97112208 A TW 97112208A TW 97112208 A TW97112208 A TW 97112208A TW 200942763 A TW200942763 A TW 200942763A
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating device
heat sink
securing frame
securing
Prior art date
Application number
TW97112208A
Other languages
Chinese (zh)
Inventor
Jer-Haur Kuo
Xin-Xiang Zha
Ye-Fei Yu
Jun Ding
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW97112208A priority Critical patent/TW200942763A/en
Publication of TW200942763A publication Critical patent/TW200942763A/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating device includes a securing frame and a heat sink. The securing frame is disposed around the heat sink. The securing frame includes two first sides and two second sides which connect with free ends of the first sides respectively. The second side is located above and spaces a distance from the first side. The second side has two resilient clips and a hooks formed thereon. The hooks fasten the securing frame toward the printed circuit board. The resilient clip is located upon the heat sink and generates a resilient force to press the heat sink toward the printed circuit board.
TW97112208A 2008-04-03 2008-04-03 Heat dissipating device and heat dissipating device assembly and securing device thereof TW200942763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97112208A TW200942763A (en) 2008-04-03 2008-04-03 Heat dissipating device and heat dissipating device assembly and securing device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97112208A TW200942763A (en) 2008-04-03 2008-04-03 Heat dissipating device and heat dissipating device assembly and securing device thereof

Publications (1)

Publication Number Publication Date
TW200942763A true TW200942763A (en) 2009-10-16

Family

ID=44868791

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97112208A TW200942763A (en) 2008-04-03 2008-04-03 Heat dissipating device and heat dissipating device assembly and securing device thereof

Country Status (1)

Country Link
TW (1) TW200942763A (en)

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