TW200741427A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200741427A
TW200741427A TW095114346A TW95114346A TW200741427A TW 200741427 A TW200741427 A TW 200741427A TW 095114346 A TW095114346 A TW 095114346A TW 95114346 A TW95114346 A TW 95114346A TW 200741427 A TW200741427 A TW 200741427A
Authority
TW
Taiwan
Prior art keywords
heat
dissipation device
dissipating
heat dissipation
dissipating plates
Prior art date
Application number
TW095114346A
Other languages
Chinese (zh)
Other versions
TWI307007B (en
Inventor
Cheng-Tien Lai
Zhi-Yong Zhou
Qiao-Li Ding
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95114346A priority Critical patent/TWI307007B/en
Publication of TW200741427A publication Critical patent/TW200741427A/en
Application granted granted Critical
Publication of TWI307007B publication Critical patent/TWI307007B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a pair of heat-dissipating plates attached on opposite sides of a printed circuit board and a clamp clamping the heat-dissipating plates and the printed circuit board together. A heat pipe is disposed in one of the heat-dissipating plates. Opposites ends of the heat-dissipating plates engage with each other. The clamp includes a connecting portion and a pair of elastic pressing portions extending from two free ends of the connecting portion. The heat dissipation device with the heat pipe accommodated in the heat-dissipating plate therein transfers the heat from a heat-generating electronic component to the whole the heat-dissipating plate via the heat pipe. Heat-dissipation efficiency of the heat dissipation device is correspondingly improved.
TW95114346A 2006-04-21 2006-04-21 Heat dissipation device TWI307007B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95114346A TWI307007B (en) 2006-04-21 2006-04-21 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95114346A TWI307007B (en) 2006-04-21 2006-04-21 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200741427A true TW200741427A (en) 2007-11-01
TWI307007B TWI307007B (en) 2009-03-01

Family

ID=45071511

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95114346A TWI307007B (en) 2006-04-21 2006-04-21 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI307007B (en)

Also Published As

Publication number Publication date
TWI307007B (en) 2009-03-01

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